A circuit board etching device

Abstract

The utility model discloses a kind of circuit board etching devices, including transmission mechanism, first spraying mechanism, suction mechanism and liquid collecting mechanism, transmission mechanism is used to drive circuit board to move;First spraying mechanism is set on transmission mechanism top;Suction mechanism is set on transmission mechanism top, located in the side of first spraying mechanism, for suction etching liquid remaining on circuit board;Liquid collecting mechanism is set between first spraying mechanism and suction mechanism, and liquid collecting mechanism includes liquid collecting module, multiple liquid collecting modules are set on the both sides of transmission mechanism along transmission direction, can drive etching liquid remaining on circuit board to the center line between multiple liquid collecting modules gather. The utility model is matched with liquid collecting mechanism and suction mechanism, reduces the residual amount of circuit board etching liquid, improves etching effect.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to a circuit board etching device. Background Technology

[0002] In the printed circuit board (PCB) manufacturing process, the designed circuit pattern needs to be precisely transferred to a copper-clad laminate to form the required conductive lines. This process requires the use of an etching device. In related technologies, the PCB is typically placed horizontally and then transferred to the etching device, where the etching solution is sprayed horizontally. This process is susceptible to the "pool effect," which can affect the precision of the etching. The "pool effect" can lead to over-etching of the PCB surface, reducing line width and impacting the conductivity of the final product. Related technologies use vacuum suction tubes or sponge rollers to remove residual etching solution, which can leave residue on the sides of the PCB, affecting the etching effect. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a circuit board etching device that reduces residual etching solution on the circuit board and improves the etching effect.

[0004] A circuit board etching apparatus according to an embodiment of the present invention includes:

[0005] The transmission mechanism is used to move the circuit board.

[0006] The first spraying mechanism is located above the transmission mechanism;

[0007] A suction mechanism is located above the transmission mechanism and on one side of the first spray mechanism, and is used to suction the etching solution remaining on the circuit board.

[0008] The liquid collection mechanism is located between the first spraying mechanism and the suction mechanism. The liquid collection mechanism includes liquid collection modules. Multiple liquid collection modules are located on both sides of the transmission mechanism along the transmission direction, which can drive the etching liquid remaining on the circuit board to gather towards the center line between the multiple liquid collection modules.

[0009] A circuit board etching apparatus according to an embodiment of the present invention has at least the following beneficial effects:

[0010] The transmission mechanism moves the circuit board along the transmission direction, thereby completing the spray etching, residual etching solution collection, and residual etching solution suction of the circuit board in a simple and fast manner. The liquid collection mechanism drives the residual etching solution on the circuit board to gather towards the center line between multiple liquid collection modules, and then the suction mechanism sucks away the gathered residual etching solution, which can improve the residual etching solution suction rate and reduce the amount of etching solution remaining on the circuit board. The liquid collection mechanism drives the etching solution to gather from both sides of the circuit board towards the center, reducing the residual etching solution on both sides of the circuit board, avoiding over-etching on both sides of the circuit board, and ensuring the consistency of the circuit board etching. It avoids the "pool effect" on the circuit board, avoids over-etching of the circuit board surface, ensures that the copper foil linewidth meets the design requirements, ensures etching accuracy, and improves the etching effect.

[0011] According to an embodiment of the present invention, a circuit board etching device includes a liquid collection module as a first air outlet, and multiple first air outlets are respectively disposed above both sides of the transmission mechanism along the transmission direction, with the first air outlets discharging air to the upper surface of the circuit board.

[0012] According to an embodiment of the present invention, a circuit board etching apparatus wherein a first venting element vents air at the angle between the upper surface and the side surface of the circuit board.

[0013] According to an embodiment of the present invention, a circuit board etching apparatus further includes a collection mechanism disposed below the transmission mechanism to collect etching solution falling from the circuit board.

[0014] According to an embodiment of the present invention, a circuit board etching device includes a suction mechanism comprising a suction generator, a gas-liquid separator, a suction tube, and a suction nozzle, wherein the suction generator, the gas-liquid separator, the suction tube, and the suction nozzle are connected in sequence.

[0015] According to an embodiment of the present invention, in a circuit board etching apparatus, the drain port of the gas-liquid separator is located above the collection mechanism.

[0016] According to an embodiment of the present invention, in a circuit board etching device, the center line of the suction nozzle coincides with the center line between multiple liquid collection modules, and the suction tube is connected to the center line of the suction nozzle to improve the suction efficiency of the suction nozzle.

