A collimated light source based on cob packaging

Abstract

This invention provides a collimated light source based on COB packaging, including a PCB circuit board, a light-emitting chip, an all-plastic aspherical collimating lens, and connecting pins. The PCB circuit board has a negative electrode connection part and a preset pad (8). The light-emitting chip is fixed to the preset pad through a die bonding process, and a conductive path is formed between the light-emitting chip, the preset pad (8), and the negative electrode connection part by gold wire bonding. The PCB circuit board has an integrally formed heat dissipation structure. The all-plastic aspherical collimating lens is fixed on the PCB circuit board corresponding to the light emission direction of the light-emitting chip. The connecting pins are fixed to the edge of the PCB circuit board for electrical connection with external circuits. The advantages of this invention are: no need for gold-plated tube sockets and special equipment, the PCB can be customized, significantly reducing costs, the heat dissipation structure of the integral molding is equivalent to that of TO packaging, avoiding light decay, the integrated design eliminates the need for secondary assembly, high efficiency, adaptability to multiple types of chips, and wide applicability.

Description

Technical Field

[0001] This utility model mainly relates to the field of light source technology, specifically to a collimated light source based on COB packaging for encoders and sensors, which can emit infrared light or visible light and can directly adapt to the signal acquisition needs of encoders and sensors without the need for secondary assembly by the client. Background Technology

[0002] In precision equipment such as encoders and sensors, the light source is a core component, and its performance directly affects the detection accuracy and stability of the equipment. Currently, the TO (TransistorOutline) packaged light source, which is widely used in the industry, is mainly composed of a gold-plated tube base, a light-emitting chip, and a glass lens. With the characteristics of an all-metal structure, it can achieve good heat dissipation and maintain stable light emission performance during long-term operation. Therefore, it occupies a certain market share in the field of industrial inspection.

[0003] However, TO packaging technology has obvious limitations and cannot meet the current industry's demand for low cost and high integration. The material cost of its gold-plated tube base is high, and the production process relies on dedicated tube base welding and lens packaging equipment. The equipment procurement and maintenance costs significantly increase the production costs of enterprises. The light source using TO packaging is only a basic light-emitting element. The customer needs to provide additional accessories such as circuit boards and heat sink brackets. It can only be put into use after complex secondary assembly. This not only consumes a lot of manpower, but also makes it easy for the light source collimation to decrease due to assembly errors, affecting the overall performance of the equipment.

[0004] It should be noted that the above content falls within the scope of the inventor's technical knowledge. Due to the vast and complex nature of the technical content in this field, the above content of this application does not necessarily constitute prior art. Utility Model Content

[0005] 1. The technical problem to be solved by the utility model:

[0006] This invention provides a collimated light source based on COB packaging to solve the technical problems existing in the background art.

[0007] 2. Technical Solution:

[0008] To achieve the above objectives, the technical solution provided by this utility model is as follows: a collimating light source based on COB packaging, comprising a PCB circuit board, a light-emitting chip, an all-plastic aspherical collimating lens, and connecting pins. The PCB circuit board is provided with a negative electrode connection portion and a preset pad 8. The light-emitting chip is fixed to the preset pad by a die bonding process, and a conductive path is formed between the light-emitting chip, the preset pad 8, and the negative electrode connection portion by gold wire bonding. The PCB circuit board has an integrally formed heat dissipation structure. The all-plastic aspherical collimating lens is fixed to the PCB circuit board corresponding to the light emission direction of the light-emitting chip. The connecting pins are fixed to the edge of the PCB circuit board for electrical connection with external circuits.

[0009] Furthermore, the heat dissipation structure and the PCB circuit board are made of the same substrate, and the structure of the heat dissipation structure can be any one of the following: airfoil structure, fan-shaped structure, or wavy line structure.

[0010] Furthermore, the size of the heat dissipation structure can be adapted and adjusted according to the power of the light-emitting chip, with an adjustment range of 1cm² to 6cm².

[0011] Furthermore, the PCB circuit board has pre-drilled pin header soldering holes, through which the connecting pins are fixedly connected to the PCB circuit board, enabling rapid connection with external circuits.

[0012] Furthermore, the all-plastic aspherical collimating lens is fixed to the PCB circuit board with adhesive, and the lens position corresponds to the light emission center of the light-emitting chip, which is used to collimate the divergent light emitted by the light-emitting chip into parallel light.

[0013] Furthermore, the gold wire has two wires: one for connecting the positive pin of the light-emitting chip to the preset pad 8 of the PCB circuit board, and the other for connecting the negative pin of the light-emitting chip to the negative connection part of the PCB circuit board, which together form a closed conductive path.

