A kind of fixed device of heat conducting adhesive tape heat conducting performance test and cooperating structure with adhesive tape

By using a combination of a pad and a cover plate to hold the release film, the problems of sample flatness and easy peeling in thermal conductive tape testing are solved, achieving accurate and efficient thermal conductivity testing.

CN224303612UActive Publication Date: 2026-05-29JIANGYIN TONGLI OPTOELECTRONICS TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGYIN TONGLI OPTOELECTRONICS TECH
Filing Date
2025-03-31
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing thermal conductivity testing devices for thermally conductive tapes have difficulty maintaining sample flatness, leading to inaccurate testing. Furthermore, the tape is difficult to peel off from the temperature testing probe, which can easily damage the probe.

Method used

The sample to be tested and the sensor sheet are held together by a pad and a cover plate. The release film on the surface of the pad maintains the flatness of the test state. The probe is fixed by a limiting component. A protective film is used to prevent the tape from directly contacting the sensor, which simplifies the installation and makes it easy to peel off.

Benefits of technology

It improves the accuracy and efficiency of thermal conductivity testing, prevents wrinkles and damage, simplifies preparation, and protects the temperature test probe.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of heat-conducting adhesive tape heat-conducting performance test fixing device and with adhesive tape cooperation structure, comprising: pedestal, with the sample bearing plane, and the gasket and cover plate located above the sample bearing plane;Limiting piece, with pedestal connection, for fixed temperature test probe;Clamping channel, set between gasket and cover plate, extend along first direction, for clamping the sensor wafer of sample to be measured and temperature test probe;Gasket and cover plate can be removed and set on sample bearing plane, at least the surface of cover plate towards gasket is provided with release film, release film includes first release layer and second release layer respectively connected with cover plate and sample to be measured, and the release force of first release layer is greater than the release force of second release layer. By gasket and cover plate clamping sample to be measured and sensor wafer, in combination with the release film set on gasket surface, the flatness of test state is maintained, prevent the appearance of both wrinkle, difficult to peel phenomenon, gasket and cover plate can be removed and set to facilitate the installation of sample to be measured.
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Description

Technical Field

[0001] This utility model relates to the technical field of auxiliary equipment for thermal conductivity testing, and in particular to a fixing device for testing the thermal conductivity performance of thermally conductive tape and a structure that works in conjunction with the tape. Background Technology

[0002] When determining the thermal conductivity of thermally conductive tape materials, the fixing device for the test sample is often rudimentary, making it difficult to ensure its flatness. Wrinkled test samples compromise the accuracy of the test. Furthermore, existing commonly used methods for testing thermal conductivity involve directly attaching the thermally conductive adhesive layer of the tape to the temperature test probe. While this provides accurate test values, the highly viscous adhesive is difficult to peel off from the temperature test probe, potentially damaging it.

[0003] Therefore, it is necessary to improve the existing fixing device for testing the thermal conductivity of thermally conductive tape. Utility Model Content

[0004] One of the objectives of this invention is to overcome the defects in the existing technology and provide a fixing device for testing the thermal conductivity of thermally conductive tape. The device uses a pad and a cover plate to clamp the sample to be tested and the sensor sheet. Combined with the release film on the surface of the pad, the flatness of the test state is maintained, and the wrinkles and difficulty in peeling are prevented. Both the pad and the cover plate can be removed to facilitate the installation of the sample to be tested and improve the efficiency of the preparation work during performance testing.

[0005] To achieve the above technical effects, the technical solution of this utility model is: a fixing device for testing the thermal conductivity of thermally conductive tape, comprising:

[0006] The base has a sample support plane, and a pad and a cover plate located above the sample support plane;

[0007] A limiting component, connected to the base, is used to fix the temperature test probe;

[0008] A clamping channel, disposed between the pad and the cover plate, extends along a first direction and is used to clamp the sample to be tested and the sensor sheet of the temperature test probe;

[0009] Both the pad and the cover are removable and disposed on the sample support plane. At least the surface of the cover facing the pad is provided with a release film. The release film includes a first release layer and a second release layer that are respectively connected to the cover and the sample to be tested. The release force of the first release layer is greater than the release force of the second release layer.

[0010] A preferred technical solution is that the base is provided with a rotating shaft, and both the pad and the cover plate are provided with through holes that fit into the rotating shaft.

