A sputtering wafer fixing device

Abstract

The utility model relates to chip manufacturing technical field, and disclose a kind of for sputtering table wafer fixing device, the for sputtering table wafer fixing device, including annular, the top end surface of annular is equipped with limiting recess, the bottom fixed end surface of annular is fixedly connected with the inner wall of limiting recess is provided with fixed component. This for sputtering table wafer fixing device, cross recess and multiple-point recess provide evenly distributed contact point, increase frictional resistance, can provide additional resistance when wafer has slight wobble, more can resist horizontal direction's shear slip than pure smooth surface, chamfer guides wafer, so that wafer pushes rubber block to move to the recess in, rubber block provides circumferential distribution's frictional clamping force at wafer edge, prevent wafer from rotating skid due to gravity or vibration, improve processing stability, vertical groove is more difficult to slide in groove when wafer is subjected to vibration or external force, improve clamping stability.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, specifically to a wafer fixing device for a sputtering stage. Background Technology

[0002] In the semiconductor chip manufacturing process, wafers need to undergo point sputtering, which requires extremely high positional accuracy. Therefore, ensuring that the wafer does not undergo any slight positional movement during sputtering is crucial to improving the manufacturing precision of the chip.

[0003] According to a published wafer sputtering fixing device (publication number: CN215668186U), the wafer sputtering fixing device described in the above application is a ring adapted to the size of the wafer; the outer edge of the ring is provided with an inward protrusion; the inner edge of the ring is provided with a centripetal protrusion; a sandblasting area is provided on the surface of the ring opposite to the inward protrusion; a fusion spraying area is provided inside the sandblasting area; and the fusion spraying area is provided with interconnected patterned structures and S-shaped concave-convex structures inside.

[0004] However, in actual use, the above-mentioned fixing device directly places the wafer inside the ring. But the wafer itself is lightweight and has a smooth surface. When there is slight vibration, thermal expansion or airflow disturbance, the wafer is easy to slide or rotate, resulting in uneven film thickness. In view of this, we propose a wafer fixing device for sputtering stage. Utility Model Content

[0005] The purpose of this invention is to provide a wafer fixing device for a sputtering stage to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a wafer fixing device for a sputtering stage, comprising a ring, a limiting groove formed on the top end face of the ring, and a protruding ring fixedly connected to the bottom fixed end face of the ring. A fixing component is provided on the inner wall of the limiting groove, the fixing component comprising:

[0007] A cross-shaped groove is formed on the inner bottom surface of a limiting groove. The inner bottom surface of the limiting groove has multiple grooves. An arc-shaped groove is formed on the inner wall of the limiting groove. A placement groove is formed on the inner wall of the limiting groove.

[0008] A magnetic component is fixedly connected to the inner wall of an arc-shaped groove. The inner wall of the arc-shaped groove is slidably connected to an arc-shaped rod. A magnet is fixedly connected to the end face of the arc-shaped rod, and a rubber block is fixedly connected to the end of the arc-shaped rod away from the magnet.

[0009] Preferably, the limiting groove coincides with the axis of the ring, and the convex ring coincides with the axis of the ring.

[0010] Preferably, the cross groove and the multi-point groove are provided in several groups, and the several groups of cross grooves and multi-point grooves are equally spaced on the inner bottom surface of the limiting groove.

[0011] Preferably, the magnet is magnetically connected to the magnetic component, the rubber block is inserted into the placement groove, and the magnetic component pushes the magnet in the opposite direction, causing the magnet to move away from the magnetic component.

[0012] Preferably, the sidewall of the rubber block is chamfered, and the chamfer is located on the side of the rubber block away from the convex ring. The chamfer guides the wafer, causing the wafer to push the rubber block into the placement groove.

[0013] Preferably, the number of the arc-shaped rods and rubber blocks is set in several groups, and the several groups of arc-shaped rods and rubber blocks are equally spaced on the inner wall of the limiting groove, and the rubber blocks clamp the outer wall of the wafer.

[0014] Preferably, a vertical groove is provided at the end of the rubber block away from the arc-shaped rod, and the number of vertical grooves is set in several groups, with the several groups of vertical grooves being equally spaced on the side wall of the vertical groove.

