Screen module and electronic device

Abstract

The present disclosure relates to a screen module and an electronic device. The screen module comprises a cover layer and an adhesive layer connected to the cover layer. The adhesive layer comprises a base and a transparent filler. The transparent filler is distributed in at least a partial area of the base. The distribution area of the transparent filler is for the sound wave signal to pass through. The transparent filler is used to adjust the acoustic impedance of the adhesive layer, so that the difference between the acoustic impedance of the distribution area of the transparent filler and the acoustic impedance of the cover layer is less than or equal to a preset threshold. In the screen module of the present disclosure, the transparent filler is arranged in at least a partial area of the base to adjust the acoustic impedance of the adhesive layer, thereby reducing the difference between the acoustic impedance of the distribution area of the transparent filler and the acoustic impedance of the cover layer. The difference in acoustic impedance is too large to cause the sound wave signal to reflect between the layers, thereby reducing the signal amount. The transmission amount of the sound wave signal is improved.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device technology, and in particular to a screen module and an electronic device. Background Technology

[0002] With the continuous development of electronic information technology, fingerprint recognition technology has been widely used in various electronic products. Currently, fingerprint recognition technologies mainly include capacitive recognition, optical recognition, and acoustic recognition. Among them, acoustic recognition has the advantages of being unaffected by screen brightness and ambient brightness and being able to recognize fingerprints with wet hands, and its application in electronic devices is becoming more and more widespread. Summary of the Invention

[0003] To overcome the problems existing in related technologies, this disclosure provides a screen module and an electronic device.

[0004] According to a first aspect of the present disclosure, a screen module is provided, comprising:

[0005] Cover layer;

[0006] An adhesive layer, connected to the cover plate layer;

[0007] The adhesive layer includes a matrix and a transparent filler. The transparent filler is distributed in at least a portion of the matrix. The distribution area of ​​the transparent filler allows acoustic signals to pass through. The transparent filler is used to adjust the acoustic impedance of the adhesive layer so that the difference between the acoustic impedance of the distribution area of ​​the transparent filler and the acoustic impedance of the cover layer is less than or equal to a preset threshold.

[0008] In this embodiment of the present disclosure, by providing a transparent filler in at least a portion of the substrate, the acoustic impedance of the transparent filler distribution area is adjusted, thereby reducing the difference between the acoustic impedance of the transparent filler distribution area and the acoustic impedance of the cover layer. This avoids excessive acoustic impedance difference causing sound wave signals to be reflected between layers, which in turn reduces the signal amount. Thus, by adjusting the acoustic impedance of the adhesive layer, the transmission amount of sound wave signals is increased, thereby improving the accuracy and reliability of sound wave recognition.

[0009] In one possible implementation, the transparent filler comprises a plurality of transparent particles, each of which has a size less than or equal to a preset size, the preset size being positively correlated with the wavelength of the acoustic signal.

[0010] In this embodiment of the disclosure, a preset size is determined based on the wavelength of the sound wave signal, and the size of the transparent particle is set to be less than or equal to the preset size to avoid the transparent particle from obstructing the propagation path of the sound wave signal.

[0011] In one possible implementation, the wavelength of the acoustic signal is λ, and the size of each of the transparent particles is less than or equal to 1 / 5λ.

[0012] In this embodiment of the disclosure, since the influence of transparent particles on the propagation path is small when the size of the transparent particles is less than or equal to 1 / 5 of the wavelength of the sound wave signal, setting the size of the transparent particles to be less than or equal to 1 / 5λ can reduce the influence of transparent particles on the propagation path of the sound wave signal.

[0013] In one possible implementation, the plurality of transparent particles include at least one of glass particles, microcrystalline glass particles, and ceramic powder particles.

[0014] In this embodiment, the material of the transparent particles can be selected from glass particles, microcrystalline glass particles, and ceramic powder particles, which improves the flexibility of design and processing.

[0015] In one possible implementation, at least some of the transparent particles have the same shape, and / or at least some of the transparent particles have the same size.

[0016] In this embodiment, the shape and size of the transparent particles do not need to be consistent, which can reduce the requirements for processing accuracy.

[0017] In one possible implementation, the transparent particles are spherical, and a plurality of the transparent particles have the same diameter.

[0018] In this embodiment of the disclosure, the transparent particles have the same shape and size to facilitate batch processing of the transparent particles.

[0019] In one possible implementation, the transparent filler is distributed in a target area of ​​the adhesive layer, the target area including a fingerprint recognition area, and the area of ​​the target area is greater than or equal to that of the fingerprint recognition area.

