A millimeter-wave MMIC chip testing device and chip

Abstract

This utility model discloses a millimeter-wave MMIC chip testing device and chip. The testing device includes a test circuit board and a chip fixing fixture. The chip fixing fixture is detachably connected to the test circuit board. The chip fixing fixture includes a metal cavity clamp and a conductive film. The metal cavity clamp has a through slot. The conductive film is disposed at the bottom of the metal cavity clamp, located at the through slot. In use, the conductive film is communicatively connected to a bent waveguide on the test circuit board. This utility model provides convenient testing, is suitable for quickly obtaining the chip performance in a circuit, and facilitates the needs of mass production testing and batch testing of chips.

Description

Technical Field

[0001] This utility model relates to the field of microwave and millimeter-wave chip testing technology, specifically a millimeter-wave MMIC chip testing device and chip. Background Technology

[0002] In recent years, the research, design, and manufacturing of millimeter-wave chips have made significant progress. Due to its short wavelength, wide bandwidth, all-weather capability, and strong adaptability to smoke, the millimeter-wave band has been widely used in communication, imaging, and radar. A common testing method for millimeter-wave packaged chips involves connecting DC and RF signals to the millimeter-wave BGA pins using metal spring pins or elastic particles. However, the metal spring pin connection method, due to contact damage and high-frequency response issues, can easily introduce additional parasitic responses to the millimeter-wave chip. Ordinary elastic particles, due to testing errors caused by their elastic deformation, are not effective in the E-band (60GHz-90GHz).

[0003] Both of these methods are difficult to apply to the RF testing of 77G millimeter-wave chips for mass production and screening. Therefore, how to accurately characterize the real response of millimeter-wave chips and carry out subsequent mechanized and automated testing has become an important issue in chip production and delivery.

[0004] For example, patent application CN109655733A discloses a method for non-destructive testing of millimeter-wave BGA packaged components. During testing, a metal housing 1 is placed upside down on a first dielectric substrate 7, and the solder balls of the BGA packaged component 2 make elastic contact with the high-frequency ferrule 5 and the low-frequency ferrule 6. The low-frequency ferrule 6 contacts the disc of the low-frequency adapter cable 14, connecting to the low-frequency test interface formed by the finger lines. The high-frequency signal is vertically transitioned to the high-impedance matching line 11 through the high-frequency ferrule 5, and then transmitted to the standard 50-ohm universal high-frequency test interface formed by the coplanar transmission line 13 through the low-impedance matching line 12. The performance of the BGA packaged component 2 can be non-destructively tested through the coplanar line 13 and the low-frequency adapter cable 14. The high-frequency and low-frequency ferrules in this patent are the elastic particles mentioned above. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a circuit structure for testing millimeter-wave MMIC chips that accurately characterizes the true response of millimeter-wave chips and enables subsequent mechanized and automated testing.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0007] A millimeter-wave MMIC chip testing device includes: a test circuit board 10 and a chip fixing fixture 20; the chip fixing fixture 20 is detachably connected to the test circuit board 10.

[0008] The chip fixing fixture 20 includes a metal cavity clamp 21 and a conductive film 22; the metal cavity clamp 21 is provided with a through groove 221; the conductive film 22 is located at the bottom of the metal cavity clamp 21 and at the through groove 221; in use, the conductive film 22 is connected to the bent waveguide on the test circuit board 10.

[0009] In this embodiment, the metal cavity clamp 21 is provided with an auxiliary mounting groove 23; the auxiliary mounting groove 23 is provided around the top of the through groove 221; and the top and sides of the auxiliary mounting groove 23 are open and communicate with the through groove 221.

[0010] In this embodiment, the side of the auxiliary mounting groove 23 that connects with the through groove 221 is sloped.

[0011] In this embodiment, the chip fixing fixture 20 includes a fastener 24; the fastener 24 is located on the metal cavity clamp 21, which detachably connects the metal cavity clamp 21 to the test circuit board 10.

[0012] In this embodiment, the test circuit board 10 includes a PCB board 11 and a millimeter-wave test circuit disposed on the PCB board 11; the millimeter-wave test circuit includes a test input circuit 12 and a test output circuit 13; wherein the test input circuit 12 and the test output circuit 13 are disposed on the same plane on the PCB board 11.

[0013] In this embodiment, the test input circuit 12 includes an input connector 121 and a first test bend waveguide 122; the test output circuit 13 includes an output connector 131 and a second test bend waveguide 132.

[0014] The first end of the first test bend waveguide 122 is connected to the input connector 121; the second end of the second test bend waveguide 132 is connected to the output connector 131.

[0015] The end of the first test bend waveguide 122 and the beginning of the second test bend waveguide 132 are at the mirror position and are connected to the conductive film 22.

[0016] In this embodiment, the test input circuit 12 and the test output circuit 13 are mirrored on the PCB board 11.

