A base for a chip kdg test socket

Abstract

The utility model belongs to the field of semiconductor test application technology, specifically disclose a kind of base for chip KGD test socket, including stage, stage supporting leg, air passage, exhaust fan, test socket pedestal, hollow cavity, outlet passage, air inlet, air hole, temperature sensor mounting hole, temperature sensor and PLC controller etc. The beneficial effect of the base for chip KGD test socket of the utility model is that: 1, can be quickly assembled between test socket pedestal, while the exhaust fan, temperature sensor and PLC controller of cooperation use, can complete preset temperature adjustment in time when testing, realize efficient and accurate chip KGD test operation;2, the fixed plate of cooperation use, sealing plate, through-hole, several air outlets, tension spring and sealing baffle, realize the sealing in detection cavity when detecting or temperature adjustment, guarantee the sealing property of system when detecting.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor testing application technology, specifically relating to a base for a chip KGD test socket. Background Technology

[0002] KGD testing involves static and dynamic testing of bare chips, subjecting devices to high stress such as high voltage, high current, and high temperature to eliminate chips that fail early or have defects, ensuring that the final selected chips meet the quality and reliability requirements of the packaged finished product.

[0003] Currently, the problem with KGD test sockets is that they cannot automatically adjust the temperature in a timely manner during the test, and excessively high temperatures can affect the accuracy of the test data.

[0004] To address the aforementioned issues, this utility model provides a base for a chip KGD test socket. Utility Model Content

[0005] Purpose of the utility model: The purpose of this utility model is to address the shortcomings of the existing technology by providing a base for a chip KGD test socket, thereby solving the problems existing in the background technology.

[0006] Technical Solution: This utility model provides a base for a chip KGD test socket, including a platform, platform legs disposed at both ends of the platform, an air duct disposed within the symmetrical center line of the platform, an exhaust fan disposed on the bottom surface of the platform and located on the surface of the air duct, a test socket base disposed on the platform, a hollow cavity disposed in the upper part of the test socket base, an air outlet channel disposed in the lower part of the test socket base and connected to the hollow cavity, an air inlet channel disposed in one end of the test socket base and connected to the hollow cavity, an air hole disposed in the upper end face of the test socket base and connected to the hollow cavity, a temperature sensor mounting hole disposed in one side of the test socket base and connected to the hollow cavity, a temperature sensor disposed in the temperature sensor mounting hole, and a PLC controller connected to the exhaust fan and the temperature sensor respectively.

[0007] The base for the chip KGD test socket of this technical solution also includes a fixed plate in the symmetrical air passage, a sealing plate disposed in the air passage and located below the fixed plate, through holes symmetrically disposed on the outer layer of the sealing plate, a plurality of air outlet holes uniformly disposed on the inner layer of the sealing plate, a tension spring with one end fixed to the surface of the fixed plate and the other end passing through the through hole, and a sealing baffle located on the surface of the sealing plate and fixed to the tension spring.

[0008] In this technical solution, the fixing plate is configured as an arc-shaped structure.

[0009] In this technical solution, the diameter of the sealing baffle is smaller than the diameter of the sealing plate, and the sealing baffle covers the through hole and several air outlet holes inside the sealing plate.

[0010] Compared with the prior art, the beneficial effects of the chip KGD test socket base of this utility model are as follows: 1. It can be quickly assembled with the test socket base, and the exhaust fan, temperature sensor and PLC controller used in conjunction can complete the timely preset temperature adjustment during testing, so as to achieve efficient and accurate chip KGD testing; 2. The fixed plate, sealing plate, through hole, several air vents, tension spring and sealing baffle used in conjunction can achieve the sealing of the test cavity during testing or after temperature adjustment, so as to ensure the sealing of the system during testing. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the main structural part of the base for a chip KGD test socket according to this utility model;

[0013] Figure 2 This is a top view schematic diagram of the test socket base, hollow cavity, air hole, temperature sensor mounting hole and temperature sensor of a chip KGD test socket base according to this utility model.

[0014] Figure 3 This is a top view of the platform, platform legs, air passage and fixing plate of a base for a chip KGD test socket according to this utility model.

[0015] Figure 4 It is a schematic diagram of the sealing state of the fixed plate, sealing plate, through hole, several air outlet holes, tension spring and sealing baffle;

[0016] Figure 5 It is a schematic diagram of the exhaust state of the fixed plate, sealing plate, through hole, several air outlet holes, tension spring and sealing baffle;

[0017] The numbers in the diagram are as follows: 10-Platform, 11-Platform support leg, 12-Test socket base, 121-Temperature sensor mounting hole, 122-Air hole, 123-Air inlet, 124-Hollow cavity, 125-Temperature sensor, 13-Air outlet, 14-Air duct, 15-Exhaust fan, 16-Fixing plate, 17-Tension spring, 18-Sealing plate, 19-Through hole, 20-Air outlet, 21-Sealing baffle, 22-PLC controller. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0019] In the description of this utility model, it should be noted that the terms "top," "bottom," "one side," "the other side," "front," "back," "middle part," "inner," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "joined" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] Example 1

[0021] like Figure 1 , Figure 2 and Figure 3 The shown is a base for a chip KGD test socket, including a stage 10.

[0022] and platform legs 11 set at both ends of the platform 10,

[0023] and the air passage 14 located within the symmetrical center line of the platform 10,

[0024] and an exhaust fan 15 disposed on the bottom surface of the platform 10 and located on the surface of the air duct 14.

