A semiconductor package structure
By placing a heat sink with high thermal conductivity between the chip and the inductor, the problem of heat affecting the inductor performance through the inductor in the packaging structure is solved, achieving more efficient heat dissipation and a more stable power module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JCET MANAGEMENT CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-06-02
AI Technical Summary
In the existing heat dissipation path of the packaging structure, the heat generated by the chip is conducted through components such as inductors, which affects the performance of the inductors and the stability and reliability of the power module.
A heat sink with a thermal conductivity greater than 5000w/mk is placed between the chip and the inductor. The heat sink includes a heat sink body and a heat sink support. Heat is conducted to the outside through the heat sink body along the heat sink support, preventing heat from spreading through the inductor.
It improves the heat transfer effect of the chip and inductor, protects the key parameters of the inductor, and enhances the stability and reliability of the power module.
Smart Images
Figure CN224319871U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip packaging technology, and more particularly to a semiconductor packaging structure. Background Technology
[0002] A chip's power module is a core component providing stable power to the chip. It integrates power chips, inductors, capacitors, and other components to achieve power conversion, voltage regulation, and control functions. The main function of the power module is to convert the input electrical energy into the precise voltage and current required by the chip, ensuring stable operation under various workloads. It typically includes various types of circuits, such as linear regulators (LDOs) for low-noise applications and switching regulators (such as buck, boost, and buck-boost converters) for high-efficiency conversion. Modern power modules may also have digital control functions, enabling intelligent power management and monitoring, and providing protection against overcurrent, overvoltage, and short circuits. Chip power modules are widely used in consumer electronics (such as smartphones and tablets), computers (such as servers and laptops), communication equipment (such as base stations and routers), and industrial automation, providing reliable power support for various chips (such as CPUs, GPUs, and memory chips). Their high integration, small size, and high efficiency make them an indispensable key component in modern electronic devices.
[0003] The heat-generating components in the packaging structure mainly include the chip and the inductor, with the chip having relatively high power consumption. For example... Figure 1 As shown, the heat dissipation path of the existing packaging structure is as follows: chip 1 → thermal conductive sheet 3 → solder 4 → inductor 2 → external heat sink 5. The heat generated by the chip needs to be conducted through the inductor. During the heat transfer process, the inductor will be heated to a high temperature, which will affect the normal performance of the inductor and cause changes in key parameters such as inductance and quality factor, thus affecting the stability and reliability of the power module.
[0004] Given the heat dissipation problems of traditional packaging structures, it is necessary to improve and optimize them to enhance the heat dissipation performance and overall reliability of power modules, and meet the high performance and high stability requirements of modern electronic devices. Summary of the Invention
[0005] The problem this application aims to solve is to provide a semiconductor packaging structure that optimizes the heat dissipation path of the packaging structure so that the heat generated by the chip structure does not pass through the first components such as inductors during conduction, ensuring that the first components such as inductors have good key parameters, and ensuring that the chip structure has good stability and reliability.
[0006] To address the above problems, this application provides a semiconductor packaging structure, comprising:
[0007] A heat sink, comprising a heat sink body and at least one heat sink branch connected to the heat sink body; the heat sink body has a first surface and a second surface disposed opposite to each other;
[0008] The first component is disposed on the first surface of the heat sink body;
[0009] A chip packaging structure, the chip packaging structure including a substrate and a chip structure located on the surface of the substrate, wherein the second surface of the heat dissipation body is disposed on the surface of the chip structure away from the substrate;
[0010] The end of the heat dissipation branch away from the heat dissipation body is used to dissipate heat to the outside. When the first component and the chip structure generate heat, the heat is conducted to the outside through the heat dissipation body along the heat dissipation branch.
[0011] By placing a heat sink between the first component and the chip package structure (specifically, the chip structure), the heat generated by the first component and the chip package structure (specifically, the chip structure) is conducted to the external heat sink through the heat sink body along the heat sink branch. This avoids the heat generated by the chip package structure from diffusing outward through the first component (e.g., an inductor), which could affect the performance of the first component, cause changes in key parameters such as the quality factor of the first component (e.g., the inductance of the inductor), and even affect the stability and reliability of the package structure (e.g., the power module).
[0012] In one optional embodiment, the first component is a power device, an inductor, or a resistor.
[0013] In practical applications, power devices include transistor power devices, thyristor power devices, insulated-gate bipolar transistor power devices, and integrated power devices.