[0017] In this embodiment, the millimeter-wave test circuit on the test circuit board 10 and the conductive film 22 are fabricated according to the pin definition of the millimeter-wave chip A under test.

[0018] In this embodiment, during use, the RF BGA solder balls of the millimeter-wave chip A under test are in contact with the conductive film 22.

[0019] This invention also provides a millimeter-wave chip, which is subjected to radio frequency testing using the millimeter-wave MMIC chip testing device described above.

[0020] Compared with the prior art, the beneficial effects of this utility model are:

[0021] This invention addresses the challenges of mass production testing and performance screening of MMIC chip RF parameters. It provides a solution combining a millimeter-wave test circuit, conductive film, and test fixture, solving the testing problems from millimeter-wave chip pins to PCB packaging and instrument ports. To achieve better testing results, the millimeter-wave test circuit and conductive film need to be fabricated according to the pin definitions of the millimeter-wave chip under test.

[0022] Compared with existing technologies, this invention simplifies testing by requiring only the millimeter-wave chip to be placed in a chip fixture. This makes testing more convenient and suitable for quickly obtaining chip performance data within a circuit, facilitating mass production and batch testing. The auxiliary mounting slot further enhances the ease of handling and placing the millimeter-wave chip. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a millimeter-wave MMIC chip testing device according to an embodiment of the present invention.

[0024] Figure 2 This is a schematic diagram of a chip fixing fixture according to an embodiment of the present invention.

[0025] Figure 3 This is an exploded view of a millimeter-wave MMIC chip testing device according to an embodiment of the present invention.

[0026] Figure 4 This is a schematic diagram showing the test parameters and analysis results of the millimeter-wave chip according to an embodiment of this utility model. Detailed Implementation

[0027] To facilitate understanding of the technical solution of this utility model by those skilled in the art, the technical solution of this utility model will now be further described in conjunction with the accompanying drawings.

[0028] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0029] Please see Figures 1 to 3 As shown, this embodiment provides a millimeter-wave MMIC chip testing device, including: a test circuit board 10 and a chip fixing fixture 20, wherein the chip fixing fixture 20 is detachably connected to the test circuit board 10.

[0030] In one embodiment of this utility model, the test circuit board 10 includes a PCB board 11 and a millimeter-wave test circuit disposed on the PCB board 11. The millimeter-wave test circuit includes a test input circuit 12 and a test output circuit 13, and the test input circuit 12 and the test output circuit 13 are arranged coplanarly and mirror images on the PCB board 11.

[0031] In this embodiment, the test input circuit 12 includes an input connector 121 and a first test bend waveguide 122, and the test output circuit 13 includes an output connector 131 and a second test bend waveguide 132. The first end of the first test bend waveguide 122 is connected to the input connector 121, and the last end of the second test bend waveguide 132 is connected to the output connector 131. The last end of the first test bend waveguide 122 and the first end of the second test bend waveguide 132 are mirror images of each other and are connected to the conductive film 22.

[0032] In this embodiment, the test bend wire in the millimeter-wave test circuit is 2.17 mm wide, has a port impedance of 50 ohms, a loss of 6 dB, and supports de-embedding operations.

[0033] In one embodiment of the present invention, the chip fixing fixture 20 includes a metal cavity clamp 21, a conductive film 22, and a fastener 24.

[0034] In this embodiment, a through groove 221 is provided on the metal cavity fixture 21; a conductive film 22 is disposed at the bottom of the metal cavity fixture 21, located at the through groove 221. In use, the conductive film 22 is communicatively connected to the bent waveguide on the test circuit board 10, i.e., conductive.

[0035] In this embodiment, the metal cavity clamp 21 is provided with an auxiliary mounting groove 23, which surrounds the top of the through groove 221 and has open tops and sides, communicating with the through groove 221. The side of the auxiliary mounting groove 23 that communicates with the through groove 221 is sloped.

[0036] In this embodiment, the fastener 24 is located on the metal cavity clamp 21, which detachably connects the metal cavity clamp 21 to the test circuit board 10. Specifically, the fastener 24 is a screw.

[0037] In this embodiment, the chip fixture 20 can be used in conjunction with an ATE (Automatic Test Equipment) machine for large-scale automated testing.

[0038] In one embodiment of this invention, the millimeter-wave test circuit and conductive film 22 on the test circuit board 10 are fabricated according to the pin definitions of the millimeter-wave chip A under test. During use, the RF BGA solder balls of the millimeter-wave chip A under test contact the conductive film 22. It should be further noted that the BGA solder balls are miniature ball-shaped solder points on the bottom of a BGA (Ball Grid Array) packaged chip used for electrical connection and mechanical fixation.

[0039] In this embodiment, the chip fixing fixture 20 is used to install and position the millimeter-wave chip A under test, and to connect the BGA solder balls of the millimeter-wave chip A under test to the millimeter-wave test circuit, so that multiple fasteners 24 are positioned and tightened.

