An industrial camera housing optimized for heat dissipation

Abstract

This application discloses an industrial camera housing with optimized heat dissipation, belonging to the technical field of industrial camera housings. It includes a heat dissipation housing, within which an industrial camera is mounted, with a heat sink mounted on its upper end. A heat dissipation frame is fitted around the end face of the industrial camera, and a connecting frame is connected to the heat dissipation frame. Microchannels are provided at both the heat dissipation frame and the connecting frame. The water-cooling mechanism includes water-cooled heat pipes distributed between adjacent heat dissipation frames. Chamfered surfaces are formed on the periphery of the water-cooled heat pipes, with gaps between the sidewalls of the chamfered surfaces and the adjacent heat dissipation frames. An upper pipe, an extension pipe, and a lower pipe are connected to the water-cooled heat pipes, and a connecting box is fixedly connected to the lower end of the water-cooled heat pipes. The beneficial effect of this application is that by protecting the industrial camera by mounting it in the heat dissipation housing, and by simultaneously cooling the industrial camera portion mounted inside the heat dissipation housing through water cooling and air cooling, while the air cooling also dissipates heat from the coolant, the heat dissipation effect on the industrial camera is effectively improved.

Description

Technical Field

[0001] This application relates to the field of industrial camera housing technology, and more specifically, to an industrial camera housing with optimized heat dissipation. Background Technology

[0002] Industrial cameras are a key component of machine vision systems. Their most fundamental function is to convert light signals into ordered electrical signals. As the precision of machine vision increases to the micrometer level, the power consumption density of CMOS sensors is also gradually increasing, leading to higher heat dissipation efficiency. Traditional aluminum alloy housings cannot meet the growing heat dissipation requirements. According to publication number CN220252365U, an industrial camera housing with excellent heat dissipation performance is disclosed. This housing includes a housing body, a light-blocking plate fixedly mounted on the surface of the housing body, a fixing block fixedly mounted on the back of the housing body, a cover plate slidably connected to the surface of the fixing block, and bolts slidably connected to the surface of the cover plate, achieving better heat dissipation. In terms of thermal performance, when the motor is started during use, it drives the rotating rod to rotate on the fixed plate, while the fan blades rotate between the support plate and the support rod. This allows the heat generated by the industrial camera to be blown out of the casing through the heat dissipation vents. This avoids the problem of traditional industrial cameras using a composite heat exchange method, where heat is dissipated by attaching lightweight, easily processed metals with good thermal conductivity to the heat-generating surface. However, during use, air cooling does not fully utilize the effective heat dissipation area of ​​the industrial camera and is accompanied by obvious gas backflow, leading to heat accumulation and increased internal camera temperature. As a result, the safety of camera use cannot be guaranteed.

[0003] Therefore, an industrial camera housing with optimized heat dissipation is needed to solve the above problems. Utility Model Content

[0004] The summary section of this application is intended to provide a brief overview of the concepts, which will be described in detail in the detailed description section below. This summary section is not intended to identify key or essential features of the claimed technical solutions, nor is it intended to limit the scope of the claimed technical solutions.

[0005] To address the technical problems mentioned in the background section, some embodiments of this application provide an industrial camera housing with optimized heat dissipation, comprising: a heat dissipation housing, an industrial camera mounted on the heat dissipation housing, a heat sink connected to the upper end of the heat dissipation housing via a threaded component, four circumferentially distributed heat dissipation brackets attached to the end face of the industrial camera located inside the heat dissipation housing, two vertically symmetrically distributed connecting brackets provided at the interval between the three heat dissipation brackets on the right side, the heat dissipation brackets and the connecting brackets being fixed inside the heat dissipation housing, the heat dissipation brackets and the connecting brackets each including a heat-conducting plate abutting against the end face of the industrial camera and heat dissipation fins evenly distributed in the front-back direction, microchannels provided on the heat dissipation fins at the three heat dissipation brackets and the two connecting brackets, the microchannels between the heat dissipation brackets and the connecting brackets being interconnected, and a water-cooling mechanism provided between the heat dissipation brackets and the connecting brackets;