[0014] In one optional embodiment, the thermal conductivity of the heat dissipation body is greater than 5000 W / mK.
[0015] By limiting the thermal conductivity of the heat sink to greater than 5000w / mk, the heat generated by the chip structure and inductor components can be directly transferred to the heat sink branch through the heat sink body, which greatly improves the heat transfer effect.
[0016] In one optional embodiment, the heat sink includes a heat pipe, a first heat sink plate, and a second heat sink plate, wherein the heat pipe has a straight section and a bent section disposed at the end of the straight section;
[0017] The straight section of the heat pipe passes through the first heat sink to form a first heat sink-shaped structure, and the first heat sink-shaped structure serves as the heat sink body.
[0018] The end tubes of the bent portion away from the straight portion are respectively inserted into the second heat dissipation plate to form a second heat dissipation plate-like structure, and the second heat dissipation plate-like structure serves as the heat dissipation support.
[0019] In one optional embodiment, each end of the straight tube has a bend, and there are two second heat dissipation plates. The two bends and the two second heat dissipation plates 84 correspond to form two heat dissipation branches.
[0020] In an alternative embodiment, the heat pipe has a "U" shaped structure.
[0021] In one optional embodiment, the heat pipes are multiple, and the first heat sink and the second heat sink are respectively provided with multiple mounting holes, through which the multiple heat pipes pass on the first heat sink and the second heat sink.
[0022] In an optional embodiment, the straight section of the heat pipe is the evaporation section of the heat pipe;
[0023] The bent section of the heat pipe is the condensation section of the heat pipe;
[0024] The connection point between the straight section and the bent section is the insulation section of the heat pipe.
[0025] A heat pipe is a component that utilizes the phase change of a heat dissipation medium for efficient heat exchange. It has a thermal conductivity greater than 5000 W / mK and can be divided into an evaporation section, an adiabatic section, and a condensation section. It consists of three parts: a tube shell, a wick, and end caps. The inside of the tube is evacuated and filled with a heat dissipation medium. Filling with heat dissipation media with different boiling points allows the heat pipe to be used in various working environments.
[0026] The working principle of a heat pipe is as follows: When an external heat source heats the evaporation section of the heat pipe, the working liquid in the wick absorbs heat, evaporates, and carries away the heat. Under the action of the pressure difference inside the pipe, the vapor flows through the adiabatic section to the condensation section, releases heat, and condenses into liquid. Under the action of capillary force or gravity of the wick, the liquid returns to the evaporation section. Since the evaporation and condensation of the heat dissipation medium utilizes the latent heat of the heat dissipation medium, a large amount of heat is continuously transferred from the evaporation section to the condensation section through this continuous cycle.
[0027] In one optional embodiment, the heat pipe is a copper pipe containing a heat dissipation medium, which may be Freon, ammonia, or propane.
[0028] In one optional embodiment, the first heat sink is a metal plate, and the second heat sink is a metal plate.
[0029] In an optional embodiment, an external heat sink is further included, which is connected to the second heat sink plate of the heat sink component;
[0030] The first heat sink is a flat plate structure adapted to the first component and the chip structure;
[0031] The second heat sink is a plate-shaped structure adapted to the shape of the external heat sink.
[0032] In one optional embodiment, the heat sink includes a heat sink strip, a first heat sink plate, and a second heat sink plate. The heat sink strip has a straight tube portion and a bent portion disposed at the end of the straight tube portion.
[0033] The straight section of the heat sink passes through the first heat sink to form a first heat sink-shaped structure, and the first heat sink-shaped structure serves as the heat sink body.
[0034] The end tubes of the bent portion away from the straight portion are respectively inserted into the second heat dissipation plate to form a second heat dissipation plate-like structure, and the second heat dissipation plate-like structure serves as the heat dissipation support.
[0035] In actual use, the heat sink can be either hollow or solid.
[0036] In an optional embodiment, a thermally conductive layer is further included, which is disposed between the heat dissipation body and the chip structure, and between the heat dissipation body and the first component.
[0037] In one optional embodiment, the thermally conductive layer is a thermally conductive silicone grease layer, a thermally conductive gel layer, or a thermally conductive adhesive layer.
[0038] In an optional embodiment, the first component includes a heat dissipation area and an electrical connection area, wherein the electrical connection area is connected to the heat dissipation area and protrudes from the heat dissipation area;
[0039] The first component is disposed on the first surface of the heat dissipation body through the heat dissipation area;
[0040] The electrical connection area is used for electrical connection with the substrate of the chip packaging structure.