[0017] According to an embodiment of the present invention, a circuit board etching apparatus includes a transfer mechanism comprising transfer rollers, wherein multiple transfer rollers are spaced apart.

[0018] According to an embodiment of the present invention, a circuit board etching apparatus includes a second spraying mechanism below the transmission mechanism. The second spraying mechanism includes multiple spray heads, which are staggered with multiple transmission rollers to improve the spraying effect.

[0019] According to an embodiment of the present invention, a circuit board etching apparatus further includes a cleaning mechanism, which is disposed on the side of the first spraying mechanism away from the suction mechanism.

[0020] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0022] Figure 1 This is a side view of a circuit board etching apparatus according to an embodiment of the present invention;

[0023] Figure 2 This is a perspective view of the liquid collection mechanism, cleaning mechanism, circuit board, liquid suction nozzle, and liquid suction tube of a circuit board etching apparatus according to an embodiment of the present invention.

[0024] Figure 3 This is a side view of the liquid collection mechanism and the circuit board of a circuit board etching device according to an embodiment of the present invention.

[0025] Explanation of reference numerals in the attached figures:

[0026] Conveying mechanism 100; Conveying roller 110;

[0027] First spraying mechanism 200;

[0028] Second spraying mechanism 300; Spray head 310;

[0029] Suction mechanism 400; suction generator 410; gas-liquid separator 420; drain port 421; suction pipe 430; suction nozzle 440;

[0030] Liquid collection mechanism 500; First air outlet component 510;

[0031] Collection agencies: 600;

[0032] Cleaning mechanism 700; Second air outlet 710;

[0033] Circuit board 800;

[0034] Top cover plate 900; infusion tubing 910. Detailed Implementation

[0035] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0036] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0037] In the description of a utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If the terms "first" and "second" are used, they are merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly specifying the number of indicated technical features or the order of the indicated technical features.

[0038] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0039] Reference Figures 1 to 3 The arrow indicates the transmission direction. This utility model embodiment provides a circuit board etching device, including a transmission mechanism 100, a first spraying mechanism 200, a suction mechanism 400, and a liquid collection mechanism 500. The transmission mechanism 100 is used to drive the circuit board 800 to move. The first spraying mechanism 200 is disposed above the transmission mechanism 100 and can spray etching liquid onto the upper surface of the circuit board 800. The suction mechanism 400 is disposed above the transmission mechanism 100 and located on one side of the first spraying mechanism 200, and is used to suction the etching liquid remaining on the circuit board 800. The liquid collection mechanism 500 is disposed between the first spraying mechanism 200 and the suction mechanism 400, that is, the first spraying mechanism 200, the liquid collection mechanism 500, and the suction mechanism 400 are arranged sequentially along the transmission direction. The liquid collection mechanism 500 includes liquid collection modules. Multiple liquid collection modules are disposed on both sides of the transmission mechanism 100 along the transmission direction, and can drive the etching liquid remaining on the circuit board 800 to gather towards the center line C between the multiple liquid collection modules.

[0040] During operation, the circuit board 800 is placed on the transmission mechanism 100, which moves the circuit board 800 along the transmission direction. The first spraying mechanism 200 sprays etching solution onto the upper surface of the circuit board 800, and the etching solution etches the circuit board 800. After etching, the transmission mechanism 100 continues to move the circuit board 800 along the transmission direction, and the liquid collection mechanism 500 drives the etching solution remaining on the circuit board 800 to gather at the center line C between multiple liquid collection modules. The transmission mechanism 100 then continues to move the circuit board 800 along the transmission direction, and the residual etching solution gathered on the surface of the circuit board 800 at the center line C moves to the suction mechanism 400, which then sucks away the gathered etching solution.

[0041] The etching solution remaining on the circuit board 800 is driven by the liquid collection mechanism 500 to gather towards the center line C between multiple liquid collection modules, and then the gathered residual etching solution is sucked away by the suction mechanism 400. This improves the suction rate of residual etching solution and reduces the amount of residual etching solution on the circuit board 800. The liquid collection mechanism 500 also drives the etching solution to gather from both sides of the circuit board 800 towards the center, reducing the residual etching solution on both sides of the circuit board 800, avoiding over-etching on both sides of the circuit board 800, and ensuring the consistency of etching on the circuit board 800. This also avoids the "pool effect" on the circuit board 800, prevents over-etching of the surface of the circuit board 800, ensures that the copper foil linewidth meets the design requirements, ensures etching accuracy, improves etching effect, and ensures the quality of the final product.

