A heat dissipation system and energy storage product
By using separate circuit boards and air ducts in energy storage products, the problems of low heat dissipation efficiency and heat accumulation caused by centralized power device arrangement are solved, achieving more efficient heat dissipation and a more compact structural design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN POWEROAK NEWENER CO LTD
- Filing Date
- 2025-04-28
- Publication Date
- 2026-05-29
Smart Images
Figure CN224305986U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of energy storage technology, and in particular to a heat dissipation system and an energy storage product. Background Technology
[0002] With the rapid development of new energy technologies, the demand for energy storage products is also gradually increasing. As energy storage products are upgraded and iterated, their functions are constantly being added. More functions mean more power devices on the circuit board, and the heat generated by the power device losses is also increasing.
[0003] In existing technologies, power devices (such as power modules, chipsets, MOSFETs, etc.) on circuit boards are typically concentrated in a planar area of the circuit board, which leads to the following problems:
[0004] Low space utilization: Power devices densely occupy the core area of the circuit board, affecting the layout of other functional modules and causing local heat to be unable to dissipate;
[0005] Limited heat dissipation efficiency: Traditional series air ducts need to pass through the heat-generating area formed by all power devices. The air ducts are long and have high air resistance. The power devices at the rear end suffer from insufficient heat dissipation due to airflow attenuation.
[0006] Thermal accumulation effect: The heat emitted by the upstream power devices enters the downstream area with the airflow. As the internal air absorbs heat and heats up, it exacerbates the temperature rise problem of the downstream devices.
[0007] In short, current power devices are concentrated in a single airflow channel, which suffers from drawbacks such as long airflow channels, high air resistance, and insufficient heat dissipation at the rear of the device. How to improve the heat dissipation efficiency of power devices has become an urgent technical challenge to be solved. Utility Model Content
[0008] In view of the above problems, embodiments of this application provide a heat dissipation system and an energy storage product, which overcome the above problems or at least partially solve the above problems.
[0009] According to one aspect of the embodiments of this application, a heat dissipation system is provided, including a housing, a first circuit board, a second circuit board, a first air supply component, a first air exhaust component, and a second air exhaust component; the housing is provided with a first receiving cavity and an air inlet and an air outlet communicating with the first receiving cavity; the first air supply component is received in the first receiving cavity and disposed corresponding to the air inlet, and the first air exhaust component is received in the first receiving cavity and disposed corresponding to the air outlet; the first circuit board and the second circuit board are disposed side by side in the first receiving cavity along a first direction; a first power device is disposed on the first circuit board, and a first air duct is formed between the air inlet, the first air supply component, the first power device, the first air exhaust component, and the air outlet; a second power device is disposed on the second circuit board, and the second air exhaust component is received in the first receiving cavity and disposed close to the second circuit board, and a second air duct is formed between the air inlet, the first air supply component, the second power device, the second air exhaust component, and the air outlet.
[0010] In one alternative embodiment, the air inlet and the air outlet are arranged opposite each other along a second direction, which is perpendicular to the first direction, and the first circuit board is disposed between the air inlet and the air outlet.
[0011] In one alternative embodiment, the heat dissipation system further includes a first air duct paper having a first wall and a second wall connected together. The first wall is disposed on the side of the first power device facing away from the first circuit board, and the second wall is disposed on the side of the first power device facing away from the second circuit board along the first direction. The side of the first wall facing away from the second wall along the first direction has an opening for fluid to flow into the second air duct.
[0012] In an alternative embodiment, the heat dissipation system further includes a first radiator disposed on the first circuit board, and the first wall is mounted on the first radiator.
[0013] In one optional embodiment, the heat dissipation system further includes a second air duct paper, which comprises a first part, a second part, and a third part connected in sequence. The first part, the second part, and the third part enclose a channel with an inlet and an outlet. The second power device is housed in the channel. The first part is disposed on the side of the second power device facing away from the first circuit board along the first direction, and the third part is disposed on the side of the second power device facing the first circuit board along the first direction. The second exhaust component is disposed corresponding to the outlet, and a second air duct is formed between the air inlet, the first air supply component, the opening, the inlet, the second power device, the outlet, the second exhaust component, and the air outlet.
