A laser cleaning device

By combining the laser removal component and the telescopic cleaning component of the laser cleaning device, the problem of difficult removal of particulate matter in the microgrooves of the carrier plate is solved, achieving efficient cleaning of the carrier plate and improving the production quality and efficiency of photovoltaic products.

CN224323739UActive Publication Date: 2026-06-05SHENZHEN AIPYANG LASER TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN AIPYANG LASER TECHNOLOGY CO LTD
Filing Date
2025-05-29
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Existing liquid cleaning methods cannot effectively remove particulate matter from the microgrooves of the carrier plate, which affects the production quality and efficiency of photovoltaic products.

Method used

A laser cleaning device is used, in which a laser is emitted through the laser removal component and passes through the carrier plate. Combined with the telescopic cleaning component and cleaning fluid, the carrier plate is cleaned. The laser energy breaks down impurities in the micro-grooves, and the movement of the telescopic cleaning component achieves thorough cleaning.

Benefits of technology

It effectively removes impurities from the microgrooves of the carrier plate, avoiding adverse effects on subsequent transfer processes and improving the production quality and efficiency of photovoltaic products.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to photovoltaic printing equipment cleaning technical field especially, relate to a kind of laser cleaning device, including carrying assembly, telescopic cleaning component and laser cleaning component;Carrying assembly is provided with at least one working station;Telescopic cleaning component is set with the side of the carrying assembly, the telescopic cleaning component is provided with the containing bin of one side opening;Wherein, the laser cleaning component emits example laser by laser emission port, the example laser can pass through the example carrier plate placed in the working station, extends to the telescopic cleaning component.
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Description

Technical Field

[0001] This utility model relates to the field of cleaning technology for photovoltaic printing equipment, and in particular to a laser cleaning device. Background Technology

[0002] In the manufacturing process of the photovoltaic industry, a transfer operation is required using a carrier plate. Because the carrier plate has a large number of microgrooves, large particles can easily remain in the microgrooves during the use of the carrier plate.

[0003] Existing liquid cleaning methods are ineffective at removing particulate matter from the microgrooves of the carrier plate. The presence of these particulate matter can negatively impact subsequent transfer processes, such as causing quality issues like grid breakage, severely affecting the production quality and efficiency of photovoltaic products.

[0004] Therefore, there is an urgent need for a device that can effectively clean particulate matter in the microgroove of a carrier plate. Utility Model Content

[0005] In order to overcome the shortcomings of existing technologies that cannot effectively remove particulate matter from the microgrooves of the carrier plate, thus affecting the production quality and efficiency of photovoltaic products, this utility model provides a laser cleaning device.

[0006] Technical solution: A laser cleaning device, such as Figure 1-8 As shown, the device includes a mounting component, a telescopic cleaning component, and a laser cleaning component. The mounting component has at least one working station. The telescopic cleaning component is located on one side of the mounting component and has a receiving compartment with an opening on one side. The laser cleaning component is located on one side of the mounting component and has a laser emission port that faces the opening of the receiving compartment of the telescopic cleaning component from a third-party perspective. The working station is located between the laser cleaning component and the telescopic cleaning component. The laser cleaning component emits an example laser through the laser emission port. The example laser can pass through an example carrier plate placed at the working station and extend to the telescopic cleaning component. The telescopic cleaning component can drive the receiving compartment to move towards the working station and clean the example carrier plate placed at the working station.

[0007] Further explanation: the mounting component includes a drive unit and a platform: the working part of the drive unit is connected to the platform, and the platform is provided with at least one working station; the platform is located between the laser emission port of the laser cleaning component and the telescopic cleaning component; wherein, the drive unit can drive the platform to rotate so that the working station covers or moves away from the telescopic cleaning component.

[0008] To further explain, there are at least four workstations, and several of these workstations are arranged in a ring array around the center of the platform from a third-party perspective.

[0009] Further explanation: the telescopic cleaning assembly includes a telescopic component and a cleaning box; the telescopic component is disposed on one side of the driving component and is provided with a vibrating component; the cleaning box is connected to the telescopic part of the telescopic component and has a receiving compartment with an opening on one side; wherein, the receiving compartment of the cleaning box can be filled with cleaning fluid, and the telescopic component can drive the cleaning box to move in a third direction so that the cleaning fluid in the receiving compartment wets the example carrier plate.

