A flat copper wire double-station paint stripping production line
By combining a dual-station paint stripping production line with carbon dioxide lasers and MOPA lasers, the problem of oxidation and discoloration of flat copper wires caused by high-power cleaning has been solved, achieving efficient and non-destructive cleaning results and improving cleaning speed and welding quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN JPT OPTO ELECTRONICS CO LTD
- Filing Date
- 2025-05-16
- Publication Date
- 2026-06-02
AI Technical Summary
In existing technologies, high-power MOPA lasers are prone to causing oxidation and discoloration when cleaning flat copper wires, leading to poor soldering.
A dual-station paint stripping production line is adopted. The first laser cleaning unit performs rough cleaning, and the second laser cleaning unit performs secondary cleaning. The combination of carbon dioxide laser and MOPA laser is used to control the laser cleaning power to ensure the cleaning effect and the integrity of the copper wire substrate.
It achieves efficient and non-destructive cleaning of flat copper wires, improving cleaning speed and quality, and avoiding defects such as poor soldering.
Smart Images
Figure CN224309190U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of flat copper wire stripping technology, and in particular to a flat copper wire dual-station stripping production line. Background Technology
[0002] Hairpin motors are one of the core components of new energy vehicles. Their stator windings are made of flat copper wire and are shaped like hairpins. During the production process, the surface of the flat copper wire is usually coated with an insulating varnish layer. This varnish layer needs to be completely removed before welding to ensure welding quality and motor performance.
[0003] Currently, flat copper wire cleaning is generally divided into two types: mechanical cleaning and laser cleaning. Traditional mechanical paint removal methods (such as physical polishing and ultrasonic cleaning) have a significant impact on the environment and equipment, and are prone to damaging the surface of the flat copper wire. Laser cleaning is a non-contact cleaning method, which, compared to mechanical cleaning, does not cause wear and tear on the flat copper wire substrate by the blades, resulting in better cleaning effects. Furthermore, the use of high-power MOPA lasers can accelerate the cleaning process.
[0004] Regarding the aforementioned technologies, while ensuring cleaning speed, excessively high energy output from a high-power MOPA laser can cause oxidation and discoloration of the flat copper wire, leading to defects such as poor welding during subsequent flat copper wire processing. Utility Model Content
[0005] To ensure a good cleaning effect for flat copper wire while maintaining cleaning efficiency, this utility model provides a dual-station stripping production line for flat copper wire.
[0006] The present invention provides a flat copper wire dual-station paint stripping production line, which adopts the following technical solution.
[0007] A dual-station stripping production line for flat copper wire includes: a wire feeding mechanism, a first laser cleaning mechanism, a second laser cleaning mechanism, and a wire receiving mechanism arranged sequentially along the wire conveying direction; the wire feeding mechanism, the first laser cleaning mechanism, the second laser cleaning mechanism, and the wire receiving mechanism are electrically connected to each other; the first laser cleaning mechanism is used to perform rough cleaning on the flat copper wire, and the second laser cleaning mechanism is used to perform secondary cleaning on the rough cleaning area of the flat copper wire; the wire feeding mechanism and the wire receiving mechanism move synchronously.
[0008] Optionally, the first laser cleaning mechanism includes two first laser cleaning modules, which are arranged around the periphery of the flat copper wire. The light-emitting sides of the two first laser cleaning modules are arranged opposite each other, and the two first laser cleaning modules are located at different heights.
[0009] Optionally, the first laser cleaning module includes a carbon dioxide laser, a first galvanometer, and a first light-shielding plate. The first galvanometer is positioned in front of the carbon dioxide laser, and the first light-shielding plate is positioned in front of the first galvanometer, blocking more than half of the scanning range of the first galvanometer.
[0010] Optionally, the first laser cleaning mechanism may also include a water chiller for dissipating heat from the first laser cleaning module.
[0011] Optionally, the second laser cleaning mechanism includes four second laser cleaning modules, which are evenly distributed around the periphery of the flat copper wire conveying route; the light-emitting sides of the four second laser cleaning modules are arranged opposite each other, and the four second laser cleaning modules are used to clean the periphery of the flat copper wire.
[0012] Optionally, the second laser cleaning module includes a MOPA laser, a second galvanometer, and a second light-shielding plate. The second galvanometer is positioned in front of the MOPA laser, and the second light-shielding plate is positioned in front of the second galvanometer, blocking more than half of the scanning range of the second galvanometer.
[0013] Optionally, both the first and second laser cleaning mechanisms are equipped with industrial control computers, and the two industrial control computers are interconnected.