[0020] In this embodiment of the disclosure, a transparent filler is provided to adjust the acoustic impedance of the target area, and the target area includes a fingerprint recognition area, thereby increasing the acoustic signal transmission of the fingerprint recognition area and improving the accuracy of acoustic fingerprint recognition.

[0021] In one possible implementation, the transparent particles are evenly distributed in the target area.

[0022] In this embodiment of the disclosure, transparent particles are evenly distributed in the target area to improve the uniformity of acoustic impedance in the target area, and the area of ​​distribution in the target area is controllable, which helps to control costs.

[0023] In one possible implementation, the adhesive layer is configured as a thin film covering the fingerprint recognition area.

[0024] In this embodiment, the adhesive layer is formed into a thin film by coating, which does not occupy too much space inside the screen module and is beneficial for miniaturization design.

[0025] In one possible implementation, the difference between the acoustic impedance of the target region and the acoustic impedance of the cover plate layer is greater than or equal to 0 and less than or equal to 12 Rayles.

[0026] In this embodiment of the present disclosure, by setting transparent particles to increase the acoustic impedance of the target area, the difference between the acoustic impedance of the target area and the acoustic impedance of the cover layer is increased to 0-12 Rayleigh, reducing the difference between the two, which significantly increases the transmission of sound wave signals compared with related technologies, thereby improving the fingerprint recognition effect.

[0027] In one possible implementation, the screen module further includes a display layer, and the adhesive layer is disposed between the cover layer and the display layer.

[0028] In this embodiment of the present disclosure, the acoustic impedance difference between the cover layer and the target area is adjusted by setting a transparent filler, thereby effectively improving the transmission of acoustic signals and improving the fingerprint recognition effect.

[0029] In one possible implementation, the screen module further includes an acoustic wave recognition module located on the side of the display layer opposite to the cover plate layer;

[0030] The acoustic wave recognition module emits an acoustic wave signal, and the projection of the area covered by the acoustic wave signal on the adhesive layer at least partially overlaps with the fingerprint recognition area.

[0031] In this embodiment of the present disclosure, the acoustic wave recognition module emits an acoustic wave signal, and the projection of the coverage area of ​​the acoustic wave signal on the adhesive layer at least partially overlaps with the fingerprint recognition area to facilitate fingerprint recognition.

[0032] In one possible implementation, the screen module further includes a conductive layer disposed on the side of the display layer opposite to the cover layer, with a portion of the conductive layer hollowed out to form an installation space, and the acoustic wave recognition module disposed within the installation space.

[0033] In this embodiment of the disclosure, by installing the acoustic wave recognition module in the installation space formed by hollowing out the conductive layer, the acoustic wave recognition module and the conductive layer are at least partially stacked in the thickness direction, which improves the space utilization, avoids the overall thickness of the screen module from increasing, and is conducive to reducing the thickness of the screen module.

[0034] In one possible implementation, the screen module further includes a touch layer and a protective film layer, the touch layer being disposed between the display layer and the cover layer, and the protective film layer being disposed on the side of the cover layer opposite to the display layer;

[0035] The adhesive layer is disposed between the protective film layer and the cover plate layer; and / or,

[0036] The adhesive layer is disposed between the cover plate layer and the touch layer; and / or,

[0037] The adhesive layer is disposed between the touch layer and the display layer; and / or,

[0038] The adhesive layer is disposed between the display layer and the acoustic wave recognition module.

[0039] In this embodiment of the disclosure, the adhesive layer can also be disposed between other layers of the screen module. By adjusting the acoustic impedance of the target area of ​​the adhesive layer, the acoustic impedance difference of other layers can be reduced, thereby achieving a better fingerprint recognition effect.

[0040] According to a second aspect of the present disclosure, an electronic device is provided, including a screen module as described in the first aspect of the present disclosure.

[0041] In this embodiment of the disclosure, the electronic device is provided with the aforementioned screen module, which helps to increase the transmission amount of sound wave signals, thereby improving the accuracy and reliability of sound wave fingerprint recognition of the electronic device and enhancing the user experience.

[0042] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0043] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0044] Figure 1 This is a schematic diagram of the propagation of sound wave signals in related technologies.

[0045] Figure 2 This is a schematic diagram of the adhesive layer structure according to an exemplary embodiment.

[0046] Figure 3 This is a schematic diagram of the adhesive layer structure according to another exemplary embodiment.

[0047] Figure 4 This is a schematic diagram of the adhesive layer structure according to yet another exemplary embodiment.

[0048] Figure 5 This is a schematic diagram illustrating the propagation of a sound wave signal according to an exemplary embodiment.

