A nozzle dedicated to semiconductor long distance cleaning type
By designing a semiconductor long-distance clean nozzle with multi-channel nozzles, uniform air chambers, purification mechanisms, and vertical reciprocating displacement mechanisms, the problems of cleaning effect and uniformity are solved, achieving high-cleanliness gas jetting and stable cleaning coverage, adapting to complex process environments.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XINJIE SEMICONDUCTOR TECHNOLOGY (SUZHOU) CO LTD
- Filing Date
- 2025-05-28
- Publication Date
- 2026-06-02
AI Technical Summary
Existing semiconductor wafer nozzles have poor cleaning performance and insufficient uniformity of cleaning coverage, making it difficult to meet high cleanliness requirements.
A semiconductor long-distance cleaning nozzle was designed, comprising a multi-channel nozzle, a gas equalization chamber, an air inlet pipe, a purification mechanism, and a vertical reciprocating displacement mechanism. The gas equalization chamber achieves uniform gas distribution, the purification mechanism filters impurities, and the vertical reciprocating displacement mechanism ensures stable displacement of the nozzle body, thereby achieving long-distance cleaning coverage.
It achieves high-purity gas jetting, ensuring no contamination on the wafer surface, adapting to diverse process requirements, improving the uniformity and stability of cleaning coverage, and preventing microparticle shedding.
Smart Images
Figure CN224309176U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor wafer cleaning technology, specifically a long-distance cleaning nozzle for semiconductors. Background Technology
[0002] In semiconductor wafer cleaning and wafer cell cleaning processes, it is necessary to ensure that ultrapure materials are free from contaminants such as metal ions, anions and cations, TVOCs, and oil stains, while also meeting requirements such as resistance to acid and alkali corrosion, and ensuring that no microparticles (≥0.1um) are shed during use. Semiconductor wafer nozzles are key components in semiconductor manufacturing processes used to precisely deliver gas to the wafer surface. Their structure is usually made of corrosion-resistant materials. By optimizing the design of the nozzle shape and arrangement, different forms of fluid output, such as uniform spraying, directional spraying, or precise dripping, can be achieved.
[0003] For example, the Chinese authorized patent CN222778248U, entitled "A Nozzle Device for Cleaning Wafers", includes a mixing block, with a medium inlet at the top, a gas inlet on the side wall of the mixing block, and a cleaning outlet at the bottom of the mixing block; the nozzle device for cleaning wafers can force pressurized gas into the gas inlet, thereby improving the spraying effect of the nozzle.
[0004] While the existing technologies can clean semiconductor wafers, they have limitations. On the one hand, the cleaning effect is poor, and surface deposits and particle residues are easily left behind. On the other hand, the cleaning coverage is not uniform, thus failing to meet current requirements. To address this, we propose a long-distance cleaning nozzle specifically designed for semiconductors. Utility Model Content
[0005] The purpose of this invention is to provide a dedicated long-distance cleaning nozzle for semiconductors to solve the problems of poor nozzle cleaning effect and poor cleaning coverage uniformity mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a dedicated long-distance clean nozzle for semiconductors, comprising a nozzle body, a multi-channel nozzle at the front end of the nozzle body, an air inlet pipe at the rear end of the nozzle body, an air equalization chamber inside the multi-channel nozzle, the air equalization chamber being connected to the multi-channel nozzle and the air inlet pipe respectively, connectors integrally formed on both sides of the rear end of the nozzle body, a base at the bottom of the nozzle body, the base being fixed to the connectors by bolts, a vertical reciprocating displacement mechanism at the bottom of the base for improving the cleaning orientation of the multi-channel nozzle, and a purification mechanism at the rear end of the air inlet pipe for process treatment of the injected air.
[0007] Preferably, the vertical reciprocating displacement mechanism includes a transmission box, the transmission box having a limiting groove inside, a movable column installed inside the limiting groove, the outer wall of the movable column slidingly engaging with the limiting groove, and the upper end of the movable column being fixed to the bottom of the base, a rack integrally formed on one side of the movable column, a drive wheel installed on one side of the rack, and the drive wheel being driven by a motor inside the transmission box, and a fan-shaped toothed ring provided on the outside of the drive wheel, the toothed ring meshing with the rack.