[0014] Optionally, the wire feeding mechanism, the first laser cleaning mechanism, the second laser cleaning mechanism, and the wire taking-up mechanism are each independent equipment modules; or some of the wire feeding mechanism, the first laser cleaning mechanism, the second laser cleaning mechanism, and the wire taking-up mechanism are integrated and set on the same equipment frame.
[0015] This invention, by setting up a dual-station cleaning mechanism, enables the flat copper wire to be cleaned twice during the conveying process. During these two cleaning processes, the laser cleaning power can be better controlled, ensuring that the enamel coating is removed while preventing damage to the copper wire substrate. Furthermore, utilizing dual stations for sequential cleaning significantly improves the cleaning speed, thereby achieving efficient and high-quality cleaning. Attached Figure Description
[0016] Figure 1 This is an overall structural diagram of a flat copper wire dual-station paint stripping production line according to an embodiment of this utility model.
[0017] Figure 2 This is a first-view structural diagram of the first laser cleaning mechanism in an embodiment of this utility model.
[0018] Figure 3 This is a first-view structural diagram of the first laser cleaning mechanism in an embodiment of this utility model.
[0019] Figure 4 This is a first-view structural diagram of the second laser cleaning mechanism in an embodiment of this utility model.
[0020] Figure 5 yes Figure 4 A magnified view of part A in the middle.
[0021] Explanation of reference numerals in the attached drawings: 100, First laser cleaning mechanism; 110, First laser cleaning module; 111, Carbon dioxide laser; 112, First galvanometer; 113, First light shield; 120, Cleaning hood; 121, Through hole; 130, Dust extraction pipe; 200, Second laser cleaning mechanism; 210, Second laser cleaning module; 211, MOPA laser; 212, Second galvanometer; 213, Second light shield; 300, Flat copper wire. Detailed Implementation
[0022] The following is in conjunction with the appendix Figure 1 - Appendix Figure 5 The present invention will be described in further detail below.
[0023] This utility model discloses a 300-unit double-station flat copper wire stripping production line. (Refer to...) Figure 1 The flat copper wire 300 dual-station paint stripping production line includes a wire feeding mechanism (not shown in the figure), a first laser cleaning mechanism 100, a second laser cleaning mechanism 200, and a wire receiving mechanism (not shown in the figure). Along the conveying direction of the flat copper wire 300, the wire feeding mechanism, the first laser cleaning mechanism 100, the second laser cleaning mechanism 200, and the wire receiving mechanism are arranged sequentially.
[0024] The wire feeding mechanism and the wire taking-up mechanism move synchronously, with the flat copper wire 300 clamped in each mechanism. The wire feeding mechanism and the wire taking-up mechanism jointly drive the flat copper wire 300 to move within the first laser cleaning mechanism 100 and the second laser cleaning mechanism 200. Simultaneously, the wire feeding mechanism and the wire taking-up mechanism ensure that the flat copper wire 300 within the first laser cleaning mechanism 100 and the second laser cleaning mechanism 200 remains taut.
[0025] Both the wire feeding mechanism and the wire take-up mechanism are common double-roller clamping and conveying structures. For example, they both include a driving wheel, a driven wheel, and a drive motor, with the driving wheel and driven wheel close to each other. The drive motor drives the driving wheel to rotate. A groove is provided on the circumference of the driving wheel to accommodate the flat copper wire 300. The driven wheel presses the flat copper wire 300 placed in the groove, thereby causing the driving wheel to move the flat copper wire 300. Alternatively, the wire feeding mechanism and the wire take-up mechanism can also be based on the double-roller clamping and conveying structure, with the addition of multiple correction wheels to form a wire correction structure. This embodiment of the invention does not specifically limit the wire feeding mechanism and the wire take-up mechanism.
[0026] The wire feeding mechanism, the first laser cleaning mechanism 100, the second laser cleaning mechanism 200, and the wire receiving mechanism are electrically connected to each other. Flat copper wire 300 is placed in the wire feeding mechanism and the wire receiving mechanism for wire conveying, and the flat copper wire 300 sequentially passes through the first laser cleaning mechanism 100 and the second laser cleaning mechanism 200. When the flat wire is conveyed to the position of the first laser cleaning mechanism 100, the first laser cleaning mechanism 100 performs rough processing on the flat copper wire 300; when the flat copper wire 300 continues to move to the position of the second laser cleaning mechanism 200, the second laser cleaning mechanism 200 processes the rough-processed area again, thus performing a secondary cleaning.
[0027] Since the flat copper wire 300 undergoes two laser cleaning processes, a first laser cleaning mechanism 100 can be set to output a high-power laser before the initial cleaning. This allows for rapid cleaning during the roughing stage, removing most of the enamel coating. A second laser cleaning mechanism 200 can then output a low-power laser to quickly clean the remaining thin layer of enamel coating in the roughing area. Because the enamel coating is relatively thin at this stage, low-power laser cleaning can still ensure a high cleaning speed.
