Wafer clamping mechanism and wafer cutting machine

Abstract

The application discloses a wafer clamping mechanism and a wafer cutting machine. The wafer clamping mechanism comprises a bearing table, a suction cup and a clamping assembly. The suction cup comprises multiple types, and the suction cups of the multiple types are selectively and detachably installed on the bearing table. The clamping assembly comprises multiple clamping assemblies, the multiple clamping assemblies are arranged along the outer periphery of the bearing table and installed on the bearing table, the clamping assembly comprises a guide component, a mounting seat and a pressing component, the guide component is connected to the bearing table and extends along the inner-outer direction of the bearing table, the mounting seat is installed on the guide component and is movable along the extension direction of the guide component, and the pressing component is installed on the mounting seat. The pressing component has a clamping position at least partially moving above the suction cup and locking the wafer on the suction cup and an unlocking position moving away from the suction cup to release the wafer on the suction cup. The application can solve the problem that the wafer clamping mechanism of the wafer cutting machine in the prior art is difficult to clamp wafers of multiple different types.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and more specifically, to a wafer clamping mechanism and a wafer dicing machine. Background Technology

[0002] Currently, most wafer clamping mechanisms on wafer dicing machines can only clamp one type of wafer. When it is necessary to clamp different types of wafers, a new wafer clamping mechanism needs to be replaced, which is cumbersome, inconvenient to implement, and results in low production efficiency. Utility Model Content

[0003] The main objective of this application is to provide a wafer clamping mechanism and a wafer dicing machine to solve the problem that the wafer clamping mechanism of the existing wafer dicing machine is difficult to clamp a variety of different types of wafers.

[0004] According to one aspect of this application, a wafer clamping mechanism is provided, comprising:

[0005] Support platform;

[0006] The suction cups include various models, and the various models of suction cups can be selected and detachably installed on the support platform;

[0007] A clamping assembly, comprising multiple clamping assemblies, is disposed along the outer periphery of the support platform and mounted on the support platform. Each clamping assembly includes a guide component, a mounting base, and a pressing component. The guide component is connected to the support platform and extends in the inward and outward directions of the support platform. The mounting base is mounted on the guide component and is movable along the extending direction of the guide component. The pressing component is mounted on the mounting base and has a clamping position that moves at least partially above the chuck and locks the wafer onto the chuck, and an unlocking position that moves away from the chuck to release the wafer from the chuck.

[0008] Furthermore, the guiding component also includes a guide rod that extends in the inward and outward directions of the support platform. The guide rod has multiple locking positions along its length. The mounting base can move along the extension of the guide rod and be locked in different locking positions by a locking assembly.

[0009] Furthermore, the guide component also includes a connecting block, the guide rod includes two rods, the ends of the two guide rods are fixedly connected to the connecting block, the clamping assembly is connected to the support platform through the connecting block, at least one guide rod is provided with multiple locking positions, and the mounting base is connected between the two guide rods.

[0010] Furthermore, the mounting base includes a connecting plate and two sliders, the two sliders being arranged one-to-one with the two guide rods, and the sliders being able to slide along the length direction of the guide rods. The connecting plate is connected between the two sliders, and the pressing component is mounted on the connecting plate.

[0011] Furthermore, the locking position includes a locking groove;

[0012] The locking assembly includes a locking pin and an elastic element, wherein the locking pin includes a locking section, a guide section, and a limiting part;

[0013] The guide section has a locking section and a limiting part at both ends. The locking pin passes through the mounting base and is perpendicular to the guide rod. The elastic element is sleeved on the guide section and abuts against the limiting part and the mounting base. The limiting part is driven by external force to insert the locking section into the locking groove to lock the mounting base to the guide rod or to separate the locking section from the locking groove.

[0014] Furthermore, the locking section has a guide ramp at one end near the guide rod; and / or, the cross-section of the locking groove includes a V-groove.

[0015] Furthermore, the elastic element includes at least one of a spring and an elastic sleeve.

[0016] Furthermore, the pressing component includes a rotary cylinder and an L-shaped pressure plate. The rotary cylinder is mounted on the mounting base, and the vertical section of the L-shaped pressure plate is connected to the rotary cylinder and switches between the clamping position and the unlocking position under the drive of the rotary cylinder.

[0017] Furthermore, the vertical section is provided with an elongated hole, the length direction of which is consistent with the length direction of the vertical section, and the vertical section is connected to the rotary cylinder by a locking member passing through the elongated hole.

[0018] On the other hand, this application also provides a wafer dicing machine, which includes the wafer clamping mechanism described above.

