Deposition apparatus, deposition system and solar cell manufacturing line

Abstract

The application relates to a deposition device, a deposition system and a solar cell manufacturing production line. The deposition device comprises a deposition main body with a gas inlet, a reaction chamber and a gas outlet connected in sequence; and a heat exchange assembly located in the reaction chamber. The heat exchange assembly comprises at least one heat exchange plate. All the heat exchange plates are arranged close to the gas outlet. The projection of the area defined by the outer contour of the heat exchange plate in the direction of the central axis of the gas outlet covers at least part of the gas outlet. The heat exchange plate has multiple groups of gas passing holes arranged in sequence along the direction of the central axis pointing to the outer edge. In the two adjacent groups of gas passing holes, the outer group of gas passing holes is arranged around the outer periphery of the inner group of gas passing holes. Each group of gas passing holes comprises a plurality of gas passing holes arranged along the circumferential direction. The deposition device, the deposition system and the solar cell manufacturing production line can reduce the defective rate of the battery piece.

Description

Technical Field

[0001] This application relates to the field of solar cell manufacturing technology, specifically to a deposition apparatus, deposition system, and solar cell manufacturing production line. Background Technology

[0002] In the manufacturing process of solar cells, silane (SiH4) is decomposed and diffused in the high-temperature environment of the reaction chamber of the deposition apparatus to form a PN junction (formed by combining P-type semiconductors and N-type semiconductors) on the cell.

[0003] To reduce heat loss, a heat exchange component is usually installed in the reaction chamber of the deposition apparatus near the outlet. As the gas flow carrying silane passes through the heat exchange component, the gas flow exchanges heat with the heat exchange component. The heat exchange component absorbs the heat of the gas flow and keeps it in the reaction chamber to prevent the heat from spreading outside the reaction chamber and maintain the high temperature environment in the reaction chamber. After the heat exchange, the temperature of the gas flow decreases and is finally discharged from the outlet.

[0004] However, during the flow of air through the heat exchanger, the airflow is prone to rebound and turbulence in the space near the heat exchanger within the reaction chamber. This results in excessively high silane concentrations in this space, leading to incomplete reactions and the formation of silicon dust on the solar cells within this space; these are called dust-covered solar cells. Furthermore, the turbulence can also create airflow marks on the solar cells within this space; these are called airflow-covered solar cells. Both dust-covered and airflow-covered solar cells are defective. Therefore, it is evident that the traditional structure of heat exchangers contributes to an increased defect rate for solar cells. Utility Model Content

[0005] Therefore, it is necessary to provide a deposition apparatus, deposition system, and solar cell manufacturing production line that can reduce the defect rate of solar cells to address the above problems.

[0006] A deposition apparatus, the deposition apparatus comprising:

[0007] The sedimentation body has an air inlet, a reaction chamber, and an air outlet connected in sequence;

[0008] A heat exchange assembly is located in the reaction chamber. The heat exchange assembly includes at least one heat exchange plate. All the heat exchange plates are arranged close to the air outlet, and the projection of the area defined by the outer contour of the heat exchange plate in the direction of the central axis of the air outlet at least partially covers the air outlet. The heat exchange plate has multiple rings of air passage holes arranged at intervals along its central axis towards its outer edge. In two adjacent rings of air passage holes, the outer ring of air passage holes is arranged around the outer periphery of the inner ring of air passage holes. The air passage hole group includes a plurality of air passage holes arranged along its circumferential direction.

[0009] In some embodiments, the projection of the area defined by the outer contour of the heat exchange plate onto the central axis of the outlet covers the entire outlet.

[0010] In some embodiments, the heat exchange assembly includes a plurality of first connecting rods and a plurality of heat exchange plates, all of the heat exchange plates being arranged sequentially at intervals along the central axis direction of the air outlet, and all the first connecting rods being disposed on the top of the heat exchange plates and connected to all the heat exchange plates.

[0011] In some embodiments, the heat exchange plate facing the air inlet is defined as the first heat exchange plate, and the heat exchange plate facing the air outlet is defined as the last heat exchange plate, with the first connecting rod located between the first heat exchange plate and the last heat exchange plate.

[0012] In some embodiments, the heat exchange assembly includes a plurality of second connecting rods, all of which are disposed at the bottom of the heat exchange plates and are connected to all of the heat exchange plates;

[0013] The heat exchange plate facing the air inlet is defined as the first heat exchange plate, and all the second connecting rods protrude from the side of the first heat exchange plate facing the air inlet and are connected to the deposition body.

