A multi-functional PCB adapter plate
By designing a multifunctional PCB adapter board, the problems of damage and resource waste during the circuit board verification process were solved, multi-chip adaptation and efficient soldering connection were achieved, and costs and damage risks were reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI HANGJIA ELECTRONICS TECH
- Filing Date
- 2025-04-11
- Publication Date
- 2026-06-05
AI Technical Summary
In existing technologies, circuit boards require frequent soldering and removal of components when verifying chip functions, which can easily lead to damage and waste of circuit boards. Furthermore, a single circuit board can only accommodate one type of chip, resulting in resource waste and high costs.
Design a multi-functional PCB adapter board with lead-out holes and copper traces to accommodate chips with various pin types. The clever copper trace design enables the soldering connection of various chips, avoiding frequent soldering that could damage the full-function circuit board.
It improves work efficiency, reduces resource waste and costs, can adapt to various chip sizes and specifications, and reduces the risk of circuit board damage.
Smart Images
Figure CN224329647U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to an electrical device, and more particularly to a PCB adapter board. Background Technology
[0002] When developing and designing circuit boards, researchers need to verify the performance of the chips, such as... Figure 1 As shown, the conventional approach is to solder the chip onto the PCB board for debugging. The existing technical solution is to draw a full-function circuit board, solder all the components onto it, and then repeatedly verify the various functions on the circuit board until each function achieves the design purpose.
[0003] While existing technologies can verify chip functionality, the verification process involves frequent soldering and removal of components and solder lines, inevitably damaging copper traces or pads and rendering the circuit board unusable. Localized damage can render an entire circuit board unusable, resulting in significant waste. Furthermore, a single circuit board can only accommodate one specific chip size, further contributing to waste. Different chip sizes require different circuit boards for debugging, leading to substantial costs. Utility Model Content
[0004] The technical problem to be solved by this utility model is to provide a multi-functional PCB adapter board with a unique structure. One adapter board can be adapted to solder chips with various pin types, and one adapter board can be used for chips with many different pin types, which greatly improves work efficiency.
[0005] To solve this technical problem, the technical solution adopted by this utility model is as follows:
[0006] A multifunctional PCB adapter board has a square main body. At least one plane of the adapter board has adapter lines. At least 44 lead-out holes are arranged around the perimeter of the four sides of the plane. A square chip soldering area is located in the center of the adapter board. The lead-out holes on the four sides are connected to the four sides of the chip soldering area by copper traces fixedly arranged on the surface of the adapter board. The copper traces are insulated outside the chip soldering area and exposed inside the chip soldering area. The number of copper traces connected to the four sides of the chip soldering area is the same. The copper traces entering the chip soldering area are arranged horizontally and vertically, with two sets of copper traces on opposite sides matched and aligned. The spacing between the parallel copper traces on each side of the chip soldering area is the same.
[0007] A square basic welding area is provided in the chip welding area, with eight copper traces corresponding to each side. The basic welding area can be used to weld 32-pin chips.
[0008] At least one pair of adjacent sides of the chip soldering area are not connected to the copper traces of the basic soldering area. The traces are paired up and terminated when they are about to meet without contacting each other. This is so that when a chip with more than 32 pins is placed in a suitable position in the chip soldering area, all its pins can be matched with the corresponding copper traces, thus achieving an effective soldering connection with the adapter board.
[0009] Furthermore, the basic welding area can be located at the corner of the chip welding area. On each of the two sides of the chip welding area that are close to the basic welding area, all the copper traces on each side extend inward to the same length. The basic welding area is matched with the first to eighth copper traces on the two sides starting from the corner.
[0010] Eight copper traces on each of the two sides of the chip soldering area that are far from the soldering base area are connected to the position that matches the soldering base area. Other copper traces that are not connected to the soldering base area are paired up, and the two pairs terminate the routing when they are about to meet without making contact.
