A temperature detection device

Abstract

This application provides a temperature detection device, relating to the technical field of temperature measuring devices. The temperature detection device includes a housing, a core assembly, and a first heat-conducting element. The core assembly includes a heat-conducting bracket and a heat source device. The heat source device is disposed within the space enclosed by the heat-conducting bracket, and the housing surrounds the outer peripheral surface of the heat-conducting bracket. The first heat-conducting element is disposed between the outer peripheral surface of the heat-conducting bracket and the inner peripheral surface of the housing. Through this arrangement, the heat generated by the heat source device is sequentially conducted to the external environment via the heat-conducting bracket, the first heat-conducting element, and the housing. This improves the heat dissipation efficiency of the heat source device, increases the measurement accuracy of the core assembly and the service life of the heat source device, avoids damage to the heat source device and other electronic components caused by high temperatures, and enhances the stability and reliability of the core assembly.

Description

Technical Field

[0001] This application relates to the technical field of temperature measuring devices, and more particularly to a temperature detection device. Background Technology

[0002] In related technologies, temperature measuring devices are used to measure temperatures in various scenarios. These devices typically include internal circuitry, which gradually heats up due to power consumption and other factors. However, the internal circuitry has high temperature sensitivity, and this temperature rise can reduce the measurement accuracy of the device. Utility Model Content

[0003] This application provides a temperature detection device to improve the heat dissipation efficiency of heat source devices within the temperature detection device.

[0004] This application provides a temperature detection device, including: a housing, a core assembly, and a first heat-conducting element. The core assembly and the inner circumferential surface of the housing are rotatably connected. The core assembly includes a heat-conducting bracket and a heat source device. The heat source device is disposed within the space enclosed by the heat-conducting bracket. The housing is disposed around the outer circumferential surface of the heat-conducting bracket. The first heat-conducting element is an elastic element and is pressed between the outer circumferential surface of the heat-conducting bracket and the inner circumferential surface of the housing.

[0005] Through the above configuration, the first heat-conducting element fills the gap between the mechanism assembly and the housing, thereby transferring heat from the mechanism assembly to the first heat-conducting element, which then transfers it to the housing for heat dissipation, improving the heat dissipation efficiency of the heat source device. Furthermore, as the mechanism assembly rotates relative to the inner circumferential surface of the housing, the first heat-conducting element experiences radial force and extends along the inner circumferential surface of the housing and the outer circumferential surface of the heat-conducting support, thus expanding the heat dissipation area and further improving the heat dissipation efficiency of the heat source device. By conducting the heat generated by the heat source device sequentially through the heat-conducting support, the first heat-conducting element, and the housing to the external environment, the heat dissipation efficiency of the heat source device is improved, increasing the measurement accuracy of the mechanism assembly and the service life of the heat source device. This also prevents damage to the heat source device and other electronic components caused by high temperatures, enhancing the stability and reliability of the mechanism assembly.

[0006] In some embodiments, there are multiple first heat-conducting elements, which are spaced apart circumferentially along the heat-conducting support.

[0007] As can be seen from the above embodiments, multiple first heat-conducting components are provided to improve heat dissipation efficiency. Furthermore, when multiple first heat-conducting components are provided, the spacing between them in the circumferential direction of the heat-conducting bracket provides deformation space for the first heat-conducting components to stretch in the circumferential direction, thereby avoiding problems such as detachment or deformation of the first heat-conducting components due to compression.

[0008] In some embodiments, the first heat-conducting element includes a filling layer, a heat-conducting layer, and a wear-resistant layer. The heat-conducting layer is located between the filling layer and the wear-resistant layer. The heat-conducting layer is disposed around the filling layer, and the wear-resistant layer is disposed around the heat-conducting layer. A portion of the wear-resistant layer is located between the heat-conducting layer and the outer wall of the heat-conducting support, and a portion of the wear-resistant layer is located between the heat-conducting layer and the inner wall of the housing.