[0049] Figure 6 This is a schematic diagram of the structure of a screen module according to a first exemplary embodiment.

[0050] Figure 7 This is a schematic diagram of the structure of a screen module according to a second exemplary embodiment.

[0051] Figure 8 This is a schematic diagram of the structure of a screen module according to a third exemplary embodiment.

[0052] Figure 9 This is a schematic diagram of the structure of a screen module according to a fourth exemplary embodiment. Detailed Implementation

[0053] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0054] With the continuous development of electronic information technology, fingerprint recognition technology has been widely used in various electronic products. Currently, fingerprint recognition technologies mainly include capacitive recognition, optical recognition, and acoustic recognition. Among them, acoustic recognition has the advantages of being unaffected by screen brightness and ambient brightness and being able to recognize fingerprints with wet hands, and its application in electronic devices is becoming more and more widespread.

[0055] like Figure 1 As shown, in the related technology, the cover layer 21' is connected to the display layer (not shown in the figure) through the adhesive layer 11'. A sound wave recognition module (not shown in the figure) for fingerprint recognition is provided on the side of the display layer opposite to the cover layer 21'. Since the cover layer 21' has a high acoustic impedance and a large thickness, while the adhesive layer 10' has a low acoustic impedance, the acoustic impedance difference between the cover layer 21' and the adhesive layer 10' is large. Therefore, the sound wave signal 31' emitted by the sound wave recognition module is easily reflected when it reaches the cover layer 21' after passing through the adhesive layer. The resulting sound wave reflection signal 32' is strong, which leads to a weak sound wave transmission signal 33' that can penetrate the cover layer 21'. That is, the amount of sound wave signal 31' that penetrates the cover layer 21' is low. Consequently, after the sound wave signal 31' is emitted from the screen and touches the user's finger, the reflected signal is also weak. Therefore, the amount of fingerprint information that can be extracted from the reflected signal is not high, and the accuracy of fingerprint recognition is poor.

[0056] To address the aforementioned technical problems, this disclosure proposes a screen module and an electronic device. In the screen module of this disclosure, a transparent filler is provided in the target area of ​​the adhesive layer, and the acoustic impedance of the adhesive layer is adjusted. This reduces the difference between the acoustic impedance of the transparent filler distribution area and the acoustic impedance of the cover layer, preventing excessive acoustic impedance difference from causing sound wave signals to reflect between layers and thus reducing the signal amount. By adjusting the acoustic impedance of the adhesive layer, the transmission amount of sound wave signals is increased, thereby improving the accuracy and reliability of sound wave recognition.

[0057] According to an exemplary embodiment, such as Figures 2-9 As shown, this embodiment of the disclosure provides a screen module, which includes a cover layer 21 and an adhesive layer 10, with the adhesive layer 10 connected to the cover layer 21. The adhesive layer 10 includes a substrate 101 and a transparent filler, which may include, for example, a plurality of transparent particles 102, distributed in at least a portion of the substrate 101.

[0058] Since the transparent filler is made of a transparent material, its placement will not adversely affect light transmittance. The transparent filler is used to adjust the acoustic impedance of the adhesive layer 10 so that the difference between the acoustic impedance of the transparent filler distribution area and the acoustic impedance of the cover layer 21 is less than or equal to a preset threshold. Acoustic impedance is a physical quantity describing the obstruction of sound wave propagation by a medium; the higher the acoustic impedance value, the greater the obstruction of sound wave propagation by the medium. Since the acoustic impedance of the medium is Z = ρc, where ρ is the density of the medium and c is the speed of light in the medium, the acoustic impedance of the medium can be adjusted by changing the material of the medium, thereby changing ρ and / or c. In other words, by placing a transparent filler in at least a portion of the substrate 101 of the adhesive layer 10, the acoustic impedance of the corresponding area can be adjusted.

[0059] The transparent filler is distributed in an area to allow the acoustic signal 31 to pass through for acoustic recognition. For example, the transparent filler can be distributed in the fingerprint recognition area 103. It is worth noting that the transparent filler can be distributed only in a portion of the substrate 101 to reduce material costs; alternatively, the transparent filler can be distributed throughout the entire adhesive layer 10 substrate 101 to reduce manufacturing difficulty. This embodiment does not impose excessive limitations on the range of the target area.