[0019] In this application, by installing a chuck corresponding to the wafer model on the carrier stage and adjusting the mounting seat on the clamping assembly to move the mounting seat along the extension direction of the guide component, thereby driving the pressing component to move along the extension direction of the guide component, it is possible to adapt to different wafer models. Subsequently, by switching the pressing component between the clamping position and the unlocking position, the wafer can be locked on the chuck or released from the chuck. The structure is simple and can improve the processing efficiency of the wafer dicing machine when processing different wafer models. Attached Figure Description

[0020] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, are illustrative and descriptive of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0021] Figure 1 This is a three-dimensional structural diagram of the wafer clamping mechanism disclosed in the embodiments of this application;

[0022] Figure 2 This is an exploded view of the wafer clamping mechanism disclosed in the embodiments of this application;

[0023] Figure 3 This is a three-dimensional structural diagram of the clamping component (located in the clamping position) disclosed in the embodiments of this application from a first-view perspective;

[0024] Figure 4 This is a perspective view of the clamping component (located in the clamping position) disclosed in the embodiments of this application from a second perspective.

[0025] Figure 5 This is a three-dimensional structural diagram of the clamping component (located in the unlocked position) disclosed in the embodiments of this application from a third-person perspective;

[0026] Figure 6 This is a perspective view of the clamping assembly (located at the clamping position) disclosed in the embodiments of this application after removing the connecting plate and a slider.

[0027] The above figures include the following reference numerals:

[0028] 31. Support platform; 32. Suction cup; 33. Clamping assembly; 331. Guide component; 3311. Guide rod; 33111. Locking position; 3312. Connecting block; 332. Mounting base; 3321. Connecting plate; 3322. Slider; 334. Pressing component; 3341. Rotary cylinder; 3342. L-shaped pressure plate; 33421. Vertical section; 33422. Long slot; 34. Locking assembly; 341. Locking pin; 3411. Locking section; 34111. Guide slope; 3412. Guide section; 3413. Limiting part; 342. Elastic element. Detailed Implementation

[0029] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0030] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0031] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0032] As described in the background section, existing wafer dicing machines have difficulty clamping wafers of different sizes. Therefore, this application provides a novel wafer clamping mechanism capable of clamping various wafer sizes, thereby improving the production efficiency of the wafer dicing machine. It should be noted that the different wafer sizes used in this application have different external dimensions; the wafers can be circular, square, elliptical, other polygonal, or irregularly shaped. The wafer clamping mechanism of this application will be described in detail below with reference to the accompanying drawings.

[0033] See Figures 1 to 6 As shown, the wafer clamping mechanism of this application includes a support stage 31, a suction cup 32, and a clamping assembly 33.

[0034] The suction cups 32 include various models, which can be selected and detachably mounted on the support stage 31. Multiple clamping assemblies 33 are arranged along the outer periphery of the support stage 31 and mounted on it. Each clamping assembly 33 includes a guide member 331, a mounting base 332, and a pressing member 334. The guide member 331 is connected to the support stage 31 and extends in the inward and outward directions of the support stage 31. The mounting base 332 is mounted on the guide member 331 and can move along the extending direction of the guide member 331. The pressing member 334 is mounted on the mounting base 332 and has a clamping position that moves at least partially above the suction cup 32 to lock the wafer onto the suction cup 32, and an unlocking position that moves away from the suction cup 32 to release the wafer from the suction cup 32.

[0035] During the actual wafer dicing process, the appropriate type of chuck 32 can be selected and mounted on the carrier stage 31 according to the wafer model. When it is necessary to lock the wafer onto the chuck 32, simply move the mounting base 332 along the extension direction of the guide member 331 to a position matching the size of the wafer on the current chuck 32, and then move the pressing member 334 at least partially above the chuck 32 to lock the wafer onto the chuck 32 in a clamping position. When it is necessary to remove the wafer from the chuck 32, simply move the pressing member 334 away from the chuck 32 to release the wafer from the chuck 32 and place it in an unlocked position. Multiple pressing members 334 are arranged along the outer periphery of the carrier stage 31, which can stably lock the wafer onto the chuck 32.

[0036] In other words, this application can adapt to different types of wafers by installing a suction cup 32 corresponding to the wafer model on the carrier stage 31 and adjusting the mounting base 332 on the clamping assembly 33 so that the mounting base 332 moves along the extension direction of the guide member 331, thereby driving the pressing member 334 to move along the extension direction of the guide member 331. After that, by switching the pressing member 334 between the clamping position and the unlocking position, the wafer can be locked on the suction cup 32 or released from the suction cup 32. The structure is simple and can improve the processing efficiency of the wafer dicing machine when processing different types of wafers.