[0014] In one alternative approach, along the second direction, the second power device is positioned close to the air inlet, and the inlet is positioned close to the air inlet.
[0015] In an alternative embodiment, the heat dissipation system further includes two second heat sinks disposed opposite each other in the channel along the first direction, a second power device disposed between the two second heat sinks, and a second portion mounted on the second heat sinks.
[0016] In one alternative, the number of the first air supply components is two, and the two first air supply components are spaced apart along the first direction; and / or, the number of the first exhaust components is two, and the two first exhaust components are spaced apart along the first direction.
[0017] According to one aspect of the present application, an energy storage product is provided, including a battery pack and the aforementioned heat dissipation system, wherein the battery pack is housed in the housing.
[0018] In one alternative, the housing is provided with a partition that divides the housing into a first receiving cavity and a second receiving cavity, wherein the battery pack is housed in the second receiving cavity.
[0019] The beneficial effects of this application embodiment include: providing a heat dissipation system, which includes a first circuit board and a second circuit board. A first power device is located on the first circuit board and dissipates heat through a first air duct, while a second power device is located on the second circuit board and dissipates heat through a second air duct. Compared to the single air duct in the prior art, this system can shorten the length of the first and second air ducts, reduce air resistance, and alleviate the defect of insufficient heat dissipation of the tail device. In addition, the first and second air ducts in this application are not independent; they share at least an air inlet, a first air supply component, a first air exhaust component, and an air outlet. This can uniformly distribute the flow field temperature inside the first receiving cavity, reduce heat accumulation, and make the overall structure of the heat dissipation system compact. Attached Figure Description
[0020] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.
[0021] Figure 1 This is a schematic diagram of the heat dissipation system provided in an embodiment of this application.
[0022] Figure 2 This is a schematic diagram of another implementation of the heat dissipation system provided in the embodiments of this application;
[0023] Figure 3 This is an exploded view of another implementation of the heat dissipation system provided in the embodiments of this application.
[0024] Figure 4 This is a schematic diagram of the heat dissipation principle of the heat dissipation system provided in the embodiments of this application.
[0025] Figure 5 This is a schematic diagram of the energy storage product provided in the embodiments of this application.
[0026] Figure 6 This is an exploded view of the energy storage product provided in the embodiments of this application.
[0027] Figure 7 This is a partial explosion diagram of the energy storage product provided in the embodiments of this application.
[0028] Figure 8 This is a cross-sectional view of a wind field for an energy storage product provided in an embodiment of this application.
[0029] Figure 9 This is another cross-sectional view of the wind field of the energy storage product provided in the embodiments of this application.
[0030] Figure 10 This is a temperature field distribution diagram of the energy storage product provided in the embodiments of this application.
[0031] Figure 11 This is a temperature diagram of the first power device and the second power device provided in the embodiments of this application.
[0032] The attached figures are labeled as follows:
[0033] 100. Heat dissipation system;
[0034] 1. Housing; 2. First circuit board; 3. Second circuit board; 4. First air supply component; 5. First air exhaust component; 6. Second air exhaust component; 7. First power device; 8. Second power device; 9. First air duct paper; 10. First heat sink; 11. Second air duct paper; 12. Second heat sink;
[0035] 101. First receiving cavity; 102. Air inlet; 103. Air outlet;
[0036] 901, First wall; 902, Second wall; 9s, Opening;
[0037] 111. Part One; 112. Part Two; 113. Part Three; 11a. Passage; 11b. Entrance; 11c. Exit;
[0038] 1s, first air duct; 2s, second air duct;
[0039] D1, First Direction; D2, Second Direction;
[0040] 200. Energy storage product; 201. Battery pack; 202. Separator; 104. Second receiving cavity; 203. First cover plate; 204. Second cover plate. Detailed Implementation
[0041] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly attached to the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and similar expressions used in this specification are for illustrative purposes only.
