A solderless light source module

Abstract

The utility model discloses a kind of exempt from welding light source module including light source fixed subassembly and the light source rotating subassembly rotatable relative thereto, light source fixed subassembly includes radiator, rotating base and contact type PCB board, light source rotating subassembly includes light source base, light source, insulating partition, interconnection PCB board and rotating shell;The application is through rotating locking structure and pressure contact conduction design, completely abandon traditional soldering process, can realize the tool-free quick disassembly and multi-channel synchronous connection of light source, light source rotating subassembly is coaxially assembled with light source fixed subassembly through center positioning column, through rotating lock and rotating lock groove clamping, realize quick disassembly, avoid the cumbersome procedure of traditional screw disassembly;The first contact contact pin of interconnection PCB board bottom, second contact contact pin is directly conducted through pressure PCB terminal and the electrode of light source, save the soldering and disassembly and soldering procedure of wire, eliminate the risk of soldering point failure, reduce the difficulty of disassembly and soldering rework when maintaining;Modular design of each component can significantly improve assembly efficiency.

Description

Technical Field

[0001] This utility model relates to the field of lighting technology, specifically a solderless light source module. Background Technology

[0002] Currently, light source modules generally use soldering to weld external wires to the light source to achieve electrical connection, while screws and other fasteners are used to mechanically fix the light source mounting bracket to the heat sink. This technical solution requires multiple steps during later maintenance, including screw removal, wire desoldering, and wire resoldering. The operation process is cumbersome and inefficient, especially for multi-channel configuration light sources (such as dual-color temperature, RGB, or four-channel and above solutions). Because multiple wires need to be soldered and desoldered simultaneously, the assembly complexity and maintenance difficulty increase significantly, resulting in extremely low work efficiency. Utility Model Content

[0003] To solve the above problems, this utility model provides a solderless light source module, including a light source fixing component and a light source rotating component that can rotate relative to it, the light source rotating component being disposed on the light source fixing component;

[0004] The light source fixing assembly includes a heat sink, a rotating base, and a contact PCB board. The heat sink is equipped with a central positioning post. The rotating base and the contact PCB board are coaxially mounted on the central positioning post, and the contact PCB board is located on the rotating base. The bottom surface of the contact PCB board integrates surface mount terminals.

[0005] The rotating light source assembly includes a light source base, a light source, an insulating partition, an interconnecting PCB board, and a rotating housing. The insulating partition, interconnecting PCB board, and rotating housing all have through holes for the light source to pass through. The rotating housing is mounted on the light source base, forming a cavity with it. The light source, insulating partition, and interconnecting PCB board are stacked axially from bottom to top on the light source base and housed within the cavity. The light source base has a light source mounting slot, in which the light source is placed. The insulating partition is mounted on the light source base, and the interconnecting PCB board is stacked on top of it. The bottom surface of the interconnecting PCB board has a first contact pin and a second contact pin. The first contact pin passes through the insulating partition and the light source base sequentially, forming pressure contact with the top surface of the contacting PCB board. The second contact pin passes through the insulating partition and forms pressure contact with the electrodes of the light source. The side wall of the rotating housing has a rotating latch, which engages with a rotating locking groove on the side wall of the rotating base, achieving a rotatable connection and locking between the rotating light source assembly and the fixed light source assembly.

[0006] Preferably, the rotating base is provided with a terminal receiving groove, and the surface mount terminal is placed in the terminal receiving groove.

[0007] Preferably, the light source base has a plug at the bottom and the contact PCB board has slots around its perimeter, with the plug and slots engaging.

[0008] Preferably, the light source mounting slot has buckles on both sides, and the light source is fixed in the light source mounting slot by the buckles.

[0009] Preferably, a flexible silicone thermal pad is also provided in the light source mounting slot.

[0010] Preferably, a permanent magnet is embedded in the rotary lock, and a magnetic attraction engagement part is provided on the rotary lock groove, so that the permanent magnet and the magnetic attraction engagement part are magnetically attracted.