[0037] For example, the clamping components 33 in this embodiment can be configured as two, three, four or more. Figure 1 and Figure 2 The diagram shows the case where four clamping assemblies 33 are arranged at even intervals along the outer periphery of the support stage 31, which facilitates the stable locking of the wafer onto the chuck 32.

[0038] Combination Figures 2 to 6As shown, the guide component 331 in this embodiment includes a guide rod 3311, which extends along the inner and outer directions of the support platform 31. The guide rod 3311 has multiple locking positions 33111 along its length. The mounting base 332 moves along the guide rod 3311 and is locked at different locking positions 33111 by the locking assembly 34. In this embodiment, by providing multiple locking positions 33111 on the guide rod 3311 and corresponding locking assemblies 34, the mounting base 332 can be locked at different locking positions 33111 along the extension direction of the guide rod 3311, thereby adjusting the position of the pressing component 334. Finally, wafers of different sizes can be locked onto the suction cup 32. Meanwhile, the wafer clamping mechanism in this embodiment is provided with a locking component 34. Through the function of the locking component 34, the mounting base 332 with the adjusted position can be locked at different locking positions 33111 in the extension direction of the guide rod 3311, which can improve the structural stability and reliability of the entire locking component 34.

[0039] In some embodiments, the guide component 331 further includes a connecting block 3312, and the guide rods 3311 include two rods, the ends of which are fixedly connected to the connecting block 3312. The clamping assembly 33 is connected to the support platform 31 through the connecting block 3312. At least one guide rod 3311 is provided with a plurality of the aforementioned locking positions 33111, and the mounting base 332 is connected between the two guide rods 3311. In this embodiment, by providing the connecting block 3312 and setting two guide rods 3311, the mounting base 332 can be stably supported and installed, thereby improving the structural stability of the clamping assembly in this embodiment. Correspondingly, the plurality of locking positions 33111 are provided on at least one guide rod 3311, which facilitates locking the mounting base 332 in different locking positions 33111 to accommodate different types of wafers.

[0040] Of course, in other embodiments of this application, the guide rod 3311 can also be set as one, three or more. Any other variation under the concept of this application is within the protection scope of this application.

[0041] Furthermore, in this embodiment, the mounting base 332 includes a connecting plate 3321 and two sliders 3322. The two sliders 3322 are correspondingly arranged with the two guide rods 3311, and the sliders 3322 can slide along the length of the guide rods 3311. The connecting plate 3321 is connected between the two sliders 3322, and the pressing component 334 is mounted on the connecting plate 3321. With this configuration, when the mounting base 332 needs to be moved, it is only necessary to slide the two sliders 3322 along their corresponding guide rods 3311 to the appropriate positions, which will move the pressing component 334 mounted on the connecting plate 3321 to the appropriate position for locking different types of wafers. The structure is simple, stable, and reliable. In addition, by using a connecting plate 3321 and two sliders 3322 in this embodiment, the mounting base 332 can be configured as multiple components, making it easier to movably mount the mounting base between the two guide rods 3311. The structure is simple and easy to assemble.

[0042] Furthermore, in this embodiment, the locking position 33111 includes a locking groove, and the locking assembly 34 includes a locking pin 341 and an elastic member 342.

[0043] The locking pin 341 includes a locking section 3411, a guide section 3412, and a limiting part 3413. The guide section 3412 has a locking section 3411 and a limiting part 3413 at both ends. The locking pin 341 passes through the mounting base 332 (specifically, through the slider 3322) and is perpendicular to the guide rod 3311. The maximum outer diameter of the guide section 3412 is smaller than the width of the locking groove. With this configuration, when the guide section 3412 is located at the locking groove, the guide section 3412 can move relative to the locking groove. Thus, when a force is applied to the mounting base 332, it can drive the mounting base 332 to move along the length direction of the guide rod 3311.

[0044] The elastic element 342 is sleeved on the guide section 3412 and abuts against the limiting part 3413 and the mounting base 332. Under external force, the limiting part 3413 drives the locking part 3411 to insert into the locking groove, thereby locking the mounting base 332 onto the guide rod 3311 or separating the locking part 3411 from the locking groove. When it is necessary to adjust the position of the mounting base 332 on the guide rod 3311, a force is applied to the limiting part 3413 to overcome the elastic force of the elastic element 342, which can drive the locking part 3411 out of the locking groove. At this time, the mounting base 332 can be moved. When the mounting base 332 moves to another locking groove of the guide rod 3311, the force applied to the limiting part 3413 is removed. At this time, under the action of the elastic element 342, the limiting part 3413 can drive the locking part 3411 to insert into the locking groove, thereby locking the mounting base 332 onto the guide rod 3311.

