Etching system for a stepped circuit board

Abstract

This utility model discloses an etching system for a stepped circuit board, comprising a first LDI exposure device, a first developing device, a first etching device, a second LDI exposure device, a second developing device, a second etching device, and a control device arranged sequentially. The first etching device includes a first etching tank, a first conveyor belt passing through the first etching tank, a first driving device, and a first spray device. The second etching device includes a second etching tank, a second conveyor belt passing through the second etching tank, a second driving device, and a second spray device. The control device controls the upper spray pressure of the first spray device to be 2.5-3 bar and the upper spray pressure of the second spray device to be 1-1.5 bar. The conveying speed of the first conveyor belt is 0.5-0.6 m / min, and the conveying speed of the second conveyor belt is 1.1-1.3 m / min. The etching system for stepped circuit boards provided by this utility model is used to manufacture stepped circuit boards, which can shorten the process flow and achieve high manufacturing precision.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, specifically to an etching system for a stepped circuit board. Background Technology

[0002] As electronic devices evolve towards greater intelligence, precision, and standards, the demand for more sophisticated PCBs is increasing to support the control systems of these electronic products. Navigation and radar circuit boards, in particular, require higher power and current carrying capacity. With increased current carrying capacity and relatively fixed PCB module dimensions and thickness, the copper thickness must also increase accordingly. The varying copper thickness requirements for the circuitry and RF transmitting / receiving platform pads on navigation and radar circuit boards are essential for achieving the functionality of navigation and radar products, especially phased array radar products. Therefore, stepped copper thicknesses in different areas of the same surface are designed to meet these diverse functional requirements. Consequently, the demand for stepped copper thickness circuit boards with stepped grooves is growing.

[0003] Existing stepped copper manufacturing processes are generally achieved through multiple laminations or localized electroplating, which are complex and costly.

[0004] The purpose of this invention is to provide an etching system for fabricating stepped circuit boards using an etching process. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide an etching system for stepped circuit boards, which can shorten the process flow and achieve high manufacturing precision.

[0006] The technical solution of this utility model is as follows:

[0007] An etching system for a stepped circuit board includes a first LDI exposure device, a first developing device, a first etching device, a second LDI exposure device, a second developing device, a second etching device, and a control device arranged sequentially.

[0008] The first etching apparatus includes a first etching tank, a first conveyor belt passing through the first etching tank, a first driving device for driving the first conveyor belt, and a first spraying device. The first spraying device includes a first spraying pump connected to the first etching tank, a first upper spraying pipe and a first lower spraying pipe connected to the first spraying pump, a first pressure control valve and a second pressure control valve disposed on the first upper spraying pipe and the first lower spraying pipe, and a plurality of first nozzles disposed on the first upper spraying pipe and the first lower spraying pipe.

[0009] The second etching apparatus includes a second etching tank, a second conveyor belt passing through the second etching tank, a second drive device for driving the second conveyor belt, and a second spraying device. The second spraying device includes a second spraying pump connected to the second etching tank, a second upper spraying pipe and a second lower spraying pipe connected to the second spraying pump, a third pressure control valve and a fourth pressure control valve disposed on the second upper spraying pipe and the second lower spraying pipe, and a plurality of second nozzles disposed on the second upper spraying pipe and the second lower spraying pipe.

[0010] The control device is electrically connected to the first pressure control valve, the second pressure control valve, the third pressure control valve, and the fourth pressure control valve. The spray pressure of the first upper spray pipe is 2.5-3 bar, and the spray pressure of the first lower spray pipe is 2.5-3.5 kgf / cm². 2 The spray pressure of the second upper spray pipe is 1-1.5 bar, and the spray pressure of the second lower spray pipe is 1.0-2.0 kgf / cm².

[0011] The first driving device drives the first conveyor belt to a transmission speed of 1-3 m / min, and the second driving device drives the second conveyor belt to a transmission speed of 3-7 m / min.

[0012] Furthermore, the first nozzle includes a first connector connected to the first upper spray pipe or the first lower spray pipe, and a first nozzle connected to the first connector, wherein the first connector is a universal joint.

[0013] Furthermore, the second nozzle includes a second connector connected to the second upper spray pipe or the second lower spray pipe, and a second nozzle connected to the second connector, wherein the second connector is a universal joint.

[0014] Furthermore, the adjustable angle of the first or second nozzle is 30-90°.

[0015] Furthermore, the second etching apparatus also includes a wedge-shaped guide plate connected to the sidewall of the second etching tank, the wedge-shaped guide plate being located above the second conveyor belt.

[0016] Compared with the prior art, the etching system for stepped circuit boards provided by this utility model has the following advantages:

[0017] I. The etching system for the stepped circuit board provided by this utility model adopts a two-stage etching process. By adjusting the conveying speed and spraying pressure of the circuit board during the two etching stages, the stepped circuit board can be manufactured. The process is simple, and the copper thickness tolerance is controlled within 2μm, resulting in high manufacturing precision.

