A laser heat sink
By using a heat exchange method where the semiconductor cooling chip directly contacts the laser, the problem of poor cooling effect of air cooling is solved, achieving more efficient laser temperature control and extending the life of the laser.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MCVEILL (SHANGHAI) TECH CO LTD
- Filing Date
- 2025-08-07
- Publication Date
- 2026-05-29
AI Technical Summary
In existing technologies, air cooling is not effective at cooling lasers, which causes temperature changes to affect the accuracy of the laser's optical power and its lifespan.
Heat exchange is achieved through direct contact between the semiconductor cooling chip and the laser, and through indirect heat exchange between the thermal pad and the heat sink, forming a heat transfer path and improving thermal conductivity.
It effectively reduces laser temperature, improves thermal conductivity, reduces heat accumulation, extends laser life, and achieves temperature control accuracy of ±0.5℃.
Smart Images
Figure CN224305153U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of laser heat dissipation technology, and specifically relates to a laser heat dissipation device. Background Technology
[0002] A laser is a device that generates laser light through stimulated emission, and it has core characteristics such as high monochromaticity, strong directionality, and coherence.
[0003] When using lasers of a specific wavelength as detection devices, temperature changes can significantly affect the laser's optical power, leading to inaccurate measurements and shortened lifespan. Therefore, it is necessary to cool the laser. In existing technologies, air cooling is used to cool the laser, but this method is not very effective. Utility Model Content
[0004] This application provides a laser heat dissipation device to improve the cooling effect.
[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:
[0006] A laser heat dissipation device is provided, comprising:
[0007] The housing has a mounting cavity at one end and an optical collimation cavity at the other end; the mounting cavity has mounting steps.
[0008] A mounting base is connected to the mounting step; the mounting base has a mounting hole coaxially arranged with the optical collimation cavity, and the laser is installed in the mounting hole;
[0009] A semiconductor cooling chip is connected to the mounting base, and a thermal pad is connected between the chip and the laser.
[0010] A heat sink is connected to one end of the housing in the mounting cavity; a thermal pad is connected between the heat sink and the semiconductor cooling chip.
[0011] After the heat sink is connected to the housing, the heat sink sequentially presses against the thermal pad, the semiconductor cooling chip, the thermal pad, and the laser.
[0012] In one possible implementation, the mounting step has a connecting hole with an internal thread; the mounting base has a through hole aligned with the connecting hole, and the mounting base is fixed to the connecting hole by bolts.
[0013] In one possible implementation, the working end of the laser is inserted into a mounting hole, and the laser has a limiting portion that abuts against the mounting base.
[0014] In one possible implementation, the outer peripheral wall of the limiting portion has a limiting groove, the mounting base has a protrusion, a portion of the protrusion is inserted into the limiting groove, and there is a gap between the inserted portion of the protrusion and the limiting groove; wherein, the thermal pad is thermally conductive silicone grease.
[0015] In one possible implementation, the mounting base has a recessed structure at the laser limiting portion, and the laser limiting portion is located within the recessed structure; the thermal pad is thermal grease, which can fill the recessed structure.
[0016] In one possible implementation, the mounting base has at least two connecting components on one side with a recessed structure, and the thermoelectric cooler abuts against the connecting components; thermally conductive silicone grease is filled between the thermoelectric cooler and the mounting base.
[0017] In one possible implementation, the heat sink has a groove corresponding to the thermoelectric cooler, the thermal pad is disposed in the groove, and the thermal pad abuts against the thermoelectric cooler.
[0018] In one possible implementation, the heat sink includes a fixing plate and a plurality of heat dissipation fins, the plurality of heat dissipation fins being connected to one side of the fixing plate; the other side of the fixing plate abuts against the semiconductor cooling chip via a thermal pad; the fixing plate is fixed to the housing by bolts.
[0019] In one possible implementation, the housing has a plurality of threaded holes spaced apart at one end of the mounting cavity, and the fixing plate has through holes aligned with the threaded holes on the housing; the fixing plate has clearance space on the side with heat dissipation fins to accommodate the nuts of bolts.