[0045] Optionally, in this embodiment, the locking segment 3411 near the guide rod 3311 is provided with a guide slope 34111. This guide slope 34111 facilitates guidance when the locking segment 3411 is inserted into the locking groove. For example, the guide slope 34111 can be a tapered surface or similar, provided on the side of the locking segment 3411 near the guide rod 3311. Any other variations within the scope of this application are within the protection range of this application.

[0046] Optionally, the cross-section of the locking groove includes a V-shaped groove, which is more suitable for the locking segment 3411 to insert into or disengage from the groove. Of course, in other embodiments of this application, the cross-section of the locking groove can also be square, arc-shaped, or other irregularly shaped structures. Any other variations within the concept of this application are within the protection scope of this application.

[0047] Optionally, the elastic element 342 includes at least one of a spring and an elastic sleeve. That is to say, the elastic element 342 in this embodiment can be a spring, an elastic sleeve, or a combination of a spring and an elastic sleeve. Any other deformation mode that can provide elastic force between the limiting part 3413 and the mounting base 332 is within the protection scope of this application.

[0048] See you again Figures 3 to 6 As shown, the pressing component 334 in this embodiment includes a rotary cylinder 3341 and an L-shaped pressure plate 3342. The rotary cylinder 3341 is mounted on the mounting base 332. The vertical section 33421 of the L-shaped pressure plate 3342 is connected to the rotary cylinder 3341 and switches between the clamping position and the unlocking position under the drive of the rotary cylinder 3341. In actual installation, the rotary cylinder 3341 is mounted on the connecting plate 3321 and located between the two sliders 3322, resulting in a compact structure and convenient installation. The rotary cylinder 3341 can be fixed to the connecting plate 3321 by welding, screwing, snap-fitting, etc. In actual operation, the rotary cylinder 3341 drives the L-shaped pressure plate 3342 to rotate, thereby switching the L-shaped pressure plate 3342 between the clamping position and the unlocking position, thus locking the wafer onto the suction cup 32 or releasing it from the suction cup 32.

[0049] In this embodiment, when the rotary cylinder 3341 drives the L-shaped pressure plate 3342 to rotate, the horizontal section of the L-shaped pressure plate 3342 rotates above the suction cup 32 to lock the wafer onto the suction cup 32. The structure is simple and easy to implement. Specifically, the vertical section 33421 of the L-shaped pressure plate 3342 is perpendicular to the rotation axis of the rotary cylinder 3341. When the rotary cylinder 3341 rotates, it can drive the L-shaped pressure plate 3342 to rotate, specifically driving the horizontal section of the L-shaped pressure plate 3342 to move above the suction cup 32 or to avoid the suction cup 32. When the horizontal section of the L-shaped pressure plate 3342 moves above the suction cup 32, the wafer on the suction cup 32 can be locked onto the suction cup 32. When the horizontal section of the L-shaped pressure plate 3342 moves to avoid the suction cup 32, the wafer on the suction cup 32 can be released.

[0050] Furthermore, in this embodiment, the vertical segment 33421 is provided with an elongated hole 33422, the length direction of which is consistent with the length direction of the vertical segment 33421. The vertical segment 33421 is connected to the rotary cylinder 3341 through a locking member (not shown in the figure) passing through the elongated hole 33422. In this embodiment, by providing the elongated hole 33422 on the vertical segment 33421, when the locking member moves along the length direction of the elongated hole 33422 to lock the L-shaped pressure plate 3342 at different positions in the elongated hole 33422, the distance between the horizontal segment of the L-shaped pressure plate 3342 and the rotary cylinder 3341 can be adjusted. Thus, when the rotary cylinder 3341 drives the L-shaped pressure plate 3342 to switch to the clamping position, the distance between the L-shaped pressure plate 3342 and the surface of the suction cup 32 can be adjusted, thereby accommodating wafers of different thicknesses.

[0051] In other words, in this embodiment, by setting an elongated hole 33422 on the vertical section 33421 and using a locking member to move within the elongated hole 33422, the vertical section 33421 can be locked at different positions of the rotary cylinder 3341. This allows for adjustment of the distance between the horizontal section of the L-shaped pressure plate 3342 and the rotary cylinder 3341 to accommodate wafers of different thicknesses, thereby improving the clamping stability of the wafer clamping mechanism in this embodiment for wafers of different types.

