A heating device

Abstract

The application discloses a heating device and belongs to the field of heating devices.The heating device comprises a power supply assembly, a control assembly and a heating assembly; the power supply assembly is connected with the control assembly, and the control assembly is electrically connected with the heating assembly; the heating assembly has a heating surface, and the heating surface is used for placing a shaping plate; the control assembly is used for controlling the power supply assembly to supply power to the heating assembly, so that the heating surface heats the shaping plate.

Description

Technical Field

[0001] This application belongs to the field of heating devices, and specifically relates to a heating device. Background Technology

[0002] With the development of technology, the use of shaping plates has become increasingly widespread. Shaped plates are made of composite materials and can deform when heated, allowing them to be applied to the human body. By attaching the shaping plate to the body, injured areas can be immobilized; for example, the shaping plate can be attached to the spine for fixation. The shape of the shaping plate usually differs from the shape of the human body part. It needs to be heated to conform to the shape of the body part before it can be applied. However, the heating process for shaping plates is typically quite complex. Utility Model Content

[0003] The purpose of this application is to provide a heating device that at least solves the problem that heating plastic sheets is usually quite complex.

[0004] This application provides a heating device, which includes: a power supply component, a control component, and a heating component;

[0005] The power supply assembly is connected to the control assembly, and the control assembly is electrically connected to the heating assembly. The heating assembly has a heating surface for placing the shaping plate.

[0006] The control assembly is used to control the power supply assembly to supply power to the heating assembly, so that the heating surface heats the shaping plate.

[0007] Optionally, the heating assembly includes a first heating plate and a second heating plate;

[0008] Both the first heating plate and the second heating plate are electrically connected to the control component. The first heating plate has the heating surface, and the second heating plate can be stacked with the first heating plate, and the second heating plate has a heating surface.

[0009] When the shaping plate is placed on the heating surface of the first heating plate, the second heating plate is stacked on top of the first heating plate, and the heating surface is in contact with the shaping plate.

[0010] Optionally, the heating assembly has a receiving cavity and an opening, the opening communicating with the receiving cavity, the receiving cavity for receiving the molding plate, the cavity wall of the receiving cavity forming the heating surface, and a locking member provided at the opening, the locking member having a locked state and an unlocked state;

[0011] When the locking member is in the locked state, the locking member locks the opening; when the locking member is in the unlocked state, the locking member releases the locking of the opening.

[0012] Optionally, the control component and the power supply component are integrated into a single structure.

[0013] Optionally, the power supply assembly has a housing, and the control assembly includes a display screen and a control circuit board. The display screen is disposed in the housing, and the control circuit board is disposed inside the housing. The display screen is electrically connected to the control circuit board, and the control circuit board is electrically connected to the heating assembly via a connecting wire.

[0014] Optionally, the control component includes a housing, a control circuit board, and control buttons;

[0015] The control circuit board is disposed in the housing, the control button is disposed on the outer wall of the housing, the control button is electrically connected to the control circuit board, the control circuit board is electrically connected to the power supply component through a first wire, and the control circuit board is electrically connected to the heating component through a second wire.

[0016] Optionally, the control component integrates a wireless connection module for connecting to electronic devices.

[0017] Optionally, the heating device further includes a cooling component;

[0018] The cooling assembly is electrically connected to the control assembly. The cooling assembly has a cooling surface for contacting the heated plastic sheet to cool it.

[0019] The control component is also used to control the power supply component to supply power to the cooling component so that the cooling component cools down.

[0020] Optionally, the cold zone assembly includes a heat-conducting plate and a semiconductor cooling element;

[0021] The heat-conducting plate has a first side and a second side facing away from each other. The semiconductor cooling element is disposed on the first side, and the second side forms the cooling surface. The semiconductor cooling element is electrically connected to the control component, and the control component is also used to control the power supply component to supply power to the semiconductor cooling element.

[0022] Optionally, the cooling assembly includes a housing and a cooling fan. The housing has a housing space in which the cooling fan is disposed. The housing has a mounting surface with multiple through holes, and the cooling fan faces the multiple through holes. The control assembly is electrically connected to the cooling fan, and the mounting surface forms the cooling surface.

