energy storage device

Abstract

The utility model relates to the field of energy storage, concretely relates to a kind of energy storage equipment, comprising: semiconductor refrigerator, heat transfer assembly, energy storage piece;The semiconductor refrigerator has refrigeration surface and heating surface, the heat transfer assembly is connected with the refrigeration surface of the semiconductor refrigerator and / or the heating surface of the semiconductor, and the heat transfer assembly is used to conduct the cold quantity and / or heat generated by the semiconductor refrigerator to the energy storage piece, to make the phase-change energy storage piece store cold or heat.By heat transfer assembly and heating surface or refrigeration surface connection, or in heating surface or refrigeration surface simultaneously setting heat transfer assembly, phase-change energy storage piece is set on heat transfer assembly, so that it can be realized heat conduction by heat transfer assembly, and then make energy storage equipment realize refrigeration or heating, or realize refrigeration and heating simultaneously, to improve the energy storage efficiency of energy storage equipment;Phase-change energy storage piece can also be applied to heating or refrigeration equipment, to make relevant equipment realize refrigeration or heating.

Description

Technical Field

[0001] This utility model relates to the field of energy storage, specifically to an energy storage device. Background Technology

[0002] A thermal storage device is a system that uses specific devices to store temporarily unused or excess heat through certain thermal storage materials, and then releases it for use when needed. However, currently, the process of cold or heat storage requires two separate devices, which makes the equipment relatively large. Utility Model Content

[0003] Therefore, this utility model provides an energy storage device. The energy storage device can simultaneously store energy and store heat.

[0004] This utility model provides the following technical solution:

[0005] An energy storage device includes: a semiconductor cooler, a heat transfer component, and an energy storage element;

[0006] The semiconductor cooler has a cooling surface and a heating surface. The heat transfer component is connected to the cooling surface of the semiconductor cooler and / or the heating surface of the semiconductor. The heat transfer component is used to conduct the cold and / or heat generated by the semiconductor cooler to the energy storage device so that the phase change energy storage device can store cold or heat.

[0007] Furthermore, it also includes: the shell;

[0008] The housing has a cavity; the cooling surface of the semiconductor cooler is disposed in the cavity for storing cold in the phase change energy storage device, or the heating surface of the semiconductor cooler is disposed in the cavity for storing heat in the phase change energy storage device.

[0009] Furthermore, it also includes: the shell;

[0010] The housing includes a first accommodating cavity and a second accommodating cavity; both the first accommodating cavity and the second accommodating cavity are provided with phase change energy storage devices;

[0011] The heating surface of the semiconductor cooler is disposed in the first accommodating cavity for storing heat in the phase change energy storage device within the first accommodating cavity; the cooling surface of the semiconductor cooler is disposed in the second accommodating cavity for storing cold in the phase change energy storage device within the second accommodating cavity.

[0012] Furthermore, it also includes: baffles;

[0013] The baffle is disposed inside the housing, and the baffle divides the housing into a first accommodating cavity and a second accommodating cavity; the baffle is also provided with a mounting part, which is used to mount the semiconductor cooler;

[0014] The heating surface of the semiconductor cooler is located in the first accommodating cavity, and the cooling surface of the semiconductor cooler is located in the second accommodating cavity.

[0015] Furthermore, both the first accommodating cavity and the second accommodating cavity are provided with support components, which are used to install phase change energy storage devices.

[0016] Furthermore, the support assembly includes: a first support member and a second support member;

[0017] The first support member is spaced apart within the housing along a first direction, and the second support member is spaced apart within the housing along a second direction.

[0018] Furthermore, it also includes: a first driving component;

[0019] The first driving member is disposed in the first accommodating cavity and / or the second accommodating cavity, and the first support member is provided with a plurality of hollowed-out portions. The first driving member is used to drive the airflow in the first accommodating cavity and / or the second accommodating cavity.

[0020] Furthermore, the heat transfer component includes: a heat-conducting element and a heat-collecting element;

[0021] Both the cooling surface and the heating surface abut against the heat collector, and the heat-conducting component is connected to the heat collector, the first support component, and the second support component, respectively.

[0022] Furthermore, the shell has a medium cavity, the first support member has a flow guiding cavity, the flow guiding cavity is connected to the medium cavity, and the medium cavity is provided with a heat exchange medium.

[0023] Furthermore, it also includes: a second drive unit;

[0024] The second driving member is disposed in the medium cavity, and the second driving member is used to drive the heat exchange medium to flow in the medium cavity and the flow guiding cavity.