[0006] Furthermore, the water-cooling mechanism includes water-cooled heat pipes disposed between two adjacent heat sinks. The water-cooled heat pipes are arranged around the periphery of the four heat sinks, and the inner end of the water-cooled heat pipes can fit against the heat sinks. The outer end of the water-cooled heat pipes has a chamfered surface, and there is a gap between the end face of the chamfered surface and the two adjacent heat sinks. There is a gap between the two adjacent water-cooled heat pipes, and the width of the gap is the same as the thickness of the heat sink fins. A connecting box is fixed at the lower end of each water-cooled heat pipe. A cooling cavity is opened in the connecting box and the water-cooled heat pipe, and the cavity is filled with a working fluid (common working fluids include water and other low-boiling-point liquids). The left end of each water-cooled heat pipe is connected to an upper pipe and a lower pipe that are distributed vertically. An extension pipe is connected between the upper pipe and the lower pipe. The extension pipe extends and bends horizontally inside the heat sink housing.

[0007] Furthermore, the water-cooling mechanism also includes a cooling semiconductor fixed inside the heat dissipation shell. The lower end face of the cooling semiconductor is in contact with the upper end of the heat dissipation frame and the water-cooling heat pipe. The upper end face of the cooling semiconductor is provided with thermally conductive silicone and a heat dissipation plate. The heat dissipation plate can extend upward through the cavity to exchange heat with the heat dissipation fins.

[0008] Furthermore, the heat dissipation housing has an installation cavity, a heat dissipation cavity is connected to the right side of the installation cavity, a connecting cavity is connected to the upper side of the installation cavity, a cold air cavity is connected to the upper end of the connecting cavity, an exhaust cavity is connected to the left side of the heat dissipation cavity, the exhaust cavity is located above the cold air cavity, and a connecting groove is connected between the heat dissipation cavity, the exhaust cavity and the cold air cavity, and a connecting hole is connected between the cold air cavity and the heat dissipation cavity. The lower tube is inserted into the connecting hole, and the upper tube is inserted into the connecting groove.

[0009] Furthermore, a detachable dust filter plate and a fixing plate are fixedly provided at the rear end of the heat dissipation shell and at the mounting cavity and the cold air cavity. A dust removal ventilation port is provided on the left side of the dust filter plate at the mounting cavity, and an exhaust port communicating with the exhaust cavity is provided on the right side of the heat dissipation shell. A strip-shaped dust filter plate is installed at the exhaust port, and a dust removal ventilation port is provided at the dust filter plate at the exhaust port.

[0010] Furthermore, a fan is connected and installed inside the mounting cavity. The fan is installed between the dust filter vent and the cold air cavity. An upper baffle and a lower baffle are fixed inside the exhaust cavity. The upper baffle extends in three directions, and there is a gap between the left and right extensions of the upper baffle and the side wall of the exhaust cavity. The lower extension of the upper baffle is fixedly located near the heat dissipation cavity. The lower baffle extends in two directions, and the upper end of the lower baffle is fixedly connected to the upper side wall of the exhaust cavity. There is a gap between the left end of the lower baffle and the upper baffle and the lower side wall of the exhaust cavity. The heat dissipation plate extends upward and is inserted into the exhaust cavity, located at the lower end of the lower baffle. The heat dissipation fins are installed on the upper part of the exhaust cavity.

[0011] The beneficial effects of this application are as follows:

[0012] 1. By protecting the industrial camera by mounting it in a heat dissipation housing, the industrial camera part (heat-generating main body) installed in the heat dissipation housing is cooled down by both water cooling and air cooling. At the same time, air cooling can also dissipate heat from the coolant, thereby effectively improving the heat dissipation effect of the industrial camera.

[0013] 2. The cooling fins are cooled by both the coolant and air cooling. In addition, the energized refrigeration semiconductor absorbs the heat dissipated from the connector and the water-cooled heat pipe, causing the evaporated coolant to condense and flow back into the water-cooled heat pipe, thus cooling the coolant and further improving the heat dissipation effect of the industrial camera, thereby extending the service life of the industrial camera.