[0015] Compared with the prior art, the present invention provides a wafer fixing device for a sputtering stage, which has the following advantages:

[0016] 1. This wafer fixing device for sputtering stage, through its fixing components, provides evenly distributed contact points with cross grooves and multi-point grooves, increasing frictional resistance and preventing slippage. It can provide additional resistance when the wafer has slight shaking, and is more resistant to horizontal shear slippage than a purely smooth surface. The chamfer guides the wafer, causing the wafer to push the rubber block into the placement groove. The rubber block provides circumferentially distributed frictional clamping force at the edge of the wafer, preventing the wafer from rotating and slipping due to gravity or vibration, and improving processing stability.

[0017] 2. This wafer fixing device for sputtering stage has vertical grooves that make it more difficult for the wafer to slide in the grooves when it is subjected to vibration or external force, thus improving clamping stability. Adding vertical grooves is equivalent to setting multiple vertical braking points around the wafer, making it more difficult for the wafer to rotate and ensuring that it remains centered and does not deviate under extreme working conditions, such as high-speed rotation or tilting. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the main structure of the present utility model;

[0019] Figure 2 This is a schematic diagram of the ring structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the annular cross-sectional structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the exploded structure of the arc-shaped rod of this utility model.

[0022] In the diagram: 1. Circular ring; 2. Limiting groove; 3. Protruding ring; 4. Fixing component; 401. Cross groove; 402. Multi-point groove; 403. Arc groove; 404. Magnetic component; 405. Arc rod; 406. Magnet; 407. Rubber block; 408. Placement groove; 5. Vertical groove. Detailed Implementation

[0023] like Figures 1-4 As shown, this utility model provides a technical solution: a wafer fixing device for a sputtering stage, including a ring 1, a limiting groove 2 is formed on the top end face of the ring 1, and a protruding ring 3 is fixedly connected to the bottom fixed end face of the ring 1. A fixing component 4 is provided on the inner wall of the limiting groove 2. The fixing component 4 includes a cross groove 401, a multi-point groove 402, an arc groove 403, a magnetic component 404, an arc rod 405, a magnet 406, a rubber block 407, and a placement groove 408.

[0024] In one embodiment of this utility model, the limiting groove 2 coincides with the axis of the ring 1, the convex ring 3 coincides with the axis of the ring 1, the cross groove 401 is formed on the inner bottom surface of the limiting groove 2, the inner bottom surface of the limiting groove 2 is formed with multiple grooves 402, the inner wall of the limiting groove 2 is formed with an arc groove 403, the inner wall of the limiting groove 2 is formed with a placement groove 408, and the number of cross grooves 401 and multiple grooves 402 is set in several groups, and the several groups of cross grooves 401 and multiple grooves 402 are equally spaced on the inner bottom surface of the limiting groove 2.

[0025] The magnetic component 404 is fixedly connected to the inner wall of the arc groove 403. The inner wall of the arc groove 403 is slidably connected to the arc rod 405. A magnet 406 is fixedly connected to the end face of the arc rod 405. The magnet 406 is magnetically connected to the magnetic component 404. The rubber block 407 is inserted into the placement groove 408. The side wall of the rubber block 407 is chamfered. The chamfer is located on the side of the rubber block 407 away from the convex ring 3. The chamfer guides the wafer, causing the wafer to push the rubber block 407 into the placement groove 408. The magnetic component 404 pushes the magnet 406 in the opposite direction, causing the magnet 406 to move away from the magnetic component 404. The end of the arc rod 405 away from the magnet 406 is fixedly connected to the rubber block 407. Several sets of arc rods 405 and rubber blocks 407 are arranged at equal intervals on the inner wall of the limiting groove 2. The rubber block 407 clamps the outer wall of the wafer.

[0026] The cross groove 401 and the multi-point groove 402 are formed on the inner bottom surface of the limiting groove 2, providing evenly distributed contact points, increasing frictional resistance, and preventing slippage. The cross groove 401 and the multi-point groove 402 generate a slight jamming effect with the back of the wafer at the microscale, which can provide additional resistance when the wafer has slight shaking, and is more resistant to horizontal shear slippage than a purely smooth surface.

[0027] The inner diameter of the limiting groove 2 is equal to the diameter of the wafer. The chamfer on the side wall of the rubber block 407 guides the wafer during the process of placing it into the limiting groove 2, causing the wafer to push the rubber block 407 into the placement groove 408. The magnetic component 404 pushes the magnet 406 in the opposite direction, causing the magnet 406 to move away from the magnetic component 404. This allows the rubber block 407 to clamp the outer wall of the wafer. The chamfer acts as a bevel guide, so that the wafer does not need to be precisely aligned when placed. As long as it is close to the center of the limiting groove 2, it will be guided into the correct position and automatically clamped after being inserted. The rubber block 407 provides circumferentially distributed frictional clamping force at the edge of the wafer, preventing the wafer from rotating and slipping due to gravity or vibration, thus improving processing stability.

