Circuit board with improved resistance to bending

Abstract

The utility model discloses a kind of bending-resistant effect's circuit board, it is related to circuit board technical field, including circuit board body and mounting seat, the circuit board body includes substrate layer, conductive fiber reinforced layer, copper foil circuit layer, antistatic insulating layer, antistatic coating, first reinforcing layer, second reinforcing layer and protective layer, and the upper surface of substrate layer is provided with conductive fiber reinforced layer, the upper surface of conductive fiber reinforced layer is provided with copper foil circuit layer, and the upper surface of copper foil circuit layer is provided with antistatic insulating layer, the upper surface of antistatic insulating layer is provided with antistatic coating.The bending-resistant effect's circuit board, the position corresponding of heat dissipation fin and mounting seat is respectively provided with mortise and tenon, through the synergies of mortise and tenon, heat dissipation fin and heat conduction plate are realized tightly bonded, so as to conveniently transfer the heat generated by circuit board body to heat dissipation fin, effectively reduce circuit board body temperature, guarantee electronic component stable operation.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a circuit board with anti-bending effect. Background Technology

[0002] A circuit board, also known as a printed circuit board or circuit board, is the support structure for electronic components and the provider of electrical connections for them. It enables circuit miniaturization and visualization, playing a crucial role in the mass production of fixed circuits and the optimization of electrical appliance layout. It features high wiring density, light weight, thinness, and good flexibility. As electronic devices develop towards miniaturization, portability, and multifunctionality, circuit boards (PCBs), as the carriers of electronic components, face higher requirements for mechanical performance.

[0003] Traditional circuit boards typically use ordinary rigid materials, such as FR-4 epoxy resin fiberglass boards. These circuit boards lack effective bending resistance design in their structure and have poor bending resistance. When subjected to external force, they are prone to cracks at stress concentration points, which can lead to circuit breaks or short circuits and cause electronic equipment failure.

[0004] Therefore, in view of this, we studied and improved the existing structure and its shortcomings, and proposed a circuit board with a bending resistance effect. Utility Model Content

[0005] The purpose of this invention is to provide a circuit board with anti-bending properties to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a circuit board with anti-bending effect, comprising a circuit board body and a mounting base. The circuit board body includes a substrate layer, a conductive fiber reinforcement layer, a copper foil circuit layer, an antistatic insulating layer, an antistatic coating, a first reinforcement layer, a second reinforcement layer, and a protective layer. The upper surface of the substrate layer is provided with a conductive fiber reinforcement layer, the upper surface of the conductive fiber reinforcement layer is provided with a copper foil circuit layer, the upper surface of the copper foil circuit layer is provided with an antistatic insulating layer, the upper surface of the antistatic insulating layer is provided with an antistatic coating, the lower surface of the substrate layer is provided with a first reinforcement layer, the lower surface of the first reinforcement layer is mounted with a second reinforcement layer, and the lower surface of the second reinforcement layer is provided with a protective layer. The mounting base is located in the middle of the surface of the circuit board body, and bolts are screwed into screw holes at the corners of the mounting base.

[0007] Furthermore, the four corners of the circuit board body are all rounded chamfers, and the thickness of the substrate layer is 1.2mm.

[0008] Furthermore, the thickness of both the first reinforcing layer and the second reinforcing layer is 0.08 mm, and the thickness of the protective layer is 0.05 mm.

[0009] Furthermore, the mounting base has a U-shaped structure, and a heat-conducting plate is provided in the middle of the mounting base.

[0010] Furthermore, the mounting base has tenons on both sides of its top, and heat dissipation fins are connected to the outside of the tenons.

[0011] Furthermore, mortises are provided on both sides of the bottom of the heat dissipation fins, and the structural dimensions of the mortises and tenons are compatible.

[0012] Furthermore, the heat-conducting plate is tightly attached to the heat dissipation fins and the circuit board body, and two tenons are provided.

[0013] This utility model provides a circuit board with bending resistance, which has the following beneficial effects:

[0014] 1. In this utility model, mortises and tenons are respectively provided at corresponding positions of the heat dissipation fins and the mounting base. Through the synergistic effect of the mortises and tenons, the heat dissipation fins and the heat conduction plate are tightly fitted, which facilitates the transfer of heat generated by the circuit board body to the heat dissipation fins, effectively reducing the temperature of the circuit board body and ensuring the stable operation of electronic components.