[0014] 3. By using a cooling semiconductor to reduce the heat of the heat sink and the upper part of the water-cooled heat pipe, the heat dissipation becomes more uniform, reducing the internal temperature difference and creating a lower temperature working environment around the industrial camera. This maintains the working state of the industrial camera. The upper and lower baffles guide the airflow, and after the heat sink reduces the temperature of the airflow, it continues to dissipate heat on the heat sink plate. Attached Figure Description

[0015] The accompanying drawings, which form part of this application, are used to provide a further understanding of the application and to make other features, objects, and advantages of the application more apparent. The illustrative embodiments and descriptions of this application are used to explain the application and do not constitute an undue limitation of the application.

[0016] Furthermore, throughout the accompanying drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the elements are not necessarily drawn to scale.

[0017] In the attached diagram:

[0018] Figure 1 This is an overall schematic diagram of an embodiment of an industrial camera housing with optimized heat dissipation according to this application;

[0019] Figure 2 This is an overall schematic diagram of an embodiment of an industrial camera housing with optimized heat dissipation according to this application;

[0020] Figure 3 yes Figure 1 A schematic diagram showing the appearance after removing the heatsink and heat sink casing;

[0021] Figure 4 yes Figure 3 A schematic diagram showing the exterior appearance after removing the connecting box section;

[0022] Figure 5 yes Figure 4 A schematic diagram showing the appearance after the connecting box section has been removed;

[0023] Figure 6 yes Figure 4 A magnified view of a portion of the upper and lower connecting frames;

[0024] Figure 7 yes Figure 1 A half-section diagram of the embodiment after removing the industrial camera;

[0025] Figure 8 yes Figure 7 A cross-sectional view of AA in the embodiment.

[0026] Figure label:

[0027] 10. Heat dissipation shell; 11. Industrial camera; 12. Heat sink; 13. Heat dissipation frame; 14. Connecting frame; 15. Water cooling mechanism; 16. Fan; 17. Dust filter plate; 18. Fixing plate; 20. Connecting box; 21. Water-cooled heat pipe; 22. Spacing; 23. Chamfered surface; 24. Upper pipe; 25. Extension pipe; 26. Lower pipe; 27. Refrigeration semiconductor; 28. Heat dissipation plate; 30. Mounting cavity; 31. Cold air cavity; 32. Connecting cavity; 33. Heat dissipation cavity; 34. Connecting slot; 35. Exhaust cavity; 36. Connecting hole; 40. Upper baffle; 41. Lower baffle. Detailed Implementation

[0028] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.

[0029] It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other.

[0030] It should be noted that the concepts of "first" and "second" mentioned in this disclosure are used only to distinguish different devices, modules or units, and are not used to limit the order of functions performed by these devices, modules or units or their interdependencies.

[0031] It should be noted that the terms "a" and "a plurality of" used in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0032] This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0033] Reference Figure 1-6 An optimized heat dissipation industrial camera housing includes: a heat dissipation housing 10, an industrial camera 11 mounted on the heat dissipation housing 10, a heat sink 12 connected to the upper end of the heat dissipation housing 10 via a threaded connection, and four circumferentially distributed heat sink brackets 13 attached to the end face of the industrial camera 11 located inside the heat dissipation housing 10, located on the right side (within the left side). Figure 1 Two symmetrically distributed connecting frames 14 are provided between the three heat dissipation frames 13 (marked as left at the heat dissipation housing 10 and right at the industrial camera 11). Both the heat dissipation frames 13 and the connecting frames 14 are fixed inside the heat dissipation housing 10. Both the heat dissipation frames 13 and the connecting frames 14 include a heat-conducting plate that abuts against the end face of the industrial camera 11 and heat dissipation fins that are evenly distributed in the front-back direction. Microchannels are provided on the heat dissipation fins at the three heat dissipation frames 13 and the two connecting frames 14. The microchannels between the heat dissipation frames 13 and the connecting frames 14 are interconnected. A water cooling mechanism 15 is provided between the heat dissipation frames 13 and the connecting frames 14.