[0020] In one possible implementation, the housing has a cable outlet at the location of the mounting cavity.
[0021] This application provides a laser heat dissipation device. Compared with the prior art, the laser contacts the cold end of a thermoelectric cooler via a thermal pad, while the hot end of the thermoelectric cooler contacts a heat sink via the thermal pad. Therefore, the heat generated during laser operation can be transferred to the cold end of the thermoelectric cooler, where heat exchange occurs between the cold end and one side of the laser, reducing the laser's temperature. The hot end of the thermoelectric cooler exchanges heat with the heat sink via the thermal pad, achieving a cooling effect and reducing heat accumulation at the hot end of the thermoelectric cooler. Through the above-mentioned arrangement, the laser can be cooled. Because the heat exchange is achieved through direct contact, this application can improve thermal conductivity compared to the air cooling technology of the prior art. Attached Figure Description
[0022] Figure 1A schematic diagram of a laser heat dissipation device provided in an embodiment of this application;
[0023] Figure 2 An exploded view of a laser heat dissipation device provided in an embodiment of this application;
[0024] Figure 3 A schematic diagram of the housing portion of a laser heat dissipation device provided in an embodiment of this application;
[0025] Figure 4 A schematic diagram of a mounting base portion of a laser heat dissipation device provided in an embodiment of this application;
[0026] Figure 5 This is a schematic diagram of the heat sink portion of a laser heat dissipation device provided in an embodiment of this application.
[0027] Explanation of reference numerals in the attached drawings: 1. Housing; 11. Mounting cavity; 12. Optical collimation cavity; 13. Cable outlet; 2. Mounting base; 21. Mounting hole; 22. Protrusion; 23. Recessed structure; 24. Connecting component; 3. Semiconductor cooling chip; 4. Heat sink; 41. Groove; 42. Fixing plate; 43. Heat sink fins; 44. Clearance space; 5. Laser; 51. Limiting part; 52. Limiting groove. Detailed Implementation
[0028] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.
[0029] Please refer to the following: Figures 1 to 5 This application describes a laser heat dissipation device. The laser heat dissipation device includes a housing 1, a mounting base 2, a thermoelectric cooler 3, and a heat sink 4. One end of the housing 1 has a mounting cavity 11, and the other end has an optical collimation cavity 12, through which the laser source passes. The mounting cavity 11 has a mounting step. The mounting base 2 is connected to the mounting step. The mounting base 2 has a mounting hole 21 coaxially arranged with the optical collimation cavity 12, and the laser 5 is mounted in the mounting hole 21. The thermoelectric cooler 3 is connected to the mounting base 2, and a thermal pad (not shown) is connected between it and the laser 5. The heat sink 4 is connected to one end of the housing 1 at the mounting cavity 11. A thermal pad (not shown) is connected between the heat sink 4 and the thermoelectric cooler 3. After the heat sink 4 is connected to the housing 1, the heat sink 4 sequentially presses against the thermal pad, the thermoelectric cooler 3, the thermal pad, and the laser 5.
[0030] This application provides a temperature control device for a laser 5. Compared with the prior art, the laser 5 contacts the cold end of a thermoelectric cooler 3 through a thermal pad, and the hot end of the thermoelectric cooler 3 contacts a heat sink 4 through the thermal pad. Therefore, the heat generated by the laser 5 during operation can be transferred to the cold end of the thermoelectric cooler 3, and the cold end of the thermoelectric cooler 3 exchanges heat with one side of the laser 5, reducing the temperature of the laser 5. The hot end of the thermoelectric cooler 3 exchanges heat with the heat sink 4 through the thermal pad, achieving a cooling effect and reducing heat accumulation at the hot end of the thermoelectric cooler 3. Through the above-mentioned arrangement of this application, the laser 5 can be cooled. Since the heat exchange is carried out through direct contact, this application can improve the heat conduction efficiency compared with the air cooling of the prior art.