[0010] To further explain, the laser cleaning assembly includes an optical path plate, a laser, a galvanometer, and a field lens; the optical path plate is disposed on one side of the telescopic member, the optical path plate is connected to the laser, the laser is connected to the galvanometer and the field lens, the field lens is provided with a laser emission port, and the laser emission port faces the opening of the cleaning box receiving compartment from a third-party perspective.

[0011] The beneficial effects of this utility model are as follows: The laser removal component of this utility model avoids the problem that the existing technology cannot effectively remove the sample impurities in the microgrooves of the sample carrier. These sample impurities remaining on the sample carrier will have an adverse effect on the subsequent transfer work of the sample carrier, such as causing quality problems such as grid breakage in the transfer process, which seriously affects the production quality and efficiency of photovoltaic products. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of the laser cleaning device of this utility model.

[0013] Figure 2 This is a schematic diagram of the mounting component and telescopic cleaning component structure of the laser cleaning device of this utility model;

[0014] Figure 3 This is an exploded view of the component structure of the laser cleaning device of this utility model.

[0015] Figure 4 This is a schematic diagram of the platform structure disclosed in the laser cleaning device of this utility model;

[0016] Figure 5 This is a schematic diagram of the working state of the mounting components of the laser cleaning device of this utility model;

[0017] Figure 6 This is a schematic diagram of the telescopic cleaning component structure disclosed in the laser cleaning device of this utility model;

[0018] Figure 7 This is a schematic diagram of the laser cleaning component structure disclosed in the laser cleaning device of this utility model;

[0019] Figure 8 This is a diagram showing the working state of the laser cleaning device of this utility model.

[0020] The markings in the attached diagram are: mounting component (01), telescopic cleaning component (02), laser cleaning component (03), drive component (111), platform (112), and working station (011).

[0021] Region 1 (a), Region 2 (b), Region 3 (c), Region 4 (d)

[0022] Telescopic component (211), cleaning box (212)

[0023] Optical circuit board (311), laser (312), galvanometer (313), field lens (314)

[0024] Example carrier (001), example impurity (002), example laser (003)

[0025] First direction (y), second direction (x), third direction (z). Detailed Implementation

[0026] The present invention will be further described below with reference to specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention, but are not intended to limit the present invention.

[0027] Example 1

[0028] A laser cleaning device, such as Figure 1-8 As shown, it includes a mounting component 01, a telescopic cleaning component 02, and a laser removal component 03;

[0029] It is equipped with component 01 and has at least one working station 011;

[0030] Telescopic cleaning component 02 is disposed on one side of the mounting component 01, and the telescopic cleaning component 02 is provided with a receiving compartment with an opening on one side;

[0031] A laser cleaning component 03 is disposed on one side of the mounting component 01. The laser cleaning component 03 is provided with a laser emission port, which faces the opening of the receiving chamber of the telescopic cleaning component 02 from a third-direction z-angle.

[0032] The working station 011 is located between the laser cleaning component 03 and the telescopic cleaning component 02;

[0033] The laser cleaning component 03 emits an example laser 003 through a laser emission port. This example laser 003 can pass through the example carrier plate 001 placed at the working station 011 and extend to the telescopic cleaning component 02.

[0034] The telescopic cleaning component 02 can drive the receiving chamber to move toward the work station 011 and clean the example carrier plate 001 placed at the work station 011.

[0035] Before operation, the cleaning fluid is poured into the receiving chamber of the telescopic cleaning component 02, and then the example carrier plate 001 is installed at the working station 011.

[0036] At this point, the telescopic cleaning component 02 begins to operate, moving the cleaning fluid in the container towards the working station 011 until the container of the telescopic cleaning component 02 moves to the preset position. The working station 011 is located between the laser removal component 03 and the cleaning component 02.

[0037] At this point, the cleaning fluid inside the telescopic cleaning assembly 02 can soak the example carrier plate 001 on the work station 011, and then the soaked example carrier plate 001 is cleaned by the telescopic cleaning assembly 02.

[0038] However, simply cleaning the sample carrier 001 with cleaning fluid cannot effectively remove the sample impurities 002 in the microgrooves of the sample carrier 001. These sample impurities 002 remaining in the sample carrier 001 will have an adverse effect on the subsequent transfer work of the sample carrier 001, such as causing quality problems such as grid breakage in the transfer process, which seriously affects the production quality and efficiency of photovoltaic products.