[0028] The flat copper wire 300 is cleaned sequentially during the conveying process. Therefore, the wire feeding mechanism, the first laser cleaning mechanism 100, the second laser cleaning mechanism 200, and the wire collecting mechanism in this utility model can all be independent equipment modules, allowing for separate maintenance later. Alternatively, some of the four mechanisms can be integrated onto the same equipment frame, ultimately forming a complete production line. In this example, the wire feeding mechanism, the first laser cleaning mechanism 100, the second laser cleaning mechanism 200, and the wire collecting mechanism are all independent equipment modules.
[0029] In this example, the first laser cleaning mechanism 100 includes two first laser cleaning modules 110 and two water chillers (not shown in the figure). The two water chillers are connected one-to-one with the two first laser cleaning modules 110, and the water chillers provide heat dissipation for the first laser cleaning modules 110. The water chillers are independent devices and can be installed on the rack where the first laser cleaning mechanism 100 is located, or they can be placed next to the rack where the first laser cleaning mechanism 100 is located.
[0030] Two first laser cleaning modules 110 are distributed around the periphery of the flat copper wire 300, with their light-emitting sides facing each other. The transport path of the flat copper wire 300 is within the laser scanning range of the two first laser cleaning modules 110. Furthermore, the two first laser cleaning modules 110 are located at different heights. Therefore, the laser emitted by one first laser cleaning module 110 can simultaneously irradiate two sides of the flat copper wire 300, allowing for laser cleaning of all four sides of the flat copper wire 300 by the two first laser cleaning modules 110.
[0031] Specifically, the first laser cleaning module 110 includes a carbon dioxide laser 111, a first galvanometer 112, and a first light-shielding plate 113. The first galvanometer 112 is positioned in front of the carbon dioxide laser 111, and the first light-shielding plate 113 is positioned in front of the first galvanometer 112. The output wavelength of the carbon dioxide laser 111 is mainly concentrated at 10.6 μm, which falls within the far-infrared region. Copper has a low absorption rate of the laser output from the carbon dioxide laser 111. For the enamel coating on the surface of the flat copper wire 300, using a high-power carbon dioxide laser can quickly remove the enamel coating while ensuring that the copper substrate is not damaged.
[0032] In this embodiment, the first light-shielding plate 113 blocks more than half of the scanning range of the first galvanometer 112, so that the laser emitted by the carbon dioxide laser 111 can only be deflected after passing through the first galvanometer 112, reducing the risk of laser beams hitting the other first laser cleaning module 110.
[0033] In this embodiment, a cleaning hood 120 is provided on the frame of the first laser cleaning mechanism 100. A flat copper wire 300 passes through the cleaning hood 120, and a dust extraction pipe 130 is provided on the cleaning hood 120. Through holes 121 are provided on the cleaning hood 120 facing the first galvanometer 112. A first light-shielding plate 113 is bolted onto the through holes 121, allowing for partial blocking of the laser beam according to the actual light output range.
[0034] Furthermore, in this embodiment, the light emitted from the first galvanometer 112 is blocked by the two first light-shielding plates 113, causing the final output laser to be deflected in the same direction.
[0035] The second laser cleaning mechanism 200 includes four laser cleaning modules 210, which are evenly distributed around the periphery of the conveying path of the flat copper wire 300. The light-emitting sides of the four laser cleaning modules 210 are arranged in pairs facing each other, and by setting up the four laser cleaning modules 210, the four peripheries of the flat copper wire 300 are cleaned respectively.
[0036] Specifically, the second laser cleaning mechanism 200 includes a MOPA laser 211, a second galvanometer 212, and a second light-shielding plate 213. The second galvanometer 212 is positioned in front of the MOPA laser 211, and the second light-shielding plate 213 is positioned in front of the second galvanometer 212. The MOPA laser 211 has a high repetition rate and a wide pulse width range, allowing the laser output to be adjusted according to the material type and cleaning requirements. Its high repetition rate allows the operator to flexibly adjust the power and pulse width combination to optimize the cleaning effect.
[0037] In this embodiment, the second light-shielding plate 213 also blocks more than half of the scanning range of the second galvanometer 212. After the laser emitted by the MOPA laser 211 passes through the second galvanometer 212, it can only be deflected out, reducing the risk of laser beam collision.
[0038] In this embodiment, both the first laser cleaning mechanism 100 and the second laser cleaning mechanism 200 are equipped with industrial control computers, which are interconnected and control the laser cleaning mechanism is achieved through the industrial control computers.