[0014] In some embodiments, the heat exchange assembly further includes a reinforcing mounting plate, which is mounted on the side of the first heat exchange plate facing the air inlet and corresponds one-to-one with the second connecting rod, wherein the second connecting rod is detachably connected to the corresponding reinforcing mounting plate.

[0015] In some embodiments, the second connecting rod and the corresponding reinforcing mounting plate are respectively provided with a first threaded hole and a second threaded hole. The heat exchange assembly includes bolts, and the bolts correspond one-to-one with the reinforcing mounting plate and the second connecting rod. The bolts are screwed to the corresponding first threaded hole and second threaded hole.

[0016] In some embodiments, the projection of the reinforcing mounting plate in the direction of the central axis of the air outlet falls outside the air passage group of the outermost ring of the first heat exchange plate.

[0017] A deposition system comprising a deposition apparatus as described in any of the above embodiments.

[0018] A solar cell manufacturing production line includes a deposition system as described in the above embodiments.

[0019] Compared with the prior art, this application has the following beneficial effects:

[0020] In the aforementioned deposition apparatus, deposition system, and solar cell manufacturing production line, the heat exchange plate has multiple rings of air passage holes arranged sequentially at intervals along its central axis towards its outer edge. In two adjacent rings of air passage holes, the outer ring of air passage holes surrounds the outer periphery of the inner ring of air passage holes. Each air passage hole group includes several air passage holes arranged along its circumference. Airflow from various areas within the reaction chamber to the heat exchange plate can pass through the air passage holes of the multiple rings of air passage holes on the heat exchange plate and ultimately exit through the outlet to the outside of the reaction chamber. Through the multiple rings of air passage holes on the heat exchange plate, the air passage capacity of the heat exchange plate in this application is greatly improved. The risk of airflow rebounding and forming turbulence on the side of the heat exchange plate furthest from the outlet is reduced. Most of the airflow can penetrate the heat exchange plate through the air passage holes and exit through the outlet. Because the risk of airflow rebound and turbulence is reduced, the airflow concentration is lower in the space near the heat exchange plate on the side furthest from the outlet. As a result, the silane in the airflow in this space can react fully, and the risk of silicon powder and airflow marks forming on the solar cells in this space is also reduced, thus reducing the defect rate of the solar cells. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the deposition apparatus in one embodiment of this application;

[0022] Figure 2 for Figure 1 Left view of the deposition apparatus shown after it has been cut along the AA direction;

[0023] Figure 3 for Figure 1 Right view of the deposition apparatus shown;

[0024] Figure 4 for Figure 1 A schematic diagram of the heat exchange components in the deposition apparatus shown.

[0025] Figure 5 for Figure 4 The diagram shown is a structural schematic of the heat exchange assembly after the reinforcing mounting plate has been removed.

[0026] Icon labels:

[0027] 100. Deposition apparatus;

[0028] 10. Deposition substrate; 20. Heat exchanger assembly;

[0029] 11. Air inlet; 12. Reaction chamber; 13. Air outlet;

[0030] 21. Heat exchange plate; 21a. First heat exchange plate; 21b. Last heat exchange plate; 211. Air passage hole group; 2111. Air passage hole; 22. First connecting rod; 23. Second connecting rod; 231. First threaded hole; 24. Reinforcing mounting plate; 241. Second threaded hole. Detailed Implementation

[0031] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0035] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0037] In the manufacturing process of solar cells, silane (SiH4) is decomposed and diffused in the high-temperature environment of the reaction chamber of the deposition device to form a PN junction on the cell.

[0038] To reduce heat loss, a heat exchange component is usually installed in the reaction chamber of the deposition apparatus near the outlet. As the gas flow carrying silane passes through the heat exchange component, the gas flow exchanges heat with the heat exchange component. The heat exchange component absorbs the heat of the gas flow and keeps it in the reaction chamber to prevent the heat from spreading outside the reaction chamber and maintain the high temperature environment in the reaction chamber. After the heat exchange, the temperature of the gas flow decreases and is finally discharged from the outlet.

