Temperature-controlled integrated laser chip
By installing a temperature sensing chip and an anti-static chip in the laser chip, and connecting the heating resistor and the pad electrode through a surface metallization process, the problem of precise temperature control of the laser chip in a small system is solved, achieving high integration and high-stability laser output, which is suitable for the field of quantum detection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN PAIKE PHOTOELECTRIC TECH CO LTD
- Filing Date
- 2025-07-09
- Publication Date
- 2026-06-02
AI Technical Summary
Existing technologies struggle to achieve precise temperature control of laser chips in small systems, resulting in larger sizes that cannot meet the demands of quantum detection and quantum sensing technologies for narrow-line lasers in the MHz or even kHz range.
By installing a temperature sensing chip, a laser chip, and an anti-static chip in the middle of the laser chip, and connecting the heating resistor and the pad electrode through a surface metallization process, precise temperature control can be achieved. This method has high integration and occupies little space.
It achieves high integration and small footprint in laser chips, and can output highly stable lasers at the MHz or even kHz level, making it suitable for quantum detection scenarios.
Smart Images

Figure CN224318907U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of laser chips, and in particular to a temperature-controlled integrated laser chip. Background Technology
[0002] A laser chip is an integrated circuit based on silicon photonics technology, which mainly utilizes the optical properties of silicon materials to achieve the transmission and processing of optical signals. Its functions are focused on the fields of optical communication and optical computing, and it possesses technological advantages such as high integration, low cost, and large transmission bandwidth.
[0003] With the development of quantum detection and quantum sensing technologies, the demand for narrow-line lasers in the MHz or even kHz range is increasing in quantum solutions. To obtain ultra-narrow-line laser output, the current conventional approach is to use TEC and thermistors to precisely control the temperature of the laser chip. However, this approach cannot be compressed into small systems, resulting in a large size. Utility Model Content
[0004] Purpose of the invention: The purpose of this utility model is to provide a temperature-controlled integrated laser chip.
[0005] Technical solution: Includes a main body, with an upper heating wire fixedly installed on the top of the main body and a lower heating wire fixedly installed on the bottom of the main body. A temperature measuring chip, a laser chip, and an anti-static chip are installed on the top of the middle part of the main body. The main body is square and has multiple motor power supply areas. The temperature measuring chip, laser chip, and anti-static chip have their functional electrodes led to the bottom pads through surface circuits. The upper and lower heating wires are grown on the surface of the overall chip through a surface metallization process.
[0006] By adopting the above technical solution, a temperature measuring chip, a laser chip, and an anti-static chip are installed on the top surface in the middle of the body. The temperature measuring chip can monitor the temperature of the body. By supplying power to the bottom pad electrodes, the temperature measuring chip, laser chip, and anti-static chip can be driven. This solution has high integration and occupies little space.
[0007] Optionally, a heating resistor A end, a heating resistor B end, a temperature sensing chip A end, a laser anode and a laser cathode plus a temperature sensing chip B end are installed on one end of the bottom surface of the main body. The heating resistor A end, the heating resistor B end, the temperature sensing chip A end, the laser anode and the laser cathode plus a temperature sensing chip B end are all made by surface metallization process.
[0008] By adopting the above technical solution, the heating resistor A end and the heating resistor B end are used to connect the electric heating wire, the temperature measuring chip A end and the laser cathode plus temperature measuring chip B end are used to connect the temperature measuring chip, and the laser anode and the laser cathode plus temperature measuring chip B end are used to connect the laser chip.
[0009] Optionally, a connecting piece 1 is connected to the outer end of the temperature sensing chip, and the outer side of the connecting piece 1 is coated with an insulating layer.
[0010] By adopting the above technical solution, the connecting piece 1 is used to connect the temperature measuring chip and the circuit.
[0011] Optionally, a second connecting piece is connected to the outer end of the laser chip, and the outer side of the second connecting piece is coated with an insulating layer.
[0012] By adopting the above technical solution, the connecting piece 2 is used to connect the laser chip and the circuit.
[0013] Optionally, the outer end of the anti-static chip is connected to a connecting piece three, and the outer side of the connecting piece three is coated with an insulating layer.
[0014] By adopting the above technical solution, the connecting piece three is used to connect the anti-static chip and the circuit.
[0015] Optionally, the heating resistor A and heating resistor B are connected to the upper heating wire and the lower heating wire, which are connected by soldering.
[0016] By adopting the above technical solution, the upper heating wire and the lower heating wire work to heat the laser module.
[0017] Optionally, the A end of the temperature sensing chip is connected to the connecting piece 1, and the two are connected by soldering.
[0018] By adopting the above technical solution, the A end of the temperature measuring chip is used for circuit connection.
[0019] Optionally, the laser anode is connected to the connecting piece 2 by soldering.
[0020] By adopting the above technical solution, the laser anode is used for circuit connection.
