A PCB board testing mechanism

Abstract

This application discloses a PCB board testing mechanism, relating to the field of PCB board testing technology. It includes a main body, a slider, and a through-hole. The main body has a placement groove on its upper side. Two sets of uprights arranged symmetrically around the center are fixedly connected to the upper diagonal of the main body. A lifting groove is formed on the inner side of each upright. The slider is slidably connected to the inner side of the lifting groove. A pressing mechanism is installed on the outside of the uprights, and a detection mechanism is installed on the outside of the slider. The through-hole is located on the upper side of the placement groove, and a heating mechanism is installed inside the main body. In a single operation, this device accurately measures the PCB thickness by pressing down with a pressure block, while simultaneously using hot air heating and real-time monitoring of pressure changes to directly determine its thermal expansion trend, achieving efficient and simultaneous detection of thickness and thermal expansion performance.

Description

Technical Field

[0001] This utility model relates to the field of PCB board testing technology, and more specifically, to a PCB board testing mechanism. Background Technology

[0002] As the core carrier of electronic products, the thickness accuracy and thermal expansion stability of printed circuit boards (PCBs) are key indicators affecting product reliability. Traditional testing methods typically require separate steps: measuring the thickness using calipers or a dedicated thickness gauge, and then separately heating the PCB in an oven to observe deformation or measure dimensional changes. These steps are cumbersome and time-consuming.

[0003] The main problem with existing technologies is that thickness measurement and thermal expansion performance testing cannot be completed efficiently and simultaneously, resulting in low testing efficiency. Furthermore, it is difficult to directly observe the real-time impact of material expansion on contact pressure during heating. The separate operation steps not only increase workload but also easily introduce human error, making it difficult to conveniently evaluate the comprehensive performance of PCBs under heating conditions. Therefore, in order to address the above technical problems, a PCB testing mechanism is proposed here. Utility Model Content

[0004] The purpose of this invention is to provide a PCB board testing mechanism that can accurately measure the PCB thickness by pressing down the pressure block in a single operation, and simultaneously use hot air heating and real-time monitoring of pressure changes to directly determine its thermal expansion trend, thus achieving efficient and synchronous detection of thickness and thermal expansion performance.

[0005] This utility model is achieved through the following technical solution:

[0006] A PCB board testing mechanism, comprising:

[0007] The main body of the mechanism has a placement slot on its upper side. Two sets of uprights are fixedly connected at the diagonal corners of the upper side of the main body of the mechanism. The inner side of the uprights has a lifting slot.

[0008] The slider is slidably connected to the inner side of the lifting groove, the upright is equipped with a pressing mechanism, and the slider is equipped with a detection mechanism.

[0009] A through hole is provided on the upper side of the placement slot, and a heating mechanism is installed inside the main body of the mechanism.

[0010] Preferably, the pressing mechanism includes a drive motor and a lead screw. The drive motor is fixedly connected to the bottom of the upright, the lead screw is fixedly connected to the output end of the drive motor, and the lead screw is rotatably connected to the inner side of the lifting groove. The slider is threadedly connected to the outside of the lead screw.

[0011] Preferably, the detection mechanism includes a pressure block, a pressure sensor, a scale, and an indicator plate. The pressure block is fixedly connected to the outside of the slider and is located above the placement groove. The pressure sensor is fixedly connected to the bottom of the pressure block.

[0012] Preferably, the scale is fixedly connected to the outside of the upright, the indicator plate is fixedly connected to one side of the slider, and the pressure block and the scale are slidably connected.

[0013] Preferably, the bottom of the main body of the mechanism is provided with a ventilation opening, and the number of through holes and ventilation openings are several groups arranged in an array.

[0014] Preferably, the hot drying mechanism includes a first fixed rod, a second fixed rod, a fan, and a thermoelectric component. The first fixed rod and the second fixed rod are both fixedly connected to the inside of the main body of the mechanism, and the second fixed rod is located above the first fixed rod. The fan is fixedly connected to the outside of the first fixed rod, and the thermoelectric component is fixedly connected to the outside of the second fixed rod.

[0015] Preferably, a storage battery is fixedly installed inside the main body of the mechanism, and the storage battery is electrically connected to the fan and the thermoelectric components.

[0016] Preferably, the bottom of the main body of the mechanism is fixedly connected to a support foot, and the outside of the main body of the mechanism is fixedly connected to a PLC processor, and the PLC processor is connected to the drive motor, pressure sensor, fan and thermoelectric components for communication.