[0039] However, during the flow of air through the heat exchanger, the airflow is prone to rebound and turbulence in the space near the heat exchanger within the reaction chamber. This results in excessively high silane concentrations in this space, leading to incomplete reactions and the formation of silicon dust on the solar cells within this space; these are called dust-covered solar cells. Furthermore, the turbulence can also create airflow marks on the solar cells within this space; these are called airflow-covered solar cells. Both dust-covered and airflow-covered solar cells are defective. Therefore, it is evident that the traditional structure of heat exchangers contributes to an increased defect rate for solar cells.

[0040] Please see Figures 1 to 5To alleviate the above problems, this application provides a deposition apparatus 100, which includes a deposition body 10 and a heat exchange assembly 20. The deposition body 10 has an air inlet 11, a reaction chamber 12 and an air outlet 13 connected in sequence. The heat exchange assembly 20 is located in the reaction chamber 12 and includes at least one heat exchange plate 21. All heat exchange plates 21 are arranged close to the air outlet 13, and the projection of the area defined by the outer contour of the heat exchange plate 21 onto the central axis of the air outlet 13 covers at least part of the air outlet 13. The heat exchange plate 21 has multiple rings of air passage holes 211 arranged at intervals along its central axis toward its outer edge. In two adjacent rings of air passage holes 211, the outer ring of air passage holes 211 is arranged around the outer periphery of the inner ring of air passage holes 211. The air passage hole group 211 includes a plurality of air passage holes 2111 arranged along its circumferential direction.

[0041] Specifically, the sedimentation body 10 is generally a cylindrical structure, which contains a cylindrical reaction chamber 12. The air inlet 11, the reaction chamber 12 and the air outlet 13 are arranged and connected in sequence along the central axis of the air outlet 13.

[0042] As an example, there may be one or more heat exchange plates 21. If there are multiple heat exchange plates 21, all heat exchange plates 21 are arranged sequentially along the central axis of the air outlet 13. As an example, the heat exchange plates 21 are generally made of metal or alloy with better heat transfer effect.

[0043] All heat exchange plates 21 are positioned close to the outlet 13, meaning that along the central axis of the outlet 13, the distance from each heat exchange plate 21 to the outlet 13 is less than its distance to the inlet 11. Multiple solar cells are stacked along the central axis of the outlet 13 within the reaction chamber 12, located between the inlet 11 and the heat exchange plate 21 furthest from the outlet 13. During actual operation, silane enters through the inlet 11 and fills the reaction chamber 12, then decomposes under the high-temperature environment within the reaction chamber 12, depositing onto each solar cell to form a PN junction. The deposition system containing the deposition apparatus 100 also includes a gas extraction device. During the above process, the gas extraction device is located outside the deposition body 10 and extracts the airflow at the outlet 13. The operation of the gas extraction device guides the airflow within the reaction chamber 12, allowing the airflow to flow from the inlet 11 to the outlet 13, contacting and depositing onto each solar cell to form a PN junction.

[0044] Since the projection of the area defined by the outer contour of the heat exchange plate 21 onto the central axis of the outlet 13 at least partially covers the outlet 13, the heat exchange plate 21 can at least block a portion of the airflow and come into contact with that portion of the airflow. Thus, during the flow of this portion of the airflow, the heat exchange plate 21 contacts and exchanges heat with that portion of the airflow. The heat exchange plate 21 absorbs the heat from the airflow and retains the heat within the reaction chamber 12, reducing heat diffusion to the outside of the reaction chamber 12. This helps maintain a high-temperature environment within the reaction chamber 12, reduces heat loss, and improves heat utilization. The temperature of the airflow after heat exchange decreases, and it is eventually discharged from the outlet 13.

[0045] Furthermore, the heat exchange plate 21 has multiple rings of air passage holes 211 arranged sequentially at intervals along its central axis (which coincides with or is approximately parallel to the central axis of the air outlet 13) pointing towards its outer edge. In two adjacent rings of air passage holes 211, the outer ring of air passage holes 211 is arranged around the outer periphery of the inner ring of air passage holes 211. The air passage hole group 211 includes a number of air passage holes 2111 arranged along its circumference. Then, the airflow from each area in the reaction chamber 12 to the heat exchange plate 21 can pass through the air passage holes 2111 of the multiple rings of air passage holes 211 on the heat exchange plate 21 and finally be output to the outside of the reaction chamber 12 through the air outlet 13. By using a multi-ring venting hole group 211 on the heat exchange plate 21, compared to the traditional heat exchange assembly 20 which only has one venting hole 2111 in the central area of ​​the heat exchange plate 21, the air passage capacity of the heat exchange plate 21 in this application is greatly improved. The risk of airflow rebounding and forming turbulence on the side of the heat exchange plate 21 furthest from the outlet 13 is reduced. Most of the airflow can penetrate the heat exchange plate 21 through the venting hole group 211 and be output from the outlet 13. Since the risk of airflow rebounding and forming turbulence is reduced, the airflow concentration is reduced in the space on the side of the heat exchange plate 21 furthest from the outlet 13 that is close to the heat exchange plate 21. As a result, the silane in the airflow in this space can react fully, and the risk of silicon powder and airflow marks forming on the solar cells in this space is also reduced, thus reducing the defect rate of the solar cells.

