Fcbga heat sink manual compression jig

Abstract

This utility model discloses a manual pressing fixture for FCBGA heat sinks, comprising: a base, a platform mounted on the base, the platform having multiple vertical through holes for embedding chips to be pressed, the multiple vertical through holes being arranged along the circumferential direction of the platform; multiple supports elastically mounted on the base, the supports sliding in the lower end of the vertical through holes, the supports being covered with a stress buffer layer, and an adhesive layer for bonding the chips being laid on the stress buffer layer; and a reaction cover plate, which is vertically mounted on the platform and positioned above the multiple vertical through holes, the bottom of the reaction cover plate forming multiple air blowing grooves, the openings of the air blowing grooves being aligned with the upper end of the vertical through holes, and the reaction cover plate having air holes communicating with the air blowing grooves. This utility model solves the problem of high investment costs associated with using automated machines and matching fixtures in the early stages of FC-BGA packaged chip production.

Description

Technical Field

[0001] This utility model relates to the field of FC-BGA packaged chip technology, specifically to a manual pressing fixture for FCBGA heat sinks. Background Technology

[0002] Current semiconductor FC-BGA (Flip Chip Ball Grid Array) packaging technology requires heat sinks to help dissipate heat from the chip. The heat sink and substrate must not have any gaps or misalignments (<0.05mm), and there is even a risk of it detaching. Therefore, current production relies on purchasing automated equipment and tooling (tooling mainly refers to the fixtures and hardware used in the testing process), which is extremely expensive (>2 million RMB). However, due to the small initial functional verification and sample delivery volume, the cost is a very large expenditure. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, a manual pressing fixture for FCBGA heat sinks is provided to solve the problem of high investment costs associated with using automated machines and matching fixtures in the early stages of FC-BGA packaged chip production.

[0004] To achieve the above objectives, a manual pressing fixture for FCBGA heatsinks is provided, comprising:

[0005] A base, on which a platform is mounted, the platform having multiple vertical through holes for embedding chips to be pressed, the multiple vertical through holes being arranged along the circumferential direction of the platform;

[0006] Multiple supports are flexibly mounted on the base, the supports are slidably disposed in the lower end of the vertical through hole, the supports are covered with a stress buffer layer, and an adhesive layer for bonding the chip is laid on the stress buffer layer;

[0007] A reaction cover plate is vertically mounted on the pedestal and positioned above the plurality of vertical through holes. The bottom of the reaction cover plate has a plurality of air blowing grooves, the openings of which are aligned with the upper ends of the vertical through holes. The reaction cover plate has air holes that communicate with the air blowing grooves. Airflow is input into the air blowing grooves through the air holes and then discharged into the upper end of the vertical through holes through the openings of the air blowing grooves to press the chip against the pedestal using the airflow.

[0008] Furthermore, the cross-section of the stress buffer layer is inverted trapezoidal.

[0009] Furthermore, the lower end of the vertical through hole extends toward the inner side of the vertical through hole to form a supporting flange, and the supporting flange is arranged in a circle in the circumferential direction away from the vertical through hole.

[0010] Furthermore, the pedestal has a first guide hole, and the base has a guide post vertically mounted thereon, with the guide post slidingly disposed in the first guide hole.

[0011] Furthermore, there are four vertical through holes, which are evenly spaced along the circumferential direction of the base.

[0012] Furthermore, there are two reaction cover plates, with each reaction cover plate having its opposite ends positioned above two vertical through holes. The pedestal is vertically provided with multiple guide rods, and the reaction cover plates have second guide holes in which the guide rods slide.

[0013] Furthermore, a threaded hole is provided in the middle of the base, and a screw is screwed into the threaded hole. The lower end of the screw is rotatably installed on the base, and a knob is connected to the upper end of the screw. The opposite sides of the knob press against the two reaction cover plates respectively.

