Wafer size adapter

Abstract

The utility model discloses a kind of wafer size adapters, which are convenient to operate and can meet the testing needs of different sizes of wafer slices at the feeding end. The wafer size adapter includes a substrate assembly and a plurality of adapter ring assemblies. The edge profile of the substrate assembly is compatible with the edge profile and size of the largest wafer slice that can be tested by the testing equipment. The edge profile and size of the outer edge of each adapter ring assembly are consistent with those of the substrate assembly. The edge profile and size of the inner edge of each adapter ring assembly are consistent with those of a wafer slice to be tested. When the adapter ring assembly and the substrate assembly are attached to form a kit, the inner edge area of the adapter ring assembly serves as a wafer slice receiving area.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit or discrete device manufacturing technology, and specifically to a wafer size adapter. Background Technology

[0002] With the rapid development of the semiconductor industry, the pace of semiconductor equipment upgrades and iterations has also accelerated to meet market demands. Wafer fabs have gradually expanded from 4-inch wafers to 5-inch, 6-inch, 8-inch, and 12-inch wafers, while simultaneously increasing capacity efficiency and steadily improving yield.

[0003] Variations in wafer size place high demands on the compatibility of processing equipment. Factory-configured testing equipment is only compatible with 6-inch and 8-inch wafers (or only with 8-inch and 12-inch compatible wafers), limiting its functionality and preventing it from testing 4-inch, 5-inch, and 6-inch wafers for end users. Utility Model Content

[0004] The purpose of this invention is to overcome the defects in the existing technology and provide a wafer size adapter that is easy to operate and can meet the testing requirements of wafers of different sizes at the loading end.

[0005] To achieve the above objectives, the technical solution of this utility model is to design a wafer size adapter, which includes a substrate assembly and several adapter ring assemblies. The edge contour of the substrate assembly is consistent with the edge contour and size of the largest wafer that the test equipment can be compatible with. The outer edge contour and size of each adapter ring assembly are consistent with the edge contour and size of the substrate assembly, and the inner edge contour and size of each adapter ring assembly are consistent with the edge contour and size of a wafer to be tested. When the adapter ring assembly and the substrate assembly are bonded together as a kit, the inner edge region of the adapter ring assembly serves as the wafer to be tested receiving area.

[0006] Furthermore, the inner edge of the adapter ring assembly includes a flat edge, and the center of the flat edge is provided with a groove, the groove being 2.5cm wide and 0.5cm deep.

[0007] Furthermore, the adapter ring assembly is provided with at least three fastening holes. One of the three fastening holes is located on the diameter line of the adapter ring assembly perpendicular to the flat side, and is separated from the flat side by the inner edge region of the adapter ring assembly. The other two fastening holes are located on both sides of the diameter line of the adapter ring assembly parallel to the flat side.

[0008] The substrate assembly has a fastening structure at a corresponding position. When the fastening structure is combined with the fastening hole, the substrate assembly and the adapter ring assembly fit tightly together, and the fastening structure does not protrude above the surface of the adapter ring assembly.

[0009] Furthermore, the central region of the substrate assembly is provided with at least three protrusions for supporting the wafer under test and keeping the wafer under test in a horizontal position.

[0010] Furthermore, the three protruding points are distributed in an equilateral triangle shape with a side length spacing of 2cm.

[0011] Furthermore, both the substrate assembly and the adapter ring assembly are made of aluminum alloy.

[0012] Furthermore, both the substrate assembly and the adapter ring assembly are treated with blackening oxidation, and both have smooth surfaces without burrs and sharp edges.

[0013] Furthermore, the total thickness of the substrate assembly and the adapter ring assembly after being tightly bonded together is within the slot spacing of the dedicated wafer holder of the wafer testing equipment.