[0042] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0043] Please see Figure 1This application provides a heat dissipation system 100, including a housing 1, a first circuit board 2, a second circuit board 3, a first air supply component 4, a first air exhaust component 5, a second air exhaust component 6, a first power device 7, and a second power device 8. The housing 1 is provided with a first receiving cavity 101 and an air inlet 102 and an air outlet 103 communicating with the first receiving cavity 101. The first air supply component 4 is housed in the first receiving cavity 101 and is disposed corresponding to the air inlet 102, and the first air exhaust component 5 is housed in the first receiving cavity 101 and is disposed corresponding to the air outlet 103. The first circuit board 2 and the second power device 8... Circuit board 3 is arranged side-by-side in the first receiving cavity 101 along the first direction D1; the first power device 7 is disposed on the first circuit board 2, and a first air duct 1s is formed between the air inlet 102, the first air supply component 4, the first power device 7, the first exhaust component 5, and the air outlet 103; the second power device 8 is disposed on the second circuit board 3, and the second exhaust component 6 is housed in the first receiving cavity 101 and disposed close to the second circuit board 3, and a second air duct 2s is formed between the air inlet 102, the first air supply component 4, the second power device 8, the second exhaust component 6, and the air outlet 103. The heat dissipation system 100 of this application embodiment, by setting the first circuit board 2 and the second circuit board 3, places the first power device 7 on the first circuit board 2 and dissipates heat through the first air duct 1s, while simultaneously placing the second power device 8 on the second circuit board 3 and dissipating heat through the second air duct 2s. Compared with the prior art using only a single air duct, the heat dissipation system 100 provided in this application embodiment can effectively shorten the length of the first air duct 1s and the second air duct 2s, reduce wind resistance, and alleviate the problem of insufficient heat dissipation of the tail device. Furthermore, the first air duct 1s and the second air duct 2s in this application are not completely independent. They share the air inlet 102, the first air supply component 4, the first air exhaust component 5, and the air outlet 103. This helps to uniformly distribute the flow field temperature inside the first receiving cavity 101, reduce heat accumulation, and make the structure of the entire heat dissipation system 100 more compact.
[0044] In some embodiments, the rotational speeds of the first air supply component 4, the first exhaust component 5, and the second exhaust component 6 can be controlled separately by a controller, thereby adjusting the temperatures of the first air duct 1s and the second air duct 2s, and thus changing the flow ratio between the first air duct 1s and the second air duct 2s. Through dynamic adjustment, the flow field inside the housing 1 can be made more reasonable, and the heat dissipation effect can be more obvious.
[0045] For example, when the second power device 8 in the second air duct 2s has high losses and high temperature, the rotation speed of the second exhaust fan 6 can be increased to increase the air intake of the second air duct 2s and enhance the heat dissipation effect of the second air duct 2s.
[0046] For example, when the first power device 7 in the first air duct 1s has high losses and high temperature, the rotation speed of the first air supply component 4 and / or the rotation speed of the first exhaust component 5 can be increased to increase the air intake volume and fluid flow rate of the first air duct 1s and enhance the heat dissipation effect of the first air duct 1s.
[0047] It is worth noting that the program steps involved in the controller controlling the speed of the first air supply component 4, the speed of the first exhaust component 5, and the speed of the second exhaust component 6 are existing program steps, and the controller also uses existing processors, such as Intel's i3 processor, AMD Ryzen processor, etc.
[0048] It is worth noting that the first air supply component 4 can be an air supply fan or an air supply blower, the first air exhaust component 5 can be an exhaust fan or an exhaust blower, and the second air exhaust component 6 can be an exhaust fan or an exhaust blower.
[0049] It is worth noting that there can be multiple first power devices 7, which are spaced apart on the first circuit board 2. There can also be multiple second power devices 8, which are spaced apart on the second circuit board 3.
[0050] It is understandable that the first air duct 1s is not a solid entity, but rather an air duct formed between various components for fluid flow. The second air duct 2s is also not a solid entity, but rather an air duct formed between various components for fluid flow.
