A circuit board with high-efficiency heat dissipation function

Abstract

This invention proposes a circuit board with high-efficiency heat dissipation, comprising a board body and a chip. The chip is installed at the center of the bottom surface of the board body, and several components are installed on the bottom surface of the board body. The board body consists of three layers: upper, middle, and lower. A port group is fixedly connected to the top edge of the board body. The advantages of this invention are: through-holes are opened at the heat-generating points of the board body, and a copper heat sink is built in. The bottom opening of the heat sink has annularly distributed heat-conducting feet close to the heat-generating area of ​​the components, and the top opening connects to a heat sink plate and a heat sink fin, forming a vertical heat dissipation path. Thermally conductive silicone pads are filled between the heat sink cylinder and the inner wall of the through-holes to enhance the heat conduction efficiency from the components → heat-conducting feet → heat sink cylinder → heat sink plate. The heat sink fins are distributed along the heat sink plate to expand the heat dissipation area and achieve rapid heat dissipation to the environment. This design, through the combination of internal thermally conductive through-holes and external heat sink fins, improves the heat dissipation efficiency by more than 40% compared with traditional circuit boards, and has a compact structure, making it suitable for high-density electronic devices.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board with efficient heat dissipation function. Background Technology

[0002] Traditional circuit boards rely heavily on external heat sinks or fans for heat dissipation, which suffers from problems such as large space occupation, long heat dissipation paths, and low efficiency. Especially for high-power chips and densely distributed heat-generating components, heat can easily accumulate, leading to performance degradation or even damage. While using metal substrates can improve thermal conductivity in existing technologies, it is still difficult to achieve rapid heat conduction from components to heat sinks. Therefore, there is an urgent need for an integrated heat dissipation structure that optimizes internal heat conduction paths to improve heat dissipation performance. Utility Model Content

[0003] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0004] Therefore, one objective of this utility model is to provide a circuit board with efficient heat dissipation function to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.

[0005] To achieve the above objectives, one embodiment of the present invention provides a circuit board with efficient heat dissipation function, including a board body and a chip, wherein the chip is installed at the center of the bottom surface of the board body, and a plurality of components are installed on the bottom surface of the board body;

[0006] The plate consists of three layers: upper, middle, and lower. A port group is fixedly connected to the top edge of the plate.

[0007] Several pins are fixedly connected to the edge of the bottom surface of the plate.

[0008] Through holes are provided at several points on the plate. A heat dissipation cylinder is fixedly connected inside the through hole. The heat dissipation cylinder is hollow. Several heat-conducting feet are fixedly connected to the bottom opening of the heat dissipation cylinder. The heat-conducting feet are attached to the bottom surface of the plate.

[0009] A heat dissipation plate is fixedly connected to the top opening of the heat dissipation cylinder, and several heat dissipation fins are fixedly connected to the top surface of the heat dissipation plate.

[0010] Preferably, in any of the above embodiments, the middle layer of the plate is an aluminum substrate, the upper and lower layers are epoxy resin insulating layers, and the three layers are bonded together by a hot-pressing process to form an integral structure.

[0011] The above technical solution employs a hot-pressing process to composite the board body with an upper epoxy resin insulating layer, a middle aluminum substrate, and a lower epoxy resin layer. The aluminum substrate provides a high thermal conductivity channel. Through-holes are created at the heat-generating points on the board, housing an internal copper heat sink. The bottom of the heat sink has annularly distributed thermally conductive feet close to the heat-generating area of ​​the components, while the top connects to a heat sink plate and heat fins, forming a vertical heat dissipation path. Thermally conductive silicone pads are filled between the heat sink and the inner wall of the through-holes to enhance the heat conduction efficiency from components → thermally conductive feet → heat sink → heat sink plate. The heat sink fins are distributed along the heat sink plate, expanding the heat dissipation area and enabling rapid heat dissipation to the environment. This design, through the combination of internal thermally conductive through-holes and external heat sink fins, improves heat dissipation efficiency by more than 40% compared to traditional circuit boards, and its compact structure makes it suitable for high-density electronic devices.

[0012] Preferably, in any of the above solutions, the pin is configured as multiple sets of symmetrically distributed elastic contacts, and the root of the pin is provided with an anti-disengagement buckle structure.

[0013] Each thermally conductive foot maintains a 0.2mm gap from the heat-generating area of ​​the component, with thermally conductive silicone pads filling the gaps to ensure efficient heat transfer to the heat sink. A long strip of aluminum heat sink is fixed to the top of the heat sink, with multiple parallel heat sink fins vertically welded to its top surface. The fins are aligned with the heat sink to form a directional airflow channel, improving convection cooling efficiency.

[0014] Preferably, in any of the above embodiments, the wall thickness of the heat sink is 0.5-1.2mm, it is made of copper material and has an anti-oxidation coating on its outer surface, and a thermally conductive silicone pad is filled between the heat sink and the inner wall of the through hole.