[0060] Because the cover layer 21 is typically thick, and its acoustic impedance is generally much greater than that of the adhesive layer 10 in related technologies, the cover layer 21 has a significant impact on the acoustic signal 31. For example... Figures 2-5 As shown, by setting a transparent filler to adjust the acoustic impedance of the adhesive layer 10, the difference in acoustic impedance between the cover layer 21 and the transparent filler distribution area is reduced, compared to Figure 1According to the relevant technologies in this disclosure, the technical solution of this embodiment can reduce the acoustic wave reflection signal 32 generated by the acoustic wave signal 31 being reflected by the cover plate layer 21, thereby enhancing the acoustic wave transmission signal 33 of the acoustic wave signal 31 penetrating the cover plate layer 21, that is, increasing the transmission amount of the acoustic wave signal 31, thereby improving the accuracy of fingerprint recognition.

[0061] The adhesive layer 10 can also be used to bond other layers in the screen module. As long as the acoustic impedance difference between the other layer structure in the screen module and the original adhesive layer 10 is large, it will have an adverse effect on the transmission of the acoustic signal 31. In this case, the technical solution of the present disclosure embodiment can be adopted to set a transparent filler in the corresponding area of ​​the adhesive layer 10 to adjust the acoustic impedance, so that the acoustic impedance difference between the transparent filler distribution area and other layer structures is reduced, thereby increasing the transmission of the acoustic signal 31.

[0062] Of course, it is understandable that since the acoustic impedance of the cover layer 21 is usually much greater than that of the adhesive layer 10, the purpose of using a transparent filler to reduce the reflection of the acoustic signal 31 by the cover layer 21 is to increase the acoustic impedance. When the acoustic impedance of the cover layer 21 is less than that of the adhesive layer 10, or when the adhesive layer 10 is used to bond other layer structures with lower acoustic impedance than the adhesive layer 10, a transparent filler can also be used to reduce the acoustic impedance of the adhesive layer 10 to prevent the signal reflected back from the acoustic signal 31 from being reflected by the adhesive layer 10 with its higher acoustic impedance. As long as the acoustic impedance difference is less than or equal to a preset threshold, that is, the acoustic impedance of the adhesive layer 10 and the adjacent layer structures are close, a better acoustic wave recognition effect can be achieved. This embodiment does not impose excessive restrictions on the specific value of the preset threshold.

[0063] In this embodiment of the present disclosure, by providing transparent filler in at least a portion of the substrate 101 of the adhesive layer 10, the acoustic impedance of the corresponding area is adjusted, thereby reducing the difference between the acoustic impedance of the transparent filler distribution area and the acoustic impedance of the cover layer 21. This avoids excessive acoustic impedance difference causing the acoustic signal 31 to be reflected between layers, thereby increasing the transmission of the acoustic signal 31, improving the accuracy and reliability of acoustic wave recognition, and enhancing the user experience.

[0064] In some embodiments, the difference between the acoustic impedance of the target area and the acoustic impedance of the cover layer 21 is greater than or equal to 0 and less than or equal to 12 Rayles. In related technologies, the difference between the acoustic impedance of the cover layer 21 and the acoustic impedance of the adhesive layer 10 is typically around 12-13 Rayles. For example, the acoustic impedance of the cover layer 21 is 15 Rayles, and the acoustic impedance of the adhesive layer 10 is 1.8 Rayles, resulting in a difference of 13.2 Rayles. Since improving fingerprint recognition accuracy is achieved as long as the acoustic impedance difference between the target area and the cover layer 21 in this embodiment is less than that in related technologies, the technical solution of this embodiment improves the acoustic impedance of the target area by setting transparent particles 102, thereby increasing the difference between the acoustic impedance of the target area and the acoustic impedance of the cover layer 21 to 0-12 Rayles. This reduces the difference and significantly increases the transmission of the acoustic signal 31 compared to related technologies, thus improving the fingerprint recognition effect.

[0065] In some embodiments, the transparent filler includes a plurality of transparent particles 102, each of which has a size less than or equal to a preset size, the preset size being positively correlated with the wavelength of the acoustic signal 31. If the size of the transparent particles 102 is too large, it will obstruct the propagation path of the acoustic signal 31. Therefore, the preset size is determined based on the wavelength of the acoustic signal 31, and the size of the transparent particles 102 is set to be less than or equal to the preset size to avoid the transparent particles 102 obstructing the propagation path of the acoustic signal 31.

[0066] In one example, the wavelength of the acoustic signal 31 is λ, and the size of each transparent particle 102 is less than or equal to 1 / 5λ. When the size of the transparent particle 102 is less than or equal to 1 / 5 of the wavelength of the acoustic signal 31, its impact on the propagation path is small. Therefore, setting the size of the transparent particle 102 to be less than or equal to 1 / 5 of the wavelength of the acoustic signal 31 can reduce the impact of the transparent particle 102 on the propagation path of the acoustic signal 31.