[0034] The water-cooling mechanism 15 includes water-cooled heat pipes 21 disposed between two adjacent heat sinks 13. The water-cooled heat pipes 21 are arranged around the outer perimeter of the four heat sinks 13, and the inner end of the water-cooled heat pipes 21 can fit in contact with the heat sinks 13. The outer end of the water-cooled heat pipes 21 is provided with a chamfered surface 23. There is a gap between the end face of the chamfered surface 23 and the two adjacent heat sinks 13. There is a gap 22 between the two adjacent water-cooled heat pipes 21. The width of the gap 22 is the same as the thickness of the heat sink fins of the heat sink 13. A connecting box 20 is fixed at the lower end of each water-cooled heat pipe 21. The connecting box 20 and the water-cooled heat pipe 21 have a cooling cavity filled with a working fluid (common working fluids include water and other low-boiling-point liquids). The left end of each water-cooled heat pipe 21 is connected to an upper pipe 24 and a lower pipe 26 distributed vertically. An extension pipe 25 is connected between the upper pipe 24 and the lower pipe 26. The extension pipe 25 extends and bends horizontally and is disposed in the heat sink shell 10.

[0035] Reference Figure 5 The water cooling mechanism 15 also includes a cooling semiconductor 27 fixed in the heat dissipation shell 10. The lower end of the cooling semiconductor 27 is in contact with the upper end of the heat sink 13 and the water cooling heat pipe 21. The upper end of the cooling semiconductor 27 is provided with thermally conductive silicone and a heat sink 28. The heat sink 28 can extend upward and exchange heat with the heat sink 12 through the cavity. The cooling semiconductor 27 and the heat sink 28 absorb the heat at the upper end, thereby causing the evaporated gas at the upper end to condense quickly.

[0036] Reference Figure 7-8 The heat dissipation housing 10 has an installation cavity 30. A heat dissipation cavity 33 is connected to the right side of the installation cavity 30. A connecting cavity 32 is connected to the upper side of the installation cavity 30. A cold air cavity 31 is connected to the upper end of the connecting cavity 32. An exhaust cavity 35 is connected to the left side of the heat dissipation cavity 33. The exhaust cavity 35 is located above the cold air cavity 31. A connecting groove 34 is connected between the heat dissipation cavity 33, the exhaust cavity 35 and the cold air cavity 31. A connecting hole 36 is connected between the cold air cavity 31 and the heat dissipation cavity 33. A lower tube 26 is inserted into the connecting hole 36. An upper tube 24 is inserted into the connecting groove 34. The side wall of the lower tube 26 is inserted and fitted with the lower tube 26 to achieve a seal. The connecting groove 34 is opened at the front and rear to fit the upper tube 24 so as to achieve air circulation.

[0037] A detachable dust filter plate 17 and a fixing plate 18 are fixedly installed at the rear end of the heat dissipation shell 10 and at the mounting cavity 30 and the cold air cavity 31. A dust removal vent is provided on the left side of the dust filter plate 17 at the mounting cavity 30, and an exhaust vent communicating with the exhaust cavity 35 is provided on the right side of the heat dissipation shell 10. A strip-shaped dust filter plate 17 is installed at the exhaust vent, and a dust removal vent is provided at the dust filter plate 17 at the exhaust vent. Dust removal is achieved by installing a filter screen at the vent position.