[0023] In this embodiment, since the power supply component is connected to the control component, and the control component is electrically connected to the heating component, the power supply can be controlled by the control component to supply power to the heating component. Once the heating component is powered, it will heat up, causing the heating surface to heat up. When the shaping plate is placed on the heating surface, the heating surface can heat the shaping plate, causing it to soften and become easily deformable. This allows the shaping plate to be shaped according to actual needs, achieving the desired shape. In other words, in this embodiment, by connecting the control component to the power supply component and electrically connecting the control component to the heating component, when heating the shaping plate is required, the shaping plate can be directly placed on the heating surface. The control component then controls the power supply component to supply power to the heating component, allowing the heating component to heat the shaping plate, making the heating of the shaping plate relatively simple. In short, in this embodiment, heating the shaping plate is relatively simple; simply placing the shaping plate on the heating surface is sufficient for heating. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of one embodiment of a heating device provided in this application;

[0025] Figure 2 This is a second schematic diagram illustrating a heating device provided in an embodiment of this application;

[0026] Figure 3 This is a third schematic diagram illustrating a heating device provided in an embodiment of this application;

[0027] Figure 4 This is a fourth schematic diagram illustrating a heating device provided in an embodiment of this application;

[0028] Figure 5 This diagram illustrates a refrigeration component provided in an embodiment of this application.

[0029] Figure 6 This is a schematic diagram illustrating a heating assembly provided in an embodiment of this application.

[0030] Figure label:

[0031] 10: Power supply assembly; 20: Control assembly; 21: Display screen; 22: Housing; 23: Control buttons; 30: Heating assembly; 31: First heating plate; 32: Second heating plate; 33: Locking element; 40: Cooling assembly; 41: Heat conduction plate; 42: Semiconductor cooling element. Detailed Implementation

[0032] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0033] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0034] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] like Figures 1 to 6 As shown, the heating device includes a power supply component 10, a control component 20, and a heating component 30.

[0036] The power supply assembly 10 is connected to the control assembly 20, and the control assembly 20 is electrically connected to the heating assembly 30. The heating assembly 30 has a heating surface for placing the molding plate. The control assembly is used to control the power supply assembly 10 to supply power to the heating assembly 30 so that the heating surface heats the molding plate.

[0037] In this embodiment, since the power supply component 10 is connected to the control component 20, and the control component 20 is electrically connected to the heating component 30, the power supply can be controlled by the control component 20 to supply power to the heating component 30. Once the heating component 30 is powered, it will heat up, causing the heating surface to heat up. When the shaping plate is placed on the heating surface, the heating surface can heat the shaping plate, causing it to soften and become easily deformable. This allows the shaping plate to be shaped according to actual needs, achieving the desired shape. In other words, in this embodiment, by connecting the control component 20 to the power supply component 10 and electrically connecting the control component 20 to the heating component 30, when heating the shaping plate is required, the shaping plate can be directly placed on the heating surface. The control component 20 then controls the power supply component 10 to supply power to the heating component 30, allowing the heating component 30 to heat the shaping plate, making the heating of the shaping plate relatively simple. In this embodiment of the application, the molding plate can be heated in a relatively simple way; that is, the molding plate only needs to be placed on the heating surface to heat the molding plate.

[0038] It should be noted that the area of ​​the heating surface can be large, and the area of ​​the heating surface can be greater than or equal to the area of ​​the molding plate. The shape of the heating surface can be the same as the shape of the molding plate, so that the molding plate can be fully heated after being placed on the heating surface.

[0039] In addition, in this embodiment, the control component 20 can control the power of the electrical energy transmitted from the power supply component 10 to the heating component 30. That is, once the shaping plate is placed on the heating surface of the heating component 30, the control component 20 can control the power supply component 10 to transmit electrical energy to the heating component 30 with a larger power. Thus, under the action of the large power electrical energy, the heating component 30 can quickly heat up and heat the shaping plate.

[0040] In addition, in this embodiment, the power supply component 10 can be a battery pack.

[0041] In addition, in this embodiment, the heating component 30 may be flexible, so that the heating component 30 can be bent, thereby allowing the heating component 30 to be bent after the heating of the plastic plate is finished, making it easy to store the heating component 30.

[0042] Additionally, in some embodiments, such as Figure 1 As shown, the heating assembly 30 includes a first heating plate 31 and a second heating plate 32; both the first heating plate 31 and the second heating plate 32 are electrically connected to the control assembly 20. The first heating plate 31 has a heating surface, and the second heating plate 32 can be stacked with the first heating plate 31, and the second heating plate 32 has a heating surface; when a shaping plate is placed on the heating surface of the first heating plate 31, the second heating plate 32 is stacked with the first heating plate 31, and the heating surface contacts the shaping plate.