[0011] A preferred technical solution is that the pad includes several unit pads, and all of the several unit pads are rotatably connected to the rotating shaft.

[0012] A preferred technical solution is that the limiting member includes a slider for fixing the fixing head of the temperature test probe, the sliders are arranged in pairs, a first clamping gap extending in a first direction is provided between the pairs of sliders, the sample support plane is provided with a guide and an elastic member, the guide extends in the direction where the clamping gap tends to be larger, the slider and the guide are in concave-convex cooperation, and the elastic member has compression deformation opposite to the slider.

[0013] A preferred technical solution is that the limiting member further includes a limiting groove for fixing the lead portion of the temperature test probe. The limiting grooves are arranged in pairs, and a second clamping gap extending in a first direction is provided between the pairs of limiting grooves. The pairs of limiting grooves are detachably connected, and at least one of the pairs of limiting grooves is connected to the base.

[0014] A preferred technical solution is that the extending directions of the first clamping gap and the second clamping gap are collinear with the extending direction of the clamping channel.

[0015] A preferred technical solution is that the groove wall of the limiting groove is provided with an elastic layer.

[0016] The second objective of this utility model is to overcome the defects existing in the prior art and provide a thermal conductive tape thermal conductivity test fixing device and tape matching structure, wherein the tape is the test sample and the test sample is disposed on the two surfaces of the sensor sheet of the temperature test probe.

[0017] A preferred technical solution is that the sample to be tested includes a thermally conductive adhesive layer, and a protective film is disposed on the surface of the thermally conductive adhesive layer, with the protective film facing the sensor sheet.

[0018] A preferred technical solution is that the thickness of the protective film is less than 0.2 μm.

[0019] The advantages and beneficial effects of this utility model are as follows:

[0020] The thermal conductivity tape test fixing device has a reasonable structure. The test sample and sensor sheet are clamped by a pad and a cover plate to maintain the flatness of the test state and prevent wrinkles. Both the pad and the cover plate can be removed to facilitate the installation of the test sample and improve the efficiency of the preparation work during performance testing. The release film on the surface of the pad ensures stable adhesion and easy peeling of the test sample, while ensuring that the test sample remains flat. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the thermal conductivity test and fixing device for thermally conductive tape before assembly.

[0022] Figure 2 This is a schematic diagram of the assembled structure of the thermal conductivity testing and fixing device for thermally conductive tape of this utility model;

[0023] Figure 3 This is a schematic diagram of the structure of the sample to be tested.

[0024] In the diagram: 1. Base; 3. Limiting component; 2. Clamping channel; 4. Temperature test probe; 5. Sample to be tested; 10. Sample support plane; 11. Rotating shaft; 20. Pad; 21. Cover plate; 31. Slider; 32. Slider; 33. Elastic component; 34. Elastic layer; 40. Sensor sheet; 41. Fixing head; 42. Lead wire section; 50. Protective film; 51. Thermally conductive adhesive layer; 201. Perforation. Detailed Implementation

[0025] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings and examples. The following examples are only used to more clearly illustrate the technical solution of this utility model and should not be construed as limiting the scope of protection of this utility model.

[0026] The terms "above" and "surface" refer to the normal operating state of the thermal conductivity test fixing device for thermal conductive tape, and are used only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model.

[0027] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0028] like Figures 1-2 As shown, the structure of the temperature test probe 4 includes a sensor sheet 40, a fixing head 41 for fixing the sensor sheet, and a heat transfer lead part 42 connected in sequence. The lead part 42 is not fully shown.

[0029] The thermal conductivity tape fixing device for testing thermal conductivity includes a base 1, a limiting member 3, and a clamping channel 2. The base 1 has a sample support plane 10, and a pad 20 and a cover plate 21 located above the sample support plane 10. The limiting member 3 is connected to the base 1 and is used to fix the temperature test probe 4. The clamping channel 2 is disposed between the pad 20 and the cover plate 21 and extends along a first direction to clamp the sample to be tested 6 and the sensor sheet 40 of the temperature test probe 4. Both the pad 20 and the cover plate 21 are removable and disposed on the sample support plane 10. At least the surface of the cover plate 21 facing the pad 20 is provided with a release film (not shown). The release film includes a first release layer and a second release layer connected to the cover plate 21 and the sample to be tested, respectively. The release force of the first release layer is greater than the release force of the second release layer. The first direction is the length extension direction of the sensor sheet 40 during the performance testing of the sample.