[0018] II. The etching system for stepped circuit boards provided by this utility model designs the nozzle with an adjustable angle structure. By adjusting the nozzle angle, the fluid distribution is optimized. Furthermore, by installing a wedge-shaped guide plate in the second etching area, the fluid is made to form turbulence, thereby improving the manufacturing accuracy of the stepped circuit board. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a diagram showing the connection relationships of the various devices in the etching system of the stepped circuit board of this utility model.

[0021] Figure 2 yes Figure 1 A schematic diagram of the structure of the first etching device in the etching system of the stepped circuit board shown.

[0022] Figure 3 yes Figure 1 A schematic diagram of the structure of the second etching device in the etching system of the stepped circuit board shown. Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solutions in the embodiments of this utility model, and to make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be further described below in conjunction with the accompanying drawings.

[0024] It should be noted that the descriptions of these embodiments are for the purpose of aiding understanding of the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0025] Please see Figure 1This diagram illustrates the positional relationship of the various devices in the etching system of the stepped circuit board of this invention. The etching system of the stepped circuit board of this invention includes, in sequence, a first LDI exposure device 1, a first developing device 2, a first etching device 3, a second LDI exposure device 4, a second developing device 5, a second etching device 6, and a control device (not shown). Specifically, the first LDI exposure device 1 is used to transfer the designed circuit pattern onto the circuit board by irradiating the photoresist with ultraviolet light and utilizing a photochemical reaction, thereby providing a precise pattern protection layer for subsequent etching; the first developing device 2 is used to develop the exposed areas requiring deep etching; the first etching device 3 is used to etch the areas requiring deep etching, removing a portion of the circuit pattern in those areas; the second LDI exposure device 4 is used to transfer the designed circuit pattern onto the circuit board by irradiating the photoresist with ultraviolet light and utilizing a photochemical reaction, thereby providing a precise pattern protection layer for subsequent etching; the second developing device 5 is used to develop the exposed areas requiring shallow etching; and the second etching device 6 is used to etch both the areas requiring deep etching and the areas requiring shallow etching. Furthermore, the first LDI exposure device 1 and the second LDI exposure device 4 are in a dust-free environment, allowing the exposure to be performed in a dust-free environment; the first developing device 2 and the first etching device 3 are connected by a conveyor belt, and the second developing device 5 and the second etching device 6 are connected by a conveyor belt.

[0026] In this invention, the structures of the first LDI exposure device 1, the first developing device 2, the second LDI exposure device 4, and the second developing device 5 are based on existing technology and will not be described in detail here. This invention mainly describes in detail the structures of the first etching device and the second etching device.

[0027] Please refer to the following: Figure 2 ,yes Figure 1 The diagram shows the structure of the first etching device in the etching system of the stepped circuit board. The first etching device 3 includes a first etching tank 31, a first conveyor belt 32 passing through both ends of the first etching tank 31, a first driving device (not shown) for driving the first conveyor belt 32, and a first spray device 34. The first spray device 34 includes a first spray pump 341 connected to the first etching tank 31, a first upper spray pipe 342 and a first lower spray pipe 343 connected to the first spray pump 341, a first pressure control valve 344 and a second pressure control valve 345 disposed on the first upper spray pipe 342 and the first lower spray pipe 343, and a plurality of first nozzles 346 disposed on the first upper spray pipe and the first lower spray pipe.

[0028] Please refer to the following: Figure 3 ,yes Figure 1The diagram shows a schematic of the second etching device in the etching system of the stepped circuit board. The second etching device 6 includes a second etching tank 61, a second conveyor belt 62 passing through both ends of the second etching tank 61, a second drive device (not shown) for driving the second conveyor belt 62, and a second spray device 64. The second spray device 64 includes a second spray pump 641 connected to the second etching tank 61, a second upper spray pipe 642 and a second lower spray pipe 643 connected to the second spray pump 641, a third pressure control valve 644 and a fourth pressure control valve 645 disposed on the second upper spray pipe and the second lower spray pipe, and a plurality of second nozzles 646 disposed on the second upper spray pipe and the second lower spray pipe.

[0029] In this invention, the first pressure control valve 344, the second pressure control valve 345, the third pressure control valve 644, and the fourth pressure control valve 645 are electrically connected to a control device. The control device controls the spray pressure of the first nozzle 346 and the second nozzle 646 to meet the process requirements of different etching stages. Specifically, the spray pressure of the first upper spray pipe 342 is 2.5-3 bar, and the spray pressure of the first lower spray pipe 343 is 2.5-3.5 kgf / cm³. 2 The spray pressure of the second upper spray pipe 642 is 1-1.5 bar, and the spray pressure of the second lower spray pipe 643 is 1.0-2.0 kgf / cm2.

[0030] Simultaneously, it is also necessary to control the conveying speeds of the first conveyor belt 32 and the second conveyor belt 62 to adapt the conveying speed of the circuit board to the spray pressure, thereby improving the etching accuracy of the circuit board. Specifically, the first and second driving devices are servo motors, which can precisely control the conveying speeds of the first conveyor belt 32 and the second conveyor belt 62, so that the circuit board stays for different durations in different etching areas. In this embodiment, the first driving device drives the first conveyor belt 32 at a conveying speed of 1-3 m / min, preferably 1.5 m / min; the second driving device drives the second conveyor belt 62 at a conveying speed of 3-7 m / min, preferably 5 m / min, that is, the circuit board stays for a longer time in the deep etching area and a shorter time in the shallow etching area.