[0011] Specifically, the adapter board is provided with 100 lead-out holes, and the number of copper traces connected to each side of the chip soldering area is 25, with a spacing of 0.5mm between the copper traces entering each side of the chip soldering area.
[0012] Furthermore, the basic welding area can also be located in a non-corner position within the chip welding area, and the copper traces matched by the basic welding area do not include the side end copper traces on the four sides of the chip welding area.
[0013] At this time, the edge of the chip welding area is divided into two groups of adjacent edges. The copper traces on each group of adjacent edges that are not connected to the welding base area are paired up in pairs. The two traces terminate the routing and do not come into contact when they are about to meet.
[0014] In this case, the number of copper traces connected to each side of the chip soldering area is an even number.
[0015] Specifically, the adapter board is provided with at least 64 lead-out holes, and the number of copper traces connected to each side of the chip soldering area is 16, with a spacing of 0.8mm between the copper traces entering each side of the chip soldering area.
[0016] Furthermore, the front side of the adapter board is provided with adapter lines.
[0017] Specifically, the adapter board may have 100 lead-out holes on both sides, with 25 copper traces connected to each side of the chip soldering area on the front side, and the spacing between the copper traces entering each side of the chip soldering area is 0.5mm.
[0018] The number of copper traces connected to each side of the chip soldering area on the reverse side is 16, and a total of 64 copper traces are connected to the 64 peripheral lead holes. The spacing between the copper traces entering each side of the chip soldering area is 0.8mm.
[0019] The adapter board of this invention, with its set of a certain number of leads and copper traces, and cleverly designed with various sets of copper traces in the chip soldering area, allows the adapter board to accommodate chips with various pin configurations, such as 32-pin and 44-pin. One adapter board can be used for chips with many different pin types. After the chip is matched and soldered onto the chip soldering area of the adapter board, the corresponding leads of the adapter board are connected to the full-function circuit board for testing and verification. Frequent soldering and desoldering during repeated verification will only damage the adapter board and not the full-function circuit board. This simplifies operation, saves costs, and allows one adapter board to accommodate chips of various sizes, greatly reducing costs and improving work efficiency.
[0020] If 100 copper traces are used and the copper trace spacing in the chip soldering area is 0.5mm, the connector board can solder 32-pin, 44-pin, 64-pin, 80-pin, and 100-pin chips.
[0021] If 64 copper traces are used and the copper trace spacing in the chip soldering area is 0.8mm, the connector board can solder 32-pin, 44-pin, and 64-pin chips.
[0022] When both sides of the adapter board are equipped with the above two types of adapter lines, the adapter board can support debugging and verification of eight types of chips. Attached Figure Description
[0023] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings, wherein:
[0024] Figure 1 This is a schematic diagram of the structure for testing chip-on-circuit board bonding in existing technology.
[0025] Figure 2 This is a schematic diagram of the structure of the multifunctional PCB adapter board of this utility model.
[0026] In the picture:
[0027] 1. Lead-out hole 2. Chip soldering area
[0028] 201. Basic Welding Area 3. Copper Tracing Detailed Implementation
[0029] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments:
[0030] Figure 2 A multifunctional PCB adapter board has a square main body and adapter lines on both the front and back sides.
[0031] On the front of the adapter board, 100 lead-out holes 1 are arranged around the four perimeters. A square chip soldering area 2 is set in the middle of the adapter board. Each of the lead-out holes 1 on the four sides is connected to the four sides of the chip soldering area 2 by copper traces 3 fixedly arranged on the surface of the adapter board. The copper traces 3 are in an insulated state outside the chip soldering area 2 (i.e., covered by a layer of insulating solder resist) and exposed state inside the chip soldering area 2. The number of copper traces 3 connected to the four sides of the chip soldering area 2 is the same, with 25 on each side. The copper traces 3 entering the chip soldering area 2 are arranged horizontally and vertically, and the two sets of copper traces 3 on opposite sides are matched and aligned. The spacing between the parallel copper traces 3 on each side of the chip soldering area 2 is 0.5mm.
