Split type solder ball mold

Abstract

The utility model discloses a split type solder ball mould, include: the bottom plate of superposition setting, forming block and shell, bottom plate, forming block and shell can be dismantled and install the mould body with forming cavity, forming block sets up in the shell inside, and the bottom plate, forming block and shell center insert and set up the thimble, the utility model discloses a solder ball mould is set into split type structure, and the forming block of shell inside installation only needs to replace the corresponding model forming block after wearing, need not integral replacement mould, convenient to use, save the cost.

Description

Technical Field

[0001] This utility model relates to the field of mold technology, specifically to a split-type solder ball mold. Background Technology

[0002] Solder balls are spherical components formed by melting molten solder in a mold. They are mostly made of tin-lead alloys or lead-free tin-silver-copper alloys, possessing good electrical and thermal conductivity and solderability, and are widely used in electronics manufacturing, semiconductor packaging, and precision industries. In the solder ball production process, molten solder is heated to a high temperature and then injected into a corresponding mold. The molded material is then cooled and solidified to form solder balls of the required specifications.

[0003] In actual production, due to the solidification and shrinkage of molten solder within the mold, the mechanical pulling during demolding, and the high-frequency contact between the solder balls and the mold forming surface during repeated production, continuous and significant frictional losses occur between them. As production batches increase, this friction causes scratches, dents, and other wear phenomena on the mold surface, directly leading to deviations in key dimensional parameters such as the diameter and roundness of the formed solder balls from the standard range. This, in turn, affects the finished solder ball yield rate. To ensure product quality, frequent replacement of the entire mold is required, resulting in high production costs. Utility Model Content

[0004] The purpose of this utility model is to provide a split-type solder ball mold in order to solve the above problems.

[0005] To achieve the above objectives, this utility model specifically adopts the following technical solution, including:

[0006] A base plate, a forming block, and a shell are stacked together, and the base plate, forming block, and shell are detachably installed to form a mold body with a forming cavity;

[0007] The molding block is disposed inside the outer shell, and a pin is inserted into the center of the base plate, the molding block, and the outer shell.

[0008] As a further description of the above technical solution, the bottom plate has mounting holes along its edge, and the mounting holes are arranged in 4-6 sets.

[0009] As a further description of the above technical solution, the base plate has an insertion groove at its center, and a pin passes through the insertion groove.

[0010] As a further description of the above technical solution, the outer shell edge is provided with mounting grooves, and the mounting grooves are provided in 4-6 sets.

[0011] As a further description of the above technical solution, the outer shell has a receiving cavity at its center, and a molding block is installed in the receiving cavity.

[0012] As a further description of the above technical solution, the receiving cavity has an overlapping groove on the side near the bottom plate, and an arc-shaped groove on the side away from the bottom plate.

[0013] As a further description of the above technical solution, a fixing groove is provided on one side of the outer shell.

[0014] As a further description of the above technical solution, a molding cavity is provided at one end of the center of the molding block, and the molding cavity is hemispherical.

[0015] As a further description of the above technical solution, an ejection cavity is provided at the other end of the center of the molding block, and the ejection cavity is connected to the bottom of the molding cavity.

[0016] As a further description of the above technical solution, the end of the molding block near the bottom plate is provided with an overlap edge, and the outer contour of the overlap edge fits with the inner contour of the overlap groove.

[0017] The beneficial effects of this utility model are as follows:

[0018] In this invention, the solder ball mold is designed as a split structure, with the base plate, molding block and outer shell being detachable and installable to form a mold body with molding cavity. After the molding block installed inside the outer shell is worn, only the corresponding model molding block needs to be replaced, without the need to replace the entire mold, which is convenient to use and saves costs.

[0019] To more clearly illustrate the structural features and functions of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the split solder ball mold of this utility model;

[0021] Figure 2 This is an exploded view of the split-type solder ball mold of this utility model;

[0022] Figure 3 This is the front view of the split solder ball mold of this utility model;

[0023] Figure 4 yes Figure 3 Front view of the base plate and ejector pin;

[0024] Figure 5 yes Figure 3 Front view of the medium-sized block;

[0025] Figure 6 yes Figure 3 Front view of the inner shell.

[0026] Figure label:

[0027] 1. Base plate; 11. Mounting hole; 12. Insertion slot; 2. Molding block; 21. Molding cavity; 22. Ejection cavity; 23. Overlap edge; 3. Outer shell; 31. Mounting slot; 32. Receiving cavity; 33. Overlap slot; 34. Arc groove; 35. Fixing slot; 4. Ejector pin. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0029] like Figures 1-6 As shown, in one embodiment, a split solder ball mold includes: a base plate 1, a molding block 2, and a shell 3 stacked together.

[0030] The molding block 2 is located inside the outer shell 3, and ejector pins 4 are correspondingly inserted on the central axis of the base plate 1, molding block 2, and outer shell 3. It can be understood that the split-design base plate 1, molding block 2, and outer shell 3 can be detachably installed to form a mold body with a molding cavity 21. After the molding block 2 installed inside the outer shell 3 wears out, only the corresponding model of molding block 2 needs to be replaced, without replacing the entire mold. This can meet the production needs of different specifications of solder balls, while the split structure facilitates the individual disassembly, maintenance, and replacement of the molding block 2, effectively reducing the overall maintenance cycle and production cost of the mold.

[0031] Please continue reading. Figures 1-6 In this embodiment, a cylindrical insertion groove 12 is provided in the center of the base plate 1, and an ejector pin 4 is inserted through the insertion groove 12 to provide a stable through channel for the ejector pin 4, ensuring that the ejector pin 4 can move stably along the vertical axis during the demolding process.

