Fireproof coating protects high temperature-resistant and flame-resistant PCB

Abstract

The utility model provides a kind of fireproof coating protection high temperature-resistant flame-retardant PCB board, especially relate to the field of flame-retardant PCB board.To solve the problem of the high temperature-resistant flame-retardant PCB board in prior art, poor flame-retardant performance, when encountering fire source, unable to slow down or stop the spread of flame, improve the risk of fire occurrence, and poor high temperature resistance, will cause the decline of electrical performance and mechanical performance due to high temperature, shorten the service life of PCB board.Problems include:PCB board body, the PCB board body includes epoxy glass cloth substrate, the surface of the epoxy glass cloth substrate is provided with adhesive layer, the surface of the adhesive layer is provided with top layer, and the epoxy glass cloth substrate includes copper-clad plate material layer.Compared with the original PCB board, the PCB board has good flame-retardant performance, can slow down or stop the spread of flame when encountering fire source, reduces the risk of fire occurrence, and has good high temperature resistance, will not cause the decline of electrical performance and mechanical performance due to high temperature, thereby avoiding equipment failure, prolonging the service life of PCB board.

Description

Technical Field

[0001] This utility model relates to devices in the field of fire-resistant PCB boards, and more particularly to a fire-retardant coating for protecting high-temperature-resistant fire-resistant PCB boards. Background Technology

[0002] Circuit boards are named as follows: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed circuit board (copper etching technology), etc. PCB boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout.

[0003] Currently available high-temperature resistant and flame-retardant PCBs have poor flame-retardant properties. When exposed to a fire source, they cannot slow down or prevent the spread of flames, increasing the risk of fire. In addition, their poor high-temperature resistance will cause a decline in electrical and mechanical properties due to high temperatures, shortening the service life of the PCBs. Utility Model Content

[0004] The purpose of this invention is to provide a fire-retardant coating for protecting high-temperature resistant and flame-retardant PCB boards. This addresses the problems of existing high-temperature resistant and flame-retardant PCB boards, which have poor flame-retardant properties, failing to slow or prevent the spread of flames when exposed to a fire source, thus increasing the risk of fire. Furthermore, their poor high-temperature resistance leads to a decline in electrical and mechanical properties due to high temperatures, shortening the PCB board's lifespan. The various technical effects of the preferred solutions provided by this invention are detailed below.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] This utility model provides a fire-resistant coating for a high-temperature resistant and flame-retardant PCB board, comprising: a PCB board body, the PCB board body including an epoxy fiberglass cloth substrate, an adhesive layer disposed on the surface of the epoxy fiberglass cloth substrate, a top layer disposed on the surface of the adhesive layer, the epoxy fiberglass cloth substrate including a copper-clad laminate material layer, an organic polymer material layer disposed on the surface of the copper-clad laminate material layer, an insulating layer disposed on the surface of the organic polymer material layer, the top layer including a glass fiber layer, an external circuit layer disposed on the surface of the glass fiber layer, a soldering layer disposed on the surface of the external circuit layer, and a coating layer disposed on the surface of the soldering layer.

[0007] Preferably, the PCB board body has fixing through holes around its upper perimeter.

[0008] Preferably, the thickness of the copper clad laminate material layer is less than the thickness of the organic polymer material layer.

[0009] Preferably, the thickness of the copper clad laminate material layer is 0.9mm-2.2mm.

[0010] Preferably, the outer surface of the glass fiber layer is bonded to the inner surface of the outer circuit layer.

[0011] Preferably, the outer surface of the outer circuit layer is bonded to the inner surface of the solder layer, and the outer surface of the solder layer is bonded to the inner surface of the coating layer.

[0012] The beneficial effects of the fireproof coating protection high temperature resistance and flame retardant PCB board provided by this utility model are as follows: Compared with the original PCB board, this PCB board has better flame retardant performance, which can slow down or prevent the spread of flames when it encounters a fire source, reducing the risk of fire. In addition, it has good high temperature resistance, and its electrical and mechanical properties will not decline due to high temperature, thereby avoiding equipment failure and extending the service life of the PCB board. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of a fire-resistant coating for protecting a high-temperature-resistant and flame-retardant PCB board, according to this utility model.