[0043] Since both the first heating plate 31 and the second heating plate 32 are electrically connected to the control component 20, the power supply component 10 can be controlled by the control component 20 to transmit electrical energy to both the first heating plate 31 and the second heating plate 32. This allows both the heating surface of the first heating plate 31 and the heating surface of the second heating plate 32 to heat up. Therefore, when heating the molding plate is required, the molding plate can be placed directly on the heating surface of the first heating plate 31, and then the second heating plate 32 can be stacked on top of the first heating plate 31, with the molding plate positioned between the first heating plate 31 and the second heating plate 32. This ensures that the heating surface contacts one surface of the molding plate, and the heating surface contacts the other surface. Once the first heating plate 31 and the second heating plate 32 are powered, both opposing surfaces of the molding plate can be heated simultaneously, allowing for rapid heating. In other words, by using the first heating plate 31 and the second heating plate 32, the heating efficiency of the molding plate can be effectively improved.

[0044] It should be noted that both the first heating plate 31 and the second heating plate 32 are provided with heating wires. The heating wires are electrically connected to the control component 20. The electrical energy of the power supply component 10 is transferred to the heating wires through the control component 20, causing the heating wires to heat up, which in turn causes the heating surface of the first heating plate 31 to heat up, and / or causes the heating surface of the second heating plate 32 to heat up. The heating wires, the first heating plate 31, and the second heating plate 32 are all flexible, allowing the first heating plate 31 and the second heating plate 32 to be bent.

[0045] Additionally, in some embodiments, such as Figure 6 As shown, the heating assembly 30 has a receiving cavity and an opening, the opening being connected to the receiving cavity. The receiving cavity is used to receive the molding plate, and the cavity wall of the receiving cavity forms a heating surface. A locking member 33 is provided at the opening, and the locking member 33 has a locked state and an unlocked state. When the locking member 33 is in the locked state, the locking member 33 locks the opening; when the locking member 33 is in the unlocked state, the locking member 33 releases the lock on the opening.

[0046] Since the heating assembly 30 has a receiving cavity and an opening, the cavity wall effectively forms a heating surface. Additionally, a locking member 33 is provided at the opening, allowing the opening to be locked. Even if the opening is closed, the locking member 33 can be released to open it. Specifically, when the molding plate needs to be heated, the locking member 33 can be unlocked, releasing the lock on the opening and allowing the molding plate to be placed in the receiving cavity. The control assembly 20 then controls the power supply assembly 10 to supply power to the heating assembly 30, which heats the molding plate in the receiving cavity. This heating ensures the molding plate is heated evenly, facilitating subsequent molding. Once heating is complete, the molding plate can be removed from the receiving cavity through the opening, and the locking member 33 is switched to the locked state, locking the opening and preventing impurities from entering the receiving cavity. By setting up a receiving cavity, the molding plate in the receiving cavity can be heated more completely, which facilitates the molding of the molding plate. In addition, the locking part 33 can ensure that there are fewer impurities in the receiving cavity.

[0047] It should be noted that the heating component 30 can be a bag-like structure, in which case the locking member 33 can be a zipper structure. Of course, the locking member 33 can also be other structures, such as a snap-on structure. The specific type of the locking member 33 is not limited in this embodiment.

[0048] In some embodiments, the control component 20 and the power supply component 10 are integrated into a single structure. This arrangement facilitates the storage of the heating device and simplifies its structure.

[0049] Additionally, in some embodiments, such as Figure 2 As shown, the power supply assembly 10 has a housing, and the control assembly 20 includes a display screen 21 and a control circuit board (not shown in the figure). The display screen 21 is disposed in the housing, and the control circuit board is disposed inside the housing. The display screen 21 is electrically connected to the control circuit board, and the control circuit board is electrically connected to the heating assembly 30 through a connecting wire.

[0050] Since the display screen 21 is located within the housing and the control circuit board is located inside the housing, and the display screen 21 is electrically connected to the control circuit board, operations such as clicking and swiping can be performed on the display screen 21. This is equivalent to sending corresponding commands to the control circuit board, which can then control the power supply component 10 to transmit electrical energy to the heating component 30. In other words, by setting up the display screen 21 and the control circuit board, it is convenient for operators to operate on the display screen 21, thereby facilitating the operation and control of the power supply component 10, and enabling operators to control whether to provide electrical energy to the heating component 30.

[0051] It should be noted that operation on the display screen 21 allows for control of the power of the electrical energy transmitted by the heating component 30. Furthermore, the type of display screen 21 includes, but is not limited to, LED display screen 21 and LCD display screen 21.

[0052] Additionally, in some embodiments, such as Figure 3 As shown, the control component 20 includes a housing 22, a control circuit board, and a control button 23. The control circuit board is disposed in the housing 22, and the control button 23 is disposed on the outer wall of the housing 22. The control button 23 is electrically connected to the control circuit board. The control circuit board is electrically connected to the power supply component 10 through a first wire, and the control circuit board is electrically connected to the heating component 30 through a second wire.