[0011] Preferably, both the first contact pin and the second contact pin are coated with a nano-silver coating.

[0012] Preferably, there are at least four first contact pins and four second contact pins, which are distributed in concentric circles, wherein the second contact pins are evenly distributed in the inner circle and the first contact pins are evenly distributed in the outer circle.

[0013] Preferably, the radiator has a microchannel phase change heat storage unit embedded inside.

[0014] Preferably, the surface of the radiator is provided with a biomimetic fin structure.

[0015] The beneficial effects are as follows: This application completely eliminates the traditional soldering process through a rotary locking structure and pressure contact conduction design, enabling tool-free rapid assembly and disassembly of the light source and synchronous connection of multiple channels. The rotating light source component is coaxially assembled with the fixed light source component through a central positioning post, and rapid assembly and disassembly are achieved through a rotary latch and a rotary locking groove, avoiding the cumbersome process of traditional screw removal. The first contact pin and the second contact pin at the bottom of the interconnect PCB board directly conduct the PCB terminal and the electrode of the light source through pressure, eliminating the soldering and desoldering process of the wires, eliminating the risk of solder joint failure, and reducing the difficulty of desoldering and rework during maintenance. The modular design of each component can significantly improve assembly efficiency. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is an assembly diagram of the present invention;

[0019] Figure 3 This is a schematic diagram of the exploded structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the bottom structure of a contact-type PCB board;

[0021] Figure 5 This is a schematic diagram of the bottom structure of an interconnect PCB board;

[0022] In the picture:

[0023] 1. Light source fixing assembly;

[0024] 11. Radiator; 111. Center positioning post;

[0025] 12. Rotating base; 121. Terminal receiving slot; 122. Rotating locking slot;

[0026] 13. Contact PCB board; 131. Surface mount terminal; 132. Slot;

[0027] 2. Light source rotation assembly;

[0028] 21. Light source base; 211. Light source mounting slot; 212. Clip; 213. Insert;

[0029] 22. Light source;

[0030] 23. Insulating partition;

[0031] 24. Interconnect PCB board; 241. First contact pin; 242. Second contact pin;

[0032] 25. Rotating outer casing; 251. Rotating latch. Detailed Implementation

[0033] The following drawings will disclose several embodiments of this utility model. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0034] It should be noted that all directional indicators in this utility model embodiment, such as up, down, left, right, front, back, etc., are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicator will also change accordingly.

[0035] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0036] Example

[0037] Please see Figures 1 to 2 , Figure 1 This is a schematic diagram of the overall structure of this utility model. Figure 2 This is a schematic diagram of the assembly of the present invention. This embodiment provides a solderless light source module, including a light source fixing component 1 and a light source rotating component 2 that can rotate relative to it, the light source rotating component 2 being disposed on the light source fixing component 1.

[0038] Please see Figure 3 , Figure 3 This is an exploded structural diagram of the present invention. The light source fixing assembly 1 includes a heat sink 11, a rotating base 12, and a contact PCB board 13. A microchannel phase change heat storage unit, such as a paraffin-based composite material, can be embedded inside the heat sink 11, allowing for rapid heat dissipation from the light source 22 through phase change heat absorption. The surface of the heat sink 11 can also be provided with a biomimetic fin structure, such as a honeycomb-shaped microchannel, to improve radiative heat dissipation efficiency. A central positioning post 111 is provided on the heat sink 11, which serves not only for structural positioning but also for heat conduction. The rotating base 12 and the contact PCB board 13 are coaxially mounted on the central positioning post 111. The contact PCB board 13 is located on the rotating base 12. In this application, the contact PCB board 13 is interpreted as a printed circuit board with contact points. Please refer to... Figure 4 , Figure 4 This is a schematic diagram of the bottom structure of the contact PCB board. The bottom surface of the contact PCB board 13 integrates surface mount terminals 131. External wires are connected to the surface mount terminals 131 through plug-in terminals to achieve electrical conduction. The surface mount terminals 131 can be designed to be one to four or even more, depending on the actual needs. The rotating base 12 is provided with a terminal receiving slot 121, and the surface mount terminals 131 are placed in the terminal receiving slot 121. The contact PCB board 13, the rotating base 12, and the heat sink 11 are then fixed by fasteners such as screws.