[0040] Please see Figures 1 to 3 As shown, after the test circuit board 10 and chip mounting fixture 20 are assembled, the millimeter-wave chip A under test is placed in the through slot 221. The RF BGA solder balls on the bottom of the millimeter-wave chip A come into contact with the conductive film 22. A crimping device is used to connect the conductive film 22 to the millimeter-wave chip A under test, indirectly making the millimeter-wave chip A under test and the millimeter-wave test circuit conductive. Then, a vector network analyzer or spectrum analyzer is connected to the input connector 121 and the output connector 131 for RF testing.

[0041] In this embodiment, it is important to note that during the assembly of the chip fixing fixture 20, flatness and screw hole errors in the fit with the fastener 24 will affect the pad contact and thus the test accuracy. After initially fixing the metal cavity fixture 21, the positions of the metal cavity fixture 21 and the fastener 24 are optimized to achieve the best match between the conductive film 22 and the millimeter-wave test circuit. The millimeter-wave chip A under test is placed in, and the corresponding RF signal PIN is input from the input connector 121. The output POUT is obtained from the output connector 131. Signal analysis is performed using a vector network analyzer or spectrum analyzer, with the operating frequency band of the vector network analyzer or spectrum analyzer set to 60GHz to 90GHz.

[0042] In one embodiment of this utility model, to facilitate rapid testing, the output signal POUT is digitally sampled using a 50MHz sampling rate ADC, and the entire RF chip specification can be obtained through FFT operation. See details... Figure 4 As shown.

[0043] Please see Figures 1 to 4 As shown, this embodiment also provides a millimeter-wave chip, and performs radio frequency testing using the millimeter-wave MMIC chip testing device described above.

[0044] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this invention, and no reference numerals in the claims should be construed as limiting the scope of the claims.

[0045] The above-described embodiments are merely examples of implementation methods of the utility model. The scope of protection of this utility model is not limited to the above-described embodiments. For those skilled in the art, several modifications and improvements can be made without departing from the concept of this utility model, and these all fall within the scope of protection of this utility model.

Claims

1. A millimeter-wave MMIC chip testing device, characterized in that, include: Test circuit board (10) and chip fixing fixture (20); the chip fixing fixture (20) and test circuit board (10) are detachably connected; The chip fixing fixture (20) includes a metal cavity clamp (21) and a conductive film (22); the metal cavity clamp (21) is provided with a through groove (221); the conductive film (22) is located at the bottom of the metal cavity clamp (21) and at the through groove (221); in use, the conductive film (22) is connected to the bent waveguide on the test circuit board (10) for communication.

2. The millimeter-wave MMIC chip testing device according to claim 1, characterized in that, The metal cavity clamp (21) is provided with an auxiliary mounting groove (23); the auxiliary mounting groove (23) is provided around the top of the through groove (221); and the top and sides of the auxiliary mounting groove (23) are open and communicate with the through groove (221).

3. The millimeter-wave MMIC chip testing device according to claim 2, characterized in that, The side of the auxiliary mounting groove (23) that connects with the through groove (221) is sloped.

4. The millimeter-wave MMIC chip testing device according to claim 1, characterized in that, The chip fixing fixture (20) includes a fastener (24); the fastener (24) is located on a metal cavity fixture (21) and detachably connects the metal cavity fixture (21) to the test circuit board (10).

5. The millimeter-wave MMIC chip testing device according to claim 1, characterized in that, The test circuit board (10) includes a PCB board (11) and a millimeter-wave test circuit disposed on the PCB board (11); the millimeter-wave test circuit includes a test input circuit (12) and a test output circuit (13); wherein the test input circuit (12) and the test output circuit (13) are disposed on the same plane on the PCB board (11).

6. The millimeter-wave MMIC chip testing device according to claim 5, characterized in that, The test input circuit (12) includes an input connector (121) and a first test bend waveguide (122); the test output circuit (13) includes an output connector (131) and a second test bend waveguide (132); The first end of the first test bend waveguide (122) is connected to the input connector (121); the end of the second test bend waveguide (132) is connected to the output connector (131); The end of the first test bend waveguide (122) and the beginning of the second test bend waveguide (132) are at the mirror position and connected to the conductive film (22).

7. The millimeter-wave MMIC chip testing device according to claim 5, characterized in that, The test input circuit (12) and the test output circuit (13) are mirrored on the PCB board (11).

8. The millimeter-wave MMIC chip testing device according to claim 1, characterized in that, The millimeter-wave test circuit on the test circuit board (10) and the conductive film (22) are fabricated according to the pin definition of the millimeter-wave chip (A) under test.

9. The millimeter-wave MMIC chip testing device according to claim 1, characterized in that, During use, the RF BGA solder balls of the millimeter-wave chip (A) under test are in contact with the conductive film (22).

10. A millimeter-wave chip, characterized in that, Radio frequency testing is performed using the millimeter-wave MMIC chip testing apparatus according to any one of claims 1-9.

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