[0009] As can be seen from the above embodiments, the filling layer, thermally conductive layer, and wear-resistant layer are layered and wrapped together. The thermally conductive layer completely covers the outer surface of the filling layer, and the wear-resistant layer completely covers the outer surface of the thermally conductive layer. By providing the wear-resistant layer, direct contact between the thermally conductive layer inside the first thermally conductive component and the outer wall of the thermally conductive bracket or the inner wall of the housing can be avoided. This helps reduce wear on the thermally conductive layer, improves the reduced heat dissipation efficiency caused by thinning due to wear, and enhances the reliability of the first thermally conductive component. After the heat from the heat source device is transferred to the first thermally conductive component, it can be further transferred to the housing through the thermally conductive layer, thereby improving the heat dissipation efficiency of the heat source device. By placing the filling layer inside the first thermally conductive component, the space between the core assembly and the housing can be filled, allowing the first thermally conductive component to adhere to the outer peripheral surface of the thermally conductive bracket and the inner peripheral surface of the housing, further improving the heat dissipation efficiency of the heat source device.

[0010] In some embodiments, the filler layer is extruded between the outer wall of the thermally conductive support and the inner wall of the housing.

[0011] As can be seen from the above embodiments, the filling layer is disposed between the outer wall of the heat-conducting bracket and the inner wall of the housing by extrusion, which is beneficial to filling the gap between the heat-conducting bracket and the housing, thereby increasing the effective contact area between the first heat-conducting element and the outer wall of the heat-conducting bracket and the inner wall of the housing, thereby improving the heat dissipation efficiency of the heat source device.

[0012] In some embodiments, the compression ratio of the filler layer ranges from 15% to 40%.

[0013] As can be seen from the above embodiments, the filler layer has good deformation ability, thereby preventing the filler layer from falling off or undergoing permanent deformation due to compression.

[0014] In some embodiments, the hardness of the filler layer ranges from 10 Shore A to 20 Shore A.

[0015] As can be seen from the above embodiments, the hardness of the filler layer is set to a range of 10 Shore A to 20 Shore A, thereby enabling the filler layer to have good elasticity and allowing it to be pressed and installed between the first heat-conducting component and the housing.

[0016] In some embodiments, the thermal conductivity of the thermally conductive layer is greater than or equal to 1.0 W / m·K.

[0017] As can be seen from the above embodiments, by limiting the thermal conductivity of the heat-conducting layer, the heat generated by the heat source device can be quickly conducted, thereby improving the heat dissipation efficiency of the first heat-conducting component.

[0018] In some embodiments, the first thermally conductive element is connected to the outer peripheral surface of the thermally conductive bracket via a connecting layer.

[0019] As can be seen from the above embodiments, a connecting layer is provided on the outer peripheral surface of the heat-conducting bracket, thereby ensuring the stability of the connection between the first heat-conducting component and the heat-conducting bracket, and increasing the effective contact area through the connecting layer to improve the heat dissipation efficiency of the first heat-conducting component.

[0020] In some embodiments, the outer peripheral surface of the heat-conducting bracket forms a first opening. The temperature sensing device also includes a cover plate connected to the heat-conducting bracket and covering the first opening; the cover plate and the inner peripheral surface of the housing are threaded together.

[0021] As can be seen from the above embodiments, by threading the cover plate and the housing, the cover and the housing can be rotated relative to each other and tightened to achieve fixation when the core assembly is installed inside the housing. When the cover rotates relative to the housing, the cover drives the core assembly to move axially, and the first heat-conducting element is subjected to radial force from the housing, which compresses radially and then stretches circumferentially to achieve a larger area of ​​contact with the heat-conducting bracket, thereby further improving heat dissipation efficiency.

[0022] In some embodiments, the thermally conductive support includes a carrier plate and a sleeve, the sleeve being disposed around the edge of the carrier plate, and the outer surface of the sleeve comprising the outer peripheral surface of the thermally conductive support. A heat source device is connected to the carrier plate via a second thermally conductive element.