[0053] With this setup, once the molding plate needs to be heated, it can be placed on the heating surface of the heating assembly 30. The operator can then operate the control button 23, which is equivalent to sending a corresponding command to the control circuit board. The control circuit board can then control the power supply assembly 10, causing it to transfer electrical energy to the heating assembly 30. Specifically, the electrical energy from the power supply assembly 10 is transferred to the heating assembly 30 through the first and second wires. In short, by setting up the control button 23, the operator can easily control the power supply assembly 10.

[0054] It should be noted that the number of control buttons 23 can be set according to actual needs. For example, if there are three control buttons 23, one control button 23 is used to control the power supply component 10 to transmit electrical energy to the heating component 30, another control button 23 is used to control the power supply to stop transmitting electrical energy to the heating component 30, and another control button 23 is used to control the power of the electrical energy transmitted from the power supply component 10 to the heating component 30. Alternatively, the number of control buttons 23 can be two. The specific number of control buttons 23 is not limited in this embodiment.

[0055] In some embodiments, the control component 20 integrates a wireless connection module for connecting to electronic devices. With this configuration, during the operation of the heating device, the operator can connect to the wireless connection module via an electronic device and then operate the device to control the power supply component 10. In other words, by providing a wireless connection module, the operator can easily control the power supply component 10.

[0056] It should be noted that the wireless connection module can be a Bluetooth module, and the electronic devices include, but are not limited to, mobile phones, laptops, tablets, etc.

[0057] Additionally, in some embodiments, such as Figure 4 As shown, the heating device also includes a cooling assembly 40; the cooling assembly 40 is electrically connected to the control assembly 20, the cooling assembly 40 has a cooling surface for contacting the heated molding plate to cool the heated molding plate; the control assembly 20 is also used to control the power supply assembly 10 to supply power to the cooling assembly 40 so that the cooling assembly 40 cools.

[0058] Since the cooling component 40 is electrically connected to the control component 20, and the cooling component 40 has a cooling surface, the power supply component 10 can be controlled by the control component 20 to supply power to the cooling component 40, thereby enabling the cooling component 40 to operate. Specifically, in practical applications, once the molding plate is heated and shaped, the shaped plate can be placed on the cooling surface, and the power supply component 10 can be controlled by the control component 20 to supply power to the cooling component 40. The cooling surface of the cooling component 40 can then transfer cold energy to the molding plate, allowing the molding plate to cool and solidify rapidly. That is, by setting up the cooling component 40, the molding plate can be rapidly cooled after being heated and shaped, thereby improving the efficiency of the molding plate's curing.

[0059] Additionally, in some embodiments, such as Figure 5 As shown, the cold zone assembly includes a heat-conducting plate 41 and a semiconductor cooling element 42; the heat-conducting plate 41 has a first side and a second side facing away from each other, the semiconductor cooling element 42 is disposed on the first side, and the second side forms a cooling surface, the semiconductor cooling element 42 is electrically connected to the control component 20, and the control component 20 is also used to control the power supply component 10 to supply power to the semiconductor cooling element 42.

[0060] Since the thermoelectric cooler 42 is electrically connected to the control component 20, the control component 20 can control the power supply component 10 to supply power to the thermoelectric cooler 42, causing the thermoelectric cooler 42 to operate. This allows the thermoelectric cooler 42 to cool the heat-conducting plate 41. Once the first surface of the heat-conducting plate 41 contacts the molded plate, the heat-conducting plate 41 can transfer heat from the molded plate to the thermoelectric cooler 42, causing the thermoelectric cooler 42 to cool rapidly and the molded plate to solidify quickly. In other words, by using the heat-conducting plate 41 and the thermoelectric cooler 42, the molded plate can solidify rapidly.

[0061] It should be noted that the control component 20 can be electrically connected to the semiconductor cooling component 42 via a connecting wire. Additionally, the heat-conducting plate 41 can be made of metal, for example, copper. Of course, the heat-conducting plate 41 can also be made of other materials with thermal conductivity, as long as the heat-conducting plate 41 can conduct heat.

[0062] In some embodiments, the cooling assembly 40 includes a receiving member (not shown) and a cooling fan (not shown). The receiving member has a receiving space in which the cooling fan is disposed. The receiving member has a mounting surface with multiple through holes, and the cooling fan faces the multiple through holes. The control assembly 20 is electrically connected to the cooling fan, and the mounting surface forms a cooling surface.