[0042] As a preferred option, refer to Figure 2 and Figure 3 There are two liquid collection modules, which are respectively set on both sides of the transmission mechanism 100 along the transmission direction.

[0043] Optionally, the liquid collection module can be a soft scraping strip, which is driven by a motor to swing on the surface of the circuit board 800. Multiple soft scraping strips located on both sides of the circuit board 800 scrape the etching solution remaining on the surface of the circuit board 800 towards the vicinity of the center of the circuit board 800 by swinging. Alternatively, the liquid collection module can be a soft rotating brush, in which the soft rotating brushes on both sides of the circuit board 800 rotate in opposite directions under different motor drives, so as to drive the etching solution remaining on the surface of the circuit board 800 towards the vicinity of the center of the circuit board 800. The liquid collection module can also be a soft pusher that can be pushed from both sides to the center, a guide strip in the shape of an "8" and extending to the surface of the circuit board, etc., all of which can achieve the liquid collection effect.

[0044] It should be noted that in some other embodiments, reference is made to... Figure 1 It also includes a top cover plate 900, a first spray mechanism 200 connected to the lower side of the top cover plate 900, and a connecting pipe provided inside the top cover plate 900. The connecting pipe is connected to the first spray mechanism 200 to deliver etching liquid to the first spray mechanism 200.

[0045] According to some embodiments of this application, refer to Figure 1 The liquid collection module is a first air outlet 510. Multiple first air outlets 510 are respectively disposed on both sides above the transmission mechanism 100 along the transmission direction, and the first air outlets 510 discharge air to the upper surface of the circuit board 800. Specifically, the multiple first air outlets 510 are connected to the lower side of the top cover plate 900, and an air pipe is provided inside the top cover plate 900 to connect the multiple first air outlets 510 for gas delivery. Specifically, the first air outlets 510 discharge air obliquely downwards from both sides above the circuit board 800 towards the center line C. The airflow drives the etching liquid remaining on the upper surface of the circuit board 800 to the vicinity of the middle of the circuit board 800, resulting in good liquid collection and avoiding scratches on the surface of the circuit board 800.

[0046] Furthermore, referring to Figure 2 and Figure 3 The first air outlet 510 discharges air into the angle between the upper surface and the side of the circuit board 800. After the airflow reaches the angle between the upper surface and the side of the circuit board 800, part of it flows along the upper surface of the circuit board 800 toward the middle of the circuit board 800. In this process, it can drive the etching solution to flow toward the middle of the circuit board 800. The other part flows downward along the side of the circuit board 800. In this process, it can drive the etching solution to flow downward and eventually fall off the circuit board 800 to reduce the amount of etching solution remaining on the side of the circuit board 800.

[0047] According to some embodiments of this application, refer to Figure 1 It also includes a collection mechanism 600, which is located below the transmission mechanism 100 to collect the etching solution that falls from the circuit board 800 for recycling. Specifically, the collection mechanism 600 is a collection pool that can collect the etching solution that falls from the circuit board 800.

[0048] Furthermore, the suction mechanism 400 includes a suction generator 410, a gas-liquid separator 420, a suction pipe 430, and a suction nozzle 440, which are connected sequentially. Specifically, the suction generator 410 is a vacuum pump, and the gas-liquid separator 420 is a gas-liquid separation tank. The vacuum pump and the gas-liquid separation tank are located on the upper side of the top cover plate 900. The vacuum pump generates negative pressure near the suction nozzle 440, and the etching solution is drawn in from the suction nozzle 440 under the action of negative pressure, flows through the suction pipe 430 to the gas-liquid separation tank, and is separated out.

[0049] Furthermore, the drain port 421 of the gas-liquid separator 420 is located above the collection mechanism 600, and the etching solution separated from the gas-liquid separator 420 is discharged from the drain port 421 to the collection mechanism 600 to further improve the recovery rate of the etching solution.

[0050] It should be noted that in some other embodiments, reference is made to... Figure 2 The centerline of the suction nozzle 440 coincides with the centerline C between the multiple liquid collection modules, and the suction tube 430 is connected to the centerline of the suction nozzle 440. The etching solution remaining on the circuit board 800 is driven to the vicinity of the centerline C between the multiple liquid collection modules, and then sucked in from the centerline of the suction nozzle 440. Since the suction force is greatest at the centerline of the suction nozzle 440, the suction efficiency of the suction nozzle 440 can be improved.