[0014] Figure 2 This is a schematic diagram of the PCB board body structure of a fireproof coating-protected high-temperature resistant and flame-retardant PCB board according to this utility model.

[0015] Figure 3 This is a schematic diagram of the epoxy fiberglass cloth substrate structure for fire-resistant coating protection of a high-temperature resistant and flame-retardant PCB board according to this utility model.

[0016] Figure 4 This is a schematic diagram of the top layer structure of a fire-resistant coating for protecting a high-temperature-resistant and flame-retardant PCB board, according to this utility model.

[0017] In the diagram: 1. PCB board body; 2. Epoxy fiberglass cloth substrate; 201. Copper clad laminate material layer; 202. Organic polymer material layer; 203. Insulating layer; 3. Adhesive layer; 4. Top layer; 401. Fiberglass layer; 402. External circuit layer; 403. Soldering layer; 404. Coating layer; 5. Fixing through hole. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0019] The specific embodiments of this utility model are described in detail below with reference to the accompanying drawings. In the drawings, the same reference numerals indicate the same or corresponding technical features. The drawings are for illustrative purposes only and are not necessarily drawn to scale.

[0020] See Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown in the figure, a fire-resistant coating protects a high-temperature resistant and flame-retardant PCB board, comprising: a PCB board body 1, the PCB board body 1 including an epoxy fiberglass cloth substrate 2, an adhesive layer 3 disposed on the surface of the epoxy fiberglass cloth substrate 2, a top layer 4 disposed on the surface of the adhesive layer 3, the epoxy fiberglass cloth substrate 2 including a copper clad laminate material layer 201, an organic polymer material layer 202 disposed on the surface of the copper clad laminate material layer 201, an insulating layer 203 disposed on the surface of the organic polymer material layer 202, and a glass fiber layer 401, an external circuit layer 402 disposed on the surface of the glass fiber layer 401, a soldering layer 403 disposed on the surface of the external circuit layer 402, and a coating layer 404 disposed on the surface of the soldering layer 403.

[0021] Furthermore, fixing through holes 5 are provided around the upper part of the PCB board body 1.

[0022] In this embodiment, the epoxy fiberglass cloth substrate 2 has high strength, good heat resistance and dielectric properties, and is widely used in products such as mobile communications, digital television, satellite and radar. Its flame retardant performance is certified by UL94 standard, usually reaching V-0 or V-1 level. When it encounters a fire source, it can slow down or prevent the spread of flames, thereby reducing the risk of fire and increasing the flame retardant performance of the PCB board body 1.

[0023] Furthermore, the thickness of the copper clad laminate material layer 201 is less than the thickness of the organic polymer material layer 202.

[0024] In this embodiment, the copper clad laminate material layer 201 mainly serves to interconnect, insulate, and support the PCB board body 1, which has a great influence on the signal transmission speed, energy loss, and characteristic impedance in the circuit. Therefore, it affects the performance, quality, manufacturability, manufacturing level, manufacturing cost, and long-term reliability and stability of the PCB board body 1.

[0025] Furthermore, the thickness of the copper clad laminate material layer 201 is 0.9mm-2.2mm.

[0026] In this embodiment, the organic polymer material layer 202 has high strength, good rigidity, impact strength that is 3-5 times that of BOPP film, and excellent wear resistance, folding resistance, pinhole resistance and tear resistance, etc., which increases the service life of the PCB board body 1.

[0027] Furthermore, the outer surface of the glass fiber layer 401 is bonded to the inner surface of the outer circuit layer 402.

[0028] In this embodiment, by setting the coating layer 404, a film that is usually colorless, transparent and glossy can now be colored by adding additive particles. It has excellent mechanical properties, high rigidity, hardness and toughness, puncture resistance, abrasion resistance, high and low temperature resistance, good chemical resistance, oil resistance, air tightness and aroma retention. It is one of the commonly used barrier composite film substrates, which increases the high temperature resistance and flame retardant properties of the PCB board body 1, and also increases the strength and life of the PCB board body 1.

[0029] Furthermore, the outer surface of the outer circuit layer 402 is bonded to the inner surface of the solder layer 403, and the outer surface of the solder layer 403 is bonded to the inner surface of the coating layer 404.