[0063] Since the cooling fan is electrically connected to the control component 20, the control component 20 can control the power supply component 10 to supply power to the cooling fan, causing the cooling fan to run. The cold air blown out by the cooling fan can then be transmitted to the through-hole on the mounting surface and outwards through the through-hole. At this point, once the molded sheet comes into contact with the mounting surface of the receiving component, the cold air blown out by the cooling fan can pass through the through-hole perpendicularly to the molded sheet, cooling the molded sheet and causing it to solidify rapidly. In other words, by using the receiving component and the cooling fan, the molded sheet can solidify rapidly.

[0064] It should be noted that the control component 20 can be electrically connected to the cooling fan via a connecting cable.

[0065] In this embodiment, since the power supply component 10 is connected to the control component 20, and the control component 20 is electrically connected to the heating component 30, the power supply can be controlled by the control component 20 to supply power to the heating component 30. Once the heating component 30 is powered, it will heat up, causing the heating surface to heat up. When the shaping plate is placed on the heating surface, the heating surface can heat the shaping plate, causing it to soften and become easily deformable. This allows the shaping plate to be shaped according to actual needs, achieving the desired shape. In other words, in this embodiment, by connecting the control component 20 to the power supply component 10 and electrically connecting the control component 20 to the heating component 30, when heating the shaping plate is required, the shaping plate can be directly placed on the heating surface. The control component 20 then controls the power supply component 10 to supply power to the heating component 30, allowing the heating component 30 to heat the shaping plate, making the heating of the shaping plate relatively simple. In this embodiment of the application, the molding plate can be heated in a relatively simple way; that is, the molding plate only needs to be placed on the heating surface to heat the molding plate.

[0066] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0067] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A heating device, characterized in that, The heating device includes: a power supply component, a control component, and a heating component; The power supply assembly is connected to the control assembly, and the control assembly is electrically connected to the heating assembly. The heating assembly has a heating surface for placing the shaping plate. The control assembly is used to control the power supply assembly to supply power to the heating assembly, so that the heating surface heats the shaping plate.

2. The heating device according to claim 1, characterized in that, The heating assembly includes a first heating plate and a second heating plate; Both the first heating plate and the second heating plate are electrically connected to the control component. The first heating plate has the heating surface, and the second heating plate can be stacked with the first heating plate, and the second heating plate has a heating surface. When the shaping plate is placed on the heating surface of the first heating plate, the second heating plate is stacked on top of the first heating plate, and the heating surface is in contact with the shaping plate.

3. The heating device according to claim 1, characterized in that, The heating assembly has a receiving cavity and an opening, the opening being in communication with the receiving cavity, the receiving cavity being used to receive the molding plate, the cavity wall of the receiving cavity forming the heating surface, and a locking member being provided at the opening, the locking member having a locked state and an unlocked state; When the locking element is in the locked state, the locking element locks the opening; When the locking element is in the unlocked state, the locking element releases the lock on the opening.

4. The heating device according to claim 1, characterized in that, The control component and the power supply component are integrated into a single structure.

5. The heating device according to claim 4, characterized in that, The power supply assembly has a housing, and the control assembly includes a display screen and a control circuit board. The display screen is disposed in the housing, and the control circuit board is disposed inside the housing. The display screen is electrically connected to the control circuit board, and the control circuit board is electrically connected to the heating assembly via a connecting wire.

6. The heating device according to claim 1, characterized in that, The control component includes a housing, a control circuit board, and control buttons; The control circuit board is disposed in the housing, the control button is disposed on the outer wall of the housing, the control button is electrically connected to the control circuit board, the control circuit board is electrically connected to the power supply component through a first wire, and the control circuit board is electrically connected to the heating component through a second wire.

7. The heating device according to claim 1, characterized in that, The control component integrates a wireless connection module, which is used to connect to electronic devices.

8. The heating device according to claim 1, characterized in that, The heating device also includes a cooling component; The cooling assembly is electrically connected to the control assembly. The cooling assembly has a cooling surface for contacting the heated plastic sheet to cool it. The control component is also used to control the power supply component to supply power to the cooling component so that the cooling component cools down.

9. The heating device according to claim 8, characterized in that, The cold zone assembly includes a heat-conducting plate and a semiconductor cooling component; The heat-conducting plate has a first side and a second side facing away from each other. The semiconductor cooling element is disposed on the first side, and the second side forms the cooling surface. The semiconductor cooling element is electrically connected to the control component, and the control component is also used to control the power supply component to supply power to the semiconductor cooling element.

10. The heating device according to claim 8, characterized in that, The cooling assembly includes a housing and a cooling fan. The housing has a housing space in which the cooling fan is disposed. The housing has a mounting surface with multiple through holes. The cooling fan faces the multiple through holes. The control assembly is electrically connected to the cooling fan, and the mounting surface forms the cooling surface.

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