[0039] The rotating light source assembly 2 includes a light source base 21, a light source 22, an insulating partition 23, an interconnect PCB board 24, and a rotating housing 25. The insulating partition 23, the interconnect PCB board 24, and the rotating housing 25 are all provided with through holes for the light source 22 to pass through, ensuring unobstructed light output. In this embodiment, the light source 22 preferably uses an LED light source obtained using COB (Chip-on-Board) technology. The rotating housing 25 is disposed on the light source base 21, forming a cavity with the light source base 21. The light source 22, the insulating partition 23, and the interconnect PCB board 24 are sequentially stacked on the light source base 21 from bottom to top along the axial direction and housed within the cavity. Fixing components, such as screws, are then used to sequentially pass through the light source base 21, the insulating partition 23, the interconnect PCB board 24, and the rotating housing 25. The rotating housing 25 secures these components; the bottom of the light source base 21 has a plug 213, and the periphery of the contact PCB board 13 has slots 132. The plug 213 and slots 132 cooperate to define the relative position of the light source base 21 and the contact PCB board 13; the light source base 21 has a light source mounting groove 211 and clips 212 on opposite sides of the light source mounting groove 211. The light source 22 is placed in the light source mounting groove 211 and secured by the clips 212. A flexible silicone thermal pad can also be placed in the light source mounting groove 211 to improve the heat conduction efficiency of the light source 22 while reducing mechanical stress damage to the light source 22 caused by vibration. An insulating partition 23 is provided on the light source base 21. The insulating partition 23 can effectively prevent short circuits and ensure the safety and reliability of electrical connections. (See also...) Figure 3 Combined again Figure 5 , Figure 5This is a schematic diagram of the bottom structure of the interconnect PCB board. The interconnect PCB board 24 is stacked on the insulating partition 23. The bottom surface of the interconnect PCB board 24 is provided with a first contact pin 241 and a second contact pin 242. The surfaces of the first contact pin 241 and the second contact pin 242 are coated with a nano-silver coating to reduce contact resistance and improve the oxidation resistance of the pins, thus extending their service life. The first contact pin 241 passes through the insulating partition 23 and the light source base 21 in sequence and forms a pressure contact with the top surface of the contact PCB board 13, realizing a solderless conductive circuit between the light source 22 and the external wires. The second contact pin 242 passes through the insulating partition 23 and forms a pressure contact with the electrode of the light source 22. A more preferred embodiment is that there are at least four first contact pins 241 and four second contact pins 242, distributed in concentric circles, wherein the second contact pins 242 are evenly distributed in the inner circle and the first contact pins 241 are evenly distributed in the outer circle. This design helps to disperse current paths, reduce single-point contact resistance, and avoid localized overheating or arcing, significantly improving heat dissipation and conductivity. Furthermore, this design enhances system fault tolerance; even if individual pins experience poor contact due to vibration or wear, other pins can still maintain circuit continuity, improving electrical connection reliability. In addition, the concentrically distributed pins form a double-layer support structure, ensuring pressure is evenly applied to the contact surface and preventing localized stress concentration that could lead to pin deformation or wear. Of course, the first contact pin 241 and the second contact pin 242 can also be two, three, five, or even more, and these technical solutions should all fall within the scope of protection of this application. See also: Figure 3 The rotating housing 25 has a rotating buckle 251 on its side wall. The rotating buckle 251 engages with the rotating locking groove 122 on the side wall of the rotating base 12, thereby realizing the rotatable connection and locking between the light source rotating component 2 and the light source fixing component 1. In another technical solution of this embodiment, a permanent magnet can be embedded in the rotating buckle 251, and a magnetic attraction part can be provided on the rotating locking groove 122, so as to realize quick locking and unlocking.