[0025] Energy storage devices include: semiconductor coolers, heat transfer components, and energy storage components. Semiconductor coolers have cooling and heating surfaces, which are connected to the heating or cooling surfaces through heat transfer components, or heat transfer components are installed on both the heating and cooling surfaces. Phase change energy storage components are also installed on the heat transfer components. In this way, heat conduction can be achieved through the heat transfer components, thereby enabling the energy storage device to achieve cooling or heating, or simultaneous cooling and heating, so as to improve the energy storage efficiency of the energy storage device. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 One of the structural schematic diagrams of the energy storage device provided in the embodiments of this utility model;

[0028] Figure 2 A second schematic diagram of the structure of the energy storage device provided in this embodiment of the utility model;

[0029] Figure 3 The third schematic diagram of the energy storage device provided in the embodiment of this utility model;

[0030] Figure 4 This is a schematic diagram of the structure of the shell and support assembly provided in an embodiment of the present utility model;

[0031] Figure 5 A schematic diagram of the structure of the shell and heat transfer assembly provided in an embodiment of this utility model;

[0032] Figure 6 This is a schematic diagram of the structure of the heat transfer component provided in an embodiment of the present utility model;

[0033] Figure 7 A schematic diagram of the structure of the first support member provided in an embodiment of this utility model.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100 - Energy storage device; 10 - Semiconductor cooler; 11 - Cooling surface; 12 - Heating surface; 20 - Heat transfer component; 21 - Heat conductor; 22 - Heat collector; 30 - Energy storage component; 40 - Shell; 41 - Cavity; 42 - First accommodating cavity; 43 - Second accommodating cavity; 44 - Medium cavity; 50 - Baffle; 51 - Mounting part; 60 - Support component; 61 - First support member; 611 - Hollowed-out part; 612 - Flow guide cavity; 62 - Second support member; 70 - First driving member; 71 - Second driving member. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0038] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0039] A thermal storage device is a system that uses specific devices to store temporarily unused or excess heat through certain thermal storage materials, and then releases it for use when needed. However, currently, the process of cold or heat storage requires two separate devices, which makes the equipment relatively large. At the same time, current cold or heat storage devices have low energy storage capacity.

[0040] Therefore, this embodiment provides an energy storage device. The energy storage device can simultaneously store energy and store heat.

[0041] Please see Figure 1 An energy storage device 100 includes: a semiconductor cooler 10, a heat transfer component 20, and an energy storage component 30;

[0042] The semiconductor cooler 10 has a cooling surface 11 and a heating surface 12. The heat transfer component 20 is connected to the cooling surface 11 and / or the heating surface 12 of the semiconductor cooler 10. The heat transfer component 20 is used to conduct the cold and / or heat generated by the semiconductor cooler 10 to the energy storage device 30 so that the phase change energy storage device 30 stores cold or heat.

[0043] The energy storage device 100 includes: a semiconductor cooler 10, a heat transfer component 20, and an energy storage component 30. The semiconductor cooler 10 has a cooling surface 11 and a heating surface 12. It is connected to the heating surface 12 or the cooling surface 11 through the heat transfer component 20, or the heat transfer component 20 is provided on both the heating surface 12 and the cooling surface 11. The phase change energy storage component 30 is also provided on the heat transfer component 20. In this way, heat conduction can be achieved through the heat transfer component 20, thereby enabling the energy storage device 100 to achieve cooling or heating, or simultaneous cooling and heating, so as to improve the energy storage efficiency of the energy storage device 100.

[0044] Please see Figure 2 In some embodiments, it further includes: a housing 40;

[0045] The housing 40 has a cavity 41; the cooling surface 11 of the semiconductor cooler 10 is disposed in the cavity 41 for storing cold in the phase change energy storage device 30, or the heating surface 12 of the semiconductor cooler 10 is disposed in the cavity 41 for storing heat in the phase change energy storage device 30.

[0046] Understandably, the energy storage device 100 includes a housing 40, which has a cavity 41. The cooling surface 11 of the semiconductor is disposed in the cavity 41. The cooling surface 11 of the semiconductor cooler 10 is connected to the heat transfer component 20. In this way, the cooling energy generated by the semiconductor cooler 10 can be transferred to the housing 40 through the heat transfer component 20 to store cold for the phase change energy storage device 30 disposed in the housing 40.

[0047] Understandably, the heating surface 12 of the semiconductor cooler 10 is connected to the heat transfer component 20, so that the heat generated by the semiconductor cooler 10 can be conducted to the housing 40 through the heat transfer component 20, so as to store heat for the phase change energy storage device 30 set in the housing 40.