[0014] 3. Beneficial effects:

[0015] Compared with the prior art, the technical solution provided by this utility model has the following advantages:

[0016] The elimination of TO-packaged gold-plated tube sockets and specialized equipment significantly reduces material and equipment costs. The appearance of the PCB can be customized according to customer needs, saving customers the steps of designing and manufacturing circuits themselves, thus reducing customer material consumption and workload.

[0017] The integrated heat dissipation structure increases the heat dissipation area, ensuring that the heat dissipation effect is equivalent to that of traditional TO packaged light sources, thus avoiding light decay or shortened lifespan due to chip overheating.

[0018] The light source integrates PCB circuit, light-emitting chip, collimating lens and connecting pins. The client can directly use it by connecting it to external circuit through the connecting pins, which improves assembly efficiency and avoids the impact of assembly errors on the collimation of the light source.

[0019] The type and size of the heat dissipation structure can be flexibly adjusted to adapt to infrared light chips or visible light chips, meeting the needs of different scenarios such as encoder position detection and sensor light signal acquisition.

[0020] It should be noted that the structures not described in this utility model are the same as or can be implemented using existing technology, and will not be elaborated here, as they do not involve the design points and improvement directions of this utility model. Attached Figure Description

[0021] Figure 1 This is the circuit matrix diagram of this utility model;

[0022] Figure 2 This is the circuit schematic diagram of this utility model;

[0023] Figure 3 This is a schematic diagram of the overall structure of this utility model;

[0024] Figure 4 This is a cross-sectional view of the overall structure of this utility model.

[0025] Figure label:

[0026] 1. Light-emitting chip; 2. Gold wire; 3. Negative electrode connection; 4. Heat dissipation structure; 5. PCB circuit board; 6. Connecting pin header; 7. All-plastic aspherical collimating lens; 8. Preset solder pad. Detailed Implementation

[0027] To facilitate understanding of this utility model, a more comprehensive description of the utility model will be given below with reference to the accompanying drawings, which show several embodiments of the utility model. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the utility model will be more thorough and complete.

[0028] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "page", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installed," "connected," "linked," "fixed," "provided with," and "located in" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] See attached document Figure 1-4 A collimating light source based on COB packaging includes a PCB circuit board 5, a light-emitting chip 1, an all-plastic aspherical collimating lens 7, and connecting pins 6. The PCB circuit board 5 is provided with a negative electrode connection part 3 and a preset pad 8. The light-emitting chip 1 is fixed to the preset pad by a die bonding process, and the light-emitting chip 1, the preset pad 8, and the negative electrode connection part 3 are bonded together by gold wires 2 to form a conductive path. A heat dissipation structure 4 is integrally formed on the PCB circuit board 5. The all-plastic aspherical collimating lens 7 is fixed on the PCB circuit board 5 corresponding to the light emission direction of the light-emitting chip 1. The connecting pins 6 are fixed to the edge of the PCB circuit board 5 for electrical connection with external circuits.

[0032] The PCB circuit board 5 serves as the carrier board and conductive substrate for the light source. It has a preset pad 8 and a negative electrode connection part 3 through an etching process. The preset pad 8 is used to fix the light-emitting chip 1. The edge of the circuit board has reserved pin header soldering holes for fixing and connecting pin header 6.

[0033] The light-emitting chip 1 is fixed to the preset pad 8 on the PCB circuit board 5 by a die bonding process. The positive pin of the light-emitting chip 1 is bonded to the preset pad 8, and the negative pin is bonded to the negative connection part 3 by gold wire 2 to form a closed conductive path, ensuring that the chip emits light stably after being powered on.

[0034] The heat dissipation structure 4 is integrally formed with the PCB circuit board 5 and is made of the same substrate as the PCB circuit board 5. The structure and size can be adjusted according to the actual use requirements of the light-emitting chip 1 to adapt to the heat dissipation requirements of different chips. The structure of the heat dissipation structure 4 can be any one of the wing structure, fan structure or wavy line structure. The size of the heat dissipation structure 4 can be adapted and adjusted according to the power of the light-emitting chip 1, and the adjustment range is 1cm²~6cm².

[0035] The all-plastic aspherical collimating lens 7 is fixed on the PCB circuit board 5 at the light emission center position of the corresponding light-emitting chip 1. The fixing medium is adhesive, which is used to collimate the divergent light emitted by the light-emitting chip 1 into parallel light, ensuring the collimation effect of the light source.

[0036] The connecting pin 6 is fixed in the pin soldering hole of the PCB circuit board 5 to realize the quick electrical connection between the collimating light source and the external circuits of the encoder and sensor without additional soldering or assembly operations.

