A polishing pad for polishing ITO conductive glass material

Abstract

The utility model discloses a kind of polishing pads for polishing ITO conductive glass material, it includes polishing piece, the lower surface of the polishing piece is fixedly connected with connecting piece, connecting piece and the groove between polishing piece are provided, the lower surface of the connecting piece is fixedly connected with taper plate, the side surface of the taper plate is fixedly connected with flow guide block, the flow guide block is communicated with recovery frame, the lower surface of the recovery frame is communicated with recovery pipe;Silica gel plate, the lower surface of the silica gel plate is fixedly connected with support plate, the inside of the support plate is provided with mounting hole, the lower surface of the silica gel plate is fixedly connected with connecting column, the side surface of the connecting column is fixedly connected with heat dissipation column. By the above structure, groove is provided for grinding fluid and chip flow, and taper plate is provided on the lower surface of connecting piece, can be attached therewith, i.

Description

Technical Field

[0001] This utility model relates to the field of polishing pad technology, and in particular to a polishing pad for polishing ITO conductive glass material. Background Technology

[0002] In the polishing process of ITO conductive glass materials, the performance of the polishing pad directly affects the polishing accuracy and efficiency. Traditional polishing pads have the following technical problems during use: the polishing fluid and debris generated during the polishing process are easily retained at the polishing interface, resulting in a decrease in polishing accuracy, and even causing scratches or contamination on the workpiece surface; insufficient heat dissipation efficiency: the heat generated by friction during the polishing process is difficult to dissipate effectively, which may lead to overheating and deformation of the polishing pad, and even reduce the service life of the material; design defects in the recycling system: the existing polishing pad's polishing fluid recycling structure does not fully consider the hydrodynamic characteristics, resulting in low heat conduction and recycling efficiency, and failing to achieve rapid heat removal and recycling of the polishing fluid.

[0003] To address the shortcomings of traditional polishing pads in terms of slurry and debris discharge, heat dissipation, and recycling, this invention optimizes the internal structure and utilizes the principles of gravity, centrifugal force, and heat conduction to improve the stability and precision of the polishing process, while simultaneously achieving efficient heat removal and recycling of the slurry. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide a polishing pad for polishing ITO conductive glass material. A groove is provided between the polishing part and the connecting part for the flow of polishing fluid and debris. A conical plate is provided on the lower surface of the connecting part, which can fit against it. That is, the upper surface of the groove is also conical. This allows the polishing fluid and debris to flow slowly towards the edge of the groove under the influence of gravity and centrifugal force until they are completely discharged, so as not to affect the polishing of the object and to ensure the precision of polishing. It can also absorb the heat inside the polishing part and guide it to the inside of the recycling frame through the guide block. During the flow process, the water inside the polishing fluid evaporates and dissipates heat. Then, it comes into full contact with the heat dissipation column inside the recycling frame, absorbs heat again, and enters the recycling tube for recycling.

[0005] This utility model also provides a polishing pad for polishing ITO conductive glass material, comprising: a polishing component, a connecting component fixedly connected to the lower surface of the polishing component, a groove provided between the connecting component and the polishing component, a conical plate fixedly connected to the lower surface of the connecting component, a flow guide block fixedly connected to the side surface of the conical plate, the flow guide block communicating with a recycling frame, and a recycling pipe communicating with the lower surface of the recycling frame; and a silicone plate, a support plate fixedly connected to the lower surface of the silicone plate, an installation hole provided inside the support plate, a connecting column fixedly connected to the lower surface of the silicone plate, and a heat dissipation column fixedly connected to the side surface of the connecting column. Through the above components, a groove is provided between the polishing part and the connecting part to allow the polishing fluid and debris to flow. A conical plate is provided on the lower surface of the connecting part to fit into it, so that the upper surface of the groove is also conical. This allows the polishing fluid and debris to flow slowly towards the edge of the groove under the influence of gravity and centrifugal force until they are completely discharged, so as not to affect the polishing of the object and to ensure the precision of the polishing. It can also absorb the heat inside the polishing part and guide it to the inside of the recovery frame through the guide block. During the flow process, the water inside the polishing fluid evaporates and dissipates heat. Then, it comes into full contact with the heat dissipation column inside the recovery frame, absorbs heat again, and enters the recovery pipe for recycling.

[0006] According to the present invention, a polishing pad for polishing ITO conductive glass material is provided, wherein the polishing components are arranged in an array on the upper surface of the connector, and the guide blocks are arranged in an array on the side surface of the conical plate. These components enable the polishing components to uniformly polish the object, and allow the polishing fluid and debris to be stably guided to the recycling frame.

[0007] According to the present invention, a polishing pad for polishing ITO conductive glass material has a tapered upper surface of grooves, and the grooves are numerous and crisscrossed. These components allow the polishing fluid and debris inside the grooves to be stably guided to the groove edges under the influence of gravity and centrifugal force.