[0023] As can be seen from the above embodiments, by using the second heat-conducting component as a connector, the heat generated by the heat source device can be transferred to the carrier plate. Furthermore, the edge of the carrier plate is connected to the sleeve, allowing the heat generated by the heat source device to be transferred sequentially through the second heat-conducting component, the carrier plate, and the sleeve, and then further transferred by the first heat-conducting component connected to the outer surface of the heat-conducting bracket, thus improving heat dissipation efficiency. Attached Figure Description

[0024] The accompanying drawings are provided to further illustrate the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solution of this utility model and do not constitute a limitation on the technical solution of this utility model.

[0025] Figure 1 This is a schematic diagram of the structure of a temperature detection device provided in an embodiment of this application;

[0026] Figure 2A cross-sectional view of a temperature detection device provided in an embodiment of this application;

[0027] Figure 3 A schematic diagram of a movement assembly provided in an embodiment of this application;

[0028] Figure 4 A schematic diagram of a movement assembly and a first heat-conducting element provided for an embodiment of this application;

[0029] Figure 5 for Figure 2 Enlarged view of the structure at point A of the temperature detection device in the image;

[0030] Figure 6 A schematic diagram of a first heat-conducting element provided in an embodiment of this application;

[0031] Figure 7 This is a schematic diagram of a cover plate and a heat-conducting bracket provided in an embodiment of this application. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0034] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, when describing pipelines, the terms "connected" and "linked" as used in this application have the meaning of establishing electrical connection. The specific meaning needs to be understood in conjunction with the context.

[0035] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0036] In modern industry and scientific research, temperature measurement devices are becoming increasingly diverse, with various devices meeting the temperature measurement needs of different scenarios. Among them, the pyrometer, as a non-contact temperature measuring instrument specifically designed for extreme high-temperature environments, plays an irreplaceable role. It receives the infrared radiation energy emitted by an object and, combined with a sophisticated optical and electronic system, converts the radiation intensity into a temperature value, accurately measuring the surface temperature of objects without direct contact. However, during temperature measurement, the circuitry inside the pyrometer gradually heats up due to power consumption and other factors. This heating reduces the pyrometer's measurement accuracy and shortens its lifespan.

[0037] Figure 1 This is a schematic diagram of the structure of a temperature detection device provided in an embodiment of this application. Figure 2 This is a cross-sectional view of a temperature detection device provided in an embodiment of this application. Figure 3 This is a schematic diagram of a movement assembly provided in an embodiment of this application. Figure 4 This is a schematic diagram of a movement assembly and a first heat-conducting element provided in an embodiment of this application. Figure 5 for Figure 2 An enlarged view of the structure at point A in the temperature detection device.

[0038] In view of this, such as Figures 1 to 5 As shown, this application provides a temperature detection device 1, including: a housing 10, a core assembly 11 and a first heat-conducting element 12, wherein the core assembly 11 and the inner peripheral surface 101 of the housing 10 are rotatably connected.

[0039] A rotational connection is achieved by instructing two components to rotate relative to each other. In the above embodiment, the movement assembly 11 rotates relative to the housing 10 and gradually completes the connection with the housing 10 during the rotation process. For example, the movement assembly 11 and the housing 10 can be connected by threaded engagement.

[0040] The mechanism assembly 11 includes a heat-conducting bracket 111 and a heat source device 112. The heat source device 112 is disposed within the space enclosed by the heat-conducting bracket 111, and the housing 10 is disposed around the outer peripheral surface 1113 of the heat-conducting bracket 111. The first heat-conducting element 12 is an elastic element, and the first heat-conducting element 12 is pressed and disposed between the outer peripheral surface 1113 of the heat-conducting bracket 111 and the inner peripheral surface 101 of the housing 10.