[0015] 2. The substrate layer of this utility model uses FR-epoxy resin glass fiber board as the basic support structure of the circuit board, providing basic insulation and load-bearing performance. The first and second reinforcing layers are both made of carbon fiber reinforced resin material. Carbon fiber has the characteristics of high strength and high modulus. Its crisscross fiber structure can effectively disperse stress and enhance the bending resistance of the circuit board. The protective layer uses polycarbonate (PC) film, which can protect the circuit board from external physical damage and chemical corrosion, while further improving the bending resistance of the circuit board and effectively reducing the probability of circuit board damage caused by bending. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a circuit board with anti-bending effect according to the present invention;

[0017] Figure 2 This is a schematic diagram of the cross-sectional structure of the circuit board body of the circuit board with anti-bending effect according to the present invention;

[0018] Figure 3 This is a three-dimensional structural diagram of the heat dissipation fins of a circuit board with anti-bending effect according to the present invention.

[0019] In the figure: 1. Circuit board body; 101. Substrate layer; 102. Conductive fiber reinforcement layer; 103. Copper foil circuit layer; 104. Antistatic insulation layer; 105. Antistatic coating; 106. First reinforcement layer; 107. Second reinforcement layer; 108. Protective layer; 2. Bolt; 3. Mounting base; 4. Heat-conducting plate; 5. Tenon; 6. Heat dissipation fins. Detailed Implementation

[0020] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0021] like Figure 1 and Figure 3 As shown, a circuit board with anti-bending effect includes a circuit board body 1 and a mounting base 3. The mounting base 3 is located in the middle of the surface of the circuit board body 1, and bolts 2 are screwed into the screw holes at the corners of the mounting base 3. The mounting base 3 has a U-shaped structure, and a heat-conducting plate 4 is provided in the middle of the mounting base 3. Tenons 5 are provided on both sides of the top of the mounting base 3, and heat dissipation fins 6 are connected to the outside of the tenons 5. The bottom sides of the heat dissipation fins 6 are provided with mortises, and the structural dimensions of the mortises and tenons 5 are compatible. The heat-conducting plate 4 is tightly attached to the heat dissipation fins 6 and the circuit board body 1 respectively. There are two tenons 5.

[0022] The specific operation is as follows: mortises and tenons 5 are respectively set at the corresponding positions of the heat dissipation fins 6 and the mounting base 3. Through the synergistic effect of the mortises and tenons 5, the heat dissipation fins 6 and the heat conduction plate 4 can be tightly fitted, so as to facilitate the transfer of heat generated by the circuit board body 1 to the heat dissipation fins 6, effectively reduce the temperature of the circuit board body 1, and ensure the stable operation of electronic components.

[0023] like Figure 2 As shown, the circuit board body 1 includes a substrate layer 101, a conductive fiber reinforcement layer 102, a copper foil circuit layer 103, an antistatic insulating layer 104, an antistatic coating 105, a first reinforcement layer 106, a second reinforcement layer 107, and a protective layer 108. The upper surface of the substrate layer 101 is provided with the conductive fiber reinforcement layer 102, the upper surface of the conductive fiber reinforcement layer 102 is provided with the copper foil circuit layer 103, and the upper surface of the copper foil circuit layer 103 is provided with the antistatic insulating layer 104. The upper surface of 04 is provided with an antistatic coating 105, and the lower surface of the substrate layer 101 is provided with a first reinforcing layer 106. The lower surface of the first reinforcing layer 106 is provided with a second reinforcing layer 107, and the lower surface of the second reinforcing layer 107 is provided with a protective layer 108. The four corners of the circuit board body 1 are all rounded chamfers. The thickness of the substrate layer 101 is 1.2mm, the thickness of the first reinforcing layer 106 and the second reinforcing layer 107 is 0.08mm, and the thickness of the protective layer 108 is 0.05mm.

[0024] The specific operation is as follows: the substrate layer 101 uses FR-4 epoxy resin glass fiber board as the basic support structure of the circuit board, providing basic insulation and load-bearing performance. The first reinforcement layer 106 and the second reinforcement layer 107 both use carbon fiber reinforced resin material. Carbon fiber has the characteristics of high strength and high modulus. Its crisscross fiber structure can effectively disperse stress and enhance the bending resistance of the circuit board. The protective layer 108 uses polycarbonate (PC) film, which can protect the circuit board from external physical damage and chemical corrosion, while further improving the bending resistance of the circuit board and effectively reducing the probability of circuit board damage due to bending.

[0025] In summary, when using this flexurally resistant circuit board, the substrate layer 101 is made of FR-4 epoxy resin fiberglass board as the basic support structure of the circuit board, providing basic insulation and load-bearing performance. The first reinforcing layer 106 and the second reinforcing layer 107 are both made of carbon fiber reinforced resin material. Carbon fiber has the characteristics of high strength and high modulus. Its crisscross fiber structure can effectively disperse stress and enhance the flexurally resistant performance of the circuit board. The protective layer 108 is made of polycarbonate (PC) film, which can protect the circuit board from external physical damage and chemical corrosion, while further improving the flexurally resistant performance of the circuit board and effectively reducing the probability of the circuit board being damaged due to bending.