[0046] Furthermore, it is worth mentioning that during the airflow through the multi-ring air passage group 211, the multi-ring air passage group 211 also has a uniform flow effect on the airflow. This design allows the airflow to be distributed more evenly into each air passage 2111 and flow out through each air passage 2111. In this process, the contact area between the airflow and the heat exchange plate 21 is larger, making the heat exchange between the airflow and the heat exchange plate 21 more complete. Most of the heat in the airflow can be transferred to the heat exchange plate 21 and retained in the reaction chamber 12, resulting in better energy saving. Further, in some embodiments, the projection of the area defined by the outer contour of the heat exchange plate 21 onto the central axis of the outlet 13 covers the entire outlet 13. The larger the area of ​​the region defined by the outer contour of the heat exchange plate 21 is projected onto the central axis of the outlet 13, the larger the area of ​​the airflow in contact with the heat exchange plate 21, and the better the heat exchange effect. In this way, most of the airflow can exchange heat with the heat exchange plate 21 during the process of flowing to the outlet 13, so that most of the heat in the airflow can be retained in the reaction chamber 12 and reused, further improving the energy-saving effect.

[0047] Please see Figure 4 and Figure 5 In some embodiments, the heat exchange assembly 20 includes a plurality of first connecting rods 22 and a plurality of heat exchange plates 21. All heat exchange plates 21 are arranged sequentially at intervals along the central axis direction of the outlet 13. All first connecting rods 22 are disposed on the top of the heat exchange plates 21 and are connected to all heat exchange plates 21.

[0048] By setting multiple heat exchange plates 21, the airflow can exchange heat with each heat exchange plate 21 as it flows through them sequentially. This allows a large amount of heat from the airflow to be stored in the reaction chamber 12 and reused, resulting in better energy saving. All the first connecting rods 22 are located on the top of the heat exchange plates 21 and are connected to all the heat exchange plates 21, allowing all the heat exchange plates 21 to be connected as a whole, which facilitates the installation of the heat exchange assembly 20 in the reaction chamber 12.

[0049] In some embodiments, the heat exchange plate 21 facing the air inlet 11 is defined as the first heat exchange plate 21a, the heat exchange plate 21 facing the air outlet 13 is defined as the last heat exchange plate 21b, and the first connecting rod 22 is located between the first heat exchange plate 21a and the last heat exchange plate 21b.

[0050] It is understood that the heat exchange plate 21 facing the air inlet 11 is the heat exchange plate 21 that is furthest from the air outlet 13.

[0051] In actual operation, the airflow in the reaction chamber 12 flows sequentially through the first heat exchange plate 21a and the last heat exchange plate 21b, and is finally output from the outlet 13.

[0052] By setting the first connecting rod 22 between the first heat exchange plate 21a and the last heat exchange plate 21b, the space occupied by the first connecting rod 22 coincides with the space between the first heat exchange plate 21a and the last heat exchange plate 21b, thereby reducing the space occupied by the heat exchange assembly 20 and making it easier to install the heat exchange assembly 20 into the reaction chamber 12.

[0053] Please see Figure 2 , Figure 4 and Figure 5 In some embodiments, the heat exchange assembly 20 includes a plurality of second connecting rods 23, all of which are disposed at the bottom of the heat exchange plates 21 and are connected to all the heat exchange plates 21. The heat exchange plate 21 facing the air inlet 11 is defined as the first heat exchange plate 21a, and all the second connecting rods 23 protrude from the side of the first heat exchange plate 21a facing the air inlet 11 and are connected to the deposition body 10. By designing all the second connecting rods 23 to be connected to the deposition body 10, the heat exchange assembly 20 can be fixed to prevent the heat exchange assembly 20 from moving under the action of airflow and covering the air outlet 13.