[0041] The elastic element refers to the first heat-conducting element 12 having elasticity, which will deform when the first heat-conducting element 12 is subjected to external force. The compression setting refers to the first heat-conducting element 12 being disposed between the outer peripheral surface 1113 of the heat-conducting bracket 111 and the inner peripheral surface 101 of the housing 10, and in contact with the heat-conducting bracket 111 and the housing 10 and subjected to pressure from the heat-conducting bracket 111 and the housing 10. At this time, the first heat-conducting element 12 deforms and is compressed due to the external force, and fits against the heat-conducting bracket 111 and the housing 10.

[0042] In some examples, the temperature detection device 1 further includes an optical component for receiving infrared radiation signals from the heat source and sending the infrared radiation signals to the mechanism assembly 11. The mechanism assembly 11 processes the infrared radiation signals to obtain the temperature of the heat source. The mechanism assembly 11 and the optical component are arranged along the axial direction of the mechanism assembly 11.

[0043] In the above embodiments, the movement assembly 11 is disposed inside the housing 10, thereby protecting the movement assembly 11 through the housing 10 and improving the stability and reliability of the temperature monitoring device.

[0044] Furthermore, the mechanism assembly 11 includes a heat-conducting bracket 111 and a heat source device 112. Figure 5 for Figure 2 An enlarged view of the structure at point A in the temperature detection device. In some examples, such as... Figure 5 As shown, the heat source device 112 includes a control module 1121 and a storage module 1122, which are electrically connected. The control module 1121 controls the storage module 1122 to perform storage operations. For example, the control module 1121 can be a System-on-a-Chip (SoC). An SoC is a highly integrated electronic system solution. It integrates multiple key components of a complete system, such as the processor core, graphics processing unit, memory controller, input / output interfaces, and various analog and digital circuits, into a single miniaturized package. The storage module 1122 can be DDR SDRAM (double-data-rate synchronous dynamic random access memory). DDR SDRAM is a memory with double the data transfer rate.

[0045] In existing technologies, heat dissipation is typically achieved by axially connecting a heat-conducting component to the movement assembly and utilizing this component. During installation, a gap exists between the movement assembly and the outer casing. Therefore, the heat generated by the movement assembly can only be transferred to the air surrounding it first, and then from there to the casing. Air has a low thermal conductivity, resulting in poor heat dissipation efficiency and consequently reducing overall cooling efficiency.

[0046] In view of this, in the embodiments of this application, a first heat-conducting element 12 is provided between the outer peripheral surface 1113 of the heat-conducting bracket 111 and the inner peripheral surface 101 of the housing 10, wherein, by Figure 3 It can be seen that the heat-conducting support 111 is columnar, and the outer surface along the circumferential direction of the columnar shape of the heat-conducting support 111 is the outer circumferential surface 1113. From... Figure 1 It can be seen that the shell 10 is also cylindrical, and the inner surface along the circumferential direction of the shell 10 is the inner circumferential surface 101. When the core assembly 11 measures the temperature of the target, the heat source device 112 with high power consumption will generate a large amount of heat and transfer the heat to the heat conduction bracket 111. By placing the first heat conduction element 12 between the heat conduction bracket 111 and the shell 10, the heat generated by the heat source device 112 is transferred sequentially through the heat conduction bracket 111, the first heat conduction element 12 and the shell 10. Finally, through the thermal convection effect, the heat is transferred to the external environment through air flow.

[0047] The first heat-conducting element 12 fills the gap between the movement assembly 11 and the housing 10, thereby transferring the heat from the movement assembly 11 to the first heat-conducting element 12, and then transferring it to the housing 10 for heat dissipation, thus improving the heat dissipation efficiency of the heat source device 112. Furthermore, as the movement assembly 11 rotates relative to the inner circumferential surface 101 of the housing 10, the first heat-conducting element 12 experiences a radial force and extends along the inner circumferential surface 101 of the housing 10 and the outer circumferential surface 1113 of the heat-conducting support 111, thereby expanding the heat dissipation area and further improving the heat dissipation efficiency of the heat source device 112.