[0039] Specifically, each industrial control computer has parameters set to control the current laser cleaning mechanism. When the flat copper wire 300 moves to the corresponding laser cleaning mechanism, the corresponding laser cleaning mechanism performs the cleaning process according to the parameters set in the industrial control computer.
[0040] The working principle of this utility model embodiment is as follows: The wire feeding mechanism, the first laser cleaning mechanism 100, the second laser cleaning mechanism 200, and the wire receiving mechanism are electrically connected to each other. After the flat copper wire 300 is placed in the wire feeding mechanism and the wire receiving mechanism, the wire feeding mechanism and the wire receiving mechanism jointly transport the flat copper wire 300. When the flat copper wire 300 is transported a certain distance and reaches the first laser cleaning mechanism 100, the first laser cleaning mechanism 100 performs cleaning processing on the flat copper wire 300 according to the set parameters in the current industrial control computer. At this time, the first laser cleaning mechanism 100 is set to high power output and removes most of the paint on the surface of the flat copper wire 300. Subsequently, when the flat copper wire 300 continues to move into the second laser cleaning mechanism 200, the second laser cleaning mechanism 200 performs further cleaning processing on the areas of the flat copper wire 300 that have already undergone rough processing, according to the set parameters in the current industrial control computer, thereby achieving overall laser cleaning of the flat copper wire 300.
[0041] The above are all preferred embodiments of this utility model, and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape and principle of this utility model should be covered within the scope of protection of this utility model.
Claims
1. A flat copper wire dual-station paint stripping production line, characterized in that, include: A wire feeding mechanism, a first laser cleaning mechanism (100), a second laser cleaning mechanism (200), and a wire receiving mechanism are arranged sequentially along the wire conveying direction; the wire feeding mechanism, the first laser cleaning mechanism (100), the second laser cleaning mechanism (200), and the wire receiving mechanism are electrically connected to each other; the first laser cleaning mechanism (100) is used to perform rough cleaning on the flat copper wire (300), and the second laser cleaning mechanism (200) is used to perform secondary cleaning on the rough-processed area of the flat copper wire (300); the wire feeding mechanism and the wire receiving mechanism move synchronously.
2. The flat copper wire dual-station stripping production line according to claim 1, characterized in that: The first laser cleaning mechanism (100) includes two first laser cleaning modules (110), which are disposed on the periphery of the flat copper wire (300). The light-emitting sides of the two first laser cleaning modules (110) are arranged opposite each other, and the two first laser cleaning modules (110) are located at different heights.
3. The flat copper wire dual-station stripping production line according to claim 2, characterized in that: The first laser cleaning module (110) includes a carbon dioxide laser (111), a first galvanometer (112), and a first light shield (113). The first galvanometer (112) is disposed in front of the carbon dioxide laser (111), and the first light shield (113) is disposed in front of the first galvanometer (112). The first light shield (113) blocks more than half of the scanning range of the first galvanometer (112).
4. The flat copper wire dual-station stripping production line according to claim 2, characterized in that: The first laser cleaning mechanism (100) also includes a water chiller, which is used to dissipate heat from the first laser cleaning module (110).
5. The flat copper wire dual-station stripping production line according to claim 1, characterized in that: The second laser cleaning mechanism (200) includes four second laser cleaning modules (210), which are evenly distributed around the periphery of the conveying route of the flat copper wire (300). The light-emitting sides of the four second laser cleaning modules (210) are arranged opposite each other, and the four second laser cleaning modules (210) are used to clean the periphery of the flat copper wire (300).
6. The flat copper wire dual-station stripping production line according to claim 5, characterized in that: The second laser cleaning module (210) includes a MOPA laser (211), a second galvanometer (212), and a second light shield (213). The second galvanometer (212) is positioned in front of the MOPA laser (211), and the second light shield (213) is positioned in front of the second galvanometer (212). The second light shield (213) blocks more than half of the scanning range of the second galvanometer (212).
7. The flat copper wire dual-station stripping production line according to claim 1, characterized in that: Both the first laser cleaning mechanism (100) and the second laser cleaning mechanism (200) are equipped with industrial control computers, and the two industrial control computers are interconnected.
8. The flat copper wire dual-station stripping production line according to claim 1, characterized in that: The wire feeding mechanism, the first laser cleaning mechanism (100), the second laser cleaning mechanism (200), and the wire taking mechanism are each independent equipment modules; or some of the mechanisms of the wire feeding mechanism, the first laser cleaning mechanism (100), the second laser cleaning mechanism (200), and the wire taking mechanism are integrated on the same equipment frame.