[0025] and the test socket base 12 mounted on the stage 10,

[0026] and the hollow cavity 124 disposed in the upper part of the test socket base 12,

[0027] and an air outlet channel 13 located inside the lower part of the test socket base 12 and connected to the hollow cavity 124.

[0028] and an air intake duct 123 disposed within one end of the test socket base 12 and connected to the hollow cavity 124.

[0029] and an air hole 122 disposed within the upper end face of the test socket base 12 and connected to the hollow cavity 124.

[0030] and a temperature sensor mounting hole 121 located inside one side of the test socket base 12 and connected to the hollow cavity 124.

[0031] and the temperature sensor 125 installed in the temperature sensor mounting hole 121,

[0032] And a PLC controller 22 that is connected to the exhaust fan 15 and the temperature sensor 125 respectively.

[0033] The aforementioned exhaust fan 15, temperature sensor 125, and PLC controller 22 are all conventional components or equipment. Temperature sensor 125 is used to monitor the temperature inside the cavity during chip KGD testing and feeds it back to PLC controller 22. PLC controller 22 controls the exhaust fan 15 to start / stop according to the preset temperature range. The exhaust fan 15 completes the gas extraction and circulation inside the cavity through the connected air hole 122, hollow cavity 124, air outlet channel 13, and air passage 14, thereby cooling the cavity during testing.

[0034] Example 2

[0035] Based on Embodiment 1, the base for the chip KGD test socket also includes a fixing plate 16 within the symmetrical air passage 14, a sealing plate 18 disposed within the air passage 14 and located below the fixing plate 16, through holes 19 symmetrically disposed on the outer layer of the sealing plate 18, a plurality of air outlet holes 20 uniformly disposed on the inner layer of the sealing plate 18, a tension spring 17 with one end fixed to the surface of the fixing plate 16 and the other end penetrating through the through hole 19, and a sealing baffle 21 located on the surface of the sealing plate 18 and fixed to the tension spring 17.

[0036] like Figure 4 As shown, when no cooling is required or when cooling is complete, under the action of the tension spring 17, the sealing baffle 21 is tightly attached to the surface of the fixed plate 16 to achieve the corresponding system seal.

[0037] like Figure 5 As shown, during cooling, after the exhaust fan 15 is started, a pressure difference occurs in the detection chamber due to the suction of the exhaust fan 15. At this time, the sealing baffle 21, which is close to the surface of the fixed plate 16, moves away from the fixed plate 16. In this way, the hot air in the detection chamber is discharged from the edge of the sealing baffle 21 through several air outlets 20 and through holes 19. After cooling is completed, the exhaust fan 15 stops. At this time, under the action of the tension spring 17, the sealing baffle 21 is close to the surface of the fixed plate 16, realizing the corresponding system sealing.

[0038] In addition, the fixing plate 16 is preferably configured as an arc-shaped structure with an airflow channel in the middle, so as not to obstruct the exhaust.

[0039] In addition, preferably, the diameter of the sealing baffle 21 is smaller than that of the sealing plate 18. The sealing baffle 21 covers the through hole 19 and several air outlet holes 20 in the sealing plate 18. In this way, the detection system is sealed under normal conditions, and the gas in the detection chamber can flow when cooling and heat dissipation are required.

[0040] It should be noted that, in this document, terms such as "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0041] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A base for a chip KGD test socket, characterized in that: The system includes a platform (10), platform legs (11) at both ends of the platform (10), an air duct (14) within the symmetrical center line of the platform (10), an exhaust fan (15) on the bottom surface of the platform (10) and located on the surface of the air duct (14), a test socket base (12) on the platform (10), a hollow cavity (124) in the upper part of the test socket base (12), an exhaust channel (13) in the lower part of the test socket base (12) and connected to the hollow cavity (124), and an exhaust channel (13) in the test socket base (12). An air inlet (123) is located inside one end of the test socket base (12) and connected to the hollow cavity (124), and an air hole (122) is located inside the upper end face of the test socket base (12) and connected to the hollow cavity (124), and a temperature sensor mounting hole (121) is located inside one side of the test socket base (12) and connected to the hollow cavity (124), and a temperature sensor (125) is located inside the temperature sensor mounting hole (121), and a PLC controller (22) is connected to the exhaust fan (15) and the temperature sensor (125) respectively.

2. The base for a chip KGD test socket according to claim 1, characterized in that: The base for the chip KGD test socket also includes a fixing plate (16) in the symmetrical air passage (14), a sealing plate (18) disposed in the air passage (14) and located below the fixing plate (16), through holes (19) symmetrically disposed on the outer layer of the sealing plate (18), a plurality of air outlet holes (20) uniformly disposed on the inner layer of the sealing plate (18), a tension spring (17) with one end fixed to the surface of the fixing plate (16) and the other end passing through the through hole (19), and a sealing baffle (21) located on the surface of the sealing plate (18) and fixed to the tension spring (17).

3. The base for a chip KGD test socket according to claim 2, characterized in that: The fixing plate (16) is configured as an arc-shaped structure.

4. The base for a chip KGD test socket according to claim 2, characterized in that: The diameter of the sealing baffle (21) is smaller than that of the sealing plate (18), and the sealing baffle (21) covers the through hole (19) and several air outlet holes (20) in the sealing plate (18).

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