[0026] The conductive fiber reinforcement layer 102 is woven from a uniformly dispersed mixture of carbon nanotubes and glass fibers. Carbon nanotubes have excellent conductivity and mechanical properties. When combined with glass fibers, they can enhance the mechanical strength of the circuit board and form a three-dimensional conductive network to quickly conduct static charges and prevent static accumulation. The copper foil circuit layer 103 is a conventional circuit layer used to realize the electrical connection of electronic components. The antistatic insulation layer 104 uses epoxy resin material with added conductive filler. The conductive filler is nano-sized antimony tin oxide (ATO) with good conductivity and transparency, which enables the antistatic insulation layer 104 to have static conduction ability while maintaining insulation performance. The antistatic coating 105 is an organosilicon antistatic coating, which effectively reduces the friction coefficient of the circuit board surface and reduces static electricity generation. The layers are tightly bonded together with high-temperature resistant and high-strength epoxy resin adhesive to ensure the integrity and stability of the circuit board body 1.

[0027] The circuit board body 1 has rounded chamfers at all four corners, which effectively eliminates stress concentration at right angles, making the external force more evenly distributed on the circuit board body 1 and reducing the risk of breakage at the corners. The mounting base 3 is installed on the circuit board body 1 by bolts 2. When installing the heat sink fin 6, align the mortise at the bottom of the heat sink fin 6 with the tenon 5 of the mounting base 3 and push gently. The tenon 5 will then engage with the mortise, achieving a firm connection between the heat sink fin 6 and the mounting base 3. The heat sink fin 6 is in close contact with the heat-conducting plate 4, which facilitates the transfer of heat generated by the circuit board body 1 to the heat sink fin 6, effectively reducing the temperature of the circuit board body 1 and ensuring the stable operation of electronic components. When disassembling, simply pinch the heat sink fin 6 with your fingers and pull it outward gently to disengage the mortise from the tenon 5, completing the disassembly of the heat sink fin 6. The operation is simple and convenient, requiring no tools. Through simple engagement and disengagement, the heat sink fin 6 can be quickly disassembled, greatly facilitating users to clean and maintain the heat sink fin 6 and improving maintenance efficiency.

[0028] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A circuit board with anti-bending effect, comprising a circuit board body (1) and a mounting base (3), characterized in that, The circuit board body (1) includes a substrate layer (101), a conductive fiber reinforcement layer (102), a copper foil circuit layer (103), an antistatic insulating layer (104), an antistatic coating (105), a first reinforcement layer (106), a second reinforcement layer (107), and a protective layer (108). The upper surface of the substrate layer (101) is provided with a conductive fiber reinforcement layer (102), and the upper surface of the conductive fiber reinforcement layer (102) is provided with a copper foil circuit layer (103). The upper surface of the copper foil circuit layer (103) is provided with... An antistatic insulating layer (104) is provided, and an antistatic coating (105) is provided on the upper surface of the antistatic insulating layer (104). A first reinforcing layer (106) is provided on the lower surface of the substrate layer (101). A second reinforcing layer (107) is installed on the lower surface of the first reinforcing layer (106), and a protective layer (108) is provided on the lower surface of the second reinforcing layer (107). The mounting base (3) is located in the middle of the surface of the circuit board body (1), and a bolt (2) is screwed into the screw hole at the corner of the mounting base (3).

2. The circuit board with anti-bending effect according to claim 1, characterized in that, The four corners of the circuit board body (1) are all rounded chamfers, and the thickness of the substrate layer (101) is 1.2mm.

3. The circuit board with anti-bending effect according to claim 1, characterized in that, The thickness of the first reinforcing layer (106) and the second reinforcing layer (107) is 0.08 mm, and the thickness of the protective layer (108) is 0.05 mm.

4. The circuit board with anti-bending effect according to claim 1, characterized in that, The mounting base (3) has a U-shaped structure, and a heat-conducting plate (4) is provided in the middle of the mounting base (3).

5. A circuit board with anti-bending effect according to claim 4, characterized in that, The mounting base (3) has tenons (5) on both sides of its top, and heat dissipation fins (6) are connected to the outside of the tenons (5).

6. A circuit board with anti-bending effect according to claim 5, characterized in that, The bottom sides of the heat dissipation fins (6) are provided with mortises, and the structural dimensions of the mortises and tenons (5) are compatible.

7. A circuit board with anti-bending effect according to claim 6, characterized in that, The heat-conducting plate (4) is tightly attached to the heat dissipation fins (6) and the circuit board body (1) respectively, and two tenons (5) are provided.

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