[0017] The technical solution of this utility model has at least the following beneficial effects:

[0018] This PCB testing mechanism significantly improves PCB inspection efficiency and accuracy. Its core advantage lies in its ability to simultaneously complete thickness measurement and thermal expansion performance evaluation in a single operation. After accurately obtaining the thickness reading by driving downward pressure, it immediately or simultaneously applies controllable hot air and monitors the changing trend of the pressure sensor feedback value in real time. It can directly and sensitively capture the pressure increment generated by the expansion of the PCB under heat, eliminating the cumbersome steps of repeatedly clamping, transferring samples, and switching equipment in traditional methods, greatly shortening the inspection cycle, and reducing manual intervention and errors. More importantly, it provides direct data on the dynamic behavior of materials during heating, making the judgment of PCB thermal stability more immediate, objective, and reliable, and providing a more comprehensive basis for product quality control. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2This is a schematic diagram of the second overall structure of the present invention;

[0021] Figure 3 for Figure 2 Enlarged view of A in the middle;

[0022] Figure 4 This is a partial front sectional view of the present invention;

[0023] Figure 5 for Figure 4 Enlarged view of B in the middle;

[0024] Figure 6 for Figure 4 Enlarged view of C;

[0025] Icons: 1. Main body of the mechanism; 2. Placement slot; 3. Upright pole; 4. Lifting slot; 5. Slider; 6. Drive motor; 7. Lead screw; 8. Pressure block; 9. Pressure sensor; 10. Through hole; 11. Ventilation port; 12. First fixed rod; 13. Second fixed rod; 14. Fan; 15. Thermoelectric assembly; 16. Support foot; 17. Scale; 18. Indicator plate; 19. PLC processor. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] Example

[0028] This application discloses a PCB board testing mechanism, comprising a main body 1, a slider 5, and a through hole 10. The main body 1 serves as the basic support structure of the entire testing device. A placement groove 2 is provided on its upper side for precise positioning of the PCB board under test. Two sets of uprights 3 are fixedly connected at opposite corners on the upper side of the main body 1, arranged symmetrically around each other. This symmetrical arrangement ensures balanced force during testing. A lifting groove 4 is provided on the inner side of the uprights 3, providing a precise vertical movement track for the slider 5. The slider 5 is slidably connected to the inner side of the lifting groove 4, and its threaded connection structure achieves precise vertical displacement control. A pressing mechanism is installed on the outside of the uprights 3. This pressing mechanism includes a drive motor 6 and a lead screw 7. The drive motor 6 is fixedly connected to the bottom of the uprights 3 to provide power output, and the lead screw 7 is fixedly connected to the output end of the drive motor 6. The lead screw 7 is rotatably connected to the inner side of the lifting groove 4 to form a stable transmission system. The threaded connection between the slider 5 and the lead screw 7 ensures the accuracy of motion conversion.

[0029] like Figure 2as well as Figure 3 As shown, a detection mechanism is installed on the outside of the slider 5. The detection mechanism includes a pressure block 8, a pressure sensor 9, a scale 17, and an indicator plate 18. The pressure block 8 is fixedly connected to the outside of the slider 5 to apply uniform pressure to the PCB board. The pressure block 8 is located above the placement groove 2 to ensure accurate test position. The pressure sensor 9 is fixedly connected to the bottom of the pressure block 8 to monitor the change of contact pressure in real time. The scale 17 is fixedly connected to the outside of the upright 3 to provide an intuitive reference for thickness measurement. The indicator plate 18 is fixedly connected to one side of the slider 5 as a reading pointer. The sliding connection between the pressure block 8 and the scale 17 ensures the stability of the measurement process.

[0030] like Figure 4 As shown, the through hole 10 is opened on the upper side of the placement slot 2 to form a hot air channel, and the bottom of the main body 1 of the mechanism is provided with a vent 11 to form a complete airflow circulation system. The array arrangement design of the through hole 10 and the vent 11 ensures the uniform distribution of the heat field.

[0031] like Figure 4 as well as Figure 6 As shown, the heating mechanism installed inside the main body 1 includes a first fixed rod 12, a second fixed rod 13, a fan 14, and a thermoelectric component 15. The first fixed rod 12 and the second fixed rod 13 form a stable internal support frame. The layered design of the second fixed rod 13 located above the first fixed rod 12 optimizes space utilization. The fan 14 is fixedly connected to the outside of the first fixed rod 12 to provide stable airflow. The thermoelectric component 15 is fixedly connected to the outside of the second fixed rod 13 to achieve precise temperature control. The battery inside the main body 1 provides an independent power supply for the entire system, and its electrical connection with the fan 14 and the thermoelectric component 15 ensures the reliability of energy supply.

[0032] like Figure 1 As shown, the support feet 16 fixedly connected to the bottom of the main body 1 provide a stable working platform. The PLC processor 19 fixedly connected to the outside of the main body 1 serves as the control center. Its communication connection with the drive motor 6, pressure sensor 9, fan 14 and thermoelectric component 15 realizes the automated control of the entire testing process.

