A thinning apparatus in a chip package

Abstract

The utility model discloses a kind of thinning device in chip packaging, including horizontal rotation's grinding disc and vertical lifting's support disc, support disc is located below grinding disc, vacuum adsorption disc is fixedly arranged on support disc, vacuum adsorption disc has vacuum cavity, the upper end of vacuum adsorption disc is evenly distributed with several first vacuum holes being communicated with vacuum cavity, the one end of vacuum adsorption disc is equipped with the vacuum pipe joint of vacuum cavity communicating pipe, the upper end of vacuum adsorption disc is fixedly equipped with multilayer silica gel suction cup, several second vacuum holes are communicated with first vacuum hole in silica gel suction cup, the rim of the silica gel suction cup in the uppermost layer is surrounded by a circle of limit, the periphery of grinding disc is equipped with multiple spray heads, wafer is adsorbed and fixed by multiple first vacuum holes and second vacuum holes, and wafer is directly placed on flexible silica gel suction cup, so that the stress received by wafer is evenly dispersed, reduce the risk of fragment in thinning process.

Description

Technical Field

[0001] This utility model relates to the field of wafer thinning technology, specifically to a thinning device in chip packaging. Background Technology

[0002] Before wafers are diced into individual chips, the back side of the wafer needs to be thinned by grinding to control its thickness for subsequent chip packaging. Traditional thinning equipment places the wafer on a vacuum chuck and then grinds it using a grinding disc. However, ordinary vacuum chucks have a central vacuum suction hole to hold the wafer in place. This method causes localized stress concentration on the wafer, increasing the risk of fragmentation during the thinning process. Utility Model Content

[0003] To address the shortcomings of the prior art, this invention proposes a thinning device for chip packaging.

[0004] To achieve the above-mentioned technical effects, the present invention adopts the following solution:

[0005] A chip thinning device includes a horizontally rotating grinding disk and a vertically lifting support disk. The support disk is located below the grinding disk. A vacuum adsorption disk is fixedly mounted on the support disk. The vacuum adsorption disk has a vacuum cavity. A plurality of first vacuum holes communicating with the vacuum cavity are evenly distributed on the upper end of the vacuum adsorption disk. A vacuum tube connector communicating with the vacuum cavity is provided at one end of the vacuum adsorption disk. A multi-layer silicone suction cup is fixedly mounted on the upper end of the vacuum adsorption disk. A plurality of second vacuum holes communicating with the first vacuum holes are opened on the silicone suction cup. A limiting edge is surrounded by the edge of the uppermost silicone suction cup. A plurality of spray heads are arranged around the grinding disk.

[0006] In a preferred embodiment, the grinding disc is fixedly mounted to the lower end of the mounting plate by bolts. The mounting plate is driven to rotate by a rotating mechanism. The lower end of the mounting plate is provided with a plurality of arrayed mounting slots, and a pressure sensor is installed in the mounting slot against the upper end of the grinding disc.

[0007] In a preferred embodiment, the rotating mechanism includes a fixedly mounted motor, the output end of which is fixedly connected to the center of the mounting plate with its downward-facing end.

[0008] In a preferred embodiment, a laser rangefinder is embedded at the upper end of the support plate, and a rangefinder plate corresponding to the laser rangefinder is fixedly arranged around the perimeter of the mounting plate.

[0009] In a preferred embodiment, the support plate is driven to move vertically up and down by a lifting mechanism. The lifting mechanism includes a fixedly installed cylinder, the telescopic rod of which is fixedly connected to the center of the support plate. At least two guide rods are also fixedly installed at the lower end of the support plate. The guide rods pass through a guide sleeve, which is fixedly installed.

[0010] Compared with existing technologies, the beneficial effects are:

[0011] This invention has a simple structure and is easy to use. It uses multiple first vacuum holes and second vacuum holes to adsorb and fix the wafer, and the wafer is placed directly on a flexible silicone suction cup, so that the stress on the wafer is evenly distributed and the risk of fragmentation during the thinning process is reduced. Attached Figure Description

[0012] Figure 1 This is a cross-sectional schematic diagram of the present invention.

[0013] Reference numerals: 1. Grinding disc; 2. Support disc; 3. Vacuum adsorption disc; 4. Vacuum chamber; 5. First vacuum hole; 6. Vacuum tube connector; 7. Silicone suction cup; 8. Second vacuum hole; 9. Limiting edge; 10. Spray head; 11. Mounting plate; 12. Bolt; 13. Pressure sensor; 14. Motor; 15. Laser rangefinder; 16. Rangefinder plate; 17. Cylinder; 18. Guide rod. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0015] A chip packaging thinning device includes a horizontally rotating grinding disk 1 and a vertically lifting support disk 2. The support disk 2 is located below the grinding disk 1. A vacuum adsorption disk 3 is fixedly mounted on the support disk 2. The vacuum adsorption disk 3 has a vacuum cavity 4 inside. A plurality of first vacuum holes 5 communicating with the vacuum cavity 4 are evenly distributed on the upper end of the vacuum adsorption disk 3. A vacuum tube connector 6 communicating with the vacuum cavity 4 is provided at one end of the vacuum adsorption disk 3. A multi-layer silicone suction cup 7 is fixedly mounted on the upper end of the vacuum adsorption disk 3. A plurality of second vacuum holes 8 communicating with the first vacuum holes 5 are opened on the silicone suction cup 7. A limiting edge 9 surrounds the edge of the uppermost silicone suction cup 7. A plurality of spray heads 10 are arranged around the grinding disk 1.