[0030] The test sample and sensor sheet are held by the pad 20 and the cover plate 21 to maintain the flatness of the test state and prevent wrinkles. Both the pad 20 and the cover plate 21 can be removed to facilitate the installation of the test sample and improve the efficiency of preparation work during performance testing. The release film on the surface of the pad ensures stable adhesion and easy peeling of the test sample, while ensuring that the test sample remains flat.

[0031] To optimize the assembly structure of the pad 20 and the cover 21, the base 1 is provided with a rotating shaft 11, and both the pad 20 and the cover 21 are provided with through holes 201 that fit into the rotating shaft 11. The through holes 201 allow the pad 20 and the cover 21 to be mounted on the sample support plane 10, and the pad 20 and the cover 21 rotate around the axis of the rotating shaft 11, so that they are positioned above the sample support plane 10 and form a clamping channel 2. Specifically, the pad 20 is first fitted onto the rotating shaft 11, and the first sample to be tested is placed on its surface facing the cover plate 21. The shaft is then rotated to the sample support plane 10. Next, the sensor sheet 40 of the temperature testing probe 4 is stacked on top of the first sample to be tested, with the thermally conductive adhesive layer of the first sample facing the sensor sheet 40. Then, the second sample to be tested is placed on the release film of the cover plate 21. The cover plate 21 with the second sample is then fitted onto the rotating shaft 11, rotated, and placed over the sensor sheet 40, with the release film surface of the cover plate 21 facing the pad 20. To further press and tighten the sample, a weight is placed on the surface of the cover plate 21 away from its release film. Both the pad 20 and the cover plate 21 are non-thermally and electrically conductive plastic plates, while the weight can be a metal block.

[0032] Since the fixing head 41, which fixes the sensor sheet, covers one end of the sensor sheet 40, the thickness of the fixing head 41 is greater than the thickness of the sensor sheet 40. To ensure the flatness of the sensor sheet 40 and prevent creases from forming after performance testing, thus affecting its testing function, the pad 20 further includes several unit pads (not shown), all of which are rotatably connected to the rotating shaft 11. The total thickness of the pad 20 can be flexibly adjusted using the unit pads to match the thickness difference between the fixing head 41 and the sensor sheet 40.

[0033] To initially fix the temperature test probe 4, the limiting member 3 includes a slider 31 for fixing the fixing head 41 of the temperature test probe. The sliders 31 are arranged in pairs, and a first clamping gap (unmarked) extending in a first direction is provided between the pairs of sliders 31. The sample support plane 10 is provided with a guide (unmarked) and an elastic member 33. The guide extends in the direction where the clamping gap tends to be larger. The slider 31 and the guide are in concave-convex fit, and the elastic member 33 has compression deformation away from the slider 31. Among them, the guide is a concave guide groove, which can maintain the flatness of the sample support plane 10 and ensure that the placed temperature test probe 4 also remains flat. The slider 31 is suitable for fixing heads 41 of different widths. Combined with the elastic member 33, it plays a role in stabilizing the fixing head. The slider 31 also plays a limiting role, ensuring that the pad 20 and the cover 21 rotate around the axis of the rotating shaft 11 to the area of ​​the sample support plane 10 close to the fixing head 41.

[0034] To further secure the temperature test probe and prevent it from shifting or warping during performance testing, the limiting member 3 also includes a limiting groove 32 for securing the lead portion 42 of the temperature test probe 4. The limiting grooves 32 are arranged in pairs, with a second clamping gap (not marked) extending in a first direction between them. The pairs of limiting grooves 32 are detachably connected, and at least one of them is connected to the base 1. The pairs of limiting grooves 32 can be arranged opposite each other along the plumb line, with the lower limiting groove fixedly connected to the base 1, and the upper limiting groove detachably connected to the lower limiting groove, specifically through a bolt (not marked) and a nut (not shown) threaded connection. The pairs of limiting grooves 32 can also be arranged opposite each other in a horizontal direction, both engaging with and slidingly connecting to the base 1, thus accommodating lead portions 42 of different thicknesses. Furthermore, the extending directions of the first and second clamping gaps are collinear with the extending direction of the clamping channel 2. Maintaining collinearity further ensures the flatness of the temperature test probe and the sample under test, and also facilitates the assembly of the temperature test probe, keeping it flush and preventing warping or displacement of components and the sample under test during assembly, which could lead to creases or wrinkles. Even further, the groove wall of the limiting groove 32 is provided with an elastic layer 34. This allows for adaptation to lead wires 42 of different thicknesses and makes the installation more stable.