[0008] Preferably, a damping reset mechanism is installed between the bottom of the movable column and the limiting slide groove. The damping reset mechanism consists of a damper and a reset spring. The upper and lower ends of the damper are fixed to the movable column and the limiting slide groove, respectively, and the reset spring is installed outside the damper.
[0009] Preferably, the inner wall of the air intake pipe is provided with a threaded hole, and the threaded hole is threadedly connected to the front end of the purification mechanism.
[0010] Preferably, a core tube is fixedly installed at the center of the purification mechanism, one end of the core tube is connected to the air inlet pipe, and the surface of the core tube is provided with multiple through holes, and multiple filter cylinders are provided on the outside of the core tube.
[0011] Preferably, a gas supply pipe is installed on the rear side of the upper end of the purification mechanism, and one end of the gas supply pipe is connected to a high-pressure gas supply system.
[0012] Preferably, the lower end face of the transmission box is provided with a shock-absorbing pad, and the shock-absorbing pad is adhered and fixed to the transmission box.
[0013] Compared with the prior art, the beneficial effects of this utility model are:
[0014] 1. The clean process gas inlet pipe used in this utility model semiconductor enters the nozzle body. The inlet pipe has a threaded structure and is connected to the purification mechanism. The nozzle body has a flow channel design to form pressure. The clean process gas is ejected through a multi-channel nozzle. In this way, the liquid ejected from the nozzle has a long distance. The clean gas will not generate pollutant particles or be affected by temperature and humidity when passing through the clean nozzle, thus meeting the requirements for semiconductor use. The clean nozzle body is made of fluorine-containing ultrapure material.
[0015] 2. This utility model features a vertical reciprocating retraction mechanism. During the operation of the nozzle body, the built-in motor in the transmission box is activated, and its output shaft drives the drive wheel to rotate. The surface of the drive wheel is provided with fan-shaped toothed rings. When the toothed rings mesh with the rack on the side of the movable column, the rotational motion is converted into linear motion. The movable column drives the nozzle body to move downward. When the fan-shaped toothed rings on the drive wheel lose mesh with the drive wheel, the left and right lower commands of the retraction mechanism drive the movable column to move the nozzle body upward to reset. This allows the nozzle body to achieve stable and controllable vertical reciprocating retraction as needed, effectively covering different positions and heights of the wafer and adapting to diverse process requirements.
[0016] 3. This utility model incorporates a purification mechanism. A core tube with multiple holes is located at the center of the purification mechanism's inner cavity. One end of the core tube is connected to the air inlet pipe. Multiple filter screens are installed on the outside of the core tube. Air supplied under high pressure enters from one side of the upper end of the purification mechanism and must pass through multiple layers of filter screens before entering through the holes in the core tube, thus being delivered to the air inlet pipe. During this process, particulate impurities and pollutants in the air are intercepted and filtered layer by layer, significantly reducing the impurity content in the gas. This effectively prevents unfiltered gas from carrying impurities into the nozzle and subsequent process steps, preventing contamination of the wafer surface and ensuring that semiconductor manufacturing is always in a highly clean environment. Attached Figure Description
[0017] Figure 1 This is a perspective view of the present utility model;
[0018] Figure 2 This is a schematic diagram of the internal structure of the nozzle body of this utility model;
[0019] Figure 3 This is a perspective view of the internal structure of the transmission box of this utility model;
[0020] Figure 4 This is a schematic diagram of the internal structure of the purification mechanism of this utility model.
