Support for chip ammonia dissociation
By designing a chip ammonia hydrolysis support, a 45° angled cover and biomimetic superhydrophobic texture are used to accelerate the sliding of water droplets. Combined with limiting baffles and rubber sealing strips, the problems of condensation corrosion and chip displacement are solved, achieving moisture-proof, corrosion-proof and easy-to-operate support.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING HIGHGENE-TECH AUTOMATION CO LTD
- Filing Date
- 2025-07-11
- Publication Date
- 2026-06-02
AI Technical Summary
In existing chip ammonolysis processes, condensation can easily form on the chip surface under high humidity or low temperature conditions, causing chemical contamination or physical corrosion. Furthermore, the chip placement box is prone to displacement, making operation inconvenient and posing safety hazards.
A chip ammonia hydrolysis support was designed, comprising a placement box support, a heat-conducting base, an anti-condensation dripping slanted cover, a placement box partition, and a chip placement box handle. It adopts a 45° slanted cover design, a biomimetic superhydrophobic texture, and a food-grade silicone oil coating, combined with limiting edges and rubber sealing strips to ensure that water droplets slide off in a directional manner and that the chip is stable.
It effectively prevents condensation from corroding the chip, reduces vibration and impact, improves operational safety and convenience, and ensures the stability of the chip during transportation and prevents displacement.
Smart Images
Figure CN224308443U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the fields of biotechnology and bioengineering, and in particular to a scaffold for chip ammonia hydrolysis. Background Technology
[0002] Ammonolysis is a critical step in semiconductor manufacturing, typically performed under specific temperature, humidity, and chemical conditions. During this process, the chip carrier, as the core component, must balance heat dissipation, moisture protection, structural stability, and ease of operation, as detailed below:
[0003] In high humidity or low temperature environments, condensation is easily generated on the top of the support. Existing designs lack a drainage structure, and water droplets fall directly onto the chip surface, which may cause chemical contamination or physical corrosion.
[0004] The limiting methods of chip placement boxes are mostly simple snap-fit or undesigned, which can easily lead to displacement during transportation or operation, resulting in failure of ammonolysis reaction or chip damage.
[0005] The support lacks an ergonomic handle or lever structure, requiring operators to directly contact damp or high-temperature components, posing safety hazards and resulting in low efficiency.
[0006] Therefore, this application provides a chip ammonia hydrolysis support to meet the requirements. Utility Model Content
[0007] The purpose of this invention is to address the shortcomings of existing technologies and propose a chip ammonia hydrolysis support.
[0008] To achieve the above objectives, the present invention adopts the following technical solution: a chip ammonia hydrolysis support, comprising a chip placement box for placing chips, and further comprising:
[0009] A chip placement box bracket is positioned outside the chip placement box.
[0010] The bracket heat-conducting base is fixed to the bottom of the box holder;
[0011] The bracket has two anti-condensation dripping slanted covers, which are symmetrically arranged on the top of the box bracket. A bracket handle is fixed between the two anti-condensation dripping slanted covers.
[0012] Furthermore, it also includes a placement box partition, one end of which is fixed with a placement box limiting stop, which is symmetrically arranged about the central axis of the placement box partition.
[0013] The beneficial effects of adopting the above technical solution are: the design of the box partition prevents the chip box from shifting during transportation, and the rubber sealing strip is embedded in the edge of the limiting baffle to reduce vibration and impact.
[0014] Furthermore, the chip placement box and the placement box partition are interlocked.
[0015] The beneficial effects of adopting the above technical solution are: the partition can be adjusted in position through slot or slide rail design to adapt to chip placement boxes of different sizes.
[0016] Furthermore, a chip placement box handle is fixed on the side of the chip placement box away from the placement box limiting edge, and chip limiting edges are fixed on the chip placement box on both sides of the chip placement box handle.
[0017] The beneficial effects of adopting the above technical solution are: the design of the chip placement box handle makes the chip placement box easier to use.
[0018] Furthermore, the angle between the anti-condensation dripping slanted cover of the bracket and the top of the placement box bracket is 45 degrees, and the surface of the anti-condensation dripping slanted cover is smoothed with a lubricant.
[0019] The beneficial effects of adopting the above technical solution are as follows: the angle between the slanted cover and the top of the bracket is 45°, the edge adopts an arc chamfer design to reduce condensation water retention, the surface microstructure treatment (such as biomimetic superhydrophobic texture) accelerates the aggregation and directional sliding of water droplets, and the use of food-grade silicone oil composite nano anti-fouling coating is wear-resistant and chemically inert, avoiding corrosion or contamination of the chip in the ammonium hydrolysis environment.
[0020] Compared with the prior art, the advantages and positive effects of this utility model are as follows:
[0021] This invention features a bracket with a slanted cover to prevent condensation dripping. The slanted cover forms a 45° angle with the top of the bracket, and the edges are designed with rounded chamfers to reduce condensation retention. Surface microstructure treatment (such as biomimetic superhydrophobic texture) accelerates water droplet aggregation and directional sliding. A food-grade silicone oil composite nano anti-fouling coating is used, which is wear-resistant and chemically inert, preventing corrosion or contamination of the chip in an ammonium hydrolysis environment. The design of the chip box partition prevents the chip box from shifting during transportation. Rubber sealing strips are embedded in the edge of the limiting baffle to reduce vibration and impact. The design of the chip box handle facilitates the use of the chip box. Attached Figure Description
[0022] Fig. 1 This is a front view of a chip ammonia hydrolysis support according to the present invention;
[0023] Fig. 2 This is a rear view of a chip ammonia hydrolysis support according to the present invention;
[0024] Fig. 3This is a partial view of a chip ammonia hydrolysis support according to the present invention.