[0035] like Figure 3 As shown, in the structure of the fixing device and tape for testing the thermal conductivity of thermally conductive tape, the tape is the test sample 5, which is disposed on both surfaces of the sensor sheet 40. The test sample 5 includes a thermally conductive adhesive layer 51, and a protective film 50 is provided on the surface of the thermally conductive adhesive layer 51, with the protective film 50 facing the sensor sheet 40. The thickness of the protective film 50 is less than 0.2 μm. Whether the test sample 5 is a single-sided or double-sided tape, its adhesive layer is always a thermally conductive adhesive layer 51, with the protective film 50 on the surface of the thermally conductive adhesive layer 51 facing the sensor sheet 40. The protective film 50 effectively prevents the thermally conductive adhesive layer 51 of the tape from directly contacting the sensor sheet 40 and making it difficult to peel off, effectively solving the problem of damage to the sensor sheet during peeling due to the strong adhesive force of the tape. Tests show that the thickness of the protective film 50 is 0.6 μm, 1.4 μm, or 1.9 μm, and it does not affect the test value of the thermal conductivity of the test sample. The protective film is a biaxially oriented polyester film.

[0036] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A fixing device for testing the thermal conductivity of thermally conductive tape, characterized in that, include: The base has a sample support plane, and a pad and a cover plate located above the sample support plane; A limiting component, connected to the base, is used to fix the temperature test probe; A clamping channel, disposed between the pad and the cover plate, extends along a first direction and is used to clamp the sample to be tested and the sensor sheet of the temperature test probe; Both the pad and the cover are removable and disposed on the sample support plane. At least the surface of the cover facing the pad is provided with a release film. The release film includes a first release layer and a second release layer that are respectively connected to the cover and the sample to be tested. The release force of the first release layer is greater than the release force of the second release layer.

2. The thermal conductivity testing and fixing device for thermally conductive tape according to claim 1, characterized in that, The base is provided with a rotating shaft, and both the pad and the cover plate are provided with through holes that fit into the rotating shaft.

3. The thermal conductivity testing and fixing device for thermally conductive tape according to claim 2, characterized in that, The pad includes several unit pads, and each of the several unit pads is rotatably connected to the rotating shaft.

4. The thermal conductivity testing and fixing device for thermally conductive tape according to claim 1, characterized in that, The limiting member includes a slider for fixing the fixing head of the temperature test probe. The sliders are arranged in pairs, and a first clamping gap extending in a first direction is provided between the pairs of sliders. The sample support plane is provided with a guide and an elastic member. The guide extends in the direction where the clamping gap tends to increase. The slider and the guide are in concave-convex fit. The elastic member has compression deformation opposite to the slider.

5. The thermal conductivity testing and fixing device for thermally conductive tape according to claim 4, characterized in that, The limiting member further includes a limiting groove for fixing the lead portion of the temperature test probe. The limiting grooves are arranged in pairs, and a second clamping gap extending in a first direction is provided between the pairs of limiting grooves. The pairs of limiting grooves are detachably connected, and at least one of the pairs of limiting grooves is connected to the base.

6. The thermal conductivity testing and fixing device for thermally conductive tape according to claim 5, characterized in that, The extending directions of the first clamping gap and the second clamping gap are collinear with the extending direction of the clamping channel.

7. The thermal conductivity testing and fixing device for thermally conductive tape according to claim 5, characterized in that, The wall of the limiting groove is provided with an elastic layer.

8. A fixing device for testing the thermal conductivity of a thermally conductive tape and a mating structure for the tape, characterized in that, Based on the thermal conductivity testing and fixing device for thermally conductive tape according to any one of claims 1 to 7, the tape is the sample to be tested, and the sample to be tested is disposed on both surfaces of the sensor sheet of the temperature testing probe.

9. The thermal conductivity testing and fixing device for thermally conductive tape and the tape mating structure according to claim 8, characterized in that, The test sample includes a thermally conductive adhesive layer, and a protective film is disposed on the surface of the thermally conductive adhesive layer, with the protective film facing the sensor sheet.

10. The thermal conductivity testing and fixing device for thermally conductive tape and the tape mating structure according to claim 9, characterized in that, The thickness of the protective film is less than 0.2 μm.