A high-brightness LED chip packaging structure

Abstract

The utility model discloses a kind of high-brightness LED chip packaging structures, it is related to LED chip packaging technical field, including support and the LED chip of fixed crystal in support inside, the outside of the LED chip is provided with encapsulation colloid, the encapsulation colloid includes the first red phosphor layer attached in support inside by dispensing process, the LED chip is set above first red phosphor layer, and the top of LED chip is provided with second red phosphor layer, the top of the second red phosphor layer is covered with silicone isolation layer. The utility model can excite red phosphor to maximum extent by setting double-layer red phosphor layer, improve red light conversion efficiency, simultaneously, using silicone isolation layer to isolate red phosphor layer and yellow-green phosphor layer physically, can ensure that blue light is effectively penetrated, improve blue light utilization, make it be converted into white light sufficiently, and then can improve the luminous intensity of LED.

Description

Technical Field

[0001] This utility model relates to the field of LED chip packaging technology, and in particular to a high-brightness LED chip packaging structure. Background Technology

[0002] In LED lighting technology, traditional LED packaging commonly employs a dispensing process that mixes red phosphors with yellow-green phosphors. The light-emitting principle involves a blue LED chip exciting the red and yellow-green phosphors to produce red and green light, which are then mixed with blue light to generate white light. During this process, the red phosphor may be secondary-excited by the green light emitted from the yellow-green phosphor. While this increases spectral richness, it also leads to the absorption of blue light due to cross-excitation, preventing its effective conversion into white light. This reduces blue light utilization, affecting overall luminous efficiency and consequently causing luminous efficacy decay and color temperature shift. Utility Model Content

[0003] In view of the shortcomings of the prior art, the present invention provides a high-brightness LED chip packaging structure, which solves the technical problems mentioned in the background art.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a high-brightness LED chip packaging structure, including a bracket and an LED chip die-bonded inside the bracket, an encapsulating colloid is disposed on the outside of the LED chip, the encapsulating colloid includes a first red phosphor layer attached to the inside of the bracket by a dispensing process, the LED chip is disposed above the first red phosphor layer, and a second red phosphor layer is disposed on the top of the LED chip, a silicone isolation layer is covered on the top of the second red phosphor layer, a yellow-green phosphor layer is covered on the top of the silicone isolation layer, and a silicone protective layer is covered on the top of the yellow-green phosphor layer.

[0005] Furthermore, the thickness of the second red phosphor layer is less than that of the first red phosphor layer.

[0006] Furthermore, the thickness of the silicone barrier layer is greater than that of the second red phosphor layer, and the light transmittance of the silicone barrier layer is greater than 95%.

[0007] Furthermore, the thickness of the silicone protective layer is greater than that of the silicone isolation layer, and the light transmittance of the silicone protective layer is greater than 98%.

[0008] Furthermore, the silicone protective layer has an arc-shaped structure.

[0009] Furthermore, the yellow-green phosphor layer is formed by mixing yellow-green phosphor with silica gel, and the mass ratio of yellow-green phosphor to silica gel is 1:4-1:6.

[0010] By employing the above technical solution, this utility model provides a high-brightness LED chip packaging structure, which has at least the following beneficial effects:

[0011] 1. This utility model features a double-layer red phosphor layer. The first red phosphor layer can directly receive blue light excitation from the LED chip, while the second red phosphor layer can capture the remaining blue light that has passed through the first layer. The double-layer structure allows for the staged and maximum excitation of the red phosphor, improving the red light conversion efficiency. Furthermore, the second red phosphor layer is thin, which reduces the amount of red phosphor used. At the same time, a silicone insulating layer physically separates the red phosphor layer and the yellow-green phosphor layer, ensuring effective transmission of blue light, improving the utilization rate of blue light, and allowing it to be fully converted into white light, thereby increasing the luminous brightness of the LED.

[0012] 2. This utility model, through the arc-shaped structure and thickened design of the silicone protective layer, can provide protection for the entire packaging structure and LED chip, thereby improving the stability and impact resistance of the LED. Attached Figure Description

[0013] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0015] In the diagram: 1. Support; 2. LED chip; 3. Encapsulating colloid; 301. First red phosphor layer; 302. Second red phosphor layer; 303. Silicone insulating layer; 304. Yellow-green phosphor layer; 305. Silicone protective layer. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] In LED lighting technology, traditional LED packaging commonly employs a dispensing process that mixes red phosphors with yellow-green phosphors. The light-emitting principle involves a blue LED chip exciting the red and yellow-green phosphors to produce red and green light, which are then mixed with blue light to generate white light. During this process, the red phosphor may be secondary-excited by the green light emitted from the yellow-green phosphor. While this increases spectral richness, it also leads to the absorption of blue light due to cross-excitation, preventing its effective conversion into white light. This reduces blue light utilization, affecting overall luminous efficiency and consequently causing luminous efficacy decay and color temperature shift.