[0033] The working principle of the PCB board testing mechanism based on the embodiment is as follows: During testing, the PCB board to be tested is first placed in the placement slot 2. Then, the drive motor 6 is started to drive the lead screw 7 at its output end to rotate. Since the slider 5 is threadedly connected to the lead screw 7 and is limited and slidably connected to the lifting slot 4 inside the upright 3, the rotation of the lead screw 7 will be converted into the vertical downward movement of the slider 5. The pressure block 8 fixed outside the slider 5 moves downward synchronously until the pressure sensor 9 at the bottom of the pressure block 8 is tightly pressed against the upper surface of the PCB board in the placement slot 2. At this time, by observing the scale value indicated by the indicator plate 18 on the scale 17, the actual thickness of the PCB board can be directly obtained, and it can be determined whether it meets the standard.

[0034] In addition, while or after the pressure sensor 9 is in contact with the PCB board to measure the thickness, the thermoelectric component 15 can be activated to heat up, and the fan 14 can be operated at the same time. The airflow generated by the fan 14 is heated by the heated thermoelectric component 15 to form hot air. The hot air is blown into the PCB board in the placement slot 2 through the through hole 10 to heat it. The vent 11 at the bottom of the main body 1 of the mechanism helps air circulation. During this heating process, the PLC processor 19 receives and displays the pressure value fed back by the pressure sensor 9 in real time. By monitoring the change trend of the pressure value during the heating process of the PCB board, it can be determined whether the PCB board has increased pressure due to thermal expansion, thereby conveniently realizing the detection of the thermal expansion performance of the PCB board.

[0035] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A testing mechanism for a PCB board, characterized in that, include: The main body of the mechanism (1) has a placement groove (2) on its upper side. Two sets of uprights (3) are fixedly connected at the diagonal corners of the upper side of the main body of the mechanism (1). The inner side of the uprights (3) has a lifting groove (4). The slider (5) is slidably connected to the inside of the lifting groove (4), the outside of the upright (3) is equipped with a pressing mechanism, and the outside of the slider (5) is equipped with a detection mechanism. A through hole (10) is provided on the upper side of the placement groove (2), and a heating mechanism is installed inside the main body (1) of the mechanism.

2. The PCB board testing mechanism according to claim 1, characterized in that: The pressing mechanism includes a drive motor (6) and a lead screw (7). The drive motor (6) is fixedly connected to the bottom of the upright (3). The lead screw (7) is fixedly connected to the output end of the drive motor (6) and is rotatably connected to the inner side of the lifting groove (4). The slider (5) is threadedly connected to the outside of the lead screw (7).

3. The PCB board testing mechanism according to claim 2, characterized in that: The detection mechanism includes a pressure block (8), a pressure sensor (9), a scale (17), and an indicator plate (18). The pressure block (8) is fixedly connected to the outside of the slider (5) and is located above the placement groove (2). The pressure sensor (9) is fixedly connected to the bottom of the pressure block (8).

4. The PCB board testing mechanism according to claim 3, characterized in that: The scale (17) is fixedly connected to the outside of the upright (3), the indicator plate (18) is fixedly connected to one side of the slider (5), and the pressure block (8) and the scale (17) are slidably connected.

5. The PCB board testing mechanism according to claim 1, characterized in that: The bottom of the main body (1) of the mechanism is provided with a ventilation opening (11), and the number of through holes (10) and ventilation openings (11) are several groups arranged in an array.

6. The PCB board testing mechanism according to claim 3, characterized in that: The heating mechanism includes a first fixed rod (12), a second fixed rod (13), a fan (14), and a thermoelectric component (15). The first fixed rod (12) and the second fixed rod (13) are both fixedly connected to the inside of the main body (1) of the mechanism, and the second fixed rod (13) is located above the first fixed rod (12). The fan (14) is fixedly connected to the outside of the first fixed rod (12), and the thermoelectric component (15) is fixedly connected to the outside of the second fixed rod (13).

7. The PCB board testing mechanism according to claim 6, characterized in that: The main body (1) of the mechanism is equipped with a storage battery, and the storage battery is electrically connected to the fan (14) and the thermoelectric component (15).

8. The PCB board testing mechanism according to claim 6, characterized in that: The bottom of the main body (1) of the mechanism is fixedly connected to a support foot (16), and the outside of the main body (1) of the mechanism is fixedly connected to a PLC processor (19). The PLC processor (19) is connected to the drive motor (6), pressure sensor (9), fan (14) and thermoelectric component (15) for communication.

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