[0051] In some embodiments, the air inlet 102 and the air outlet 103 are arranged opposite each other along a second direction D2, which is perpendicular to the first direction D1. The first circuit board 2 is disposed between the air inlet 102 and the air outlet 103. In this configuration, the first air duct 1s can form an approximately straight line along the second direction D2, improving the heat dissipation efficiency of the first power device 7 in the first air duct 1s. It is understood that the relative positional relationship between the air inlet 102 and the air outlet 103 is not limited to the arrangement of being opposite each other along the second direction D2.
[0052] In some embodiments, please refer to Figure 2 and Figure 3The heat dissipation system 100 further includes a first air duct paper 9, which has a first wall 901 and a second wall 902 connected together. The first wall 901 is disposed on the side of the first power device 7 away from the first circuit board 2, and the second wall 902 is disposed on the side of the first power device 7 away from the second circuit board 3 along the first direction D1. The side of the first wall 901 away from the second wall 902 along the first direction D1 has an opening 9s, which is used for fluid to flow into the second air duct 2s. After the fluid enters the first air duct 1s through the air inlet 102 and the first air supply component 4, it flows into the second air duct 2s through the opening 9s to dissipate heat from the second power device 8 in the second air duct 2s.
[0053] In some embodiments, the heat dissipation system 100 further includes a first heat sink 10, which is disposed on the first circuit board 2, and the first wall 901 is mounted on the first heat sink 10. Specifically, the first wall 901 may be secured to the second heat sink 12 with screws. The provision of the first heat sink 10 not only facilitates the improvement of heat dissipation efficiency for the first power device 7 disposed on the first circuit board 2, but also facilitates the installation of the first air duct paper 9.
[0054] It is worth noting that in some embodiments, the number of first heat sinks 10 is several, and the several first heat sinks 10 are distributed on the first circuit board 2. For example, the number of first heat sinks 10 is four, and the four first heat sinks 10 are distributed on the first circuit board 2, and the first wall 901 of the first air duct paper 9 is locked to the four first heat sinks 10 by screws.
[0055] In some embodiments, the heat dissipation system 100 further includes a second air duct paper 11, which includes a first part 111, a second part 112, and a third part 113 connected in sequence. The first part 111, the second part 112, and the third part 113 enclose a channel 11a with an inlet 11b and an outlet 11c. The second power device 8 is housed in the channel 11a. The first part 111 is disposed on the side of the second power device 8 away from the first circuit board 2 along the first direction D1, and the third part 113 is disposed on the side of the second power device 8 facing the first circuit board 2 along the first direction D1. The second exhaust member 6 is disposed corresponding to the outlet 11c. A second air duct 2s is formed between the air inlet 102, the first air supply member 4, the opening 9s, the inlet 11b, the second power device 8, the outlet 11c, the second exhaust member 6, and the air outlet 103. With the setting of the second air duct paper 11, the fluid escaping from the opening 9s of the first air duct paper 9 enters the second exhaust component 6 through the inlet 11b, channel 11a, and outlet 11c, ensuring the heat dissipation efficiency of the fluid entering the channel 11a for the second power device 8.
[0056] In some embodiments, along the second direction D2, the second power device 8 is disposed near the air inlet 102, and the inlet 11b is disposed near the air inlet 102. With this arrangement, fluid in the first air duct 1s near the air inlet 102 enters the channel 11a through the inlet 11b of the second air duct paper 11. That is, when the fluid temperature in the first air duct 1s is low, it enters the second air duct 2s, improving the heat dissipation efficiency of the second power device 8 in the second air duct 2s.
[0057] In some embodiments, the heat dissipation system 100 further includes two second heat sinks 12, which are disposed opposite each other along the first direction D1 in the channel 11a. The second power device 8 is disposed between the two second heat sinks 12, and the second portion 112 is mounted on the second heat sink 12. Specifically, the second portion 112 may be secured to the second heat sink 12 with screws. The arrangement of the second heat sinks 12 not only facilitates the improvement of heat dissipation efficiency for the second power device 8 disposed on the second circuit board 3, but also facilitates the installation of the second air duct paper 11.