[0031] A thermoelectric cooler (TEC) is a semiconductor device that exhibits extreme cold on one side and extreme heat on the other when energized. Its working principle is based on the Peltier effect, a thermoelectric effect that is the inverse of the Seebeck effect (thermoelectric power generation).
[0032] The semiconductor cooling chip 3 is composed of an N-type semiconductor and a P-type semiconductor connected in series by a metal conductor to form a thermocouple pair.
[0033] N-type semiconductors: Free electrons are the majority carriers, and electron mobility is high.
[0034] P-type semiconductor: Holes are the majority carriers, and electrons need to fill the holes to move.
[0035] When a direct current flows through the junction of an N-type and a P-type semiconductor: when the current flows from the N-type to the P-type (at the junction), electrons need to overcome the potential barrier and absorb heat, causing the junction temperature to drop and forming a cold junction; when the current flows from the P-type to the N-type (the other junction), electrons release energy and generate heat, causing the junction temperature to rise and forming a hot junction.
[0036] When current continues to flow, one side (cold end) of the cooling chip continuously absorbs heat and cools down, while the other side (hot end) continuously releases heat and heats up, creating a significant temperature difference.
[0037] The heat dissipation device described in this application is a miniaturized device with a high degree of integration. Therefore, the above-mentioned configuration of this application can fully meet the heat dissipation requirements of the laser 5.
[0038] In some embodiments, such as Figures 1 to 5 As shown, a thermistor is provided on the mounting base 2 at the position of the laser 5. The thermistor is electrically connected to the control module, and the semiconductor cooling chip 3 is also electrically connected to the control module. The thermistor can detect the temperature around the laser 5.
[0039] When the temperature around the laser 5 is higher than the set temperature, the control module controls the thermoelectric cooler 3 to start, and the thermoelectric cooler 3 cools the area around the laser 5; when the temperature around the laser 5 is lower than the set temperature, the control module controls the thermoelectric cooler 3 to stop working.
[0040] The temperature setting range is 25℃ to 45℃, and the accuracy of the control point temperature can be controlled within ±0.5℃.
[0041] In some embodiments, such as Figures 1 to 5 As shown, the mounting step has a connecting hole with an internal thread; the mounting base 2 has a through hole aligned with the connecting hole, and the mounting base 2 is fixed to the connecting hole by bolts.
[0042] A connecting plate is fixedly mounted on the mounting base 2, with through holes on the connecting plate. The through holes on the connecting plate are stepped holes. The stepped holes on the connecting plate are aligned with the connecting holes on the mounting step, and then the connecting plate is fixed with bolts, thereby fixing the mounting base 2 to the housing 1. After the mounting base 2 is fixed to the housing 1 with bolts, the bolt nuts are located inside the stepped holes.
[0043] In some embodiments, such as Figures 1 to 5 As shown, the working end of the laser 5 is inserted into the mounting hole 21, and the laser 5 has a limiting part 51 that abuts against the mounting base 2.
[0044] The diameter of the limiting part 51 on the laser 5 is larger than the diameter of the working end. Therefore, after the working end of the laser 5 is inserted and engaged with the mounting hole 21, the limiting part 51 of the laser 5 can abut against the mounting base 2 to limit the installation position of the laser 5.
[0045] In some embodiments, such as Figures 1 to 5 As shown, the outer peripheral wall of the limiting part 51 has a limiting groove 52, and the mounting base 2 has a protrusion 22. A part of the protrusion 22 is inserted into the limiting groove 52, and there is a gap between the inserted part of the protrusion 22 and the limiting groove 52; wherein, the thermal pad is thermal grease.
[0046] By inserting a portion of the protrusion 22 into the limiting groove 52 and creating a gap between the protrusion 22 and the limiting groove 52, when filling with thermal grease, the thermal grease can wrap around the limiting portion 51 of the laser 5 and fill the gap between the protrusion 22 and the limiting groove 52, thereby strengthening the connection between the laser 5 and the mounting base 2.