[0040] In summary, this application completely eliminates the traditional soldering process through a rotary locking structure and pressure contact conduction design, enabling tool-free rapid assembly and disassembly of the light source and synchronous connection of multiple channels. The light source rotating assembly 2 is coaxially assembled with the light source fixing assembly 1 through the central positioning post 111, and is engaged with the rotary locking groove 122 through the rotary latch 251, achieving rapid assembly and disassembly and avoiding the cumbersome process of traditional screw removal. The first contact pin 241 and the second contact pin 242 at the bottom of the interconnect PCB board 24 directly conduct the PCB terminal to the electrode of the light source through pressure, eliminating the soldering and desoldering process of the wires, eliminating the risk of solder joint failure, and reducing the difficulty of desoldering and rework during maintenance. The modular design of each component can significantly improve assembly efficiency.

[0041] The above are merely embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A solderless light source module, characterized in that, It includes a light source fixing assembly and a light source rotating assembly that can rotate relative to it, the light source rotating assembly being disposed on the light source fixing assembly; The light source fixing assembly includes a heat sink, a rotating base, and a contact PCB board. The heat sink is provided with a central positioning post. The rotating base and the contact PCB board are coaxially mounted on the central positioning post, and the contact PCB board is located on the rotating base. The bottom surface of the contact PCB board integrates surface mount terminals. The light source rotation assembly includes a light source base, a light source, an insulating partition, an interconnect PCB board, and a rotating housing. The insulating partition, interconnect PCB board, and rotating housing all have through holes for the light source to pass through. The rotating housing is mounted on the light source base, forming a cavity with it. The light source, insulating partition, and interconnect PCB board are stacked axially from bottom to top on the light source base and housed within the cavity. The light source base has a light source mounting slot, and the light source is placed within this slot. The insulating partition is mounted on the light source base, and the interconnect PCB board is stacked on top of it. The bottom surface of the interconnect PCB board has a first contact pin and a second contact pin. The first contact pin passes through the insulating partition and the light source base sequentially and then forms pressure contact with the top surface of the contact PCB board. The second contact pin passes through the insulating partition and then forms pressure contact with the electrodes of the light source. The side wall of the rotating housing has a rotating latch, which engages with a rotating locking groove on the side wall of the rotating base, achieving a rotatable connection and locking between the light source rotation assembly and the light source fixing assembly.

2. The solderless light source module according to claim 1, characterized in that, The rotating base is provided with a terminal receiving groove, and the surface mount terminal is placed in the terminal receiving groove.

3. The solderless light source module according to claim 1, characterized in that, The light source base has a plug at the bottom, and the contact PCB board has slots around its perimeter, with the plug engaging with the slots.

4. The solderless light source module according to claim 1, characterized in that, The light source mounting slot has buckles on both sides, and the light source is fixed in the light source mounting slot by the buckles.

5. The solderless light source module according to claim 1, characterized in that, The light source mounting slot is also equipped with a flexible silicone thermal pad.

6. The solderless light source module according to claim 1, characterized in that, A permanent magnet is embedded in the rotary lock, and a magnetic attraction part is provided on the rotary lock groove, so that the permanent magnet and the magnetic attraction part are magnetically attracted to each other.

7. The solderless light source module according to claim 1, characterized in that, Both the first and second contact pins are coated with a nano-silver coating.

8. The solderless light source module according to claim 1, characterized in that, There are at least four first contact pins and four second contact pins, which are arranged in concentric circles, with the second contact pins evenly distributed on the inner circle and the first contact pins evenly distributed on the outer circle.

9. The solderless light source module according to claim 1, characterized in that, The radiator is embedded with a microchannel phase change heat storage unit.

10. The solderless light source module according to claim 1, characterized in that, The surface of the radiator is provided with a biomimetic fin structure.

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