[0015] Preferably, in any of the above schemes, the number of heat-conducting feet is set to eight and distributed in a ring array, with the end of each heat-conducting foot maintaining a gap of 0.1-0.3 mm from the heat-generating area of ​​the component.

[0016] Preferably, in any of the above embodiments, the heat sink is a long strip of metal plate, and the orientation of the heat sink fins is the same as that of the heat sink.

[0017] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0018] This circuit board, featuring high-efficiency heat dissipation, utilizes a combination of vias, heat sinks, thermal leads, a heat sink plate, and heat sink fins. The board body is composited from an upper epoxy resin insulating layer, a middle aluminum substrate, and a lower epoxy resin layer via a hot-pressing process. The aluminum substrate provides a high thermal conductivity channel. Vias are created at heat-generating points on the board, housing an internal copper heat sink. The bottom opening of the heat sink has annularly distributed thermal leads close to the heat-generating areas of the components, while the top opening connects to the heat sink plate and heat sink fins, forming a vertical heat dissipation path. Thermally conductive silicone pads are filled between the heat sink and the inner wall of the vias to enhance the heat conduction efficiency from components → thermal leads → heat sink → heat sink plate. Heat sink fins are distributed along the heat sink plate, expanding the heat dissipation area and enabling rapid heat dissipation to the environment. This design, through the combination of internal thermally conductive vias and external heat sink fins, improves heat dissipation efficiency by more than 40% compared to traditional circuit boards, and its compact structure makes it suitable for high-density electronic devices.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a first-view structural schematic diagram of the present invention;

[0022] Figure 2 This utility model Figure 1 Enlarged structural diagram at point A;

[0023] Figure 3 This is a structural schematic diagram of the present invention from a second perspective;

[0024] Figure 4 This is a schematic diagram of the structure of the through hole in this utility model.

[0025] In the diagram: 1-Board body, 2-Chip, 3-Component, 4-Port group, 5-Pin, 6-Through hole, 7-Heat sink, 8-Heat conduction foot, 9-Heat sink plate, 10-Heat fin. Detailed Implementation

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0027] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] like Figure 1-4 As shown, this circuit board with high-efficiency heat dissipation function includes a board body 1 and a chip 2. The chip 2 is installed at the center of the bottom surface of the board body 1, and several components 3 are installed on the bottom surface of the board body 1.

[0029] The plate 1 consists of three layers: upper, middle and lower. A port group 4 is fixedly connected to the top edge of the plate 1.

[0030] Several pins 5 are fixedly connected to the edge of the bottom surface of the plate 1;

[0031] Through holes 6 are made at several points on the plate 1. A heat sink 7 is fixedly connected inside the through hole 6. The heat sink 7 is hollow. Several heat-conducting feet 8 are fixedly connected to the bottom opening of the heat sink 7. The heat-conducting feet 8 are attached to the bottom surface of the plate 1.

[0032] A heat sink 9 is fixedly connected to the top opening of the heat sink 7, and several heat sinks 10 are fixedly connected to the top surface of the heat sink 9.

[0033] Example 1: The middle layer of board 1 is an aluminum substrate, and the upper and lower layers are epoxy resin insulating layers. The three layers are bonded together by a hot-pressing process to form an integral structure. Board 1 is composed of an upper epoxy resin insulating layer, a middle aluminum substrate, and a lower epoxy resin layer bonded together by a hot-pressing process. The aluminum substrate provides a high thermal conductivity channel. Through-holes 6 are opened at the heat-generating points of board 1, and a copper heat sink 7 is built in. The bottom opening of the heat sink 7 has annularly distributed heat-conducting feet 8 close to the heat-generating area of ​​the component, and the top opening connects to the heat sink 9 and the heat sink 10, forming a vertical heat dissipation path. Thermally conductive silicone pads are filled between the heat sink 7 and the inner wall of the through-hole 6 to enhance the heat conduction efficiency from component 3 → heat-conducting feet 8 → heat sink 7 → heat sink 10. The heat sink 10 is distributed along the heat sink 9 to expand the heat dissipation area and achieve rapid heat dissipation to the environment. This design, through the combination of internal thermally conductive through-holes 6 and external heat sink 10, improves the heat dissipation efficiency by more than 40% compared with traditional circuit boards, and has a compact structure, making it suitable for high-density electronic devices.

[0034] Example 2: The pins 5 are configured as multiple symmetrically distributed elastic contacts, and the base of the pins 5 is equipped with an anti-disengagement latch structure. The wall thickness of the heat sink 7 is 0.5-1.2mm, made of copper material, and the outer surface is coated with an anti-oxidation layer. The space between the heat sink 7 and the inner wall of the through hole 6 is filled with a thermally conductive silicone pad. The number of thermally conductive feet 8 is set to eight and arranged in a ring array. The end of each thermally conductive foot 8 maintains a gap of 0.1-0.3mm from the heat-generating area of ​​the component 3. The heat sink 9 is a long strip of metal plate, and the orientation of the heat sink 10 is the same as that of the heat sink 9.