[0014] The beneficial effects of this invention are as follows: The FCBGA heatsink manual pressing fixture is a manual tooling alternative to an automatic machine, achieving the functionality and precision of an automatic machine. This FCBGA heatsink manual pressing fixture is inexpensive, can process four products simultaneously, significantly reducing initial product development costs while still providing the performance of an automatic machine. This FCBGA heatsink manual pressing fixture improves product reliability. This FCBGA heatsink manual pressing fixture is suitable for thinner chip packages. Attached Figure Description

[0015] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0016] Figure 1 This is a schematic diagram of the structure of the manual pressing fixture for the FCBGA heat sink according to an embodiment of the present invention.

[0017] Figure 2 This is a three-dimensional structural diagram of the base according to an embodiment of the present utility model.

[0018] Figure 3 This is a top view of the platform according to an embodiment of the present utility model.

[0019] Figure 4 This is a top view of the reaction cover plate according to an embodiment of the present utility model.

[0020] Figure 5 This is a bottom view of the reaction cover plate according to an embodiment of the present utility model.

[0021] Figure label:

[0022] Base 1, platform 11, supporting flange 12, guide post 13, vertical through hole a, overflow groove e, first guide hole f;

[0023] 2. Foundation 2, stress buffer layer 21, adhesive layer 22, elastic component 23;

[0024] 3. Reaction cover plate; 31. Guide rod; b. Air blowing groove; c. Air hole; d. Second guide hole;

[0025] Screw 4, Knob 41;

[0026] Chip 5. Detailed Implementation

[0027] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the relevant utility model and not intended to limit the scope of the utility model. Furthermore, it should be noted that, for ease of description, only the parts relevant to the utility model are shown in the accompanying drawings.

[0028] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0029] Reference Figures 1 to 5 As shown, this utility model provides a manual pressing fixture for FCBGA heat sinks, including: a base 1, a support platform 2, and a reaction cover plate 3.

[0030] In this embodiment, the base 1 is rectangular. A platform 11 is mounted on the base 1. The shape and size of the platform are adapted to the shape and size of the base. The platform is located directly above the base. The platform 11 has multiple vertical through holes a. The vertical through holes a are for embedding the chip 5 to be pressed. The chip 5 to be pressed includes a substrate and a heat sink. Figure 2 The green component is shown in the center. Multiple vertical through holes a are arranged along the circumferential direction of the base 11.

[0031] There are multiple support platforms 2. The number of support platforms is adapted to the number of vertical through holes. Multiple support platforms 2 are elastically mounted on the base 1. Specifically, in this embodiment, the support platforms 2 are elastically mounted on the base via elastic components 23. A receiving groove is provided on the base 1 corresponding to the elastic component 23. The elastic component 23 includes a buffer pad, a socket sleeve, an insertion sleeve, and a spring. The buffer pad is laid on the bottom of the receiving groove. The socket sleeve and the insertion sleeve each have an open end and a closed end, and are hollow inside. The open end of the insertion sleeve is movably inserted into the open end of the socket sleeve. The insertion sleeve and the socket sleeve can slide relative to each other in the axial direction. The closed end of the socket sleeve is connected to the bottom of the support platform 2. The closed end of the socket sleeve is mounted on the buffer pad, and the open end of the insertion sleeve extends out of the groove on the base 1 and is located above the groove. A spring is disposed in the socket sleeve and the insertion sleeve. One end of the spring is connected to the inside of the closed end of the socket sleeve, and the other end of the spring is connected to the inside of the closed end of the insertion sleeve. Both ends of the spring press against the inside of the closed ends of the socket sleeve and the insertion sleeve. In its natural state, part of the socket sleeve is located on the outside of the insertion sleeve. Thus, through the deformation of the buffer pad and the relative sliding of the socket sleeve and the insertion sleeve, combined with the compression deformation of the spring, a buffering effect can be provided for the sinking of the base 2 when it tends to sink.

[0032] In some embodiments, the cushioning pad is a rubber pad.