[0048] The heat generated by the heat source device 112 is conducted to the external environment through the heat-conducting bracket 111, the first heat-conducting element 12 and the housing 10, thereby improving the heat dissipation efficiency of the heat source device 112, improving the measurement accuracy of the core assembly 11 and the service life of the heat source device 112, avoiding damage to the heat source device 112 and other electronic components caused by high temperature, and improving the stability and reliability of the core assembly 11.

[0049] In some examples, the thermally conductive bracket 111 is connected to the heat source device 112, thereby improving the thermal conductivity of the heat source device 112.

[0050] In some examples, the first surface of the first heat-conducting element 12 is in contact with the outer peripheral surface 1113 of the heat-conducting bracket 111, and the second surface of the first heat-conducting element 12 is in contact with the inner peripheral surface 101 of the housing 10, thereby filling the installation gap between the core assembly 11 and the housing 10, and allowing the heat generated by the core assembly 11 to be transferred to the housing 10 more efficiently through the first heat-conducting element 12, and then transferred from the core assembly 11 to the external environment through airflow, thereby improving the heat dissipation efficiency of the first heat-conducting element 12.

[0051] Figure 6 This is a schematic diagram of a first heat-conducting element 12 in an embodiment of this application.

[0052] In some embodiments, such as Figure 6 As shown, the first heat-conducting element 12 includes a filling layer 121, a heat-conducting layer 122, and a wear-resistant layer 123. The heat-conducting layer 122 is located between the filling layer 121 and the wear-resistant layer 123, and the heat-conducting layer 122 wraps around the filling layer 121. The wear-resistant layer 123 wraps around the heat-conducting layer 122. Part of the wear-resistant layer 123 is located between the heat-conducting layer 122 and the outer wall of the heat-conducting support 111, and part of the wear-resistant layer 123 is located between the heat-conducting layer 122 and the inner wall of the housing 10.

[0053] In the above embodiment, the first heat-conducting element 12 is composed of a filler layer 121, a heat-conducting layer 122, and a wear-resistant layer 123. The filler layer 121, heat-conducting layer 122, and wear-resistant layer 123 are arranged in a layer-by-layer manner, with the heat-conducting layer 122 completely covering the outer surface of the filler layer 121, and the wear-resistant layer 123 completely covering the outer surface of the heat-conducting layer 122. By providing the wear-resistant layer 123, direct contact between the heat-conducting layer 122 within the first heat-conducting element and the outer wall of the heat-conducting support or the inner wall of the housing can be avoided. This helps reduce wear on the heat-conducting layer, improves the reduced heat dissipation efficiency caused by thinning of the heat-conducting layer 122 due to wear, and enhances the reliability of the first heat-conducting element 12.

[0054] In some examples, the wear-resistant layer 123 can be a PI film (polyimide film), which is a high-performance thin film material made of polyimide resin.

[0055] The heat-conducting layer 122 is disposed on the side of the wear-resistant layer 123 close to the filling layer 121, so that after the heat of the heat source device 112 is transferred to the first heat-conducting element 12, the heat can be further transferred to the housing 10 through the heat-conducting layer 122, thereby improving the heat dissipation efficiency of the heat source device 112.

[0056] In some examples, the thermally conductive layer 122 can be a graphene layer.

[0057] Furthermore, by placing the filling layer 121 inside the first heat-conducting element 12, the space between the core assembly 11 and the housing 10 can be filled, so that the first heat-conducting element 12 can be attached to the outer peripheral surface 1113 of the heat-conducting bracket 111 and the inner peripheral surface 101 of the housing 10 respectively, thereby further improving the heat dissipation efficiency of the heat source device 112.

[0058] In some examples, the filler layer 121 can be an EVA layer (ethylene-vinyl acetate copolymer). The EVA layer is a layer made of a polymer material synthesized through a copolymerization reaction of ethylene and vinyl acetate monomers.