[0031] In this embodiment, the nozzle tilt angles of the first etching device 3 and the second etching device 6 are adjustable to optimize the distribution of the liquid flow. The first nozzle 346 includes a first connector 3461 connected to the first upper spray pipe 342 / first lower spray pipe 343 and a first nozzle head 3462 connected to the first connector. The first connector 3461 is a universal joint to facilitate angle adjustment of the first nozzle head. Correspondingly, the second nozzle 646 includes a second connector 6461 connected to the second upper spray pipe 642 / second lower spray pipe 643 and a second nozzle head 6462 connected to the second connector. The second connector 6461 is a universal joint to facilitate angle adjustment of the second nozzle head. Specifically, the adjustable angles of the first nozzle head 3462 and the second nozzle head 6462 are 30-90°.

[0032] In this invention, the second etching device 6 further includes a wedge-shaped guide plate 65 connected to the side wall of the second etching tank 61, and the wedge-shaped guide plate is located above the second conveyor belt. The etching liquid sprayed from the second nozzle 646 flows through the wedge-shaped guide plate, causing the liquid flow to form turbulence. The purpose is to create physical barriers within the etching tank, change the local flow field, and make the copper ion content within the etching tank more uniform, resulting in a better etching effect. Preferably, there are multiple wedge-shaped guide plates, which are distributed at intervals.

[0033] The etching system for the stepped circuit board of this invention involves creating a full-board mask on the circuit board before etching. The pattern of the deep etching area is then exposed using a first LDI exposure device, followed by development using a first developing device. Next, the pattern is etched using a first etching device to remove a portion of the base copper in that area. Then, the pattern of the shallow etching area is exposed using a second LDI exposure device, followed by development using a second developing device. Finally, the pattern is etched using a second etching device, simultaneously etching the remaining base copper in the deep etching area and the shallow etching area, thus completing the etching process for the stepped circuit board.

[0034] The embodiments of this utility model have been described in detail above with reference to the accompanying drawings, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and spirit of this utility model still fall within the protection scope of this utility model.

Claims

1. An etching system for a stepped circuit board, characterized in that, It includes a first LDI exposure device, a first developing device, a first etching device, a second LDI exposure device, a second developing device, a second etching device, and a control device arranged sequentially. The first etching apparatus includes a first etching tank, a first conveyor belt passing through the first etching tank, a first driving device for driving the first conveyor belt, and a first spraying device. The first spraying device includes a first spraying pump connected to the first etching tank, a first upper spraying pipe and a first lower spraying pipe connected to the first spraying pump, a first pressure control valve and a second pressure control valve disposed on the first upper spraying pipe and the first lower spraying pipe, and a plurality of first nozzles disposed on the first upper spraying pipe and the first lower spraying pipe. The second etching apparatus includes a second etching tank, a second conveyor belt passing through the second etching tank, a second drive device for driving the second conveyor belt, and a second spraying device. The second spraying device includes a second spraying pump connected to the second etching tank, a second upper spraying pipe and a second lower spraying pipe connected to the second spraying pump, a third pressure control valve and a fourth pressure control valve disposed on the second upper spraying pipe and the second lower spraying pipe, and a plurality of second nozzles disposed on the second upper spraying pipe and the second lower spraying pipe. The control device is electrically connected to the first pressure control valve, the second pressure control valve, the third pressure control valve and the fourth pressure control valve. The spray pressure of the first upper spray pipe is 2.5-3 bar, the spray pressure of the first lower spray pipe is 2.5-3.5 kgf / cm², the spray pressure of the second upper spray pipe is 1-1.5 bar, and the spray pressure of the second lower spray pipe is 1.0-2.0 kgf / cm². The first driving device drives the first conveyor belt to a transmission speed of 1-3 m / min, and the second driving device drives the second conveyor belt to a transmission speed of 3-7 m / min.

2. The etching system for a stepped circuit board according to claim 1, characterized in that, The first nozzle includes a first connector connected to the first upper spray pipe or the first lower spray pipe, and a first nozzle connected to the first connector, wherein the first connector is a universal joint.

3. The etching system for stepped circuit boards according to claim 1, characterized in that, The second nozzle includes a second connector connected to the second upper spray pipe or the second lower spray pipe, and a second nozzle connected to the second connector, wherein the second connector is a universal joint.

4. The etching system for a stepped circuit board according to claim 2, characterized in that, The adjustable angle of the first nozzle is 30-90°.

5. The etching system for a stepped circuit board according to claim 3, characterized in that, The adjustable angle of the second nozzle is 30-90°.

6. The etching system for a stepped circuit board according to claim 1, characterized in that, The second etching apparatus further includes a wedge-shaped guide plate connected to the sidewall of the second etching tank, the wedge-shaped guide plate being located above the second conveyor belt.

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