[0054] Generally, to ensure smooth airflow from the outlet 13, a certain distance should be maintained between the heat exchange assembly 20 and the outlet 13. This allows the airflow from the air passages 2111 of the heat exchange plate 21 to pass through the space within this distance and ultimately exit through the outlet 13. All second connecting rods 23 protrude from the side of the first heat exchange plate 21a facing the inlet 11 and are connected to the deposition body 10. This allows the heat exchange assembly 20 to be fixed at a position with a certain distance from the outlet 13, preventing the heat exchange assembly 20 from moving to the outlet 13 and covering it under the action of airflow.

[0055] It is understandable that "heat exchange component 20 covering the air outlet 13" means that the distance between the last heat exchange plate 21b of the heat exchange component 20 and the air outlet 13 is zero, and the last heat exchange plate 21b covers the air outlet 13. "The heat exchange component 20 having a certain distance from the air outlet 13" means that the distance between the last heat exchange plate 21b of the heat exchange component 20 and the air outlet 13 is greater than zero.

[0056] Specifically, the first connecting rod 22 and the second connecting rod 23 can be connected to the heat exchange plate 21 by welding, bonding or screwing. The second connecting rod 23 can be detachably connected to the deposition body 10 by screwing or snapping to facilitate the installation or removal of the heat exchange assembly 20.

[0057] In some embodiments, the heat exchange assembly 20 further includes a reinforcing mounting plate 24, which is mounted on the side of the first heat exchange plate 21a facing the air inlet 11 and corresponds one-to-one with the second connecting rod 23. The second connecting rod 23 is detachably connected to the corresponding reinforcing mounting plate 24.

[0058] As an example, the reinforced mounting plate 24 and the first heat exchange plate 21a can be connected by welding, bonding or other methods.

[0059] In actual operation, the second connecting rod 23 can be detachably connected and positioned to the reinforcing mounting plate 24, and then the second connecting rod 23 can be welded to the heat exchange plate 21 to double fix the second connecting rod 23, thereby improving the stability of the connection between the heat exchange plate 21 and the second connecting rod 23.

[0060] Of course, the method of fixing the second connecting rod 23 is not limited to the one mentioned above. Alternatively, the second connecting rod 23 can be welded to the heat exchange plate 21 for positioning, and then the second connecting rod 23 can be detachably connected to the reinforcing mounting plate 24 to achieve double fixing.

[0061] In some embodiments, the second connecting rod 23 and the corresponding reinforcing mounting plate 24 are respectively provided with a first threaded hole 231 and a second threaded hole 241. The heat exchange assembly 20 includes bolts, and each bolt corresponds one-to-one with the reinforcing mounting plate 24 and the second connecting rod 23. The bolts are screwed into the corresponding first threaded holes 231 and second threaded holes 241. The method of fixing the second connecting rod 23 and the reinforcing mounting plate 24 with bolts is simple and convenient, and has high assembly efficiency.

[0062] In some embodiments, the projection of the reinforcing mounting plate 24 onto the central axis of the outlet 13 falls outside the outermost ring of the air passage hole group 211 of the first heat exchange plate 21a, so as to reduce the interference of the reinforcing mounting plate 24 on the air passage hole 2111 and ensure that the airflow in the reaction chamber 12 can pass smoothly through the air passage hole 2111.

[0063] This application also provides a deposition system including the deposition apparatus 100 as described in any of the above embodiments. The deposition system in this application has the effects of any of the above embodiments, and therefore will not be described again here.

[0064] In some embodiments, the deposition system further includes an air extraction device connected to the air outlet 13 and used to guide the airflow in the reaction chamber 12 from the air inlet 11 to the air outlet 13.

[0065] This application also provides a solar cell manufacturing production line, which includes the deposition system as described in any of the above embodiments. The solar cell manufacturing production line of this application has the effects of any of the above embodiments, and therefore will not be described again here.