[0041] In an optional embodiment, the substrate has metal connection posts for electrical connection with the first component.
[0042] In an alternative embodiment, the electrical connection area has pins that are connected to the metal connection posts.
[0043] In an optional embodiment, the chip structure is flip-chip mounted on the substrate.
[0044] In one optional embodiment, the metal connecting post is a copper post.
[0045] In one optional embodiment, the chip structure is a single chip, a stacked chip structure, or a packaged chip structure.
[0046] In an alternative embodiment, the substrate surface is filled with molding compound and exposes the surface of the chip structure facing away from the substrate.
[0047] The advantages of the technical solution in this application are:
[0048] By placing a heat sink between the first component and the chip package structure (specifically, the chip structure), the heat generated by both components is conducted to the external heat sink via the heat sink body along the heat dissipation branch, thus protecting both components. This prevents heat generated by the chip package structure from diffusing outward through the first component (e.g., an inductor), which could affect the component's performance, causing changes in key parameters such as the quality factor (e.g., the inductance of the inductor), and even impacting the stability and reliability of the package structure (e.g., the power module). By limiting the thermal conductivity of the heat sink to greater than 5000 W / mK, the heat generated by both the chip package structure and the inductor can be directly transferred to the heat dissipation branch via the heat sink body, significantly improving heat transfer efficiency. Attached Figure Description
[0049] Figure 1 This is a schematic diagram of heat dissipation in an existing packaging structure.
[0050] Figure 2 This is a side view of the encapsulation structure in one embodiment of this application (with the external heat sink hidden).
[0051] Figure 3 for Figure 2 A schematic diagram of the cross-sectional structure along the cutting line AA;
[0052] Figure 4 This is a schematic diagram of the axial structure of the heat sink in one embodiment of this application;
[0053] Figure 5 This is a schematic diagram of the axial structure of the first heat sink in one embodiment of this application;
[0054] The labels for the attached figures are as follows:
[0055] 1. Chip; 2. Inductor; 3. Thermal conductive sheet; 4. Solder; 5. External heat sink; 6. First component; 61. Heat dissipation area; 62. Electrical connection area; 7. Pin; 8. Heat sink component; 80. Heat pipe; 801. Straight pipe section; 802. Bending section; 81. Heat sink body; 82. Heat dissipation support; 83. First heat sink plate; 831. Mounting hole; 84. Second heat sink plate; 9. Thermal conductive layer; 10. Molding material; 11. Metal connecting post; 12. Substrate; 13. Second component; 14. Chip structure. Detailed Implementation
[0056] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0057] It should be understood that terms such as “first” and “second” used herein to describe various elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. For example, the use of terms such as “first” and “second” herein does not imply order or sequence unless the context clearly indicates otherwise. For ease of description, spatially relative terms such as “upper” and “lower” may be used herein to describe the relationship of one element or feature to other elements or features as shown in the accompanying drawings. It should be understood that spatially relative terms are intended to include not only the orientations shown in the accompanying drawings but also different orientations of the device in use or operation.
[0058] In this application, unless otherwise expressly specified and limited, the terms "connected" and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0059] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples. It should be noted that the terms "comprising" and "having," and their variations, used in this application are intended to cover non-exclusive inclusion.
[0060] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings. In describing the embodiments of this application in detail, for ease of explanation, the schematic diagrams may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this application. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.
[0061] The inventors discovered through experiments that the main material of the inductor is ferrite, with a thermal conductivity of approximately 3.5 W / mK, which is relatively low. Combined with the inductor's considerable thickness, this increases thermal resistance in the heat dissipation path, hindering rapid heat conduction and impeding effective heat dissipation from the chip structure. This can potentially affect the chip's operating efficiency and lifespan. The limited contact area between the inductor and the external heatsink severely restricts heat dissipation efficiency, making it difficult to quickly and evenly transfer heat to the external heatsink for dissipation, further exacerbating the temperature rise problem inside the power module. Prolonged high-temperature operation and heat passing through the inductor's solder joints can adversely affect the solder joints, reducing their reliability and increasing the risk of solder joint defects, detachment, and other failures, thus impacting the overall connection stability and lifespan of the package structure.