[0048] Please see Figure 3 In some embodiments, it further includes: a housing 40;

[0049] The housing 40 includes a first accommodating cavity 42 and a second accommodating cavity 43; both the first accommodating cavity 42 and the second accommodating cavity 43 are provided with a phase change energy storage device 30;

[0050] The heating surface 12 of the semiconductor cooler 10 is disposed in the first accommodating cavity 42 for storing heat in the phase change energy storage device 30 in the first accommodating cavity 42; the cooling surface 11 of the semiconductor cooler 10 is disposed in the second accommodating cavity 43 for storing cold in the phase change energy storage device 30 in the second accommodating cavity 43.

[0051] Understandably, the housing 40 includes a first accommodating cavity 42 and a second accommodating cavity 43, and a phase change energy storage device 30 is provided in both the first accommodating cavity 42 and the second accommodating cavity 43; the heating surface 12 of the semiconductor cooler 10 is located in the first accommodating cavity 42, and the heating surface 12 can conduct heat to the first accommodating cavity 42 through airflow heat exchange, so that the temperature in the first accommodating cavity 42 can be raised and the phase change energy storage device 30 can store energy, or the heat can be conducted to the phase change energy storage device 30 located in the first accommodating cavity 42 by connecting with the heat-conducting component 21, so as to realize the energy storage of the phase change energy storage device 30.

[0052] Please see Figure 3 In some embodiments, it also includes: a baffle 50;

[0053] The baffle 50 is disposed inside the housing 40, and the baffle 50 divides the housing 40 into a first accommodating cavity 42 and a second accommodating cavity 43; the baffle 50 is also provided with a mounting part 51, which is used to mount the semiconductor cooler 10.

[0054] The heating surface 12 of the semiconductor cooler 10 is located in the first accommodating cavity 42, and the cooling surface 11 of the semiconductor cooler 10 is located in the second accommodating cavity 43.

[0055] Understandably, a baffle 50 is provided inside the housing 40, dividing the housing 40 into a first accommodating cavity 42 and a second accommodating cavity 43. A mounting portion 51 is provided on the baffle 50, and the thermoelectric cooler 10 is mounted on the mounting portion 51. After the thermoelectric cooler 10 is mounted on the mounting component, the heating surface 12 of the thermoelectric cooler 10 faces the first accommodating cavity 42, and the cooling surface 11 of the thermoelectric cooler 10 faces the second accommodating cavity 43. Energy storage components 30 are provided in both the second accommodating cavity 43. This allows the two surfaces of the semiconductor cooler 10 to store heat or cold for the phase change energy storage component 30, respectively. In this way, the cooling surface 11 and the heating surface 12 of the semiconductor cooler 10 can simultaneously store energy for the phase change energy storage component 30 (the heating surface 12 heats the phase change energy storage component 30 in the first accommodating cavity 42 and the cooling surface 11 cools the phase change energy storage component 30 in the second accommodating cavity 43), thereby improving the energy storage efficiency of the energy storage component 30.

[0056] Please see Figure 4 In some embodiments, a support assembly 60 is provided in both the first accommodating cavity 42 and the second accommodating cavity 43, and the support assembly 60 is used to install the phase change energy storage device 30.

[0057] Understandably, a support assembly 60 is provided in both the first accommodating cavity 42 and the second accommodating cavity 43. The support assembly 60 divides the first accommodating cavity 42 and the second accommodating cavity 43 into multiple installation spaces. Each of the multiple installation spaces is used to install the energy storage component 30. This allows the first accommodating cavity 42 and the second accommodating cavity 43 to store more energy storage components 30, thereby increasing the overall energy storage capacity of the energy storage device 100. At the same time, the simultaneous energy storage of multiple energy storage components 30 can also improve the energy storage efficiency of the energy storage device 100.

[0058] Please see Figure 4 In some embodiments, the support component 60 includes: a first support member 61 and a second support member 62;

[0059] The first support member 61 is disposed at intervals along a first direction within the housing 40, and the second support member 62 is disposed at intervals along a second direction within the housing 40.