[0014] The advantages and benefits of this utility model are: convenient operation, strong wafer size compatibility, and the wafer size adapter can replace the adapter ring components with different inner edge shapes and sizes to adapt to wafers of different sizes, thereby meeting the testing requirements of wafers of different sizes at the loading end. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the wafer-scale adapter structure;

[0016] Figure 2 A schematic diagram of a dedicated chip holder for the testing equipment;

[0017] Figure 3 This is a schematic diagram of a wafer size adapter within a dedicated wafer holder on the loading end of a test device.

[0018] In the figure: 001, substrate assembly; 002, adapter ring assembly; 003, inner edge of adapter ring assembly; 004, outer edge of substrate assembly and adapter ring assembly; 005, groove; 006, raised support point; 007, fastening hole; 008, slot spacing of test equipment special plate holder; 009, plate holder body. Detailed Implementation

[0019] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings and examples. The following examples are only used to more clearly illustrate the technical solution of this utility model and should not be construed as limiting the scope of protection of this utility model.

[0020] according to Figures 1-3As shown, this utility model is a wafer size adapter, including a substrate assembly 001 and several adapter ring assemblies 002. The edge contour of the substrate assembly 001 is consistent with the edge contour and size of the largest wafer that the test equipment can be compatible with. The edge contour and size of the outer edge of each adapter ring assembly 002 are consistent with the edge contour and size of the substrate assembly 001, and the edge contour and size of the inner edge of each adapter ring assembly 002 are consistent with the edge contour and size of a wafer to be tested. When the adapter ring assembly 002 and the substrate assembly 001 are attached to form a kit, the inner edge area of ​​the adapter ring assembly 002 serves as the wafer to be tested receiving area.

[0021] The edge contour of the substrate assembly should match the edge contour and size of the largest wafer that the testing equipment can be compatible with. This design allows the testing equipment to be backward compatible with the size of the wafer under test. The edge contour of the inner edge region of the adapter ring assembly should match the edge contour of the wafer under test, and the size of the inner edge region of each adapter ring assembly corresponds to one size of the wafer under test. It is understood that in practical applications, when designing the inner edge region of the adapter ring assembly, although the size of the inner edge region should match the size of the wafer under test, it will be slightly larger to ensure that the edge of the wafer under test does not scrape or warp when placed in the inner edge region.

[0022] The wafer size adapter of this invention is easy to operate and has strong wafer size compatibility. The wafer size adapter can replace the adapter ring assembly with different inner edge shapes and sizes to adapt to wafers of different sizes, thereby meeting the testing requirements of wafers of different sizes at the loading end.

[0023] To facilitate the use of clamps to pick up and place wafers in the adapter ring assembly, a preferred embodiment of this invention includes a flat edge 003 along the inner edge of the adapter ring assembly, with a groove 005 at the center of the flat edge. The groove is 2.5 cm wide and 0.5 cm deep. In one embodiment, the groove can be an arc-shaped groove, which has smoother edges and can prevent sharp edges from scratching the wafer.

[0024] To achieve a tight fit between the adapter ring assembly and the substrate assembly, a preferred embodiment of this invention further includes at least three fastening holes 007 on the adapter ring assembly. One of the three fastening holes is located on a diameter line perpendicular to the flat edge of the adapter ring assembly, and is separated from the flat edge by an inner edge region of the adapter ring assembly. The other two fastening holes are located on opposite sides of a diameter line parallel to the flat edge of the adapter ring assembly. A fastening structure is provided at a corresponding position on the substrate assembly. When the fastening structure is combined with the fastening holes, the substrate assembly and the adapter ring assembly fit tightly together, and the fastening structure does not protrude above the surface of the adapter ring assembly.

[0025] To facilitate the handling and testing of the wafer under test, a preferred embodiment of this utility model further includes at least three raised points 006 in the central region of the substrate assembly, which are used to support the wafer under test and keep it in a horizontal position.

[0026] To ensure a more stable support for the wafer under test by the protrusions, the preferred embodiment of this invention is that the three protrusions 006 are distributed in an equilateral triangle shape with a side length spacing of 2cm.