[0008] According to the present invention, a polishing pad for polishing ITO conductive glass material is provided, wherein the inner wall of the recovery frame is fixedly connected to the side surface of the guide block, and two recovery tubes are provided on both sides of the recovery frame. These components provide support for the recovery frame, and the two recovery tubes increase the efficiency of polishing fluid and debris recovery.

[0009] According to the present invention, a polishing pad for polishing ITO conductive glass material is provided, wherein the upper surface of the silicone plate is fixedly connected to the lower surface of the conical plate, and the side surface of the silicone plate is fixedly connected to the inner sidewall of the conical plate. These components provide stable support for the silicone plate, preventing it from detaching.

[0010] According to the present invention, a polishing pad for polishing ITO conductive glass material is provided, wherein the side surface of the support plate is fixedly connected to the inner wall of the conical plate, and the side surface of the connecting column is fixedly connected to the inner wall of the support plate. Through these components, the support plate supports the entire device, the connecting column increases friction to prevent the support plate from falling off, and the connecting column can be embedded inside the support plate to facilitate heat dissipation.

[0011] According to the present invention, a polishing pad for polishing ITO conductive glass material is provided, wherein the connecting posts and heat dissipation posts are multiple and evenly distributed on the lower surface of the support plate, thereby increasing the heat dissipation efficiency of the device.

[0012] According to the present invention, a polishing pad for polishing ITO conductive glass material includes a heat dissipation column located inside a recovery frame, the inner wall of which is fixedly connected to the lower surface of a support plate. These components enable the polishing fluid inside the recovery frame to absorb heat from the heat dissipation column, ensuring the polished part maintains a normal temperature.

[0013] Beneficial effects:

[0014] Compared with the prior art, this utility model has a groove between the polishing part and the connecting part for the flow of polishing fluid and debris. A conical plate is provided on the lower surface of the connecting part to fit it, so that the upper surface of the groove is also conical. This allows the polishing fluid and debris to flow slowly towards the edge of the groove under the influence of gravity and centrifugal force until they are completely discharged, so as not to affect the polishing of the object and to ensure the precision of polishing. It can also absorb the heat inside the polishing part and guide it to the inside of the recovery frame through the guide block. During the flow process, the water inside the polishing fluid evaporates and dissipates heat. Then, it comes into full contact with the heat dissipation column inside the recovery frame, absorbs heat again, and enters the recovery pipe for recovery. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0016] Figure 1 This is an overall structural diagram of the polishing pad for polishing ITO conductive glass material according to this utility model;

[0017] Figure 2 This is a top view of the polishing pad for polishing ITO conductive glass material according to this utility model.

[0018] Figure 3 This is a front cross-sectional view of the polishing pad used for polishing ITO conductive glass material according to this utility model.

[0019] Figure 4 This invention relates to a polishing pad for polishing ITO conductive glass materials. Figure 3 Structural diagram at point A in the middle.

[0020] Legend:

[0021] 1. Polished parts; 2. Connectors; 3. Grooves; 4. Conical plates; 5. Guide blocks; 6. Recycling frames; 7. Recycling pipes; 8. Silicone plates; 9. Support plates; 10. Mounting holes; 11. Connecting columns; 12. Heat dissipation columns. Detailed Implementation

[0022] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0023] Reference Figure 1-4 This utility model provides a polishing pad for polishing ITO conductive glass material, comprising: a polishing component 1, a connecting component 2 fixedly connected to the lower surface of the polishing component 1, several polishing components 1 arranged in an array on the upper surface of the connecting component 2, a groove 3 provided between the connecting component 2 and the polishing component 1, the upper surface of the groove 3 being conical, several grooves 3 arranged in a crisscross pattern, a conical plate 4 fixedly connected to the lower surface of the connecting component 2, a guide block 5 fixedly connected to the side surface of the conical plate 4, several guide blocks 5 arranged in an array on the side surface of the conical plate 4, a collection frame 6 connected to the guide block 5, the inner wall of the collection frame 6 being fixedly connected to the side surface of the guide block 5, and a collection pipe 7 connected to the lower surface of the collection frame 6, two collection pipes 7 located on both sides of the collection frame 6.

[0024] Specifically, the material is polished by the polishing part 1. A groove 3 is provided between the polishing part 1 and the connecting part 2 for the flow of polishing liquid and debris. A conical plate 4 is provided on the lower surface of the connecting part 2, which can fit with it. That is, the upper surface of the groove 3 is also conical. This allows the polishing liquid and debris to flow slowly towards the edge of the groove 3 under the influence of gravity and centrifugal force until they are completely discharged, so as not to affect the polishing of the object and to ensure the precision of polishing. It can also absorb the heat inside the polishing part 1 and guide it to the inside of the recycling frame 6 through the guide block 5, and then recycle it through the recycling pipe 7.