[0052] For example, the locking element in this embodiment can be a screw, a pin, etc. Any other variation of the concept of this application is within the protection scope of this application.

[0053] On the other hand, this application also discloses a wafer dicing machine, which includes the aforementioned wafer clamping mechanism. Therefore, the wafer dicing machine in this embodiment includes all the technical effects of the aforementioned wafer clamping mechanism. Since the technical effects of the wafer clamping mechanism have been described in detail above, they will not be repeated here.

[0054] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0055] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0056] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer clamping mechanism, characterized in that, include: Support platform (31); The suction cup (32) includes various models, and the various models of the suction cup (32) can be selected and detachably installed on the support platform (31); A clamping assembly (33) is provided, comprising a plurality of clamping assemblies (33) arranged along the outer periphery of the support platform (31) and mounted on the support platform (31). Each clamping assembly (33) includes a guide member (331), a mounting base (332), and a pressing member (334). The guide member (331) is connected to the support platform (31) and extends along the inner and outer directions of the support platform (31). The mounting base (332) is mounted on the guide member (331) and is movable along the extending direction of the guide member (331). The pressing member (334) is mounted on the mounting base (332) and has a clamping position that moves at least partially above the chuck (32) and locks the wafer on the chuck (32), and an unlocking position that moves away from the chuck (32) to release the wafer on the chuck (32).

2. The wafer clamping mechanism according to claim 1, characterized in that, The guide component (331) further includes a guide rod (3311), which extends along the inner and outer directions of the support platform (31). The guide rod (3311) has multiple locking positions (33111) along its length. The mounting base (332) can move along the extension of the guide rod (3311) and be locked in different locking positions (33111) by the locking assembly (34).

3. The wafer clamping mechanism according to claim 2, characterized in that, The guide component (331) further includes a connecting block (3312). The guide rod (3311) includes two rods, and the ends of the two guide rods (3311) are fixedly connected to the connecting block (3312). The clamping assembly (33) is connected to the support platform (31) through the connecting block (3312). At least one guide rod (3311) is provided with a plurality of locking positions (33111). The mounting base (332) is connected between the two guide rods (3311).

4. The wafer clamping mechanism according to claim 3, characterized in that, The mounting base (332) includes a connecting plate (3321) and two sliders (3322). The two sliders (3322) are arranged in a one-to-one correspondence with the two guide rods (3311), and the sliders (3322) can slide along the length direction of the guide rods (3311). The connecting plate (3321) is connected between the two sliders (3322), and the pressing component (334) is mounted on the connecting plate (3321).

5. The wafer clamping mechanism according to claim 2, characterized in that, The locking position (33111) includes a locking groove; The locking assembly (34) includes a locking pin (341) and an elastic element (342). The locking pin (341) includes a locking section (3411), a guide section (3412), and a limiting part (3413). The guide section (3412) is provided with a locking section (3411) and a limiting part (3413) at both ends. The locking pin (341) passes through the mounting base (332) and is perpendicular to the guide rod (3311). The elastic element (342) is sleeved on the guide section (3412) and abuts against the limiting part (3413) and the mounting base (332). When the limiting part (3413) is subjected to external force, it drives the locking section (3411) to be inserted into the locking groove to lock the mounting base (332) to the guide rod (3311) or to separate the locking section (3411) from the locking groove.

6. The wafer clamping mechanism according to claim 5, characterized in that, The locking section (3411) is provided with a guide ramp (34111) at one end near the guide rod; and / or, the cross-section of the locking groove includes a V-groove.

7. The wafer clamping mechanism according to claim 5, characterized in that, The elastic element (342) includes at least one of a spring and an elastic sleeve.

8. The wafer clamping mechanism according to any one of claims 1 to 7, characterized in that, The pressing component (334) includes a rotary cylinder (3341) and an L-shaped pressure plate (3342). The rotary cylinder (3341) is mounted on the mounting base (332). The vertical section (33421) of the L-shaped pressure plate (3342) is connected to the rotary cylinder (3341) and switches between the clamping position and the unlocking position under the drive of the rotary cylinder (3341).

9. The wafer clamping mechanism according to claim 8, characterized in that, The vertical section (33421) is provided with an elongated hole (33422), the length direction of the elongated hole (33422) is consistent with the length direction of the vertical section (33421), and the vertical section (33421) is connected to the rotary cylinder (3341) through a locking member passing through the elongated hole (33422).

10. A wafer dicing machine, characterized in that, The wafer dicing machine includes the wafer clamping mechanism as described in any one of claims 1 to 9.

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