[0060] Understandably, the support assembly 60 includes: a first support member 61 and a second support member 62, wherein the first support member 61 is along a first direction (i.e., as shown in the image). Figure 4 The second support components 60 are spaced apart in the left and right directions as shown, and spaced apart along the second direction (i.e., as shown). Figure 4 (As shown in the vertical direction), both ends of the second support rod are set on the first support rod, so that the first support member 61 and the second support member 62 form multiple spaces that can accommodate the energy storage device 30. The accommodating space formed by the first support member 61 and the second support member 62 can also allow the energy storage device 100 to accommodate more phase change energy storage devices 30. After the phase change energy storage device 30 is installed in the first accommodating cavity 42, it can store energy. After the energy storage is completed, it can be taken out from the first accommodating cavity 42. When in use, the energy storage device 30 can be installed in the required place. After the energy storage device 30 is installed in the first accommodating cavity 42, the semiconductor cooler 10 can be turned on, so that the heating surface 12 of the semiconductor cooler 10 emits heat and the cooling surface 11 generates cold energy, which is absorbed and stored by the energy storage device 30, thus realizing energy storage.

[0061] Please see Figure 4 and Figure 7 In some embodiments, it further includes: a first driving member 70;

[0062] The first driving member 70 is disposed in the first accommodating cavity 42 and / or the second accommodating cavity 43, and the first support member 61 is provided with a plurality of hollowed-out portions 611. The first driving member 70 is used to drive the airflow in the first accommodating cavity 42 and / or the second accommodating cavity 43.

[0063] Understandably, the first support member 61 is provided with multiple hollowed-out portions 611. The hollowed-out portions 611 are to facilitate the flow of air in the accommodating cavity. To further facilitate the air flow, the phase change energy storage device 30 can be positioned in the middle of the first support member 61 so that the airflow can pass through the hollowed-out portions 611 at both ends of the first support member 61. In order to improve the efficiency of airflow, a first driving member 70 is also provided in the first accommodating cavity 42. The first driving member 70 drives the airflow in the first accommodating cavity 42 to flow and exchange heat with the heating surface 12 of the semiconductor cooler 10, thereby improving the energy storage effect of the energy storage device 100.

[0064] Please see Figure 5 and Figure 6 In some embodiments, the heat transfer component 20 includes: a heat-conducting element 21 and a heat-collecting element 22;

[0065] The cooling surface 11 and the heating surface 12 are both in contact with the heat collector 22, and the heat conductor 21 is connected to the heat collector 22, the first support 61, and the second support 62 respectively.

[0066] Understandably, the heat-conducting component includes: a heat-conducting element 21 and a heat-collecting element 22; both the cooling surface 11 and the heating surface 12 are connected to the heat-collecting element 22, so that the heat-collecting element 22 can absorb the energy from the heating surface 12 and the cooling surface 11. The heat-collecting element 22 is connected to the heat-conducting element 21, and the heat-conducting element 21 is connected to the first support 61 and the second support 62. After the heat-collecting element 22 absorbs the heat from the cooling surface 11 and / or the heating surface 12, the heat is conducted to the first support 61 and the second support 62 through the heat-conducting element 21. This achieves heat conduction, so that the heat can be conducted to the first support 61 and the second support 62 more evenly, thereby improving the energy storage effect of the energy storage device 100.

[0067] Please see Figure 5 In some embodiments, the housing 40 has a medium cavity 44, the first support member 61 has a flow guiding cavity 612, the flow guiding cavity 612 is connected to the medium cavity 44, and the medium cavity 44 is provided with a heat exchange medium.

[0068] Understandably, a medium cavity 44 is provided around the side wall of the shell 40, and a flow guide cavity 612 is provided in the first support member 61. By connecting the medium cavity 44 and the flow guide cavity 612, the heat exchange medium in the medium cavity 44 can flow into the flow guide cavity 612. This allows the heat exchange medium to flow in the flow guide cavity 612 and the medium cavity 44, thereby raising the temperature of the first shell 40 and the first support member 61. This allows the temperature of the energy storage device 100 to rise more quickly, thereby improving the energy storage efficiency.

[0069] Please see Figure 6 In some embodiments, it further includes: a second driving element 71;

[0070] The second driving member 71 is disposed in the medium cavity 44, and the second driving member 71 is used to drive the heat exchange medium to flow in the medium cavity 44 and the flow guiding cavity 612.

[0071] Understandably, the second driving component 71 can be set in the medium cavity 44 or the flow guiding cavity 612. The second driving component 71 can drive the heat exchange medium in the medium cavity 44 and the flow guiding cavity 612 to flow. The heat exchange medium can be heated. In this way, the temperature inside the shell 40 can be raised relatively quickly by driving the heat exchange medium through the circulation component, thereby improving the energy storage efficiency.

[0072] In some embodiments, a heat insulation layer is provided on the outer periphery of the housing 40.