[0033] In this embodiment, the support 2 is slidably disposed in the lower end of the vertical through-hole a. The cross-section of the vertical through-hole is rectangular and adapted to the shape and size of the chip. The shape and size of the support are adapted to the outer diameter and size of the cross-section of the vertical through-hole. The support is movable in the vertical through-hole along the axial direction. A stress buffer layer 21 is laid on the support 2. The stress buffer layer is located on the upper surface of the support and is made of gel, fiber, or composite material.

[0034] As a preferred embodiment, the stress buffer layer 21 has an inverted trapezoidal cross-section.

[0035] An adhesive layer 22 for bonding chip 5 is laid on stress buffer layer 21.

[0036] In this embodiment, the adhesive layer is conductive adhesive or DAF (Die Attach Film). DAF is an ultrathin film adhesive used in semiconductor packaging processes to connect semiconductor chips to circuit substrates or between chips.

[0037] The reaction cover 3 is vertically and flexibly mounted on the base 11. The reaction cover 3 is positioned above multiple vertical through holes a. Multiple air blowing grooves b are formed at the bottom of the reaction cover 3. The openings of the air blowing grooves b are aligned with the upper ends of the vertical through holes a. The reaction cover 3 has air holes c that communicate with the air blowing grooves b. Airflow enters the air blowing grooves b through the air holes c, and then exits into the upper end of the vertical through holes a through the openings of the air blowing grooves b, so as to press the chip 5 against the support 2 using the airflow.

[0038] In this embodiment, a support flange 12 extends from the lower end of the vertical through hole a toward the inner side of the vertical through hole a. The support flange 12 is arranged in a circle along the circumferential direction of the vertical through hole a. An elastic pad layer is laid on the inner wall of the vertical through hole.

[0039] Combination Figure 1 and Figure 3 As shown, an overflow groove e is formed on the upper surface of the stage. One end of the overflow groove is connected to the upper end of the vertical through hole, and the other end of the overflow groove penetrates the side of the stage. When the reaction cover is closed on the upper part of the stage, the airflow in the vertical through hole is discharged through the overflow groove to maintain the pressure of the airflow on the chip to be pressed in the vertical through hole. In this embodiment, the upper parts of two adjacent vertical through holes are connected by the overflow groove.

[0040] Continue reading Figure 1 and Figure 3 As shown, the platform 11 has a first guide hole f. The base 1 has a guide post 13 vertically mounted on it. The guide post 13 slides within the first guide hole f. The cooperation between the guide post and the first guide hole allows the platform to move stably in the vertical direction. In this embodiment, the platform has four first guide holes. The four first guide holes are arranged along the circumferential direction of the platform.

[0041] In this embodiment, there are four vertical through holes a on the base. The four vertical through holes a are equally spaced along the circumferential direction of the base 11. The four vertical through holes are arranged in a matrix.

[0042] As a preferred implementation method, see [reference]. Figure 1 and Figure 4 , Figure 5 As shown, there are two reaction cover plates 3. Each reaction cover plate 3 has its opposite ends positioned above two vertical through holes a. Multiple guide rods 31 are vertically mounted on the base 11. Each reaction cover plate 3 has a second guide hole d. The guide rods 31 slide within the second guide hole d.

[0043] A threaded hole is provided in the middle of the base 11. A screw 4 is screwed into the threaded hole of the base 11. The lower end of the screw 4 is rotatably mounted on the base 1. A knob 41 is connected to the upper end of the screw 4. The opposite sides of the knob 41 press against two reaction cover plates 3 respectively. The base has a threaded hole, and the lower end of the screw is screwed into the threaded hole of the base.

[0044] Before bonding the chip to be pressed, airflow is introduced into the air blower through the air vent. The airflow is directed at the chip to be pressed in the vertical through-hole, and a stable air pressure is maintained. This causes the reaction cover to press against the knob under the reaction force of the airflow. Then, the stage can be moved closer to the base by rotating the knob, while the knob is pushed down to push the reaction cover closer to the stage.

[0045] The workflow of the manual pressing fixture for FCBGA heat sinks of this utility model includes:

[0046] S1. The chip to be pressed (including the substrate and heat sink stacked together) is laid on the adhesive layer on the support platform in the vertical through hole.