[0067] In one example, the wavelength λ of the acoustic signal 31 is less than or equal to 30 μm, and the size of the transparent particle 102 is greater than or equal to 1 μm and less than or equal to 6 μm. In acoustic fingerprint recognition, the commonly used acoustic signal 31 is ultrasound, with a wavelength λ less than or equal to 30 μm. Therefore, based on the fact that the size of the transparent particle 102 is less than or equal to 1 / 5λ, we can obtain that the size of the transparent particle 102 is less than or equal to 6 μm. However, due to current limitations in processing precision and efficiency, the size of the transparent particle 102 can be set to be greater than or equal to 1 μm to achieve a better improvement in fingerprint recognition accuracy. Of course, it is understandable that the smaller the size of the transparent particle 102, the less obstruction it poses to the propagation path of the acoustic signal 31, and the higher the fingerprint recognition accuracy. Therefore, if processing difficulty is not a concern, the size of the transparent particle 102 can also be set to be less than or equal to 1 μm.

[0068] In some embodiments, the transparent filler includes a plurality of transparent particles 102, which include at least one of glass particles, microcrystalline glass particles, and ceramic powder particles. In one example, the transparent particles 102 include glass particles; in another example, the transparent particles 102 include microcrystalline glass particles and ceramic powder particles; in yet another example, the transparent particles 102 include glass particles, microcrystalline glass particles, and ceramic powder particles. That is, the transparent particles 102 may include one or more of glass particles, microcrystalline glass particles, and ceramic powder particles. When the transparent particles 102 include several of these, the transparent particles 102 of different materials can be uniformly doped, or a portion of the material can be set to one material and a portion of the material can be set to another material, or the transparent particles 102 of different materials can be stacked. The transparent particles 102 may also be transparent powder particles of other materials to improve the flexibility of design and processing.

[0069] In some embodiments, the transparent filler includes a plurality of transparent particles 102, at least some of which have the same shape and / or have the same size. In one example, at least some of the transparent particles 102 have the same shape, while the different transparent particles 102 may have the same or different sizes. In another example, at least some of the transparent particles 102 have the same size, while the different transparent particles 102 may have the same or different shapes. In yet another example, at least some of the transparent particles 102 have the same shape and at least some of the transparent particles 102 have the same size.

[0070] That is, in this embodiment of the present disclosure, the shape and size of the transparent particles 102 do not need to be consistent, which can reduce the requirements for processing accuracy. As long as the largest transparent particle 102 is not larger than 1 / 5 of the wavelength of the sound wave signal 31, it can be ensured that the propagation of the sound wave signal 31 will not be affected. Even if the shape and size of the transparent particles 102 are not uniform, they can still adjust the acoustic impedance of the target area, thereby improving the accuracy of sound wave recognition.

[0071] In one example, several transparent particles 102 have the same shape and size. Figure 2 As shown, the transparent particles 102 can be spherical, and all transparent particles 102 have the same diameter, so as to facilitate batch processing of transparent particles 102.

[0072] In another example, the shapes and sizes of the transparent particles 102 may differ. For example... Figure 3 As shown, the transparent particles 102 can be spherical, cubic, or other shapes. The shapes of different transparent particles 102 can be different or at least partially the same. The sizes of different transparent particles 102 can be different or at least partially the same. This embodiment of the present disclosure does not require the shape and size consistency of the transparent particles 102 in order to reduce the requirements for processing accuracy.

[0073] In some embodiments, a transparent filler is distributed in the target area of ​​the adhesive layer 10, the target area including the fingerprint recognition area 103, and the area of ​​the target area is greater than or equal to the fingerprint recognition area 103, so as to cover the fingerprint recognition area 103, improve the transmittance of the acoustic signal 31 of the fingerprint recognition area 103, and improve the fingerprint recognition effect.

[0074] In some embodiments, the transparent particles 102 may be uniformly or non-uniformly distributed in the target area. In one example, such as... Figure 2 As shown, the transparent particles 102 are evenly distributed in the target area to improve the uniformity of acoustic impedance within the target area. Furthermore, the area of ​​these particles within the target area is controllable, which helps control costs. In another example, the transparent particles 102 are not evenly distributed in the target area. For instance, since the central region of a fingerprint contains the most information during fingerprint recognition, the density of transparent particles 102 in the central region can be higher than that in the edge regions to increase the transmission of the acoustic signal 31 in the central region of the target area.