[0038] Reference Figure 7-8A fan 16 is installed in the mounting cavity 30 and the cold air cavity 31. The fan 16 in the mounting cavity 30 blows air vertically to the right, and the fan 16 in the cold air cavity 31 blows air upward at an angle, with the airflow direction towards the 34. The fan 16 is installed between the vent of the dust filter plate 17 and the cold air cavity 31. An upper baffle 40 and a lower baffle 41 are fixedly installed in the exhaust cavity 35. The upper baffle 40 extends in three directions, and there is a gap between the left and right extensions of the upper baffle 40 and the side wall of the exhaust cavity 35. The lower extension of the upper baffle 40 is fixedly located near the heat dissipation cavity 33. The lower baffle 41 extends in two directions, and the upper end of the lower baffle 41 is fixedly connected to the upper side wall of the exhaust cavity 35. There is a gap between the left end of the lower baffle 41 and the upper baffle 40 and the lower side wall of the exhaust cavity 35. The heat dissipation plate 28 extends upward and is inserted into the exhaust cavity 35, located at the lower end of the lower baffle 41. The heat dissipation fin 12 is installed on the upper part of the exhaust cavity 35.

[0039] Working process or usage method:

[0040] 1. Install the industrial camera 11 inside the heat dissipation housing 10, and insert the power cord and data cable into the rear end of the industrial camera 11 to put the industrial camera 11 into working condition.

[0041] 2. During use, the heat sink 13 and connecting bracket 14 attached to the outer end of the industrial camera 11 absorb heat and transfer the heat generated by the industrial camera 11 to the heat sink fins of the heat sink 13 and connecting bracket 14. The water cooling mechanism 15 absorbs the heat from the heat sink 13 and connecting bracket 14 and transfers the heat to the coolant in the connecting box 20, causing the coolant to evaporate and absorb heat. The steam generated during the heat absorption process rises with the heat and can be absorbed by the cooling semiconductor 27 located above. The cooling semiconductor 27 operates with its lower end as the heat absorption surface and its upper end as the heat release surface. The heat release surface dissipates heat to the exhaust chamber 35 through its contact with the heat sink 28, thus achieving the heat dissipation effect for the industrial camera 11.

[0042] 3. The fan 16 operates, with the left end of the fan 16 being the suction end and the right end of the fan 16 being the blowing end. The suction end is set at the air vent of the dust filter plate 17 on the mounting cavity 30 to draw in external air. The dust filter plate 17 filters the dust. The right end of the fan 16 delivers air to the cold air cavity 31 and the heat dissipation cavity 33. The flow of air enhances air convection and achieves heat dissipation.

[0043] For example, air flows to the heat dissipation cavity 33, and the air flows in the heat dissipation cavity 33 through the microchannel opened at the lower end of the heat dissipation frame 13 and the gap between the heat dissipation frame 13 and the chamfered surface 23. The heat dissipation frame 13 transmits the gas to the top of the industrial camera 11 through two connecting frames 14, and heat dissipation is carried out on the connecting frames 14 during this period. Another part of the gas flows through the gap between the heat dissipation frame 13 and the chamfered surface 23 to achieve heat dissipation. The heat dissipation surface is increased by the curved extension tube 25, and coolant and steam are present in the extension tube 25 at the same time.

[0044] For example, air flows upward to the cold air chamber 31, coolant flowing in through the water-cooled heat pipe 21 is installed in the lower pipe 26, and steam flowing in through the water-cooled heat pipe 21 is installed in the upper pipe 24. This allows the air to dissipate heat and exchange heat between the upper pipe 24, the extension pipe 25 and the lower pipe 26, and accelerates the condensation and reflux of steam in the upper pipe 24.

[0045] Finally, the two streams of gas enter the exhaust chamber 35 through the heat dissipation chamber 33 and the connecting groove 34. In the exhaust chamber 35, the gas is first guided by the upper baffle 40 to contact the heat sink 12 for heat dissipation. Then, under the guidance of the lower baffle 41, the gas contacts the heat sink 28 at the upper end of the cooling semiconductor 27 to achieve heat dissipation and is then discharged outward through the dust filter plate 17.

[0046] The above description is merely a selection of preferred embodiments of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in the embodiments of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in the embodiments of this disclosure.