[0062] Therefore, this application provides a semiconductor packaging structure, in conjunction with reference to the following: Figures 2-4 ,in Figure 2 This is a side view of the encapsulation structure in one embodiment of this application. Figure 3 for Figure 2 A schematic diagram of the cross-sectional structure along the cutting line AA (the arrow indicates the direction of heat transfer outward). Figure 4 This is a schematic diagram of the axial structure of the heat sink in one embodiment of this application. Figure 5 This is a schematic diagram of the axial structure of the first heat sink in one embodiment of this application; the packaging structure includes:
[0063] The heat sink 8 includes a heat sink body 81 and at least one heat sink branch 82 connected to the heat sink body 81; the heat sink body 81 has a first surface and a second surface disposed opposite to each other.
[0064] First component 6, the first component 6 is disposed on the first surface of heat dissipation body 81;
[0065] A chip packaging structure includes a substrate 12 and a chip structure 14 located on the surface of the substrate, wherein the second surface of the heat dissipation body is disposed on the surface of the chip structure 14 away from the substrate.
[0066] The end of the heat dissipation support 82 away from the heat dissipation body 81 is used to dissipate heat to the outside. When the first component 6 and the chip structure 14 generate heat, the heat is conducted to the outside through the heat dissipation body 81 along the heat dissipation support 82.
[0067] By placing a heat sink 8 between the first component 6 and the chip package 14, the heat generated by the first component 6 and the chip structure 14 is conducted to the external heat sink 5 through the heat sink body 81 along the heat sink branch 82. This avoids the heat generated by the chip structure 14 from spreading outward through the inductor element, affecting the performance of the first component 6, causing changes in key parameters such as the inductance of the inductor element, and even affecting the stability and reliability of the package structure (e.g., power module).
[0068] In one embodiment, the first component 6 is a power device, an inductor, or a resistor.
[0069] In practical applications, power devices include transistor power devices, thyristor power devices, insulated-gate bipolar transistor power devices, and integrated power devices.
[0070] In one embodiment, the thermal conductivity of the heat dissipation body 81 is greater than 5000 W / mK.
[0071] In one embodiment, the thermal conductivity of the heat dissipation branch 82 is greater than 5000 W / mK.
[0072] By limiting the thermal conductivity of the heat sink 8 to greater than 5000 W / mK, the heat generated by the chip structure 14 and the inductor can be directly transferred to the heat sink branch 82 through the heat sink body 81, which greatly improves the heat transfer effect.
[0073] In one embodiment, the heat sink 8 includes a heat pipe 80, a first heat sink 83 and a second heat sink 84, and the heat pipe 80 has a straight pipe portion 801 and a bent portion 802 provided at the end of the straight pipe portion 801.
[0074] The straight pipe section 801 of the heat pipe 80 passes through the first heat sink 83 to form a first heat sink-shaped structure, and the first heat sink-shaped structure serves as the heat sink body 81.
[0075] The end tubes of the bent portion 802, which are away from the straight portion 801, are respectively inserted into the second heat sink 84 to form a second heat sink-shaped structure, which serves as a heat dissipation support 82.
[0076] In one embodiment, each end of the straight tube has a bend 802, and there are two second heat dissipation plates 84. The two bends 802 and the two second heat dissipation plates 84 correspond to form two heat dissipation branches 82.
[0077] In this embodiment, there are two second heat sinks 84.
[0078] In one embodiment, the heat dissipation support 82 may also have only one.
[0079] In one embodiment, the heat pipe 80 has a "U" shaped structure.
[0080] In one embodiment, there are multiple heat pipes 80, and the first heat sink 83 and the second heat sink 84 are respectively provided with multiple mounting holes 831. The multiple heat pipes 80 pass through the multiple mounting holes 831 on the first heat sink 83 and the second heat sink 84.
[0081] In one embodiment, the straight section 801 of the heat pipe 80 is the evaporation section of the heat pipe 80;
[0082] The bend 802 of the heat pipe 80 is the condensation section of the heat pipe 80;
[0083] The connection point between the straight section 801 and the bend section 802 is the insulation section of the heat pipe 80.
[0084] The heat pipe 80 is a high-efficiency heat exchange element that utilizes the phase change of the heat dissipation medium. It has a thermal conductivity greater than 5000 W / mK and can be divided into an evaporation section, an adiabatic section, and a condensation section. It consists of three parts: a tube shell, a wick, and end caps. The tube is evacuated and filled with a heat dissipation medium. Filling with heat dissipation media with different boiling points allows the heat pipe 80 to be used in various working environments.