[0032] A square soldering base area 201 is provided in the chip soldering area 2, with eight copper traces 3 corresponding to each side. The soldering base area can be used to solder 32-pin chips.
[0033] The basic welding area 201 is located at the upper left corner of the chip welding area 2. All copper traces on each of the two sides (upper and left) of the chip welding area 2 that are close to the basic welding area 201 extend inward to the same length. The basic welding area 201 is matched with the first to eighth copper traces 3 starting from the corner of the two sides.
[0034] The eight copper traces 3 on each of the two sides (right and bottom) of the chip soldering area 2 that are away from the soldering base area 201 and match the soldering base area 201 (the eight copper traces 3 at the upper right end and the eight copper traces 3 at the lower left end, respectively) are connected to the position that matches the soldering base area 201. The other copper traces 3 that are not connected to the soldering base area 201 are paired in pairs, and the two pairs terminate the traces and do not come into contact when they are about to meet.
[0035] In this way, the front of the adapter board can not only match and solder 0.5mm, 32-pin chips, but also, when chips larger than 32 pins (including 44-pin, 64-pin, 80-pin, and 100-pin chips) are placed in the appropriate position within the chip soldering area 2, all their pins can be matched with the corresponding copper traces 3, thus achieving an effective soldering connection with the adapter board.
[0036] On the reverse side of the adapter board, similarly, 100 lead-out holes 1 are arranged around the four perimeters. A square chip soldering area 2 is provided in the center of the adapter board. 16 lead-out holes 1 are taken from each of the four sides and connected to the four sides of the chip soldering area 2 by copper traces 3 fixedly arranged on the surface of the adapter board. The copper traces 3 are in an insulated state outside the chip soldering area 2 (i.e., covered by a layer of insulating solder resist) and exposed inside the chip soldering area 2. The number of copper traces 3 connected to the four sides of the chip soldering area 2 is the same, 16 on each side. The copper traces 3 entering the chip soldering area 2 are arranged horizontally and vertically, with two sets of copper traces 3 on opposite sides matched and aligned. The spacing between the parallel copper traces 3 on each side of the chip soldering area 2 is 0.8mm.
[0037] A square soldering base area 201 is provided in the chip soldering area 2, with eight copper traces 3 corresponding to each side. The soldering base area can be used to solder 32-pin chips.
[0038] At this time, the basic welding area 201 can be set at the upper left corner of the chip welding area 2, just like the front side of the adapter board. The arrangement of the copper traces 3 in the basic welding area 201 is also similar to that on the front side.
[0039] The basic welding area 201 can also be set in a non-corner position within the chip welding area 2. That is, the copper traces 3 matched by the basic welding area 201 do not include the side copper traces on the four sides of the chip welding area 2, but are matched with the copper traces 3 in the middle position of each side.
[0040] At this time, the edge of the chip welding area 2 can be divided into two groups of adjacent edges. The copper traces 3 on each group of adjacent edges that are not connected to the welding base area 201 are paired up in pairs, and the two traces terminate the routing and do not come into contact when they are about to meet.
[0041] In this way, the reverse side of the adapter board can not only match and solder 0.8mm, 32-pin chips, but also, when chips larger than 32 pins (including 44-pin and 64-pin chips) are placed in the appropriate position within the chip soldering area 2, all their pins can be matched with the corresponding copper traces 3, thus achieving an effective soldering connection with the adapter board.
[0042] When designing the adapter circuit of the adapter board, if the basic soldering area 201 is set in a non-corner position within the chip soldering area 2, the number of copper traces 3 connecting to each side of the chip soldering area 2 should be an even number, such as 20 or 16.
[0043] The adapter board can also be configured with adapter lines on one side, and the number of lead-out holes on the periphery can be 80 or 64, etc. In addition to using 0, 5 or 0.8 mm, the spacing between the parallel copper traces on each side of the chip soldering area 2 can also be other sizes to suit chips with other special pin sizes.