Claims

1. An industrial camera housing with optimized heat dissipation, characterized in that, include: Heat sink casing (10), heat sink (12), heat sink bracket (13), connecting bracket (14), water cooling mechanism (15), and fan (16). An industrial camera (11) is installed inside the heat dissipation shell (10). A heat sink (12) is installed on the upper end of the heat dissipation shell (10). The heat dissipation frame (13) is attached to the end face of the industrial camera (11) on the outside. The connecting frame (14) is arranged above and below to connect the three heat dissipation frames (13). Microchannels are opened at both the heat dissipation frame (13) and the connecting frame (14). The water cooling mechanism (15) includes water cooling heat pipes (21) distributed between two adjacent heat sinks (13). The water cooling heat pipes (21) have chamfered surfaces (23) on their periphery. There is a gap between the side wall of the chamfered surfaces (23) and the two adjacent heat sinks (13). An upper pipe (24), an extension pipe (25) and a lower pipe (26) are connected to the water cooling heat pipes (21). A connecting box (20) is fixedly connected to the lower end of the water cooling heat pipes (21). The fan (16) is installed inside the heat dissipation housing (10) and is used to provide air cooling for the heat dissipation frame (13), the connecting frame (14), the upper tube (24), the extension tube (25) and the lower tube (26).

2. The industrial camera housing with optimized heat dissipation according to claim 1, characterized in that: The heat dissipation housing (10) has an installation cavity (30) inside. The installation cavity (30) is connected to a heat dissipation cavity (33) and a cold air cavity (31). The upper end of the cold air cavity (31) and the heat dissipation cavity (33) is connected to an exhaust cavity (35). The installation cavity (30) is used to install the fan (16) and allow air to enter. The heat dissipation cavity (33) is used to install the industrial camera (11) and dissipate heat from the industrial camera (11).

3. The industrial camera housing with optimized heat dissipation according to claim 2, characterized in that: A connecting hole (36) is provided between the cold air cavity (31) and the heat dissipation cavity (33). The lower pipe (26) passes through and is fitted to the inner circumferential surface of the connecting hole (36). A connecting groove (34) is provided between the cold air cavity (31) and the exhaust cavity (35). The upper pipe (24) is disposed on the connecting groove (34).

4. The industrial camera housing with optimized heat dissipation according to claim 2, characterized in that: The water cooling mechanism (15) also includes a cooling semiconductor (27) attached to the connecting frame (14) and the water cooling heat pipe (21). The upper end surface of the cooling semiconductor (27) is attached to a heat sink (28), which extends upward and can be inserted into the exhaust chamber (35).

5. An industrial camera housing with optimized heat dissipation according to claim 4, characterized in that: An upper baffle (40) and a lower baffle (41) are fixed inside the exhaust chamber (35). The upper baffle (40) and the lower baffle (41) are used to guide the airflow to contact the heat sink (12) before contacting the heat sink (28). The lower end of the upper baffle (40) is fixed to the left and right ends of the exhaust chamber (35) with a gap. The upper end of the lower baffle (41) is fixed to the lower end of the upper baffle (40) and the exhaust chamber (35) with a gap. The upper end of the heat sink (28) is located below the lower baffle (41).

6. The industrial camera housing with optimized heat dissipation according to claim 1, characterized in that: The water-cooled heat pipe (21) surrounds the outer end portion of the industrial camera (11), and a gap (22) is provided between two adjacent water-cooled heat pipes (21). The width of the gap (22) is consistent with the thickness of a single heat dissipation fin of the heat sink (13).

7. An industrial camera housing with optimized heat dissipation according to claim 2, characterized in that: A removable dust filter plate (17) is installed at the rear end of the heat dissipation shell (10) and at the mounting cavity (30). A vent is provided at the dust filter plate (17) and the vent is located at the air extraction end of the fan (16).

8. An industrial camera housing with optimized heat dissipation according to claim 2, characterized in that: A connecting box (20) is fixedly provided at the lower end of the water-cooled heat pipe (21). A cooling chamber is provided at the connecting box (20) and the water-cooled heat pipe (21). The cooling chamber is filled with coolant. The upper pipe (24) and the lower pipe (26) are located at the upper and lower ends of the water-cooled heat pipe (21) respectively. The extension pipe (25) is bent and installed in the cold air cavity (31).

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