[0021] In the diagram: 1. Nozzle body; 2. Multi-channel nozzle; 3. Air inlet pipe; 4. Connector; 5. Base; 6. Bolt; 7. Purification mechanism; 8. Air delivery pipe; 9. Transmission box; 10. Limiting slide groove; 11. Movable column; 12. Air distribution chamber; 13. Rack; 14. Drive wheel; 15. Damper; 16. Return spring; 17. Filter screen; 18. Core tube. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0023] Please see Figure 1-4This utility model provides an embodiment of a long-distance clean nozzle for semiconductors, comprising a nozzle body 1, a multi-channel nozzle 2 at the front end of the nozzle body 1, an air inlet pipe 3 at the rear end of the nozzle body 1, an air equalization chamber 12 inside the multi-channel nozzle 2, and the air equalization chamber 12 being connected to the multi-channel nozzle 2 and the air inlet pipe 3 respectively, connecting parts 4 integrally formed on both sides of the rear end of the nozzle body 1, a base 5 at the bottom of the nozzle body 1, and the base 5 being fixed to the connecting parts 4 by bolts 6, a vertical reciprocating retraction mechanism at the bottom of the base 5 for improving the cleaning position of the multi-channel nozzle 2, and a purification mechanism 7 at the rear end of the air inlet pipe 3 for process treatment of the injected air;
[0024] Clean process gas enters through the inlet pipe 3, is evenly distributed by the gas equalization chamber 12, and then ejected from the multi-channel nozzle 2. The base 5 and the connecting piece 4 are fixed by bolts 6, providing stable support for the nozzle body 1. The vertical reciprocating displacement mechanism and the purification mechanism 7 supplement the functions in terms of spatial cleaning range and gas cleanliness, respectively. The design of the gas equalization chamber 12 and the multi-channel nozzle 2 ensures uniform gas ejection, achieves long-distance spraying, and improves cleaning efficiency; the stable fixing method and the design of the supporting mechanisms ensure the stability and functionality of the nozzle in complex working environments.
[0025] Please see Figure 3 The vertical reciprocating mechanism includes a transmission box 9. The transmission box 9 has a limiting groove 10 inside. A movable column 11 is installed inside the limiting groove 10. The outer wall of the movable column 11 is slidably engaged with the limiting groove 10. The upper end of the movable column 11 is fixed to the bottom of the base 5. A rack 13 is integrally formed on one side of the movable column 11. A drive wheel 14 is installed on one side of the rack 13. The drive wheel 14 is driven by a motor inside the transmission box 9. The drive wheel 14 has fan-shaped toothed rings on its outside. The toothed rings mesh with the rack 13. A shock-absorbing pad is provided on the lower end face of the transmission box 9. The shock-absorbing pad is adhered and fixed to the transmission box 9.
[0026] The motor inside the transmission box 9 is turned on, driving the drive wheel 14 to rotate. When the fan-shaped toothed rings on the outside of the drive wheel 14 mesh with the rack 13, the rotational motion is converted into linear motion, driving the movable column 11 to slide up and down within the limiting slide groove 10. This, in turn, causes the base 5 and nozzle body 1 connected to the movable column 11 to move vertically back and forth. The shock-absorbing pad buffers vibrations during the movement, reducing mechanical wear and noise. This vertical reciprocating motion of the nozzle body 1 expands the cleaning coverage of the multi-channel nozzle 2, enabling effective cleaning of wafers at different heights and positions.
[0027] Please see Figure 3A damping reset mechanism is installed between the bottom of the movable column 11 and the limiting slide groove 10. The damping reset mechanism consists of a damper 15 and a reset spring 16. The upper and lower ends of the damper 15 are fixed to the movable column 11 and the limiting slide groove 10 respectively, and the reset spring 16 is installed on the outside of the damper 15.
[0028] When the sector-shaped gear ring on the drive wheel 14 disengages from the rack 13, the return spring 16 provides a return force, pulling the movable column 11 upward and causing the nozzle body 1 to reset. The damper 15 buffers and regulates the reset speed, preventing impact caused by excessive speed during the reset process. This ensures the continuity and regularity of the nozzle body 1's displacement process, making the cleaning action of the multi-channel nozzle 2 stable and controllable; it also effectively reduces inertial impact during the reset process, preventing damage to the semiconductor wafer.
[0029] Please see Figure 1 and Figure 2 The inner wall of the intake pipe 3 is provided with a threaded hole, which is threadedly connected to the front end of the purification mechanism 7. The intake pipe 3 is screwed into the threaded structure at the front end of the purification mechanism 7 through the threaded hole on the inner wall to achieve a tight connection, ensuring that the gas will not leak during transmission and facilitating disassembly and installation. This threaded connection method ensures the sealing of the connection between the intake pipe 3 and the purification mechanism 7, preventing external impurities from entering the gas transmission channel.