[0039] Therefore, this device is also equipped with a laser cleaning component 03. When the cleaning fluid wets the example carrier plate 001, the laser cleaning component 03 starts to work and emits an example laser 003 from its laser emission port. Figure 8 As shown, the example laser 003 passes through the example carrier plate 001 and irradiates the example impurity 002. The example laser 003 breaks the example impurity 002 in the microgroove of the example carrier plate 001 with its preset wavelength energy. In this way, the broken impurity is generated, which enables the telescopic cleaning component 02 to clean the example carrier plate 001 more quickly and thoroughly.

[0040] Example 2

[0041] Based on the above embodiment 1, as follows Figures 2-8 As shown

[0042] The mounting component 01 includes a drive component 111 and a platform 112;

[0043] The driving component 111 is connected to a platform 112, and the platform 112 is provided with at least one of the working stations 011.

[0044] The platform 112 is located between the laser emission port of the laser cleaning component 03 and the telescopic cleaning component 02.

[0045] The drive unit 111 can drive the platform 112 to rotate so that the work station 011 covers or moves away from the telescopic cleaning assembly 02.

[0046] At least four workstations 011 are provided, and several of the workstations 011 are arranged in a ring array around the center of the stage 112 from a third-direction z-view.

[0047] The telescopic cleaning assembly 02 includes a telescopic component 211 and a cleaning box 212;

[0048] Telescopic member 211 is disposed on one side of the driving member 111, and the telescopic member 211 is provided with a vibrating element.

[0049] The cleaning box 212 is connected to the telescopic part of the telescopic component 211, and the cleaning box 212 has a receiving compartment with an opening on one side.

[0050] The cleaning box 212 can hold cleaning fluid, and the telescopic member 211 can move the cleaning box 212 along a third direction z so that the cleaning fluid in the holding chamber can wet the example carrier plate 001.

[0051] The laser removal assembly 03 includes an optical path plate 311, a laser 312, a galvanometer 313, and a field lens 314;

[0052] An optical path plate 311 is disposed on one side of the telescopic member 211. The optical path plate 311 is connected to a laser 312. The laser 312 is connected to a galvanometer 313 and a field lens 314. The field lens 314 is provided with a laser emission port. The laser emission port faces the opening of the cleaning box 212's receiving compartment from a third-direction z-angle perspective.

[0053] Furthermore, in actual cleaning operations, the specific steps for example carrier 001 include at least the following:

[0054] Loading, that is, installing the sample carrier board 001 at work station 011;

[0055] Cleaning, that is, cleaning the example carrier plate 001 by means of the cooperation of the telescopic cleaning component 02 and the laser removal component 03, to obtain a clean carrier plate;

[0056] Testing involves using external testing equipment to check whether the cleaned carrier plate is clean enough to determine if it meets the usage standards. If it does, it is determined to be a qualified carrier plate.

[0057] Unloading involves removing qualified carrier plates from the device and putting them into subsequent production processes.

[0058] Therefore, in order to make the actual cleaning work of the example carrier 001 more consistent and efficient, the workstation 011 is equipped with at least four stations.

[0059] Taking workstation 011 with four workstations as an example, such as Figure 4 As shown, let the first area a of the platform 112 be the loading area, the second area b of the platform 112 be the cleaning area, the third area c of the platform 112 be the inspection area, and the fourth area d of the platform 112 be the unloading area.

[0060] Specifically, before operation, the cleaning fluid is loaded into the cleaning box 212.

[0061] Before operation, the device installs the example carrier plate 001 at workstation 011 in the loading area. Then, the drive unit 111 starts operating, rotating from a third-party z-angle perspective until the example carrier plate 001 rotates to the cleaning area. At this point, subsequent example carrier plates 001 are installed at workstation 011 in the loading area.

[0062] At this point, the telescopic component 211 begins to operate, driving the connected cleaning box 212 to move towards the example carrier plate 001 in the cleaning area until the cleaning fluid contained in the cleaning box 212 completely wets the example carrier plate 001.

[0063] Subsequently, the vibrating element installed on the telescopic component 211 begins to operate, driving the cleaning box 212 to clean the immersed sample carrier plate 001.

[0064] Simultaneously, field mirror 314 begins operation, and through the cooperation of optical path board 311, laser 312, and galvanometer 313, the example laser 003 is emitted from the laser emission port, such as... Figure 8 As shown, the example laser 003 passes through the example carrier plate 001 and irradiates the example impurity 002, breaking the example impurity 002 within the microgroove of the example carrier plate 001, thus obtaining a clean carrier plate.