[0025] A silicone plate 8 has its upper surface fixedly connected to the lower surface of a cone plate 4, and its side surface fixedly connected to the inner wall of the cone plate 4. A support plate 9 is fixedly connected to the lower surface of the silicone plate 8, and its side surface is fixedly connected to the inner wall of the cone plate 4. The inner wall of the recycling frame 6 is fixedly connected to the lower surface of the support plate 9. An installation hole 10 is provided inside the support plate 9. A connecting column 11 is fixedly connected to the lower surface of the silicone plate 8, and its side surface is fixedly connected to the inner wall of the support plate 9. A heat dissipation column 12 is fixedly connected to the side surface of the connecting column 11. Several connecting columns 11 and heat dissipation columns 12 are evenly distributed on the lower surface of the support plate 9, and the heat dissipation column 12 is located inside the recycling frame 6.

[0026] Specifically, a support plate 9 is provided to support the device, and an installation hole 10 is provided inside it for easy installation. The silicone plate 8 can reduce the concentration of polishing stress and prevent polishing from damaging the object. The silicone plate 8 can also conduct the heat generated by the upper component through the connecting column 11 and transfer the heat to the heat dissipation column 12. Since the heat dissipation column 12 is located inside the recycling frame 6, the polishing fluid that has been cooled between the guide blocks 5 inside the recycling frame 6 can fully contact the heat dissipation column 12, absorb its internal heat and then recycle it.

[0027] Working Principle: During use, a support plate 9 provides support for the device, and mounting holes 10 are provided inside for easy installation. The polishing component 1 polishes the material. A groove 3 is provided between the polishing component 1 and the connecting component 2 for the flow of polishing fluid and debris. A conical plate 4 is provided on the lower surface of the connecting component 2, which fits into the groove 3. This conical shape allows the polishing fluid and debris to flow slowly towards the edge of the groove 3 under the influence of gravity and centrifugal force until they are completely discharged, ensuring that they do not affect the polishing of the object and guaranteeing the polishing process. The precision is high, and it can absorb the internal heat of the polished part 1. The heat is guided to the inside of the recycling frame 6 through the guide block 5 and recycled through the recycling pipe 7. The silicone plate 8 can reduce the concentration of polishing stress and prevent polishing from damaging the object. The silicone plate 8 can also conduct the heat generated by the upper part through the connecting column 11 and transfer the heat to the heat dissipation column 12. Since the heat dissipation column 12 is located inside the recycling frame 6, the polishing fluid that has been cooled between the guide blocks 5 inside the recycling frame 6 can fully contact the heat dissipation column 12, absorb its internal heat and then recycle it.

[0028] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A polishing pad for polishing ITO conductive glass material, characterized in that, include: A polishing part (1) is fixedly connected to a connector (2) on its lower surface. A groove (3) is provided between the connector (2) and the polishing part (1). A cone plate (4) is fixedly connected to the lower surface of the connector (2). A guide block (5) is fixedly connected to the side surface of the cone plate (4). A recycling frame (6) is connected to the guide block (5). A recycling pipe (7) is connected to the lower surface of the recycling frame (6). A silicone plate (8) is fixedly connected to a support plate (9) on its lower surface. An installation hole (10) is provided inside the support plate (9). A connecting column (11) is fixedly connected to the lower surface of the silicone plate (8). A heat dissipation column (12) is fixedly connected to the side surface of the connecting column (11).

2. The polishing pad for polishing ITO conductive glass material according to claim 1, characterized in that, The polished part (1) has several and is arranged in an array on the upper surface of the connector (2), and the guide block (5) has several and is arranged in an array on the side surface of the cone plate (4).

3. The polishing pad for polishing ITO conductive glass material according to claim 1, characterized in that, The upper surface of the groove (3) is conical, and the groove (3) has several grooves that are distributed in a crisscross pattern.

4. The polishing pad for polishing ITO conductive glass material according to claim 1, characterized in that, The inner wall of the recycling frame (6) is fixedly connected to the side surface of the guide block (5), and there are two recycling pipes (7) located on both sides of the recycling frame (6).

5. A polishing pad for polishing ITO conductive glass material according to claim 1, characterized in that, The upper surface of the silicone plate (8) is fixedly connected to the lower surface of the cone plate (4), and the side surface of the silicone plate (8) is fixedly connected to the inner side wall of the cone plate (4).

6. A polishing pad for polishing ITO conductive glass material according to claim 1, characterized in that, The side surface of the support plate (9) is fixedly connected to the inner wall of the cone plate (4), and the side surface of the connecting column (11) is fixedly connected to the inner wall of the support plate (9).

7. A polishing pad for polishing ITO conductive glass material according to claim 1, characterized in that, The connecting column (11) and the heat dissipation column (12) are several and evenly distributed on the lower surface of the support plate (9).

8. A polishing pad for polishing ITO conductive glass material according to claim 1, characterized in that, The heat dissipation column (12) is located inside the recycling frame (6), and the inner wall of the recycling frame (6) is fixedly connected to the lower surface of the support plate (9).

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