[0059] In some embodiments, the filler layer 121 is extruded between the outer wall of the heat-conducting bracket 111 and the inner wall of the housing 10.

[0060] In the above embodiment, the compression setting refers to the filling layer 121 being subjected to forces from both the outer wall of the heat-conducting bracket 111 and the inner wall of the housing 10, thereby forming compression. Because there are different and small gaps between the heat-conducting bracket 111 and the housing 10, if the filling layer 121 is too thick, it will be difficult for the first heat-conducting element 12 to be placed in the gap between the heat-conducting bracket 111 and the housing 10; if the filling layer 121 is too thin, the effective contact area between the first heat-conducting element 12 and the heat-conducting bracket 111 and the housing 10 will be too small. Therefore, the filling layer 121 is disposed between the outer wall of the heat-conducting bracket 111 and the inner wall of the housing 10 by compression, which is beneficial for filling the gap between the heat-conducting bracket 111 and the housing 10, and at the same time can increase the circumferential contact area of ​​the first heat-conducting element 12 in the heat-conducting bracket 111, thereby improving the heat dissipation efficiency of the heat source device 112.

[0061] In some embodiments, the compression ratio of the filler layer 121 ranges from 15% to 40%. For example, the compression ratio of the filler layer 121 can be 15%, 27.5%, and 40%.

[0062] In the above embodiments, by setting the compression ratio of the filling layer 121 to 15% to 40%, the filling layer 121 is guaranteed to have good deformation ability, thereby avoiding the filling layer 121 from falling off or undergoing permanent deformation due to compression when it is squeezed.

[0063] In some embodiments, the hardness of the filler layer 121 ranges from 10 Shore A to 20 Shore A.

[0064] In the above embodiment, Shore A (Chinese name: Shore A hardness) is a standard index used in materials science to quantify the hardness of soft materials. It is measured by a Shore hardness tester with a range of 0-100; the higher the value, the harder the material. In this embodiment, the hardness of the filler layer 121 is set to a range of 10 Shore A to 20 Shore A, thereby enabling the filler layer 121 to have good flexibility and preventing the first heat-conducting element 12 from being too hard and difficult to press and install between the heat-conducting element and the shell 10.

[0065] In some embodiments, the thermal conductivity of the thermally conductive layer 122 is at least 1.0 W / m·K.

[0066] In the above embodiments, by limiting the thermal conductivity of the heat-conducting layer 122, the heat generated by the heat source device 112 can be quickly conducted, thereby improving the heat dissipation efficiency of the first heat-conducting element 12.

[0067] In some embodiments, the first heat-conducting element 12 is connected to the outer peripheral surface 1113 of the heat-conducting bracket 111 via a connecting layer.

[0068] In the above embodiment, a connecting layer is provided on the outer peripheral surface 1113 of the heat-conducting bracket 111, thereby ensuring the stability of the connection between the first heat-conducting element 12 and the heat-conducting bracket 111. Furthermore, it avoids the problem of insufficient effective contact area between the first heat-conducting element 12 and the outer peripheral surface 1113 of the heat-conducting bracket 111 due to unevenness caused by workmanship issues, thus improving the heat dissipation efficiency of the first heat-conducting element 12 by increasing the effective contact area.

[0069] In some examples, combined Figure 6 The connecting layer can be made of thermally conductive adhesive 14, so as to ensure the connection between the first thermally conductive component 12 and the thermally conductive bracket 111 is stable, and the heat of the thermally conductive bracket 111 can be efficiently transferred to the first thermally conductive component 12.

[0070] Figure 7 This is a schematic diagram of a cover plate 13 and a heat-conducting bracket 111 provided in an embodiment of this application.