[0058] In some embodiments, the number of first air supply components 4 is two, and the two first air supply components 4 are arranged at intervals along the first direction D1; and / or, the number of first exhaust components 5 is two, and the two first exhaust components 5 are arranged at intervals along the first direction D1. By setting two first air supply components 4 and / or two first exhaust components 5, the air pressure in the first air duct within 1 second is increased, thereby improving the heat dissipation efficiency.
[0059] In the embodiments of this application, please refer to Figure 4 and combined Figure 3 One working principle of the heat dissipation system 100 is as follows: the first air supply component 4 sends fluid from the external environment into the first air duct paper 9 through the air inlet 102. On the one hand, the fluid entering the first air duct paper 9 flows through the first power device 7 and flows out from the air outlet 103 through the first exhaust component 5. On the other hand, the fluid entering the first air duct paper 9 escapes from the opening 9s of the first air duct paper 9, enters the channel 11a from the inlet 11b of the second air duct paper 11, and is extracted from the outlet 11c of the first air duct paper 9 through the second exhaust component 6. Then the fluid enters the second air duct paper 11 and flows out from the air outlet 103 through the first exhaust component 5.
[0060] According to one aspect of the embodiments of this application, please refer to the following: Figure 5 , Figure 6 and Figure 7An energy storage product 200 is provided, including a battery pack 201 and a heat dissipation system 100, wherein the battery pack 201 is housed in the housing 1. The specific structure and function of the heat dissipation system 100 can be found in the above embodiments, and will not be repeated here.
[0061] In some embodiments, the housing 1 is provided with a partition 202, which divides the housing 1 into a first receiving cavity 101 and a second receiving cavity 104, and the battery pack 201 is housed in the second receiving cavity 104. That is, the battery pack 201 is housed in the second receiving cavity 104, and the first circuit board 2 and the second circuit board 3 are housed in the first receiving cavity 101, which can effectively prevent the airflow of the battery pack 201 and the first air duct 1s and the second air duct 2s in the first receiving cavity from interfering with each other.
[0062] It is understandable that the casing 1 is used as the outer shell of the energy storage product 200.
[0063] In some embodiments, the energy storage product 200 further includes a first cover plate 203 and a second cover plate 204, wherein the first cover plate 203 covers the opening of the first receiving cavity 101 and the second cover plate 204 covers the opening of the second receiving cavity 104.
[0064] Please see Figure 8 and Figure 9 and combined Figure 3 The paper provides two cross-sectional views of the airflow field of the energy storage product 200. The fluid in the first air duct 1s and the second air duct 2s is relatively uniform, and the flow field is smooth. At the same time, the air blown out from the second air duct 2s can also return to the first air duct 1s and dissipate heat through the first exhaust component 5 of the first air duct 1s. The heat dissipation system 100 of the energy storage product 200 provided in this embodiment can effectively prevent the fluid from passing through the entire heat-generating area. The length of the first air duct 1s and the second air duct 2s can be reduced, and the wind resistance can be reduced, thus improving the defect of insufficient heat dissipation of the tail device due to airflow attenuation.
[0065] Please see Figure 10 and combined Figure 3This paper provides a temperature field distribution diagram for an energy storage product 200. In existing technologies with a single air duct, the temperature of the tail components increases with continuous heat accumulation, placing them in a high-temperature environment that significantly impacts their lifespan and safety. In this application, the temperature distribution of all tail components is essentially uniform at around 53°C, with a minimum temperature of 52.44°C, a maximum temperature of 54.99°C, and a maximum temperature difference of 2.5°C. This demonstrates that the parallel arrangement of the first air duct 1s and the second air duct 2s effectively solves the heat accumulation problem in this embodiment. This significantly improves the lifespan of the components and the stability and safety of the entire system.