[0047] Thermal grease has good thermal conductivity, so it can transfer the heat generated by the laser 5 to the thermoelectric cooler 3 and exchange heat with the cold end of the thermoelectric cooler 3.
[0048] In some embodiments, such as Figures 1 to 5 As shown, the mounting base 2 has a recessed structure 23 at the position of the limiting part 51 of the laser 5, and the limiting part 51 of the laser 5 is located in the recessed structure 23; the thermal pad is thermal grease, which can fill the recessed structure 23; at least two connecting parts 24 are provided on the side of the mounting base 2 with the recessed structure 23, and the thermoelectric cooler 3 abuts against the connecting parts 24; thermal grease is filled between the thermoelectric cooler 3 and the mounting base 2.
[0049] Before installing the thermoelectric cooler 3, the laser 5 is first installed on the mounting base 2, and then thermal grease is filled onto the mounting base 2. After filling, the thermoelectric cooler 3 is placed on the connecting component 24 and the thermoelectric cooler 3 is brought into contact with the thermal grease on the mounting base 2.
[0050] Thermal grease is filled at the hot end of the thermoelectric cooler 3, and then the heat sink 4 is installed on the housing 1, and the heat sink 4 is brought into contact with the thermal grease of the thermoelectric cooler 3. After the heat sink 4 is installed on the housing 1 by bolts, the heat sink 4 can press the thermal pad, the thermoelectric cooler 3, the thermal pad and the laser 5 in sequence.
[0051] In some embodiments, such as Figures 1 to 5 As shown, the heat sink 4 has a groove 41 corresponding to the thermoelectric cooler 3, and the thermal pad is disposed in the groove 41 and abuts against the thermoelectric cooler 3.
[0052] By providing a groove 41 on the heat sink 4, space can be provided to accommodate the thermally conductive silicone, so that the heat sink 4 and the thermoelectric cooler 3 are connected by the thermally conductive silicone. Since both sides of the thermoelectric cooler 3 are connected with thermally conductive silicone, both sides of the thermoelectric cooler 3 are softly connected, thereby protecting the thermoelectric cooler 3.
[0053] In some embodiments, such as Figures 1 to 5 As shown, the heat sink 4 includes a fixing plate 42 and several heat dissipation fins 43, with the several heat dissipation fins 43 connected to one side of the fixing plate 42; the other side of the fixing plate 42 is in contact with the semiconductor cooling chip 3 through a thermal pad; the fixing plate 42 is fixed to the housing 1 by bolts.
[0054] The heat dissipation fins 43 are evenly arranged on the fixed plate 42. By setting the heat dissipation fins 43 on the fixed plate 42, the heat dissipation area can be increased, making it easier to dissipate heat.
[0055] In some embodiments, such as Figures 1 to 5 As shown, the housing 1 has a plurality of threaded holes spaced apart at one end of the mounting cavity 11, and the fixing plate 42 has through holes aligned with the threaded holes on the housing 1; the fixing plate 42 has a clearance space 44 on the side with heat dissipation fins 43 to accommodate the nuts of bolts.
[0056] After placing the thermoelectric cooler 3 onto the mounting base 2, thermal grease is applied to the thermoelectric cooler 3. Then, the fixing plate 42 is placed at one end of the housing 1 in the mounting cavity 11, and the through hole on the fixing plate 42 is aligned with the threaded hole on the housing 1. The fixing plate 42 is then fixed to the housing 1 with bolts.
[0057] Since the heat dissipation fins 43 are provided with clearance space 44 at the through hole position of the fixing plate 42, the nut can rotate in the clearance space 44, which in turn facilitates the threaded section of the bolt to engage with the threaded part of the housing 1, thus fixing the fixing plate 42 to the housing 1.