[0027] To achieve lightweight, efficient heat dissipation, and ease of manufacturing of the wafer-scale adapter, the preferred embodiment of this invention is that both the substrate assembly and the adapter ring assembly are made of aluminum alloy.

[0028] In order to reduce metal ion precipitation and particle adsorption, increase corrosion resistance, and avoid scratching of the wafer under test, the preferred embodiment of this utility model is that both the substrate assembly and the adapter ring assembly are treated with oxidation blackening, and both have smooth surfaces without burrs and sharp edges.

[0029] In order to adapt to the testing equipment, the preferred embodiment of this utility model is that the total thickness of the substrate assembly and the adapter ring assembly after being fastened together is within the slot spacing 008 of the dedicated wafer holder 009 of the wafer testing equipment.

[0030] When using this wafer size adapter, follow these steps:

[0031] Step 1: Confirm the dimensions of the wafer to be tested.

[0032] Step 2: Select and secure the adapter ring assembly and substrate assembly that correspond to the size of the wafer to be tested.

[0033] Step 3: As Figure 1 As shown, the wafer is placed with the side to be tested facing upwards inside the adapter ring assembly, with the flat edge of the wafer aligned with the flat edge of the inner edge of the adapter ring assembly, and the wafer surface kept horizontal.

[0034] Step 4: Place the adapter containing the wafer to be tested horizontally and stably in the dedicated wafer holder of the test equipment.

[0035] Step 5: As Figure 3 As shown, the special plate holder is placed horizontally and stably on the loading end of the equipment, and the robotic arm of the testing equipment can freely pick up and place the plate for testing.

[0036] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A wafer-scale adapter, characterized in that, It includes a substrate assembly and several adapter ring assemblies. The edge contour of the substrate assembly is consistent with the edge contour and size of the largest wafer that the test equipment can be compatible with. The edge contour and size of the outer edge of each adapter ring assembly are consistent with the edge contour and size of the substrate assembly. The edge contour and size of the inner edge of each adapter ring assembly are consistent with the edge contour and size of a wafer to be tested. When the adapter ring assembly and the substrate assembly are bonded together as a kit, the inner edge region of the adapter ring assembly serves as the wafer receiving area.

2. The wafer size adapter according to claim 1, characterized in that, The inner edge of the adapter ring assembly includes a flat edge, and the center of the flat edge has a groove with a width of 2.5cm and a depth of 0.5cm.

3. The wafer size adapter according to claim 2, characterized in that, The adapter ring assembly has at least three fastening holes. One of the three fastening holes is located on the diameter line of the adapter ring assembly perpendicular to the flat side, and is separated from the flat side by the inner edge region of the adapter ring assembly. The other two fastening holes are located on both sides of the diameter line of the adapter ring assembly parallel to the flat side. The substrate assembly has a fastening structure at a corresponding position. When the fastening structure is combined with the fastening hole, the substrate assembly and the adapter ring assembly fit tightly together, and the fastening structure does not protrude above the surface of the adapter ring assembly.

4. The wafer size adapter according to claim 1, characterized in that, The central region of the substrate assembly has at least three protrusions for supporting the wafer under test and keeping the wafer under test in a horizontal position.

5. The wafer size adapter according to claim 4, characterized in that, The three protruding points are distributed in an equilateral triangle shape with a side length spacing of 2cm.

6. The wafer size adapter according to claim 1, characterized in that, Both the substrate assembly and the adapter ring assembly are made of aluminum alloy.

7. The wafer size adapter according to claim 6, characterized in that, Both the substrate assembly and the adapter ring assembly are treated with black oxide oxidation, and both have smooth surfaces without burrs and sharp edges.

8. The wafer size adapter according to claim 1, characterized in that, The total thickness of the substrate assembly and the adapter ring assembly after being fastened together is within the slot spacing of the dedicated wafer holder of the wafer testing equipment.

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