[0071] In some embodiments, such as Figure 7 As shown, combined with Figures 1 to 4 The outer peripheral surface 1113 of the heat-conducting bracket 111 surrounds the first opening 1114. The temperature detection device 1 also includes a cover plate 13, which is connected to the heat-conducting bracket 111 and covers the first opening 1114. The cover plate 13 and the inner peripheral surface 101 of the housing 10 are threaded together.

[0072] In the above embodiments, the temperature detection device 1 also includes a cover plate 13, and the cover plate 13 serves as a connector, allowing the heat conduction bracket 111 to be connected to the housing 10 through the cover plate 13, thereby preventing the movement of the core assembly 11 during operation and increasing the stability and reliability of the temperature detection device 1.

[0073] Furthermore, the cover plate 13 and the inner circumferential surface 101 of the housing 10 are connected by a threaded connection, which facilitates disassembly and makes it easier to replace the movement assembly 11 when it is damaged.

[0074] Since both the housing 10 and the heat-conducting bracket 111 are cylindrical, the core assembly 11 needs to be placed inside the housing 10 along the axial direction and fixed by the rotating cover 13. By threading the cover 13 and the housing 10, the cover 13 and the housing 10 can be rotated and tightened relative to each other to fix the core assembly 11 when it is installed inside the housing 10. Due to the rotation of the cover 13, the first heat-conducting element 12 will be subjected to radial force from the housing 10, and will be compressed radially. When the hardness of the filling layer 121 is in the range of 10 to 20 Shore A, the filling layer 121 will have good flexibility. The first heat-conducting element 12 will stretch and deform circumferentially to achieve a larger area to fit the heat-conducting bracket 111, further improving the heat dissipation efficiency of the heat source device 112.

[0075] Furthermore, because the filling layer 121 has good flexibility, it will not deform due to compression during rotation. Therefore, when fixed by threaded rotation, it helps reduce wear on the first heat-conducting element 12, improving the reduced heat dissipation efficiency of the first heat-conducting element 12 caused by wear and thinning. Also, because the heat from the heat source device 112 is conducted to the heat-conducting bracket 111 more quickly, by covering the first opening 1114 with the cover plate 13 and connecting it to the heat-conducting bracket 111, the contact area with air during heat dissipation through thermal convection is increased, thereby improving the heat conduction efficiency of the heat source device 112.

[0076] In some examples, the heat-conducting bracket 111 has a second opening 1115, and a guide seat 1116 is provided on the side of the second opening 1115 away from the cover plate 13. The temperature detection device 1 also includes a connector 15, one end of which connects the cover plate 13 and the heat-conducting bracket 111 in sequence, and is connected to the guide seat 1116. The connection between the cover plate 13 and the heat-conducting bracket 111 through the connector 15 increases the stability of the heat-conducting bracket 111 and the cover plate 13.

[0077] In some examples, a lens is provided at the end of the housing 10 away from the cover plate 13, and the movement assembly 11 receives infrared radiation signals through the lens, thereby avoiding interference from heat dissipation on measurement accuracy.

[0078] In some examples, the heat source device 112 is located inside the housing 10 near the end of the cover plate 13, thereby further improving the efficiency of heat dissipation and reducing interference with temperature measurement.

[0079] In some embodiments, there are multiple first heat-conducting elements 12, and the multiple first heat-conducting elements 12 are arranged at circumferential intervals along the heat-conducting support 111.

[0080] In the above embodiments, a plurality of first heat-conducting elements 12 are provided to improve heat dissipation efficiency. Furthermore, since the plurality of first heat-conducting elements 12 are spaced apart along the circumferential direction of the heat-conducting bracket 111, the stretching of the first heat-conducting elements 12 in the circumferential direction provides deformation space, thereby avoiding problems such as the first heat-conducting elements 12 falling off or deforming due to compression.

[0081] In some examples, when the temperature detection device 1 also includes a cover plate 13, a plurality of first heat-conducting elements 12 are provided with a gap from the cover plate 13, thereby ensuring that when the first heat-conducting elements 12 are squeezed, the first heat-conducting elements 12 can extend toward the direction of the cover plate 13, avoiding the problem of damage caused by the inability of the first heat-conducting elements 12 to extend.