[0044] As long as the copper traces 3 on at least one pair of adjacent sides of the chip soldering area 2 that are not connected to the soldering base area 201 are paired up, and the two terminate the traces without contacting each other when they are about to meet, so that when a chip with more than 32 pins (44 pins, 64 pins, etc.) is placed in a suitable position in the chip soldering area 2, all its pins can be matched with the corresponding copper traces 3, thereby achieving an effective soldering connection with the adapter board.
[0045] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.
Claims
1. A multifunctional PCB adapter board, characterized in that: The main body is square, and at least one plane of the adapter board is provided with adapter lines. At least 44 lead-out holes are arranged around the four sides of the plane. A square chip soldering area is provided in the middle of the adapter board. The lead-out holes on the four sides are connected to the four sides of the chip soldering area by copper traces fixedly arranged on the surface of the adapter board. The copper traces are insulated outside the chip soldering area and exposed inside the chip soldering area. The number of copper traces connected to the four sides of the chip soldering area is the same. The copper traces entering the chip soldering area are arranged horizontally and vertically, and the two sets of copper traces on opposite sides are matched and aligned in pairs. The spacing between the parallel copper traces on each side of the chip soldering area is the same. A square basic welding area is provided in the chip welding area, with eight copper traces corresponding to each side. The basic welding area can be used to weld 32-pin chips. At least one pair of adjacent sides of the chip soldering area are not connected to the copper traces of the basic soldering area. The traces are paired up and terminated when they are about to meet without contacting each other. This is so that when a chip with more than 32 pins is placed in a suitable position in the chip soldering area, all its pins can be matched with the corresponding copper traces, thus achieving an effective soldering connection with the adapter board.
2. The adapter board according to claim 1, characterized in that: The basic welding area is located at the corner of the chip welding area. All copper traces on each of the two sides of the chip welding area that are close to the basic welding area extend inward to the same length. The basic welding area is matched with the first to eighth copper traces of the two sides starting from the corner. Eight copper traces on each of the two sides of the chip soldering area that are far from the soldering base area are connected to the position that matches the soldering base area. Other copper traces that are not connected to the soldering base area are paired up, and the two pairs terminate the routing when they are about to meet without making contact.
3. The adapter board according to claim 2, characterized in that: The adapter board has 100 lead-out holes, and 25 copper traces are connected to each side of the chip soldering area. The spacing between the copper traces entering each side of the chip soldering area is 0.5 mm.
4. The adapter board according to claim 1, characterized in that: The basic welding area is located in a non-corner position within the chip welding area, and the copper traces matched by the basic welding area do not include side copper traces on the four sides of the chip welding area. At this time, the edge of the chip welding area is divided into two groups of adjacent edges. The copper traces on each group of adjacent edges that are not connected to the welding base area are paired up in pairs. The two traces terminate the routing and do not come into contact when they are about to meet. In this case, the number of copper traces connected to each side of the chip soldering area is an even number.
5. The adapter board according to claim 4, characterized in that: The adapter board has at least 64 lead-out holes, and 16 copper traces are connected to each side of the chip soldering area. The spacing between the copper traces entering each side of the chip soldering area is 0.8 mm.
6. The adapter plate according to any one of claims 1-5, characterized in that: The adapter board has adapter lines on both sides.
7. The adapter board according to claim 6, characterized in that: The adapter board has 100 lead-out holes on both sides. The number of copper traces connected to each side of the chip soldering area on the front side is 25, and the spacing between the copper traces entering each side of the chip soldering area is 0.5mm. The number of copper traces connected to each side of the chip soldering area on the reverse side is 16, and a total of 64 copper traces are connected to the 64 peripheral lead holes. The spacing between the copper traces entering each side of the chip soldering area is 0.8mm.