[0066] Please see Figure 11 and combined Figure 3 The diagram provides temperature maps of the first power device 7 on the first circuit board 2 and the second power device 8 on the second circuit board 3. It can be seen that after the first air duct 1s and the second air duct 2s are connected in parallel, the first power device 7 and the second power device 8 can be distributed in the first air duct 1s and the second air duct 2s. This can effectively avoid the accumulation of hot devices together, the long air ducts and high air resistance, and the defects of insufficient heat dissipation of the tail devices due to airflow attenuation after passing through the entire heat-generating area. Figure 11 The first power device 7 and the second circuit board 3 are distributed at different locations throughout the housing 1, and their temperatures are all within a reasonable range.
[0067] It should be noted that while preferred embodiments of this application are provided in the specification and accompanying drawings, this application can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of this application; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of this application. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this application's specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.
Claims
1. A heat dissipation system, characterized in that, include: Housing, first circuit board, second circuit board, first air supply component, first air exhaust component, second air exhaust component; The housing is provided with a first receiving cavity and an air inlet and an air outlet communicating with the first receiving cavity; the first air supply component is received in the first receiving cavity and is provided corresponding to the air inlet, and the first air exhaust component is received in the first receiving cavity and is provided corresponding to the air outlet; The first circuit board and the second circuit board are arranged side by side in the first receiving cavity along a first direction; A first power device is disposed on the first circuit board, and a first air duct is formed between the air inlet, the first air supply component, the first power device, the first exhaust component, and the air outlet; A second power device is disposed on the second circuit board, and the second exhaust component is housed in the first receiving cavity and disposed close to the second circuit board. A second air duct is formed between the air inlet, the first air supply component, the second power device, the second exhaust component and the air outlet.
2. The heat dissipation system according to claim 1, characterized in that, The air inlet and the air outlet are arranged opposite each other along a second direction, which is perpendicular to the first direction, and the first circuit board is disposed between the air inlet and the air outlet.
3. The heat dissipation system according to claim 2, characterized in that, The heat dissipation system further includes a first air duct paper, which has a first wall and a second wall connected together. The first wall is disposed on the side of the first power device away from the first circuit board, and the second wall is disposed on the side of the first power device away from the second circuit board along the first direction. The side of the first wall away from the second wall along the first direction has an opening for fluid to flow to the second air duct.
4. The heat dissipation system according to claim 3, characterized in that, The heat dissipation system is further provided with a first heat sink, which is disposed on the first circuit board and the first wall is mounted on the first heat sink.
5. The heat dissipation system according to claim 3, characterized in that, The heat dissipation system further includes a second air duct paper, which includes a first part, a second part, and a third part connected in sequence. The first part, the second part, and the third part enclose a channel with an inlet and an outlet. The second power device is housed in the channel. The first part is disposed on the side of the second power device away from the first circuit board along the first direction, and the third part is disposed on the side of the second power device facing the first circuit board along the first direction. The second exhaust component is provided corresponding to the outlet, and a second air duct is formed between the air inlet, the first air supply component, the opening, the inlet, the second power device, the outlet, the second exhaust component, and the air outlet.
6. The heat dissipation system according to claim 5, characterized in that, Along the second direction, the second power device is positioned close to the air inlet, and the inlet is positioned close to the air inlet.
7. The heat dissipation system according to claim 5, characterized in that, The heat dissipation system further includes two second heat sinks, which are arranged opposite each other in the channel along the first direction. The second power device is disposed between the two second heat sinks, and the second part is mounted on the second heat sink.
8. The heat dissipation system according to any one of claims 1-7, characterized in that, The number of the first air supply components is two, and the two first air supply components are arranged at intervals along the first direction; And / or, the number of the first exhaust components is two, and the two first exhaust components are spaced apart along the first direction.
9. An energy storage product, characterized in that, It includes a battery pack and a heat dissipation system as described in any one of claims 1-8, wherein the battery pack is housed in the housing.
10. The energy storage product according to claim 9, characterized in that, The housing is provided with a partition, which divides the housing into a first receiving cavity and a second receiving cavity, and the battery pack is housed in the second receiving cavity.