[0082] In some embodiments, the heat-conducting support 111 includes a carrier plate 1111 and a sleeve 1112, the sleeve 1112 being disposed around the edge of the carrier plate 1111, and the outer surface of the sleeve 1112 including the outer peripheral surface 1113 of the heat-conducting support 111. The heat source device 112 is connected to the carrier plate 1111 via a second heat-conducting element 1117.

[0083] In the above embodiment, the heat source device 112 is mounted on the carrier plate 1111, thereby ensuring the stability of the heat source device 112. Furthermore, the second heat-conducting element 1117 serves as a connector, enabling the heat generated by the heat source device 112 to be transferred to the carrier plate 1111. In addition, the edge of the carrier plate 1111 is connected to the sleeve 1112, allowing the heat generated by the heat source device 112 to be transferred sequentially through the second heat-conducting element 1117, the carrier plate 1111, and the sleeve 1112, and then further transferred by the first heat-conducting element 12 connected to the outer surface of the heat-conducting support 111, thus improving heat dissipation efficiency.

[0084] In some examples, the second thermal conductive element 1117 may include thermal conductive gel and thermal conductive pad.

[0085] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A temperature detection device, characterized in that, include: case; The mechanism assembly is rotatably connected to the inner circumferential surface of the housing. The mechanism assembly includes a heat-conducting bracket and a heat source device. The heat source device is disposed within the space enclosed by the heat-conducting bracket, and the housing is disposed around the outer circumferential surface of the heat-conducting bracket. The first heat-conducting element is an elastic element, which is pressed and disposed between the outer peripheral surface of the heat-conducting bracket and the inner peripheral surface of the housing.

2. The temperature detection device according to claim 1, characterized in that, The number of the first heat-conducting elements is multiple, and the multiple first heat-conducting elements are arranged at intervals along the circumference of the heat-conducting bracket.

3. The temperature detection device according to claim 2, characterized in that, The first heat-conducting component includes a filling layer, a heat-conducting layer, and a wear-resistant layer. The heat-conducting layer is located between the filling layer and the wear-resistant layer. The heat-conducting layer is disposed around the filling layer, and the wear-resistant layer is disposed around the heat-conducting layer. A portion of the wear-resistant layer is located between the heat-conducting layer and the outer wall of the heat-conducting bracket, and a portion of the wear-resistant layer is located between the heat-conducting layer and the inner wall of the housing.

4. The temperature detection device according to claim 3, characterized in that, The filling layer is extruded between the outer wall of the heat-conducting bracket and the inner wall of the housing.

5. The temperature detection device according to claim 4, characterized in that, The compression ratio of the filler layer ranges from 15% to 40%.

6. The temperature detection device according to claim 3, characterized in that, The hardness of the filler layer ranges from 10 Shore A to 20 Shore A.

7. The temperature detection device according to claim 3, characterized in that, The thermal conductivity of the heat-conducting layer is greater than or equal to 1.0 W / m·K.

8. The temperature detection device according to any one of claims 1 to 6, characterized in that, The first heat-conducting component is connected to the outer peripheral surface of the heat-conducting bracket through a connecting layer.

9. The temperature detection device according to any one of claims 1 to 6, characterized in that, The outer circumferential surface of the heat-conducting bracket is provided with a first opening; The mechanism assembly also includes a cover plate, which is connected to the heat-conducting bracket and covers the first opening. The cover plate and the inner circumferential surface of the housing are threaded together.

10. The temperature detection device according to any one of claims 1 to 6, characterized in that, The heat-conducting support includes a carrier plate and a sleeve. The sleeve is arranged around the edge of the carrier plate, and the outer surface of the sleeve includes the outer peripheral surface of the heat-conducting support. The heat source device is connected to the carrier plate through a second heat-conducting element.

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