[0073] Understandably, a heat insulation layer is provided on the outside of the housing 40. The heat insulation layer can isolate the temperature inside the housing 40. Under the high temperature state of the housing 40, the heat insulation layer can prevent the heat inside the housing 40 from leaking out, avoid the temperature dissipation inside the housing 40, reduce the energy storage efficiency of the energy storage device 30 inside the housing 40, and reduce the waste of thermal energy.

[0074] In some embodiments, the phase change energy storage device 30 may be made of a phase change material, such as sodium acetate trihydrate or paraffin. Sodium acetate trihydrate or paraffin is prepared by microencapsulation technology, that is, the phase change material is encapsulated in tiny capsules.

[0075] When the phase change energy storage device 30 absorbs heat, the ambient temperature rises to the phase change temperature of the phase change material, at which point the phase change material inside the capsule begins to absorb heat. The heat absorbed by the phase change material causes it to change from a solid to a liquid state; this process is called melting. During this process, the temperature of the phase change material inside the capsule remains relatively constant because the absorbed heat is used to overcome intermolecular forces rather than to raise the temperature.

[0076] When the phase change energy storage device 30 releases heat, the liquid phase change material inside the capsule begins to release heat when the ambient temperature drops below the phase change temperature of the phase change material. The phase change material releases heat and changes from a liquid to a solid state; this process is called solidification. Similarly, the temperature remains relatively constant during this process. In this utility model, references to "embodiment" or "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The appearance of these phrases in various places in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this utility model can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this utility model can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this utility model, provided there is no contradiction between them.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solution of this utility model should not depart from the spirit and scope of the technical solution of this utility model.

Claims

1. An energy storage device, characterized in that, include: Semiconductor refrigerators, heat transfer components, and energy storage devices; The semiconductor cooler has a cooling surface and a heating surface. The heat transfer component is connected to the cooling surface of the semiconductor cooler and / or the heating surface of the semiconductor. The heat transfer component is used to conduct the cold and / or heat generated by the semiconductor cooler to the energy storage device so that the phase change energy storage device can store cold or heat.

2. The energy storage device according to claim 1, characterized in that, Also includes: case; The housing has a cavity; the cooling surface of the semiconductor cooler is disposed in the cavity for storing cold in the phase change energy storage device, or the heating surface of the semiconductor cooler is disposed in the cavity for storing heat in the phase change energy storage device.

3. The energy storage device according to claim 1, characterized in that, Also includes: case; The housing includes a first accommodating cavity and a second accommodating cavity; both the first accommodating cavity and the second accommodating cavity are provided with phase change energy storage devices; The heating surface of the semiconductor cooler is disposed in the first accommodating cavity for storing heat in the phase change energy storage device within the first accommodating cavity; the cooling surface of the semiconductor cooler is disposed in the second accommodating cavity for storing cold in the phase change energy storage device within the second accommodating cavity.

4. The energy storage device according to claim 2, characterized in that, Also includes: baffle; The baffle is disposed inside the housing, and the baffle divides the housing into a first accommodating cavity and a second accommodating cavity; the baffle is also provided with a mounting part, which is used to mount the semiconductor cooler; The heating surface of the semiconductor cooler is located in the first accommodating cavity, and the cooling surface of the semiconductor cooler is located in the second accommodating cavity.

5. The energy storage device according to claim 4, characterized in that, Both the first accommodating cavity and the second accommodating cavity are provided with support components, which are used to install phase change energy storage devices.

6. The energy storage device according to claim 5, characterized in that, The support assembly includes: a first support member and a second support member; The first support member is spaced apart within the housing along a first direction, and the second support member is spaced apart within the housing along a second direction.

7. The energy storage device according to claim 6, characterized in that, Also includes: First driving component; The first driving member is disposed in the first accommodating cavity and / or the second accommodating cavity, and the first support member is provided with a plurality of hollowed-out portions. The first driving member is used to drive the airflow in the first accommodating cavity and / or the second accommodating cavity.

8. The energy storage device according to claim 7, characterized in that, The heat transfer assembly includes: a heat-conducting component and a heat-collecting component; Both the cooling surface and the heating surface abut against the heat collector, and the heat-conducting component is connected to the heat collector, the first support component, and the second support component, respectively.

9. The energy storage device according to claim 8, characterized in that, The shell has a medium cavity, the first support member has a flow guiding cavity, the flow guiding cavity is connected to the medium cavity, and the medium cavity is provided with a heat exchange medium.

10. The energy storage device according to claim 9, characterized in that, Also includes: Second drive unit; The second driving member is disposed in the medium cavity, and the second driving member is used to drive the heat exchange medium to flow in the medium cavity and the flow guiding cavity.

Images