[0018] To address the aforementioned defects in the LED packaging process, please refer to [link / reference needed]. Figure 1 This invention provides a high-brightness LED chip packaging structure that improves blue light conversion efficiency and increases the white light luminescence brightness of the LED. The packaging structure is based on a support 1 and an LED chip 2 die-bonded inside the support 1. An encapsulating colloid 3 is disposed on the outside of the LED chip 2. The encapsulating colloid 3 includes a first red phosphor layer 301 attached to the inside of the support 1 via a dispensing process. The LED chip 2 is disposed above the first red phosphor layer 301, and a second red phosphor layer 302 is disposed on top of the LED chip 2. A silicone insulating layer 303 covers the top of the second red phosphor layer 302, and a yellow-green phosphor layer 304 covers the top of the silicone insulating layer 303. A silicone protective layer 305 covers the top of the yellow-green phosphor layer 304. This solution employs a two-stage dispensing process, first dispensing the red phosphor onto the support 1. A first red phosphor layer 301 is formed inside the LED chip 2, and then the red phosphor is dotted onto the LED chip 2 to form a second red phosphor layer 302. The first red phosphor layer 301 directly receives the blue light excitation from the LED chip 2, while the second red phosphor layer 302 can capture the remaining blue light that has passed through the first layer. The dual-layer structure improves the red light conversion efficiency through staged excitation, so that the red phosphor layer is excited to the maximum extent, reducing the wavelength and amount of the first red phosphor layer. Then, the second red phosphor layer 302 and the yellow-green phosphor layer 304 are physically isolated by the silicone isolation layer 303, which can reduce the energy loss caused by cross-excitation, improve the blue light conversion efficiency, and thus improve the white light luminous brightness of the LED.

[0019] In order to reduce the amount of red phosphor without affecting the brightness of the LED, the thickness of the second red phosphor layer 302 is less than that of the first red phosphor layer 301. The phosphor material used in the first red phosphor layer 301 and the second red phosphor layer 302 is the same, and the mass of the second red phosphor layer 302 is 30% of that of the first red phosphor layer 301. The first red phosphor layer 301 is formed by centrifugation, which can precisely control the thickness of the first red phosphor layer 301 and avoid excessive accumulation of red phosphor that leads to light absorption.

[0020] The silicone isolation layer 303 is used to isolate the red phosphor layer 302 and the yellow-green phosphor layer 304. The thickness of the silicone isolation layer 303 is greater than that of the second red phosphor layer 302, and the light transmittance of the silicone isolation layer 303 is greater than 95%. The silicone isolation layer 303 can completely block the contact between the red phosphor and the yellow-green phosphor. The high light transmittance of the silicone isolation layer 303 ensures that the blue light transmittance is greater than 90%, reducing interface reflection loss.

[0021] Since the silicone protective layer 305 is the outermost layer of the entire encapsulation structure, it needs to protect the internal structure. The thickness of the silicone protective layer 305 is greater than that of the silicone isolation layer 303, and the light transmittance of the silicone protective layer 305 is greater than 98%. The silicone protective layer 305 can enhance the mechanical strength and stability of the entire encapsulation structure, improve its impact resistance, protect the LED chip 2, and ensure the brightness of the LED.

[0022] To broaden the light-emitting angle of LEDs, the silicone protective layer 305 has a curved surface structure. The curved surface structure allows light to be refracted, thereby expanding the light-emitting angle and making it more suitable for lighting applications.

[0023] To prevent the precipitation or agglomeration of yellow-green phosphors, the yellow-green phosphor layer 304 is composed of a mixture of yellow-green phosphors and silica gel, with a mass ratio of 1:4 to 1:6. When the yellow-green phosphors are mixed with silica gel, the silica gel acts as a uniform dispersion medium, preventing the precipitation or agglomeration of the yellow-green phosphors and ensuring a consistent thickness of the yellow-green phosphor layer 304. This avoids local color temperature deviations. By precisely controlling the ratio of the two, it can be ensured that the yellow-green phosphors can fully absorb blue light and efficiently convert it into green light, while avoiding light scattering loss caused by excessive phosphor concentration, thus improving green light conversion efficiency and optimizing the white light spectrum.

[0024] The control method of this utility model is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The power supply is also common knowledge in the field. Since this utility model is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail.

[0025] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0026] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-brightness LED chip packaging structure, comprising a support (1) and an LED chip (2) die-bonded inside the support (1), characterized in that: The LED chip (2) is provided with an encapsulating colloid (3) on its exterior. The encapsulating colloid (3) includes a first red phosphor layer (301) attached to the inside of the bracket (1) by a dispensing process. The LED chip (2) is disposed above the first red phosphor layer (301), and a second red phosphor layer (302) is disposed on the top of the LED chip (2). The top of the second red phosphor layer (302) is covered with a silicone isolation layer (303). The top of the silicone isolation layer (303) is covered with a yellow-green phosphor layer (304), and the top of the yellow-green phosphor layer (304) is covered with a silicone protective layer (305).

2. The high-brightness LED chip packaging structure according to claim 1, characterized in that: The thickness of the second red phosphor layer (302) is less than that of the first red phosphor layer (301).

3. The high-brightness LED chip packaging structure according to claim 1, characterized in that: The thickness of the silicone isolation layer (303) is greater than that of the second red phosphor layer (302), and the light transmittance of the silicone isolation layer (303) is greater than 95%.

4. The high-brightness LED chip packaging structure according to claim 1, characterized in that: The thickness of the silicone protective layer (305) is greater than that of the silicone isolation layer (303), and the light transmittance of the silicone protective layer (305) is greater than 98%.

5. The high-brightness LED chip packaging structure according to claim 1, characterized in that: The silicone protective layer (305) has an arc-shaped structure.

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