[0085] The working principle of heat pipe 80 is as follows: When an external heat source heats the evaporation section of heat pipe 80, the working liquid in the wick absorbs heat, evaporates, and carries away the heat. Under the action of the pressure difference inside the pipe, the vapor flows through the adiabatic section to the condensation section, releases heat, and condenses into liquid. Under the action of capillary force or gravity of the wick, the liquid returns to the evaporation section. Since the evaporation and condensation of the heat dissipation medium utilizes the latent heat of the heat dissipation medium, a large amount of heat is continuously transferred from the evaporation section to the condensation section through this continuous cycle.
[0086] In one embodiment, the heat pipe is a copper pipe, and the copper pipe contains a heat dissipation medium, which is Freon, ammonia, or propane.
[0087] In one embodiment, the first heat sink 83 is a metal plate, and the second heat sink 84 is a metal plate.
[0088] In one specific embodiment, the first heat sink 83 and the second heat sink 84 are copper plates.
[0089] In one embodiment, an external heat sink 5 is also included, which is in contact with the outer wall of the second heat sink 84;
[0090] The first heat sink 83 is a flat plate structure adapted to the first component 6 and the chip structure 14;
[0091] The second heat sink 84 is a plate-shaped structure that conforms to the shape of the external heat sink 5.
[0092] In one specific embodiment, the second heat sink 84 is a flat plate;
[0093] In another specific embodiment, the second heat sink 84 is a corrugated plate or a drum-shaped plate.
[0094] In one optional embodiment, the heat sink includes a solid or hollow heat sink strip, a first heat sink plate and a second heat sink plate, wherein the heat sink strip has a straight tube portion and a bent portion disposed at the end of the straight tube portion;
[0095] The straight section of the heat sink passes through the first heat sink to form a first heat sink-shaped structure, and the first heat sink-shaped structure serves as the heat sink body.
[0096] The end tubes of the bent portion away from the straight portion are respectively inserted into the second heat dissipation plate to form a second heat dissipation plate-like structure, and the second heat dissipation plate-like structure serves as the heat dissipation support.
[0097] In one embodiment, two thermally conductive layers 9 are also included, which are respectively disposed between the heat dissipation body 81 and the chip structure 14 and between the heat dissipation body 81 and the first component 6.
[0098] In one embodiment, the thermally conductive layer 9 is a thermally conductive silicone grease layer, a thermally conductive gel layer, or a thermally conductive adhesive layer.
[0099] In one embodiment, the first component 6 includes a heat dissipation area 61 and an electrical connection area 62, wherein the electrical connection area 62 is connected to the heat dissipation area 61 and protrudes from the heat dissipation area 61;
[0100] The first component 6 is disposed on the first surface of the heat dissipation body 81 through the heat dissipation area 61, and the surface of the heat dissipation area 61 is in contact with the first surface of the heat dissipation body 81.
[0101] The electrical connection area 62 is used for electrical connection with the substrate 12 of the chip packaging structure.
[0102] In one specific embodiment, the substrate has metal connection posts 11 for electrical connection with a first component.
[0103] In one embodiment, the electrical connection area 62 has a pin 7, which is connected to a metal connection post 11.
[0104] In one embodiment, the chip structure 14 is flip-chip mounted on the substrate 12.
[0105] In one embodiment, the metal connecting post 11 is a copper post.
[0106] In one embodiment, the chip structure 14 is a single chip, a stacked chip structure, or a packaged chip structure.
[0107] In one embodiment, the surface of the substrate 12 is filled with molding compound 10 and the molding compound 10 exposes the surface of the chip structure away from the substrate 12.
[0108] In one embodiment, a second component 13 is also provided on the substrate 12. The second component 13 does not generate heat or generates very little heat, and can specifically be a fine-tuning capacitor.
[0109] Although this application has been disclosed above with reference to preferred embodiments, it is not intended to limit this application. Any person skilled in the art can make possible changes and modifications to the technical solutions of this application by utilizing the methods and techniques disclosed above without departing from the spirit and scope of this application. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the content of the technical solutions of this application shall fall within the protection scope of the technical solutions of this application.
Claims
1. A semiconductor packaging structure, characterized in that, include: A heat sink, comprising a heat sink body and at least one heat sink branch connected to the heat sink body; the heat sink body has a first surface and a second surface disposed opposite to each other; The first component is disposed on the first surface of the heat sink body; A chip packaging structure, the chip packaging structure including a substrate and a chip structure located on the surface of the substrate, wherein the second surface of the heat dissipation body is disposed on the surface of the chip structure away from the substrate; The end of the heat dissipation branch away from the heat dissipation body is used to dissipate heat to the outside. When the first component and the chip structure generate heat, the heat is conducted to the outside through the heat dissipation body along the heat dissipation branch.