[0047] S2. Place the reaction cover plate on the top of the platform, insert the guide rod on the platform into the second guide hole of the reaction cover plate, and adjust the position of the knob on the screw so that the opposite sides of the knob are above the opposite sides of the two reaction cover plates.

[0048] S3. The air source fills the air blower into the air blower through the air hole, so that the air blows towards the chip to be pressed, and the reaction cover plate abuts against the bottom of the knob.

[0049] S4. Adjust the pressure of the knob to make the heat sink bond with the chip substrate.

[0050] In step S3, when the airflow blows towards the chip to be pressed, the platform tends to sink. At this time, the buffer pad in the receiving groove offsets part of the sinking pressure of the platform. On the other hand, the springs in the socket sleeve and the insertion sleeve are compressed, which also offsets part of the sinking pressure of the platform, thus preventing the chip to be pressed on the platform from "hard landing" due to the pressure of the airflow and causing cracks.

[0051] This utility model discloses a manual pressing fixture for FCBGA heat sinks, which is a manual tooling alternative to an automatic machine, achieving the functionality and precision of an automatic machine. The manual pressing fixture for FCBGA heat sinks is inexpensive (<10,000 RMB) and can process four products simultaneously, significantly reducing initial product development costs while still providing the effect of an automatic machine.

[0052] This invention relates to a manual pressing fixture for FCBGA heatsinks, which improves product reliability. This manual pressing fixture for FCBGA heatsinks is also suitable for thinner chip packages.

[0053] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the utility model involved in this application is not limited to the technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A manual pressing fixture for FCBGA heat sinks, characterized in that, include: A base, on which a platform is mounted, the platform having multiple vertical through holes for embedding chips to be pressed, the multiple vertical through holes being arranged along the circumferential direction of the platform; Multiple supports are flexibly mounted on the base, the supports are slidably disposed in the lower end of the vertical through hole, the supports are covered with a stress buffer layer, and an adhesive layer for bonding the chip is laid on the stress buffer layer; A reaction cover plate is vertically mounted on the pedestal and positioned above the plurality of vertical through holes. The bottom of the reaction cover plate has a plurality of air blowing grooves, the openings of which are aligned with the upper ends of the vertical through holes. The reaction cover plate has air holes that communicate with the air blowing grooves. Airflow is input into the air blowing grooves through the air holes and then discharged into the upper end of the vertical through holes through the openings of the air blowing grooves to press the chip against the pedestal using the airflow.

2. The manual pressing fixture for FCBGA heatsinks according to claim 1, characterized in that, The stress buffer layer has an inverted trapezoidal cross-section.

3. The manual pressing fixture for FCBGA heatsinks according to claim 1, characterized in that, The lower end of the vertical through hole extends toward the inside of the vertical through hole to form a supporting flange, and the supporting flange is arranged in a circle in the circumferential direction away from the vertical through hole.

4. The manual pressing fixture for FCBGA heatsinks according to claim 1, characterized in that, The pedestal has a first guide hole, and the base has a guide post that slides in the first guide hole.

5. The manual pressing fixture for FCBGA heatsinks according to claim 1, characterized in that, The number of vertical through holes is four, and the four vertical through holes are equally spaced along the circumferential direction of the base.

6. The manual pressing fixture for FCBGA heat sinks according to claim 5, characterized in that, The reaction cover plate consists of two pieces, with each reaction cover plate having its opposite ends positioned above two vertical through holes. The pedestal is vertically provided with multiple guide rods, and the reaction cover plate has a second guide hole in which the guide rod slides.

7. The manual pressing fixture for FCBGA heatsinks according to claim 6, characterized in that, The base has a threaded hole in the middle, and a screw is screwed into the threaded hole. The lower end of the screw is rotatably mounted on the base, and the upper end of the screw is connected to a knob. The opposite sides of the knob press against the two reaction cover plates respectively.

Images