[0030] Please see Figure 4 A core tube 18 is fixedly installed at the center of the purification mechanism 7. One end of the core tube 18 is connected to the air inlet pipe 3, and the surface of the core tube 18 is provided with multiple through holes. Multiple filter cylinders 17 are provided on the outside of the core tube 18. An air supply pipe 8 is installed on the rear side of the upper end of the purification mechanism 7, and one end of the air supply pipe 8 is connected to the high-pressure air supply system.
[0031] High-pressure air enters the purification mechanism 7 from the air supply pipe 8 and passes through multiple layers of filter cylinders 17. During this process, the filter cylinders 17 intercept and filter particulate impurities and pollutants in the air. The purified air enters the core tube 18 through the through holes on the surface of the core tube 18 and is finally delivered to the air inlet pipe 3. The multi-stage filter cylinders 17 form a highly efficient gas purification system that effectively removes impurities from the air.
[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A dedicated long-distance cleaning nozzle for semiconductors, comprising a nozzle body (1), characterized in that: The nozzle body (1) has a multi-channel nozzle (2) at its front end and an air inlet pipe (3) at its rear end. The multi-channel nozzle (2) has an air equalization chamber (12) inside, and the air equalization chamber (12) is connected to the multi-channel nozzle (2) and the air inlet pipe (3) respectively. Connecting parts (4) are integrally formed on both sides of the rear end of the nozzle body (1). A base (5) is provided below the nozzle body (1), and the base (5) is fixed to the connecting parts (4) by bolts (6). A vertical reciprocating mechanism is provided below the base (5) to improve the cleaning position of the multi-channel nozzle (2). A purification mechanism (7) is provided at the rear end of the air inlet pipe (3) to process the injected air.
2. The long-distance cleaning nozzle for semiconductors according to claim 1, characterized in that: The vertical reciprocating mechanism includes a transmission box (9), the transmission box (9) is provided with a limiting groove (10) inside, a movable column (11) is installed inside the limiting groove (10), the outer wall of the movable column (11) is slidably engaged with the limiting groove (10), and the upper end of the movable column (11) is fixed to the bottom of the base (5). A rack (13) is integrally formed on one side of the movable column (11), and a drive wheel (14) is installed on one side of the rack (13). The drive wheel (14) is driven by a motor inside the transmission box (9). The drive wheel (14) is provided with fan-shaped toothed rings on the outside, and the toothed rings are meshed with the rack (13).
3. A long-distance cleaning nozzle for semiconductors according to claim 2, characterized in that: A damping reset mechanism is installed between the bottom of the movable column (11) and the limiting slide groove (10). The damping reset mechanism consists of a damper (15) and a reset spring (16). The upper and lower ends of the damper (15) are fixed to the movable column (11) and the limiting slide groove (10) respectively, and the reset spring (16) is installed outside the damper (15).
4. A long-distance cleaning nozzle for semiconductors according to claim 1, characterized in that: The inner wall of the air inlet pipe (3) is provided with a threaded hole, and the threaded hole is threadedly connected to the front end of the purification mechanism (7).
5. A long-distance cleaning nozzle for semiconductors according to claim 1, characterized in that: A core tube (18) is fixedly installed at the center of the purification mechanism (7). One end of the core tube (18) is connected to the air inlet pipe (3), and the surface of the core tube (18) is provided with multiple through holes. Multiple filter cylinders (17) are provided on the outside of the core tube (18).
6. A long-distance cleaning nozzle for semiconductors according to claim 5, characterized in that: A gas transmission pipe (8) is installed on the rear side of the upper end of the purification mechanism (7), and one end of the gas transmission pipe (8) is connected to the high-pressure gas transmission system.
7. A long-distance cleaning nozzle for semiconductors according to claim 2, characterized in that: The lower end face of the transmission box (9) is provided with a shock-absorbing pad, and the shock-absorbing pad is adhered and fixed to the transmission box (9).