[0058] In some embodiments, such as Figures 1 to 5 As shown, the housing 1 has a cable outlet 13 at the position of the mounting cavity 11. The cable of the laser 5 passes through the gap between the connecting parts 24 and finally comes out from the cable outlet 13. With the above arrangement, the wiring of the laser 5 is not affected while ensuring heat dissipation of the laser 5. The cable of the thermistor is also led out from the cable outlet 13.
[0059] Installation process: Set the mounting cavity 11 of the housing 1 upward and fix the mounting base 2 on the mounting cavity 11; then insert the working end of the laser 5 into the mounting hole 21 of the mounting base 2, the limiting part 51 of the laser 5 abuts against the mounting base 2, and apply thermal grease into the mounting base 2, covering the laser 5.
[0060] The thermoelectric cooler 3 is placed on the connecting component 24, and the thermoelectric cooler 3 is in contact with the thermal grease of the mounting base 2.
[0061] Thermal grease is applied to the other side of the thermoelectric cooler 3, and then the heat sink 4 is fixed to the housing 1. After the heat sink 4 is fixed, the heat sink 4 presses against the thermal pad, the thermoelectric cooler 3, the thermal pad and the laser 5 in sequence.
[0062] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A laser heat dissipation device, characterized in that, include: The housing has a mounting cavity at one end and an optical collimation cavity at the other end; The mounting cavity has mounting steps; Mounting base, connected to the mounting step; The mounting base has a mounting hole coaxially arranged with the optical collimation cavity, and the laser is installed in the mounting hole; A semiconductor cooling chip is connected to the mounting base, and a thermal pad is connected between the chip and the laser. A heat sink is connected to one end of the housing in the mounting cavity; a thermal pad is connected between the heat sink and the semiconductor cooling chip. After the heat sink is connected to the housing, the heat sink sequentially presses against the thermal pad, the semiconductor cooling chip, the thermal pad, and the laser.
2. The laser heat dissipation device as described in claim 1, characterized in that, The mounting step has a connecting hole with an internal thread; the mounting base has a through hole aligned with the connecting hole, and the mounting base is fixed to the connecting hole by bolts.
3. The laser heat dissipation device as described in claim 1, characterized in that, The working end of the laser is inserted into the mounting hole, and the laser has a limiting part that abuts against the mounting base.
4. A laser heat dissipation device as described in claim 3, characterized in that, The outer peripheral wall of the limiting part has a limiting groove, and the mounting base has a protrusion. A portion of the protrusion is inserted into the limiting groove, and there is a gap between the inserted portion of the protrusion and the limiting groove; wherein, the thermal pad is thermal grease.
5. A laser heat dissipation device as described in claim 3, characterized in that, The mounting base has a recessed structure at the laser limiting part, and the laser limiting part is located in the recessed structure; the thermal pad is thermal grease, and the thermal grease can fill the recessed structure.
6. A laser heat dissipation device as described in claim 5, characterized in that, The mounting base has at least two connecting components on one side with a recessed structure, and the thermoelectric cooler abuts against the connecting components; thermally conductive silicone grease is filled between the thermoelectric cooler and the mounting base.
7. A laser heat dissipation device as described in claim 6, characterized in that, The heat sink has a groove corresponding to the thermoelectric cooler, and the thermal pad is disposed in the groove and abuts against the thermoelectric cooler.
8. A laser heat dissipation device as described in claim 1, characterized in that, The heat sink includes a fixing plate and several heat dissipation fins, with the heat dissipation fins connected to one side of the fixing plate; the other side of the fixing plate abuts against the semiconductor cooling chip via a thermal pad; the fixing plate is fixed to the housing by bolts.
9. A laser heat dissipation device as described in claim 8, characterized in that, The housing has a plurality of threaded holes spaced apart at one end of the mounting cavity, and the fixing plate has through holes aligned with the threaded holes on the housing; the fixing plate has clearance space on the side with heat dissipation fins to accommodate the nuts of bolts.
10. A laser heat dissipation device as described in claim 1, characterized in that, The housing has a cable outlet at the location of the mounting cavity.