[0028] In addition, a vertical groove 5 is provided at the end of the rubber block 407 away from the arc rod 405. Several sets of vertical grooves 5 are provided, and the sets of vertical grooves 5 are equally spaced on the side wall of the vertical grooves 5. The vertical grooves 5 are in contact with the wafer. The rubber itself already has a certain coefficient of friction. The design of vertical grooves 5 at the position where it contacts the wafer makes it more difficult for the wafer to slide in the groove when it is subjected to vibration or external force, thereby improving the clamping stability. Adding vertical grooves 5 is equivalent to setting multiple vertical braking points around the wafer, making it more difficult for the wafer to rotate and ensuring that it remains centered and does not deviate under extreme working conditions, such as high-speed rotation or tilting and swinging.

[0029] In this invention, during use, the cross groove 401 and the multi-point groove 402 are formed on the inner bottom surface of the limiting groove 2, providing evenly distributed contact points, increasing frictional resistance, and preventing slippage. The cross groove 401 and the multi-point groove 402 create a slight resistance to the back surface of the wafer at a microscopic scale, providing additional resistance when the wafer experiences slight movement. This provides better resistance to horizontal shear slippage than a purely smooth surface. The inner diameter of the limiting groove 2 is equal to the diameter of the wafer. The chamfered sidewalls of the rubber block 407 facilitate the placement of the wafer into the limiting groove 2. In the middle, the chamfer guides the wafer, causing the wafer to push the rubber block 407 into the placement groove 408. The magnetic component 404 pushes the magnet 406 in the opposite direction, causing the magnet 406 to move away from the magnetic component 404. This allows the rubber block 407 to clamp the outer wall of the wafer. The chamfer acts as a beveled guide, so that the wafer does not need to be precisely aligned when placed. As long as it is close to the center of the limiting groove 2, it will be guided into the correct position. The rubber block 407 provides circumferentially distributed frictional clamping force at the edge of the wafer, preventing the wafer from rotating and slipping due to gravity or vibration.

[0030] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. A wafer fixing device for a sputtering stage, comprising a ring (1), wherein a limiting groove (2) is formed on the top end face of the ring (1), and a protruding ring (3) is fixedly connected to the bottom fixing end face of the ring (1), characterized in that: The inner wall of the limiting groove (2) is provided with a fixing component (4), the fixing component (4) including: A cross groove (401) is formed on the inner bottom surface of the limiting groove (2). The inner bottom surface of the limiting groove (2) has multiple grooves (402). The inner wall of the limiting groove (2) has an arc groove (403) and a placement groove (408). A magnetic component (404) is fixedly connected to the inner wall of an arc groove (403). The inner wall of the arc groove (403) is slidably connected to an arc rod (405). A magnet (406) is fixedly connected to the end face of the arc rod (405). A rubber block (407) is fixedly connected to the end of the arc rod (405) away from the magnet (406).

2. The wafer fixing device for a sputtering stage according to claim 1, characterized in that: The limiting groove (2) coincides with the axis of the ring (1), and the convex ring (3) coincides with the axis of the ring (1).

3. The wafer fixing device for a sputtering stage according to claim 1, characterized in that: The number of the cross groove (401) and the multi-point groove (402) is set in several groups, and the cross groove (401) and the multi-point groove (402) are equally spaced on the inner bottom surface of the limiting groove (2).

4. The wafer fixing device for a sputtering stage according to claim 1, characterized in that: The magnetic component (404) pushes the magnet (406) to slide, and the rubber block (407) is inserted into the placement groove (408).

5. A wafer fixing device for a sputtering stage according to claim 1, characterized in that: The sidewall of the rubber block (407) is chamfered, and the chamfer is located on the side of the rubber block (407) away from the convex ring (3).

6. A wafer fixing device for a sputtering stage according to claim 1, characterized in that: The number of the arc-shaped rods (405) and rubber blocks (407) is set in several groups, and the arc-shaped rods (405) and rubber blocks (407) are set at equal intervals on the inner wall of the limiting groove (2).

7. A wafer fixing device for a sputtering stage according to claim 1, characterized in that: The rubber block (407) has a vertical groove (5) at one end away from the arc rod (405). The number of vertical grooves (5) is set in several groups, and the several groups of vertical grooves (5) are equally spaced on the side wall of the vertical groove (5).

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