2. The semiconductor packaging structure as described in claim 1, characterized in that, The first component is a power device, an inductor, or a resistor.
3. The semiconductor packaging structure as described in claim 1, characterized in that, The thermal conductivity of the heat dissipation body is greater than 5000w / mk.
4. The semiconductor packaging structure as described in claim 1, characterized in that, The heat dissipation component includes a heat pipe, a first heat dissipation plate, and a second heat dissipation plate. The heat pipe has a straight pipe section and a bent section provided at the end of the straight pipe section. The straight section of the heat pipe passes through the first heat sink to form a first heat sink-shaped structure, and the first heat sink-shaped structure serves as the heat sink body. The end tubes of the bent portion away from the straight portion are respectively inserted into the second heat dissipation plate to form a second heat dissipation plate-like structure, and the second heat dissipation plate-like structure serves as the heat dissipation support.
5. The semiconductor packaging structure as described in claim 4, characterized in that, The straight pipe section has a bend at each end, and there are two second heat dissipation plates. The two bends and the two second heat dissipation plates correspond to form two heat dissipation branches.
6. The semiconductor packaging structure as described in claim 4, characterized in that, The heat pipe has a "U" shaped structure.
7. The semiconductor packaging structure as described in claim 4, characterized in that, The heat pipes are multiple, and the first heat sink and the second heat sink are respectively provided with multiple mounting holes. The multiple heat pipes are inserted through the mounting holes onto the first heat sink and the second heat sink.
8. A semiconductor packaging structure as described in claim 4, characterized in that, The heat pipe is a copper pipe, and the copper pipe contains a heat dissipation medium.
9. A semiconductor packaging structure as described in claim 4, characterized in that, The first heat sink is a metal plate, and the second heat sink is a metal plate.
10. A semiconductor packaging structure as described in claim 4, characterized in that, It also includes an external heat sink, which is connected to the second heat sink plate of the heat sink component; The first heat sink is a flat plate structure adapted to the first component and the chip structure; The second heat sink is a plate-shaped structure adapted to the shape of the external heat sink.
11. A semiconductor packaging structure as described in claim 1, characterized in that, The heat dissipation component includes a heat dissipation strip, a first heat dissipation plate, and a second heat dissipation plate. The heat dissipation strip has a straight tube portion and a bent portion disposed at the end of the straight tube portion. The straight section of the heat sink passes through the first heat sink to form a first heat sink-shaped structure, and the first heat sink-shaped structure serves as the heat sink body. The end tubes of the bent portion away from the straight portion are respectively inserted into the second heat dissipation plate to form a second heat dissipation plate-like structure, and the second heat dissipation plate-like structure serves as the heat dissipation support.
12. The semiconductor packaging structure as described in claim 1, characterized in that, It also includes a thermally conductive layer, which is disposed between the heat dissipation body and the chip structure, and between the heat dissipation body and the first component.
13. The semiconductor packaging structure as described in claim 12, characterized in that, The thermally conductive layer is a thermally conductive silicone grease layer, a thermally conductive gel layer, or a thermally conductive adhesive layer.
14. A semiconductor packaging structure as described in claim 1, characterized in that, The first component includes a heat dissipation area and an electrical connection area, wherein the electrical connection area is connected to the heat dissipation area and protrudes from the heat dissipation area; The first component is disposed on the first surface of the heat dissipation body through the heat dissipation area; The electrical connection area is used for electrical connection with the substrate of the chip packaging structure.
15. A semiconductor packaging structure as described in claim 14, characterized in that, The substrate has metal connecting posts for electrical connection with the first component.
16. The semiconductor packaging structure as described in claim 15, characterized in that, The electrical connection area has pins that are connected to the metal connection posts.
17. A semiconductor packaging structure as described in claim 15, characterized in that, The metal connecting column is a copper column.
18. A semiconductor packaging structure as described in claim 1, characterized in that, The chip structure is flip-chip mounted on the substrate.
19. A semiconductor packaging structure as described in claim 1, characterized in that, The chip structure can be a single chip, a stacked chip structure, or a pre-packaged chip structure.
20. A semiconductor packaging structure as described in claim 1, characterized in that, The substrate surface is filled with molding compound and exposes the surface of the chip structure facing away from the substrate.