Three-chamber housing device

By using a three-chamber casing design and a chimney-style heat dissipation structure, the problems of low heat dissipation efficiency and high height of existing computer casings are solved. This allows for independent heat dissipation and the inclusion of transparent side panels, improving the heat dissipation efficiency and aesthetic appeal of the computer casing.

CN224328382UActive Publication Date: 2026-06-05CORSAIR MEMORY INC(US)
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CORSAIR MEMORY INC(US)
Filing Date
2025-05-15
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Current computer case designs suffer from low heat dissipation efficiency, cannot form a chimney-style heat dissipation structure, cannot include transparent side panels, and are relatively tall, affecting the heat dissipation of computer components and their appearance.

Method used

It adopts a three-chamber chassis design, which divides the interior of the chassis into independent first, second and third chambers through an isolation structure, housing the central processing unit, graphics processor and power supply respectively. Each chamber is equipped with a chimney-style heat dissipation structure, which utilizes the rising characteristics of hot air for heat dissipation, while allowing for the installation of transparent side panels.

Benefits of technology

It features an independent chimney-style heat dissipation structure, which improves heat dissipation efficiency, reduces the height of the chassis, and allows for transparent side panels to display internal components, meeting the heat dissipation and appearance requirements of modern computer chassis.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224328382U_ABST
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Abstract

A three-cavity casing device includes a casing unit, a partition unit, and a cavity unit. The casing unit includes a front side panel, a rear side panel, a left side panel, a right side panel, a bottom side structure, and a top side structure. The partition unit includes a partition structure arranged in the casing unit. The partition structure is connected with the front side panel, the rear side panel, and the right side panel, and extends longitudinally to the bottom side structure and the top side structure. The cavity unit is arranged in the casing unit and includes a first cavity, a second cavity, and a third cavity. The partition structure separates the first cavity, the second cavity, and the third cavity to accommodate different computer components. Thus, transparent side panels can be arranged, the overall height of the casing can be reduced, and a chimney heat dissipation structure can be arranged in the multi-space casing.
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