[0075] In some embodiments, the gaps between the plurality of transparent particles 102 are filled with a substrate 101. When only transparent particles 102 are provided, the adhesion performance of the target area is poor, which may lead to a decrease in the reliability of the connection with other layer structures. Therefore, the gaps between the plurality of transparent particles 102 can be filled with a substrate 101, that is, the transparent particles 102 are doped into the substrate 101, to ensure that the adhesion performance of the target area is not affected while improving the fingerprint recognition effect.

[0076] In addition, by using a configuration in which the substrate 101 and transparent particles 102 are mutually doped, it is not necessary to divide the adhesive layer 10 into different configuration areas, which facilitates the processing of the adhesive layer 10 and simplifies the processing steps.

[0077] In some embodiments, the substrate 101 is a transparent adhesive layer. The substrate 101 is set as a transparent adhesive layer to meet the light transmittance requirements and avoid affecting the optical display effect. The substrate 101 can be an adhesive layer such as OCA (Optically Clear Adhesive), transparent silicone, transparent pressure-sensitive adhesive, etc. Of course, the substrate 101 can also be made of other adhesive materials with high light transmittance. The embodiments of this disclosure do not impose too many restrictions on the material of the substrate 101.

[0078] In some embodiments, the transparent particles 102 and the substrate 101 are physically mixed and then coated onto the target area. The preparation method of coating the transparent particles 102 and the substrate 101 after physical mixing is simple and easy to implement. By coating, the adhesive layer 10 is set as a thin film covering the fingerprint recognition area 103, which does not occupy too much space inside the screen module and is beneficial for miniaturization design.

[0079] In some embodiments, the screen module further includes a display layer 23. For example... Figures 2-9 As shown, the adhesive layer 10 is disposed between the cover layer 21 and the display layer 23, and the display layer 23 displays an instruction image in a fingerprint recognition scenario. The instruction image can be used to guide the user on the position of their finger on the screen. Fingerprint recognition scenarios can include applications requiring fingerprint verification, such as unlocking the screen, security verification, and fingerprint payment. This embodiment does not impose excessive limitations on the application scenarios of fingerprint recognition.

[0080] In some embodiments, the screen module further includes an acoustic wave recognition module 30. For example... Figures 6-9 As shown, the sound wave recognition module 30 is located on the side of the display layer 23 opposite to the cover layer 21, that is, on the inner side of the display layer 23. Figures 6-9 Taking the orientation shown as an example, the area below the display layer 23 is the inner side of the display screen, that is, the side closer to the inside of the electronic device when the screen module is installed on the electronic device, and the area above the display layer 23 is the outer side of the display screen, that is, the side facing the user when the screen module is installed on the electronic device.

[0081] The acoustic wave recognition module 30 emits an acoustic wave signal 31. The projection of the coverage area of ​​the acoustic wave signal 31 onto the adhesive layer 10 at least partially overlaps with the fingerprint recognition area 103 to facilitate fingerprint recognition. The acoustic wave signal 31 can be, for example, an ultrasonic signal. The ultrasonic signal is emitted towards the display layer from the screen module and then reflected by the user's finger. The acoustic wave recognition module 30 can receive the reflected ultrasonic signal and generate an electrical signal based on the reflected signal, thereby generating a fingerprint image and comparing it with a pre-stored user fingerprint image for fingerprint recognition verification.

[0082] In some embodiments, the screen module further includes a conductive layer 24. For example... Figures 6-9 As shown, the conductive layer 24 is disposed on the side of the display layer 23 opposite to the cover layer 21, that is, on the inner side of the display layer 23. The conductive layer 24 is used to electrically connect the display layer 23 to the circuit board (not shown in the figure) to avoid screen module failure caused by poor electrostatic conduction and to achieve electrostatic protection. The circuit board can be the motherboard and / or sub-board of the electronic device, and the type of circuit board can be PCB (Printed Circuit Board) and / or FPC (Flexible Printed Circuit), etc.

[0083] In this design, a portion of the conductive layer 24 is hollowed out to form an installation space 241, within which the acoustic wave recognition module 30 is disposed. By installing the acoustic wave recognition module 30 within the installation space 241 formed by the hollowed-out portion of the conductive layer 24, the acoustic wave recognition module 30 and the conductive layer 24 are at least partially stacked in the thickness direction, improving space utilization, avoiding an increase in the overall thickness of the screen module, and facilitating the reduction of the screen module's thickness.

[0084] In one example, the conductive layer 24 includes conductive foam. The conductive foam has good electrostatic protection and electromagnetic shielding properties, is easy to cut into the required shape, is lightweight, which is beneficial for achieving lightweight design of the screen module, and also has a certain cushioning and shock absorption effect.