[0032] The base plate 1 has mounting holes 11 along its edge, and the outer shell 3 has corresponding mounting grooves 31 along its edge, allowing the base plate 1 and the outer shell 3 to be securely installed using detachable connectors such as locating pins and bolts. Specifically, there are 4-6 sets of mounting holes 11 and mounting grooves 31 arranged in a ring around the base plate 1.

[0033] Furthermore, the outer shell 3 has a receiving cavity 32 at its center, and the forming block 2 is installed in the receiving cavity 32. Specifically, the receiving cavity 32 has an overlapping groove 33 on the side near the base plate 1, which can tightly abut against the edge of the forming block 2 during mold assembly, and achieve precise positioning of the forming block 2 through mechanical limiting to prevent displacement during the injection of molten solder; while the receiving cavity 32 has an arc-shaped groove 34 on the side away from the base plate 1, which can effectively guide the high-temperature molten solder to flow smoothly into the forming block 2 in a laminar flow state, reducing bubbles and forming defects; in addition, a fixing groove 35 is provided on the outside of one side of the outer shell 3, so that the assembled mold body can be quickly and accurately installed on the corresponding station of the automated production line by a fixture.

[0034] Please continue reading. Figures 1-6 In this embodiment, a molding cavity 21 is provided at one end of the center of the molding block 2, and the molding cavity 21 is hemispherical to ensure that the surface of the molded solder ball is smooth and the roundness meets the standard; correspondingly, an ejection cavity 22 is provided at the other end of the center of the molding block 2, and the ejection cavity 22 is connected to the bottom of the molding cavity 21, which not only ensures that the ejector pin 4 can move smoothly, but also prevents the molten solder from seeping into the ejection cavity 22 during the molding process.

[0035] Furthermore, the molding block 2 is provided with an overlap edge 23 at one end near the base plate 1, and the outer contour of the overlap edge 23 fits with the inner contour of the overlap groove 33. This not only effectively fixes the molding block 2 and prevents it from shifting during the molten solder injection and cooling process, but also forms a good sealing effect to prevent molten solder from leaking from the joint.

[0036] Understandably, during assembly, the molding block 2 is first placed in the receiving cavity 32 at the center of the outer shell 3. Then, the overlapping edge 23 of the molding block 2 precisely fits into the overlapping groove 33 on the side of the receiving cavity 32 near the base plate 1, ensuring that the molding block 2 is stable and accurately positioned, preventing displacement during subsequent operations. Next, the ejector pin 4 is passed through the insertion groove 12 at the center of the base plate 1, at which point one end of the ejector pin 4 extends into the ejection cavity 22 of the molding block 2. Finally, the outer shell 3 containing the molding block 2 is aligned with the base plate 1, so that the mounting holes 11 on the edge of the base plate 1 and the mounting grooves 31 on the edge of the outer shell 3 correspond one-to-one. Bolts are then passed through the mounting holes 11 and the mounting grooves 31 in sequence and tightened to fix the mold body, completing the assembly of the mold body. After assembly, the mold body can be installed on the corresponding station using a clamp through the fixing groove 35 on one side of the outer shell 3, ready for production.

[0037] Working principle: After the mold is installed in place, the high-temperature molten solder is injected from the arc groove 34 on the side of the outer shell 3 away from the base plate 1. After the solder cools and solidifies in the molding cavity 21 to form solder balls, the ejector pin 4 is driven by the cylinder and other equipment to eject the solder balls in the molding cavity 21 and demold them.

[0038] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A split-type solder ball mold, characterized in that, include: The base plate (1), molding block (2) and shell (3) are stacked together, and the base plate (1), molding block (2) and shell (3) can be detachably installed to form a mold body with molding cavity (21); The molding block (2) is disposed inside the outer shell (3), and a pin (4) is inserted into the center of the base plate (1), the molding block (2) and the outer shell (3).

2. The split-type solder ball mold according to claim 1, characterized in that, The base plate (1) has mounting holes (11) along its edge, and the mounting holes (11) are arranged in 4-6 sets.

3. The split-type solder ball mold according to claim 2, characterized in that, The base plate (1) has an insertion groove (12) in the center, and a pin (4) is inserted through the insertion groove (12).

4. The split-type solder ball mold according to claim 1, characterized in that, The outer shell (3) has a mounting groove (31) along its edge, and the mounting groove (31) is provided in 4-6 sets.

5. The split-type solder ball mold according to claim 4, characterized in that, The outer shell (3) has a receiving cavity (32) in the center, and a molding block (2) is installed in the receiving cavity (32).

6. The split-type solder ball mold according to claim 5, characterized in that, The receiving cavity (32) has an overlapping groove (33) on the side near the bottom plate (1), and an arc groove (34) on the side away from the bottom plate (1).

7. The split-type solder ball mold according to claim 5, characterized in that, A fixing groove (35) is provided on one side of the outer shell (3).

8. The split-type solder ball mold according to claim 1, characterized in that, The molding block (2) has a molding cavity (21) at one end of its center, and the molding cavity (21) is hemispherical.

9. The split-type solder ball mold according to claim 8, characterized in that, The molding block (2) has an ejection cavity (22) at the other end of its center, and the ejection cavity (22) is connected to the bottom of the molding cavity (21).

10. The split-type solder ball mold according to claim 8, characterized in that, The molding block (2) has an overlap edge (23) at one end near the base plate (1), and the outer contour of the overlap edge (23) fits the inner contour of the overlap groove (33).

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