[0037] The gold wire 2 has two wires. One wire is used to connect the positive terminal pin of the light-emitting chip 1 to the preset pad 8 of the PCB circuit board 5, and the other wire is used to connect the negative terminal pin of the light-emitting chip 1 to the negative terminal connection part 3 of the PCB circuit board 5. Together, they form a closed conductive path.

[0038] In this embodiment, the PCB circuit board 5 is made of an insulating substrate with a certain strength. The preset pads 8 and the negative electrode connection part 3 are made by etching process. At the same time, a heat dissipation structure 4 is integrally formed on one side of the circuit board. The form and size of the heat dissipation structure are determined according to the requirements of the matching light-emitting chip. The light-emitting chip 1 is a light-emitting chip adapted to the encoder signal acquisition requirements. The infrared light or visible light type can be selected according to the actual scenario. The all-plastic aspherical collimating lens 7 is an all-plastic lens with collimation function to ensure that the light emitted by the light-emitting chip can be collimated into parallel light. The connecting pin 6 is a pin that can realize fast electrical connection to ensure stable docking with the PCB circuit board 5 and external circuits. Adhesives for die bonding, gold wires for bonding, and adhesives for fixing the lens are used between the components to ensure the stability and conductivity of the connection between the components.

[0039] The assembly process steps of this technical solution are as follows:

[0040] Die bonding: Apply adhesive evenly to the preset pads 8 of the PCB circuit board 5, attach the light-emitting chip 1 to the center of the pads, and then bake to completely cure the adhesive, thereby fixing the light-emitting chip to the PCB circuit board.

[0041] Gold wire bonding: Using bonding equipment, one end of gold wire 2 is soldered to the positive terminal pin of the light-emitting chip 1, and the other end is soldered to the PCB preset pad 8; then one end of another gold wire is soldered to the negative terminal pin of the light-emitting chip 1, and the other end is soldered to the negative terminal connection part 3 of the PCB, forming a complete conductive path.

[0042] Lens fixing: Apply adhesive to the bottom of the all-plastic aspherical collimating lens 7, align the lens with the light emission center of the light-emitting chip 1, and attach it to the PCB circuit board 5. Then, cure the adhesive through a curing process to ensure the lens position is stable.

[0043] Pin header soldering: Insert the connecting pin header 6 into the pin header soldering hole of the PCB circuit board 5 and fix it through the soldering process to ensure good conductivity between the pin header and the circuit board, so as to stably connect to the external circuit.

[0044] The above-described embodiments are merely illustrative of certain implementations of this utility model, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A collimated light source based on COB packaging, characterized in that: The device includes a PCB circuit board (5), a light-emitting chip (1), an all-plastic aspherical collimating lens (7), and a connecting pin (6). The PCB circuit board (5) is provided with a negative electrode connection part (3) and a preset pad (8). The light-emitting chip (1) is fixed on the preset pad by a die bonding process. The light-emitting chip (1), the preset pad (8), and the negative electrode connection part (3) are bonded together by gold wire (2) to form a conductive path. The PCB circuit board (5) is integrally formed with a heat dissipation structure (4). The all-plastic aspherical collimating lens (7) is fixed on the PCB circuit board (5) corresponding to the light emission direction of the light-emitting chip (1). The connecting pin (6) is fixed to the edge of the PCB circuit board (5) for electrical connection with external circuits.

2. The collimating light source based on COB packaging according to claim 1, characterized in that: The heat dissipation structure (4) and the PCB circuit board (5) are made of the same substrate, and the structure of the heat dissipation structure (4) can be any one of the airfoil structure, fan structure or wavy line structure.

3. The collimating light source based on COB packaging according to claim 1, characterized in that: The size of the heat dissipation structure (4) can be adapted and adjusted according to the power of the light-emitting chip (1), with an adjustment range of 1cm² to 6cm².

4. A collimated light source based on COB packaging according to claim 1, characterized in that: The PCB circuit board (5) has reserved pin header soldering holes, and the connecting pin header (6) is fixedly connected to the PCB circuit board (5) through the pin header soldering holes to achieve quick docking with external circuits.

5. A collimated light source based on COB packaging according to claim 1, characterized in that: The all-plastic aspherical collimating lens (7) is fixed to the PCB circuit board (5) by adhesive, and the lens position corresponds to the light emission center of the light-emitting chip (1) to collimate the divergent light emitted by the light-emitting chip (1) into parallel light.

6. A collimated light source based on COB packaging according to claim 1, characterized in that: The gold wire (2) has two wires. One wire is used to connect the positive pin of the light-emitting chip (1) to the preset pad (8) of the PCB circuit board (5), and the other wire is used to connect the negative pin of the light-emitting chip (1) to the negative connection part (3) of the PCB circuit board (5), which together form a closed conductive path.

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