[0065] Then, the drive unit 111 operates further, driving the stage 112 to rotate. The stage 112 drives the cleaning carrier plate to rotate towards the inspection area until the cleaning carrier plate moves to the preset position in the inspection area. At this time, the subsequent example carrier plate 001 is then installed at the work station 011 in the loading area.

[0066] Then, using a pre-set external testing device, the cleaning carrier plate on workstation 011 in the inspection area is cleaned and tested, thus obtaining the test carrier plate. The test carrier plate is divided into two types:

[0067] If the cleaned carrier plate meets the cleanliness standards, a qualified carrier plate is obtained, and a qualified signal is emitted by the external testing equipment.

[0068] If the cleaning carrier does not meet the cleaning standards, a substandard carrier is obtained, and an external testing device will issue a non-compliance signal.

[0069] The drive unit 111 then drives the stage 112 to rotate, and the stage 112 drives the detection plate to move towards the unloading area until the detection plate moves to the preset position in the unloading area. At this time, the subsequent example plate 001 is then installed at the working station 011 in the loading area.

[0070] Simultaneously, the detection carrier plates are removed from the unloading area using an external unloading device. Based on the pass or fail signals emitted by the external detection device, the detection carrier plates are distinguished. Passing carrier plates are put into actual use, while failing carrier plates continue to undergo cleaning.

[0071] In this way, the device completes one work cycle, and while the platform 112 is carrying the example carrier 001 to perform loading, cleaning, testing and unloading, the example carrier 001 subsequently installed on the platform 112 is also working synchronously. This makes the device more consistent and more efficient in processing the example carrier 001.

[0072] It should be understood that the above description is for illustrative purposes only and is not intended to limit the present invention. Those skilled in the art will understand that variations of the present invention will be included within the scope of the claims herein.

Claims

1. A laser cleaning device, characterized in that: It includes a mounting component (01), a telescopic cleaning component (02), and a laser removal component (03). The component (01) is equipped with at least one workstation (011). A telescopic cleaning component (02) is disposed on one side of the mounting component (01), and the telescopic cleaning component (02) is provided with a receiving compartment with an opening on one side; A laser cleaning component (03) is disposed on one side of the mounting component (01). The laser cleaning component (03) is provided with a laser emission port, which faces the opening of the receiving chamber of the telescopic cleaning component (02) from a third-direction (z) perspective. The working station (011) is located between the laser cleaning component (03) and the telescopic cleaning component (02); The laser cleaning component (03) emits an example laser (003) through a laser emission port. The example laser (003) can pass through the example carrier plate (001) placed at the work station (011) and extend to the telescopic cleaning component (02). The telescopic cleaning assembly (02) can drive the receiving chamber to move toward the work station (011) and clean the sample carrier plate (001) placed at the work station (011).

2. The laser cleaning device according to claim 1, characterized in that: The mounting component (01) includes a drive unit (111) and a platform (112). The driving component (111) is connected to a platform (112) at its working part, and the platform (112) is provided with at least one of the aforementioned working stations (011). The platform (112) is located between the laser emission port of the laser cleaning component (03) and the telescopic cleaning component (02). The drive unit (111) can drive the platform (112) to rotate so that the work station (011) covers or moves away from the telescopic cleaning assembly (02).

3. The laser cleaning device according to claim 2, characterized in that: The workstations (011) are provided in at least four ways, and a number of the workstations (011) are arranged in a ring array around the center of the stage (112) from a third-direction (z) perspective.

4. The laser cleaning device according to claim 2, characterized in that: The telescopic cleaning assembly (02) includes a telescopic component (211) and a cleaning box (212). A telescopic member (211) is disposed on one side of the driving member (111), and the telescopic member (211) is provided with a vibrating member; A cleaning box (212) is connected to the telescopic part of the telescopic component (211), and the cleaning box (212) has a receiving compartment with an opening on one side. The cleaning box (212) can hold cleaning fluid, and the telescopic member (211) can move the cleaning box (212) along a third direction (z) so that the cleaning fluid in the holding chamber can wet the example carrier plate (001).

5. The laser cleaning device according to claim 4, characterized in that: The laser removal assembly (03) includes an optical path plate (311), a laser (312), a galvanometer (313), and a field lens (314). An optical path plate (311) is disposed on one side of the telescopic member (211). The optical path plate (311) is connected to a laser (312). The laser (312) is connected to a galvanometer (313) and a field lens (314). The field lens (314) is provided with a laser emission port. The laser emission port faces the opening of the cleaning box (212) compartment from a third-party z-angle perspective.