[0085] In some embodiments, the screen module further includes a touch layer 22. For example... Figures 7-9 As shown, the touch layer 22 is disposed between the display layer 23 and the cover layer 21. The touch layer 22 can be, for example, a capacitive touch layer. When the touch layer 22 detects a finger approaching, the acoustic wave recognition module 30 emits an ultrasonic signal for fingerprint recognition. Of course, it is understood that the touch layer 22 can also be other types of touch layers, and this embodiment does not impose too many restrictions on it.

[0086] In some embodiments, the screen module further includes a protective film layer 25. For example... Figure 9As shown, the protective film layer 25 is disposed on the side of the cover layer 21 away from the display layer 23, that is, the side facing the user, so as to protect the cover layer 21. The protective film layer 25 can be a factory-installed protective film or a separately applied protective film, such as tempered glass film, hydrogel film, etc. This embodiment does not impose too many restrictions on this.

[0087] In some embodiments, when at least one of the touch layer 22, display layer 23, and protective film layer 25 is connected to other layer structures via adhesive layer 10, and the acoustic impedance difference between the target area and adhesive layer 10 is large, a method similar to that used for cover plate layer 21 can be employed to adjust the acoustic impedance of the target area of ​​adhesive layer 10 to reduce the acoustic impedance difference between the target area and different layer structures, thereby achieving better fingerprint recognition performance. The acoustic impedance of the target areas of different adhesive layers 10 can be the same or different, and can be determined based on the acoustic impedance of the layer structures connected to adhesive layer 10.

[0088] In some embodiments, the adhesive layer 10 is disposed between the protective film layer 25 and the cover layer 21; and / or, the adhesive layer 10 is disposed between the cover layer 21 and the touch layer 22; and / or, the adhesive layer 10 is disposed between the touch layer 22 and the display layer 23; and / or, the adhesive layer 10 is disposed between the display layer 23 and the acoustic wave recognition module 30.

[0089] In one example, such as Figure 7 As shown, the adhesive layer 10 includes a first adhesive layer 11 and a second adhesive layer 12. Along... Figure 7 From top to bottom, or from the outside to the inside of the screen module, the layers are, in sequence, a cover layer 21, a first adhesive layer 11, a touch layer 22, a second adhesive layer 12, and a display layer 23. The conductive layer 24 and the acoustic wave recognition module 30 are both located on the side of the display layer 23 opposite to the second adhesive layer 12. The first adhesive layer 11 connects the cover layer 21 and the touch layer 22, and the second adhesive layer 12 connects the touch layer 22 and the display layer 23.

[0090] In another example, such as Figure 8 As shown, adhesive layer 10 includes a first adhesive layer 11, a second adhesive layer 12, and a third adhesive layer 13. Along... Figure 8 From top to bottom, or from the outside to the inside of the screen module, the layers are, in sequence, a cover layer 21, a first adhesive layer 11, a touch layer 22, a second adhesive layer 12, and a display layer 23. The conductive layer 24 and the acoustic wave recognition module 30 are both located on the side of the display layer 23 opposite to the second adhesive layer 12. The third adhesive layer 13 is located between the display layer 23 and the acoustic wave recognition module 30. Specifically, the first adhesive layer 11 connects the cover layer 21 and the touch layer 22, the second adhesive layer 12 connects the touch layer 22 and the display layer 23, and the third adhesive layer 13 connects the display layer 23 and the acoustic wave recognition module 30.

[0091] In yet another example, such as Figure 9 As shown, adhesive layer 10 includes a first adhesive layer 11, a second adhesive layer 12, a third adhesive layer 13, and a fourth adhesive layer 14. Along... Figure 9 From top to bottom, or from the outside to the inside of the screen module, the layers are: a protective film layer 25, a fourth adhesive layer 14, a cover layer 21, a first adhesive layer 11, a touch layer 22, a second adhesive layer 12, and a display layer 23. The conductive layer 24 and the acoustic wave recognition module 30 are both located on the side of the display layer 23 opposite to the second adhesive layer 12. The third adhesive layer 13 is located between the display layer 23 and the acoustic wave recognition module 30. Specifically, the first adhesive layer 11 connects the cover layer 21 and the touch layer 22, the second adhesive layer 12 connects the touch layer 22 and the display layer 23, the third adhesive layer 13 connects the display layer 23 and the acoustic wave recognition module 30, and the fourth adhesive layer 14 connects the cover layer 21 and the protective film layer 25.