[0021] Beneficial effects: This utility model has a temperature measuring chip, a laser chip and an anti-static chip installed on the top surface of the middle part of the body. The temperature measuring chip can monitor the temperature of the body. By supplying power to the bottom pad electrodes, the temperature measuring chip, laser chip and anti-static chip can be driven. This solution has high integration and occupies little space. Attached Figure Description
[0022] Figure 1 This is a top structural diagram of an embodiment of the present utility model;
[0023] Figure 2 This is a side view of an embodiment of the present utility model;
[0024] Figure 3 This is a bottom structural diagram of an embodiment of the present utility model;
[0025] Explanation of reference numerals in the attached diagram: 1. Main body; 2. Upper heating wire; 3. Temperature sensing chip; 4. Laser chip; 5. Antistatic chip; 6. Connecting piece one; 7. Connecting piece two; 8. Connecting piece three; 9. Lower heating wire; 10. Heating resistor A end; 11. Heating resistor B end; 12. Temperature sensing chip A end; 13. Laser anode; 14. Laser cathode plus temperature sensing chip B end. Detailed Implementation
[0026] To make the technical solution of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments, such as... Figures 1 to 3 The device includes a main body 1, with an upper heating wire 2 fixedly installed on the top and a lower heating wire 9 fixedly installed on the bottom. A temperature measuring chip 3, a laser chip 4, and an anti-static chip 5 are installed on the top surface of the middle part of the main body 1. The main body 1 is provided with multiple motor power supply areas. The temperature measuring chip 3, laser chip 4, and anti-static chip 5 are installed on the top surface of the middle part of the main body 1. The temperature measuring chip 3 can monitor the temperature of the main body 1. By supplying power to the bottom pad electrodes, the temperature measuring chip 3, laser chip 4, and anti-static chip 5 can be driven. This solution has high integration and occupies little space.
[0027] The bottom surface of the main body 1 is equipped with a heating resistor A end 10, a heating resistor B end 11, a temperature measuring chip A end 12, a laser anode 13, and a laser cathode plus temperature measuring chip B end 14. The heating resistor A end 10 and the heating resistor B end 11 are used for the connection of the electric heating wire. The temperature measuring chip A end 12 and the laser cathode plus temperature measuring chip B end 14 are used for the connection of the temperature measuring chip 3. The laser anode 13 and the laser cathode plus temperature measuring chip B end 14 are used for the connection of the laser chip.
[0028] The temperature sensing chip 3 is connected to a connecting piece 6 at its external end. The connecting piece 6 is used to connect the temperature sensing chip 3 and the circuit.
[0029] The laser chip 4 is connected to a connecting piece 2 7 at its external end. The connecting piece 2 7 is used to connect the laser chip 4 and the circuit.
[0030] The external end of the antistatic chip 5 is connected to a connecting piece 3 8, which is used to connect the antistatic chip 5 and the circuit.
[0031] Heating resistor A terminal 10 and heating resistor B terminal 11 are connected to upper heating wire 2 and lower heating wire 9. Upper heating wire 2 and lower heating wire 9 are used to heat the laser module.
[0032] The temperature sensing chip A terminal 12 is connected to the connecting piece 6, and the temperature sensing chip A terminal 12 is used for circuit connection.
[0033] The laser anode 13 is connected to the connecting piece 7, and the laser anode 13 is used for circuit connection.
[0034] The implementation principle of a temperature-controlled integrated laser chip in this application embodiment is as follows: When the temperature-controlled integrated laser chip is in use, if the heating resistor A terminal 10 and B terminal 10 are connected to a current source, the upper heating wire 2 and lower heating wire 9 will heat the entire chip according to the current magnitude. If the resistance value of the temperature sensing chip A terminal 10 and B terminal 11 is tested, the operating temperature of the entire chip can be calculated based on the obtained resistance value. When the laser anode 13 and photocathode are connected to the temperature sensing chip B terminal 14, a constant current drive is applied, and the laser will emit laser light. In actual operation, the power of the heating chip can be adjusted according to the temperature value fed back by the temperature sensing chip through an external circuit to stabilize the temperature to the level of one-hundredth of a °C. Thus, when driving the laser chip, a high-stability laser output at the MHz or even kHz level can be obtained. This level of laser output can be used in quantum detection scenarios. This chip can be designed to the sub-mm level. In this embodiment, the integrated chip size is 4mm*4mm*0.3mm. The advantage of small size and high-level technology can further expand the application of laser in the field of quantum detection.
[0035] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.
Claims
1. A temperature-controlled integrated laser chip, characterized in that: Includes a body (1), on the top of which an upper heating wire (2) is fixedly installed, and on the bottom of which a lower heating wire (9) is fixedly installed. A temperature measuring chip (3), a laser chip (4) and an anti-static chip (5) are installed on the top surface of the middle part of the body (1). The body (1) is provided with multiple motor power supply areas.
2. The temperature-controlled integrated laser chip according to claim 1, characterized in that: The bottom surface of the main body (1) is equipped with a heating resistor A end (10), a heating resistor B end (11), a temperature measuring chip A end (12), a laser anode (13), and a laser cathode plus a temperature measuring chip B end (14).
3. The temperature-controlled integrated laser chip according to claim 1, characterized in that: The temperature measuring chip (3) is connected to a connecting piece (6) at its outer end.
4. The temperature-controlled integrated laser chip according to claim 2, characterized in that: The laser chip (4) is connected to a connecting piece 2 (7) at its outer end.
5. The temperature-controlled integrated laser chip according to claim 2, characterized in that: The antistatic chip (5) is connected to a connecting piece three (8) at its outer end.
6. The temperature-controlled integrated laser chip according to claim 2, characterized in that: The heating resistor A end (10) and heating resistor B end (11) are connected to the upper heating wire (2) and the lower heating wire (9).
7. The temperature-controlled integrated laser chip according to claim 3, characterized in that: The temperature measuring chip A end (12) is connected to the connecting piece (6).
8. A temperature-controlled integrated laser chip according to claim 4, characterized in that: The laser anode (13) is connected to the connecting piece 2 (7).