[0066] The aforementioned deposition apparatus 100, deposition system, and solar cell manufacturing production line have a heat exchange plate 21 with multiple rings of air passage holes 211 arranged sequentially at intervals along its central axis toward its outer edge. In two adjacent rings of air passage holes 211, the outer ring of air passage holes 211 is arranged around the outer periphery of the inner ring of air passage holes 211. The air passage hole group 211 includes a number of air passage holes 2111 arranged along its circumference. The airflow from each area in the reaction chamber 12 to the heat exchange plate 21 can pass through the air passage holes 2111 of the multiple rings of air passage holes 211 on the heat exchange plate 21 and finally be output to the outside of the reaction chamber 12 through the air outlet 13. By utilizing the multi-ring venting hole group 211 on the heat exchange plate 21, the air passage capacity of the heat exchange plate 21 in this application is greatly improved. The risk of airflow rebounding and forming turbulence on the side of the heat exchange plate 21 furthest from the outlet 13 is reduced. Most of the airflow can penetrate the heat exchange plate 21 through the venting hole group 211 and be output from the outlet 13. Because the risk of airflow rebounding and forming turbulence is reduced, the airflow concentration is reduced in the space near the heat exchange plate 21 furthest from the outlet 13. As a result, the silane in the airflow in this space can react fully, thereby reducing the risk of silicon powder and airflow marks forming on the solar cells in this space, and thus reducing the defect rate of the solar cells.

[0067] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A deposition apparatus characterized by comprising: The deposition apparatus includes: The sedimentation body (10) has an air inlet (11), a reaction chamber (12) and an air outlet (13) connected in sequence; A heat exchange assembly (20) is located in the reaction chamber (12). The heat exchange assembly (20) includes at least one heat exchange plate (21). All the heat exchange plates (21) are arranged close to the air outlet (13). The projection of the area defined by the outer contour of the heat exchange plate (21) in the direction of the central axis of the air outlet (13) at least partially covers the air outlet (13). The heat exchange plate (21) has multiple rings of air passage holes (211) arranged sequentially at intervals along its central axis towards its outer edge. In two adjacent rings of air passage holes (211), the outer ring of air passage holes (211) is arranged around the outer periphery of the inner ring of air passage holes (211). The air passage hole group (211) includes a plurality of air passage holes (2111) arranged along its circumferential direction.

2. The deposition apparatus of claim 1, wherein The area defined by the outer contour of the heat exchange plate (21) is projected onto the entire air outlet (13) in the direction of the central axis of the air outlet (13).

3. The deposition apparatus of claim 1, wherein The heat exchange assembly (20) includes a plurality of first connecting rods (22) and a plurality of heat exchange plates (21). All the heat exchange plates (21) are arranged sequentially at intervals along the central axis direction of the air outlet (13). All the first connecting rods (22) are located on the top of the heat exchange plates (21) and are connected to all the heat exchange plates (21).

4. The deposition apparatus of claim 3, wherein The heat exchange plate (21) facing the air inlet (11) is defined as the first heat exchange plate (21a), and the heat exchange plate (21) facing the air outlet (13) is defined as the last heat exchange plate (21b). The first connecting rod (22) is located between the first heat exchange plate (21a) and the last heat exchange plate (21b).

5. The deposition apparatus according to claim 3, characterized in that, The heat exchange assembly (20) includes a plurality of second connecting rods (23), all of which are disposed at the bottom of the heat exchange plate (21) and are connected to all of the heat exchange plates (21); The heat exchange plate (21) facing the air inlet (11) is defined as the first heat exchange plate (21a), and all the second connecting rods (23) protrude from the side of the first heat exchange plate (21a) facing the air inlet (11) and are connected to the deposition body (10).

6. The deposition apparatus according to claim 5, characterized in that, The heat exchange assembly (20) also includes a reinforcing mounting plate (24), which is mounted on the side of the first heat exchange plate (21a) facing the air inlet (11) and corresponds one-to-one with the second connecting rod (23). The second connecting rod (23) is detachably connected to the corresponding reinforcing mounting plate (24).

7. The deposition apparatus according to claim 6, characterized in that, The second connecting rod (23) and the corresponding reinforcing mounting plate (24) are respectively provided with a first threaded hole (231) and a second threaded hole (241). The heat exchange assembly (20) includes bolts, and the bolts correspond one-to-one with the reinforcing mounting plate (24) and the second connecting rod (23). The bolts are screwed to the corresponding first threaded hole (231) and second threaded hole (241).

8. The deposition apparatus according to claim 6, characterized in that, The projection of the reinforcing mounting plate (24) in the direction of the central axis of the air outlet (13) falls outside the air passage hole group (211) of the outermost ring of the first heat exchange plate (21a).

9. A deposition system, characterized in that, It includes the deposition apparatus as described in any one of claims 1 to 8 above.

10. A solar cell manufacturing production line, characterized in that, Including the deposition system as described in claim 9 above.

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