[0092] Of course, it is understood that when the screen module includes more layers, those skilled in the art can also use a similar method to the present disclosure embodiment to adjust the acoustic impedance of the target area of ​​the adhesive layer 10 between other layers.

[0093] According to an exemplary embodiment, such as Figures 2-9 As shown, this disclosure provides an electronic device, which may be, for example, a mobile terminal, tablet computer, laptop computer, smartwatch, smart bracelet, or other electronic device with a display screen. The electronic device includes a screen module as described in the above embodiments.

[0094] The screen module includes a cover layer 21 and an adhesive layer 10 connected to the cover layer 21. The adhesive layer 10 includes a substrate 101 and a transparent filler. The transparent filler is distributed in at least a portion of the substrate 101. The distribution area of ​​the transparent filler allows the acoustic wave signal 31 to pass through. The transparent filler is used to adjust the acoustic impedance of the adhesive layer 10 so that the difference between the acoustic impedance of the distribution area of ​​the transparent filler and the acoustic impedance of the cover layer 21 is less than or equal to a preset threshold.

[0095] In this embodiment of the disclosure, the electronic device is provided with the above-mentioned screen module, which is beneficial to increase the transmission amount of the acoustic signal 31, thereby improving the accuracy and reliability of acoustic fingerprint recognition of the electronic device and enhancing the user experience.

[0096] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0097] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A screen module, characterized in that, include: Cover layer; An adhesive layer, connected to the cover plate layer; The adhesive layer includes a matrix and a transparent filler. The transparent filler is distributed in at least a portion of the matrix. The distribution area of ​​the transparent filler allows acoustic signals to pass through. The transparent filler is used to adjust the acoustic impedance of the adhesive layer so that the difference between the acoustic impedance of the distribution area of ​​the transparent filler and the acoustic impedance of the cover layer is less than or equal to a preset threshold.

2. The screen module according to claim 1, characterized in that, The transparent filler includes a plurality of transparent particles, each of which has a size less than or equal to a preset size, the preset size being positively correlated with the wavelength of the acoustic signal.

3. The screen module according to claim 2, characterized in that, The wavelength of the acoustic signal is λ, and the size of each transparent particle is less than or equal to 1 / 5λ.

4. The screen module according to claim 2, characterized in that, The transparent particles include at least one of glass particles, microcrystalline glass particles, and ceramic powder particles.

5. The screen module according to claim 2, characterized in that, At least some of the transparent particles have the same shape, and / or at least some of the transparent particles have the same size.

6. The screen module according to claim 5, characterized in that, The transparent particles are spherical, and several of the transparent particles have the same diameter.

7. The screen module according to claim 1, characterized in that, The transparent filler is distributed in the target area of ​​the adhesive layer, the target area including the fingerprint recognition area, and the area of ​​the target area is greater than or equal to the fingerprint recognition area.

8. The screen module according to claim 7, characterized in that, The transparent filler includes a plurality of transparent particles, which are evenly distributed in the target area.

9. The screen module according to claim 7, characterized in that, The adhesive layer is configured as a thin film covering the fingerprint recognition area.

10. The screen module according to claim 7, characterized in that, The difference between the acoustic impedance of the target region and the acoustic impedance of the cover plate layer is greater than or equal to 0 and less than or equal to 12 Rayles.

11. The screen module according to claim 7, characterized in that, The screen module also includes a display layer, and the adhesive layer is disposed between the cover layer and the display layer.

12. The screen module according to claim 11, characterized in that, The screen module includes a sound wave recognition module, which is located on the side of the display layer opposite to the cover plate layer. The acoustic wave recognition module emits an acoustic wave signal, and the projection of the area covered by the acoustic wave signal on the adhesive layer at least partially overlaps with the fingerprint recognition area.

13. The screen module according to claim 12, characterized in that, The screen module includes a conductive layer disposed on the side of the display layer opposite to the cover layer. The conductive layer includes an installation space, and the acoustic wave recognition module is disposed within the installation space.

14. The screen module according to claim 13, characterized in that, The screen module further includes a touch layer and a protective film layer. The touch layer is disposed between the display layer and the cover layer, and the protective film layer is disposed on the side of the cover layer opposite to the display layer. The adhesive layer is disposed between the protective film layer and the cover plate layer; And / or, The adhesive layer is disposed between the cover plate layer and the touch layer; and / or, The adhesive layer is disposed between the touch layer and the display layer; and / or, The adhesive layer is disposed between the display layer and the acoustic wave recognition module.

15. An electronic device, characterized in that, Includes the screen module as described in any one of claims 1 to 14.

Images