[0051] According to some embodiments of this application, refer to Figure 1 The transmission mechanism 100 includes transmission rollers 110, and multiple transmission rollers 110 are arranged at intervals. Specifically, the surface of the transmission rollers 110 is provided with a soft layer to reduce scratching of the circuit board 800.

[0052] Furthermore, a second spraying mechanism 300 is provided below the transmission mechanism 100. The second spraying mechanism 300 includes multiple spray heads 310, which are arranged alternately with the multiple transmission rollers 110. The spray heads 310 can spray etching solution onto the surface of the circuit board 800 between different transmission rollers 110, resulting in a large spraying area and improved spraying effect.

[0053] Specifically, a liquid delivery pipe 910 is provided below the transfer roller 110, and the second spraying mechanism 300 is connected to the upper side of the liquid delivery pipe 910. The liquid delivery pipe 910 is used to deliver etching liquid to the second spraying mechanism 300.

[0054] According to some embodiments of this application, a cleaning mechanism 700 is also included, which is disposed on the side of the first spraying mechanism 200 away from the suction mechanism 400. The cleaning mechanism 700 cleans the circuit board 800, and the cleaned circuit board 800 is then etched by spraying etching solution, thereby reducing the impact of dust and impurities on the circuit board 800 on the etching process and improving the etching quality.

[0055] Specifically, the cleaning mechanism 700 includes a second air outlet 710, which is located on one side above the transmission mechanism 100 and connected to the lower side of the top cover plate 900. An air pipe is provided inside the top cover plate 900 to communicate with the second air outlet 710 for conveying gas. The second air outlet 710 is arranged perpendicular to the transmission direction and emits air at an angle downward. The airflow blows towards the upper surface of the circuit board 800, blowing dust and impurities to the other side of the circuit board 800 and causing them to fall off.

[0056] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0057] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board etching apparatus, characterized in that, include: A transmission mechanism (100) is used to move the circuit board (800); The first spraying mechanism (200) is disposed above the transmission mechanism (100); A suction mechanism (400) is disposed above the transmission mechanism (100) and located on one side of the first spray mechanism (200) for suctioning the etching solution remaining on the circuit board (800); A liquid collection mechanism (500) is disposed between the first spray mechanism (200) and the suction mechanism (400). The liquid collection mechanism (500) includes liquid collection modules. Multiple liquid collection modules are disposed on both sides of the transmission mechanism (100) along the transmission direction, which can drive the etching liquid remaining on the circuit board (800) to gather towards the center line between the multiple liquid collection modules.

2. The circuit board etching apparatus according to claim 1, characterized in that, The liquid collection module is a first air outlet (510). Multiple first air outlets (510) are respectively disposed on both sides above the transmission mechanism (100) along the transmission direction. The first air outlets (510) emit air to the upper surface of the circuit board (800).

3. The circuit board etching apparatus according to claim 2, characterized in that, The first venting component (510) vents air into the angle between the upper surface and the side surface of the circuit board (800).

4. The circuit board etching apparatus according to claim 1, characterized in that, It also includes a collection mechanism (600) disposed below the transmission mechanism (100) to collect etching solution that falls from the circuit board (800).

5. The circuit board etching apparatus according to claim 4, characterized in that, The suction mechanism (400) includes a suction generator (410), a gas-liquid separator (420), a suction tube (430), and a suction nozzle (440), which are connected in sequence.

6. The circuit board etching apparatus according to claim 5, characterized in that, The drain port (421) of the gas-liquid separator (420) is located above the collection mechanism (600).

7. The circuit board etching apparatus according to claim 5, characterized in that, The centerline of the suction nozzle (440) coincides with the centerline between the multiple liquid collection modules, and the suction tube (430) is connected to the centerline of the suction nozzle (440) to improve the suction efficiency of the suction nozzle (440).

8. The circuit board etching apparatus according to claim 1, characterized in that, The transmission mechanism (100) includes transmission rollers (110), and a plurality of transmission rollers (110) are spaced apart.

9. The circuit board etching apparatus according to claim 8, characterized in that, A second spraying mechanism (300) is provided below the transmission mechanism (100). The second spraying mechanism (300) includes multiple spray heads (310). The multiple spray heads (310) and multiple transmission rollers (110) are arranged alternately to improve the spraying effect.

10. The circuit board etching apparatus according to claim 1, characterized in that, It also includes a cleaning mechanism (700) disposed on the side of the first spray mechanism (200) away from the suction mechanism (400).

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