[0030] In this embodiment, the glass fiber layer 401 provides excellent heat and chemical resistance, enabling it to remain stable in high-temperature and chemical environments and ensuring that electronic devices can operate normally under various harsh conditions. This characteristic allows the PCB board body 1 to maintain its performance in high-temperature environments, extending the service life of electronic devices. It also has the advantages of good insulation, good corrosion resistance, and high mechanical strength, increasing the strength and service life of the PCB board body 1.

[0031] In use, the epoxy fiberglass cloth substrate 2 provides high strength, good heat resistance, and dielectric properties, making it widely used in mobile communications, digital television, satellite, and radar products. Its flame retardant performance is certified by UL94 standards, typically reaching V-0 or V-1 rating. When exposed to a fire source, it can slow or prevent the spread of flames, thus reducing the risk of fire and increasing the flame retardant performance of the PCB body 1. The copper-clad laminate material layer 201 primarily serves as an interconnect, insulation, and support layer for the PCB body 1, significantly impacting signal transmission speed, energy loss, and characteristic impedance in circuits. Therefore, the performance, quality, processability, manufacturing level, manufacturing cost, and long-term reliability and stability of the PCB body 1 are all affected. The organic polymer material layer 202 provides high strength, good rigidity, impact strength 3-5 times that of BOPP film, and excellent wear resistance, folding resistance, pinhole resistance, and tear resistance. The coating layer 404, which is usually a colorless, transparent, and glossy film, can now be colored by adding additive particles. It has excellent mechanical properties, high rigidity, hardness, and toughness, and is puncture-resistant, abrasion-resistant, and resistant to high and low temperatures. It also exhibits good chemical resistance, oil resistance, airtightness, and aroma retention, making it one of the commonly used barrier composite film substrates. This increases the high-temperature resistance and flame-retardant properties of the PCB board body 1. Furthermore, it increases the strength and lifespan of the PCB board body 1. The glass fiber layer 401 provides excellent heat and chemical resistance, maintaining stability in high-temperature and chemical environments, ensuring the normal operation of electronic devices under various harsh conditions. This characteristic allows the PCB board body 1 to maintain its performance even at high temperatures, extending the lifespan of electronic devices. It also has advantages such as good insulation, good corrosion resistance, and high mechanical strength, further increasing the strength and lifespan of the PCB board body 1.

[0032] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A fire-retardant coating for protecting high-temperature resistant and flame-retardant PCB boards, characterized in that, include: The PCB board body (1) includes an epoxy fiberglass cloth substrate (2), an adhesive layer (3) is disposed on the surface of the epoxy fiberglass cloth substrate (2), a top layer (4) is disposed on the surface of the adhesive layer (3), the epoxy fiberglass cloth substrate (2) includes a copper clad laminate material layer (201), an organic polymer material layer (202) is disposed on the surface of the copper clad laminate material layer (201), an insulating layer (203) is disposed on the surface of the organic polymer material layer (202), the top layer (4) includes a glass fiber layer (401), an external circuit layer (402) is disposed on the surface of the glass fiber layer (401), a solder layer (403) is disposed on the surface of the external circuit layer (402), and a coating layer (404) is disposed on the surface of the solder layer (403).

2. The fire-retardant coating for high-temperature resistant and flame-retardant PCB board according to claim 1, characterized in that: The PCB board body (1) has fixing through holes (5) around its upper end.

3. The fire-retardant coating for protecting high-temperature resistant and flame-retardant PCB board according to claim 1, characterized in that: The thickness of the copper clad laminate material layer (201) is less than the thickness of the organic polymer material layer (202).

4. The fire-retardant coating for protecting high-temperature resistant and flame-retardant PCB boards according to claim 1, characterized in that: The thickness of the copper clad laminate material layer (201) is 0.9mm-2.2mm.

5. The fire-retardant coating for high-temperature resistant and flame-retardant PCB board according to claim 1, characterized in that: The outer surface of the glass fiber layer (401) is bonded to the inner surface of the outer circuit layer (402).

6. The fire-retardant coating for high-temperature resistant and flame-retardant PCB board according to claim 1, characterized in that: The outer surface of the outer circuit layer (402) is bonded to the inner surface of the solder layer (403), and the outer surface of the solder layer (403) is bonded to the inner surface of the coating layer (404).

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