[0035] The working principle of this utility model is as follows:

[0036] The circuit board includes a board body 1, a chip 2, and components 3. The middle layer of the board body 1 is an aluminum substrate, and the upper and lower layers are epoxy resin insulating layers, which are formed into a whole by hot pressing. The chip 2 is installed in the center of the bottom surface of the board body 1, and the pins 5 are distributed along the edge. The base of the pins 5 is equipped with anti-disengagement clips, and they are symmetrical elastic contacts to enhance the stability of the insertion.

[0037] At the corresponding location of the heat-generating area of ​​component 3, a through hole 6 is formed in board 1, and a copper heat sink 7 with a wall thickness of 0.8mm is built in. The outer surface of the heat sink 7 is nickel-plated for oxidation resistance. Eight annular array heat-conducting feet 8 are welded to the bottom of the heat sink 7. Each heat-conducting foot 8 has a 0.2mm gap between its end and the heat-generating area of ​​component 3. The gap is filled with a thermally conductive silicone pad (not shown in the figure) to ensure efficient heat transfer to the heat sink 7. A long strip aluminum heat sink 9 is fixed to the top of the heat sink 7. Multiple parallel heat sinks 10 are vertically welded to the top surface of the heat sink 9. The heat sinks 10 are aligned with the heat sink 9 to form a directional airflow channel, improving the efficiency of convection heat dissipation.

[0038] Compared with the prior art, the present invention has the following advantages:

[0039] This circuit board with high-efficiency heat dissipation utilizes a combination of vias 6, heat sinks 7, thermally conductive feet 8, a heat sink plate 9, and heat sink 10. The board body 1 is composited from an upper epoxy resin insulating layer, a middle aluminum substrate, and a lower epoxy resin layer via a hot-pressing process. The aluminum substrate provides a high thermal conductivity channel. Vias 6 are created at the heat-generating points on the board body 1, housing a copper heat sink 7. The bottom opening of the heat sink 7 has annularly distributed thermally conductive feet 8 close to the heat-generating area of ​​the component, while the top opening connects to the heat sink plate 9 and heat sink 10, forming a vertical heat dissipation path. Thermally conductive silicone pads are filled between the heat sink 7 and the inner wall of the vias 6 to enhance the heat conduction efficiency from component 3 → thermally conductive feet 8 → heat sink 7 → heat sink plate 10. The heat sink 10 is distributed along the heat sink plate 9, expanding the heat dissipation area and enabling rapid heat dissipation to the environment. This design, through the combination of internal thermally conductive vias 6 and external heat sink 10, improves heat dissipation efficiency by more than 40% compared to traditional circuit boards, and its compact structure makes it suitable for high-density electronic devices.

Claims

1. A circuit board with high-efficiency heat dissipation function, characterized in that, It includes a board (1) and a chip (2). The chip (2) is installed at the center of the bottom surface of the board (1), and several components (3) are installed on the bottom surface of the board (1). The plate (1) consists of three layers: upper, middle and lower. A port group (4) is fixedly connected to the top edge of the plate (1); a number of pins (5) are fixedly connected to the bottom edge of the plate (1). Through holes (6) are provided at several points on the plate (1). A heat dissipation cylinder (7) is fixedly connected inside the through hole (6). The heat dissipation cylinder (7) is hollow. Several heat-conducting feet (8) are fixedly connected to the bottom opening of the heat dissipation cylinder (7). The heat-conducting feet (8) are attached to the bottom surface of the plate (1). The top opening of the heat sink (7) is fixedly connected to a heat sink plate (9), and the top surface of the heat sink plate (9) is fixedly connected to a plurality of heat sink fins (10).

2. The circuit board with high-efficiency heat dissipation function as described in claim 1, characterized in that: The middle layer of the plate (1) is an aluminum substrate, and the upper and lower layers are epoxy resin insulating layers. The three layers are composited by hot pressing to form an integral structure.

3. The circuit board with high-efficiency heat dissipation function as described in claim 2, characterized in that: The pin (5) is configured as multiple sets of symmetrically distributed elastic contact elements, and the root of the pin (5) is provided with an anti-disengagement buckle structure.

4. A circuit board with high-efficiency heat dissipation function as described in claim 3, characterized in that: The wall thickness of the heat sink (7) is 0.5-1.2mm. It is made of copper material and has an anti-oxidation coating on its outer surface. The heat sink (7) and the inner wall of the through hole (6) are filled with a thermally conductive silicone pad.

5. A circuit board with high-efficiency heat dissipation function as described in claim 4, characterized in that: The number of the heat-conducting feet (8) is set to eight and arranged in a ring array. The end of each heat-conducting foot (8) maintains a gap distance of 0.1-0.3 mm with the heat-generating area of ​​the element (3).

6. A circuit board with high-efficiency heat dissipation function as described in claim 5, characterized in that: The heat sink (9) is a long strip of metal plate, and the direction of the heat sink (10) is the same as that of the heat sink (9).

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