[0016] The vacuum tube connector 6 at one end of the vacuum adsorption plate 3 is connected to an external vacuum generator. The wafer is placed on the uppermost silicone chuck 7 and the wafer is positioned by the limiting edge 9. The area formed by the limiting edge 9 around the wafer matches the wafer. Then, it is fixed to the silicone chuck 7 by vacuum adsorption. The grinding plate 1 rotates and the spray head 10 sprays polishing liquid. The wafer rises under the drive of the support plate 2 and presses against the lower end of the grinding plate 1 for grinding and thinning.

[0017] The wafer is fixed by adsorption through multiple first vacuum holes 5 and second vacuum holes 8, and the wafer is placed directly on a flexible silicone chuck 7, so that the stress on the wafer is evenly distributed and the risk of fragmentation during the thinning process is reduced.

[0018] In a preferred embodiment, the grinding disc 1 is fixedly mounted to the lower end of the mounting plate 11 by bolts 12. The mounting plate 11 has a vertically penetrating mounting hole, and the upper end of the grinding disc 1 has a threaded hole corresponding to the mounting hole. After the bolts 12 pass vertically through the mounting hole, they are screwed and locked into the threaded hole. The mounting plate 11 is driven to rotate by a rotating mechanism. The lower end of the mounting plate 11 has a plurality of arrayed mounting slots, and a pressure sensor 13 is installed in the mounting slots, which abuts against the upper end of the grinding disc 1.

[0019] It can provide real-time feedback on the pressure applied to the wafer by the grinding disc 1, avoiding the risk of wafer breakage due to excessive pressure.

[0020] In a preferred embodiment, the rotating mechanism includes a fixedly mounted motor 14, which is fixedly mounted on the frame, with the output end of the motor 14 facing downwards and fixedly connected to the center of the mounting plate 11.

[0021] In a preferred embodiment, a laser rangefinder 15 is embedded at the upper end of the support plate 2, and a rangefinder plate 16 corresponding to the laser rangefinder 15 is fixedly arranged around the perimeter of the mounting plate 11.

[0022] The thickness of the grinding disk 1 can be calculated by measuring the descent distance of the support disk 2 using a laser rangefinder 15.

[0023] In a preferred embodiment, the support plate 2 is driven to move vertically up and down by a lifting mechanism. The lifting mechanism includes a cylinder 17 fixedly mounted on the frame. The telescopic rod of the cylinder 17 is fixedly connected to the center of the support plate 2 with its extension rod facing upward. At least two guide rods 18 are also fixedly mounted at the lower end of the support plate 2. The guide rods 18 are matched and pass through the guide sleeve, which is fixedly mounted on the frame.

[0024] In the description of this utility model, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

Claims

1. A thinning device for chip packaging, characterized in that, The device includes a horizontally rotating grinding disc (1) and a vertically lifting support disc (2). The support disc (2) is located below the grinding disc (1). A vacuum adsorption disc (3) is fixedly mounted on the support disc (2). The vacuum adsorption disc (3) has a vacuum chamber (4). Several first vacuum holes (5) communicating with the vacuum chamber (4) are evenly distributed on the upper end of the vacuum adsorption disc (3). A vacuum pipe connector (6) communicating with the vacuum chamber (4) is provided at one end of the vacuum adsorption disc (3). A multi-layer silicone suction cup (7) is fixedly mounted on the upper end of the vacuum adsorption disc (3). Several second vacuum holes (8) communicating with the first vacuum holes (5) are opened on the silicone suction cup (7). A limiting edge (9) surrounds the edge of the uppermost silicone suction cup (7). Multiple spray heads (10) are arranged around the grinding disc (1).

2. The thinning device in chip packaging as described in claim 1, characterized in that, The grinding disc (1) is fixedly installed on the lower end of the mounting plate (11) by bolts (12). The mounting plate (11) is driven to rotate by a rotating mechanism. The lower end of the mounting plate (11) is provided with a plurality of arrayed mounting slots. A pressure sensor (13) is installed in the mounting slot against the upper end of the grinding disc (1).

3. The thinning device in chip packaging as described in claim 2, characterized in that, The rotating mechanism includes a fixedly mounted motor (14), the output end of which is fixedly connected to the center of the mounting plate (11) with its downward orientation.

4. The thinning device in chip packaging as described in claim 2, characterized in that, The upper end of the support plate (2) is fitted with a laser rangefinder (15), and a rangefinder plate (16) corresponding to the laser rangefinder (15) is fixed around the mounting plate (11).

5. The thinning device in chip packaging as described in claim 1, characterized in that, The support plate (2) is driven to rise and fall vertically by a lifting mechanism. The lifting mechanism includes a fixed cylinder (17). The telescopic rod of the cylinder (17) is fixedly connected to the center of the support plate (2) with its extension rod facing upward. At least two guide rods (18) are also fixedly provided at the lower end of the support plate (2). The guide rods (18) are matched and pass through the guide sleeve. The guide sleeve is fixedly provided.

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