[0025] Attached Figure
[0026] 1. Chip placement box; 2. Placement box bracket; 3. Bracket guide base; 4. Bracket handle; 5. Bracket anti-condensation dripping slanted cover; 6. Placement box partition; 7. Placement box limiting stop; 8. Chip placement box handle; 9. Chip limiting stop. Detailed Implementation
[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0028] like Figs. 1-3 As shown, this utility model provides a technical solution: a chip ammonia hydrolysis support, including a chip placement box 1 for placing the chip. The chip placement box 1 is made of high thermal conductivity aluminum alloy or copper-based composite material, and the surface is anodized to form a dense oxide layer, which enhances corrosion resistance and promotes heat conduction. It also includes:
[0029] Placement box bracket 2 is disposed outside the chip placement box 1;
[0030] The bracket heat-conducting base 3 is fixed to the bottom of the placement box bracket 2;
[0031] The bracket has two anti-condensation dripping slanted covers 5, which are symmetrically positioned on the top of the placement box bracket 2. The anti-condensation dripping slanted covers 5 are connected to the placement box bracket 2 by magnetic snap-fit, making it easy to disassemble, clean, or replace periodically. A bracket handle 4 is fixed between the two anti-condensation dripping slanted covers 5. The bracket handle 4 adopts an arc-shaped structure that conforms to the hand grip curve, and the surface is injection molded with anti-slip texture, making operation effortless and non-slip; the material is corrosion-resistant stainless steel or engineering plastic.
[0032] It also includes a placement box partition 6, the surface of which is covered with an elastic anti-slip pad (such as silicone) to prevent the chip box from shifting during transportation; a rubber sealing strip is embedded in the edge of the limiting baffle to reduce vibration and impact; a placement box limiting baffle 7 is fixed at one end of the placement box partition 6, the placement box limiting baffle 7 is symmetrically arranged about the central axis of the placement box partition 6, and the height of the placement box limiting baffle 7 is adjustable to accommodate chip boxes of various specifications.
[0033] The chip placement box 1 and the placement box partition 6 are interlocked. The placement box partition 6 is adjusted in position through slots or slide rails to accommodate chip placement boxes 1 of different sizes.
[0034] Among them, a chip placement box handle 8 is fixed on the other side of the chip placement box 1 away from the placement box limiting edge 7. Chip limiting edges 9 are fixed on the chip placement box 1 on both sides of the chip placement box handle 8. The chip limiting edges 9 have built-in elastic buffer pads to prevent the chip placement box 1 from colliding hard with the placement box bracket 2. The height of the edge is lower than the edge of the chip box to prevent it from falling out and to facilitate picking and placing. The chip placement box handle 8 and the chip limiting edges 9 are integrally injection molded to reduce the number of parts and reduce assembly complexity.
[0035] Among them, the angle between the anti-condensation dripping slanted cover 5 of the bracket and the top of the placement box bracket 2 is 45 degrees. The surface of the anti-condensation dripping slanted cover 5 is smoothed with a lubricant. The angle between the anti-condensation dripping slanted cover 5 of the bracket and the top of the placement box bracket 2 is 45 degrees, and the edge adopts an arc chamfer design to reduce condensation retention. The surface microstructure treatment (such as biomimetic superhydrophobic texture) accelerates the water droplet aggregation and directional sliding.
[0036] Working principle: such as Figs. 1-3 As shown, the chip is first placed in the chip placement box 1. The placement box partition 6 and the placement box limiting edge 7 fix its position. The bracket heat-conducting base 3 conducts the heat of the chip to the external cooling system to maintain the reaction temperature. After the condensate in the ammonium hydrolysis environment forms on the surface of the bracket anti-condensate dripping inclined cover 5, it slides down the 45° inclined plane to the outside of the heat-conducting bracket base. The lubricating coating accelerates the drainage. The bracket can be moved by the bracket handle 4, or the chip box can be pulled out by the chip placement box handle 8. The chip limiting edge 9 prevents accidental slippage.
[0037] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.
Claims
1. A chip ammonia hydrolysis support, comprising a chip placement box (1) for placing chips, characterized in that, Also includes: A placement box bracket (2) is disposed outside the chip placement box (1); The bracket heat-conducting base (3) is fixed to the bottom of the box bracket (2); The bracket anti-condensation dripping slanted cover (5) is provided in two. The two bracket anti-condensation dripping slanted covers (5) are symmetrically arranged on the top of the placement box bracket (2). A bracket handle (4) is fixed between the two bracket anti-condensation dripping slanted covers (5).
2. The chip ammonia hydrolysis support according to claim 1, characterized in that, It also includes a placement box partition (6), one end of which is fixed with a placement box limiting stop (7), which is symmetrically arranged about the central axis of the placement box partition (6).
3. The chip ammonia hydrolysis support according to claim 2, characterized in that, The chip placement box (1) and the placement box partition (6) are interlocked.
4. The chip ammonia hydrolysis support according to claim 1, characterized in that, A chip placement box handle (8) is fixed on the other side of the chip placement box (1) away from the placement box limiting edge (7), and chip limiting edges (9) are fixed on the chip placement box (1) on both sides of the chip placement box handle (8).
5. A chip ammonia hydrolysis support according to claim 4, characterized in that, The angle between the anti-condensation dripping slanted cover (5) of the bracket and the top of the placement box bracket (2) is 45 degrees, and the surface of the anti-condensation dripping slanted cover (5) is smoothed with a lubricant.