A floor heating system and a graphene floor heating system

By employing dual DC power supplies and a foolproof interface design, the complex wiring and safety issues of underfloor heating systems have been resolved, resulting in simplified installation and improved operational reliability.

CN224340208UActive Publication Date: 2026-06-09JIANGMEN PENGJIANG DISTRICT BONIA FURNITURE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGMEN PENGJIANG DISTRICT BONIA FURNITURE CO LTD
Filing Date
2025-06-20
Publication Date
2026-06-09

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Abstract

The utility model discloses a floor heating system and graphene floor heating system, through with the first direct current power supply connection of the connecting interface of three floor heating plates of floor heating plate array first line, with the second direct current power supply connection of three floor heating plates of floor heating plate array last line, the mutual connection of the adjacent row and adjacent column floor heating plate of floor heating plate array, as long as one floor heating plate access one direct current power supply, can realize the power supply of whole floor heating plate array, simultaneously, floor heating system adopts double direct current power supply and supplies power, on one hand, can avoid the problem that single power failure influences system normal operation, on the other hand, can electric power complement, guarantees each floor heating plate operating voltage consistent, improves the reliability of floor heating plate system operation.
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Description

Technical Field

[0001] This utility model relates to the field of underfloor heating, and in particular to an underfloor heating system and a graphene underfloor heating system. Background Technology

[0002] A floor heating system is a system composed of multiple floor heating panels.

[0003] like Figure 1 As shown, this is an existing underfloor heating system, which includes multiple underfloor heating panels connected in parallel to a DC power supply. The wiring of this underfloor heating system is complex and inconvenient to install. If the user connects incorrectly, it can easily cause the heating panels to burn out, affecting the operational safety of the underfloor heating system. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings and deficiencies of the existing technology and to provide a floor heating system and graphene floor heating system that are simple to wire, easier to install, and more reliable.

[0005] In a first aspect, this utility model provides a floor heating system, including a first DC power supply, a second DC power supply, and a floor heating panel array; the floor heating panels of the floor heating panel array include three connection interfaces, and the floor heating panel array includes at least a first floor heating panel, a second floor heating panel, a third floor heating panel, a fourth floor heating panel, a fifth floor heating panel, and a sixth floor heating panel;

[0006] The first DC power supply is connected to one connection interface of the first, second, and third floor heating panels respectively; the second DC power supply is connected to one connection interface of the fourth, fifth, and sixth floor heating panels respectively; the remaining two connection interfaces of the first, second, third, fourth, fifth, and sixth floor heating panels are connected to the floor heating panels in adjacent rows and / or adjacent columns.

[0007] The first floor heating panel is located in the first row and first column of the floor heating panel array; the second floor heating panel is located in the middle column of the first row of the floor heating panel array; the third floor heating panel is located in the last column of the first row of the floor heating panel array; the fourth floor heating panel is located in the first column of the last row of the floor heating panel array; the fifth floor heating panel is located in the middle column of the last row of the floor heating panel array; and the sixth floor heating panel is located in the last row and last column of the floor heating panel array.

[0008] Secondly, this utility model provides a floor heating system, including a first DC power supply, a second DC power supply, and a floor heating panel array; the floor heating panels of the floor heating panel array include four connection interfaces, and the floor heating panel array includes at least a first floor heating panel, a second floor heating panel, a third floor heating panel, a fourth floor heating panel, a fifth floor heating panel, a sixth floor heating panel, a seventh floor heating panel, and an eighth floor heating panel;

[0009] The first DC power supply is connected to one connection interface of the first, second, third, and fourth floor heating panels, respectively; the second DC power supply is connected to one connection interface of the fifth, sixth, seventh, and eighth floor heating panels, respectively; the remaining three connection interfaces of the first, second, third, fourth, fifth, sixth, seventh, and eighth floor heating panels are connected to the floor heating panels in adjacent rows and / or adjacent columns.

[0010] The first floor heating panel is located in the first row and first column of the floor heating panel array; the second and third floor heating panels are located in the middle column of the first row of the floor heating panel array; the fourth floor heating panel is located in the last column of the first row of the floor heating panel array; the fifth floor heating panel is located in the first column of the last row of the floor heating panel array; the sixth and seventh floor heating panels are located in the middle column of the last row of the floor heating panel array; and the eighth floor heating panel is located in the last row and last column of the floor heating panel array.

[0011] Thirdly, this utility model provides a floor heating system, including any of the floor heating systems described above, wherein the floor heating board of the graphene floor heating board system is a graphene floor heating board.

[0012] In this embodiment, by connecting the connection interfaces of the three floor heating panels in the first row of the floor heating panel array to a first DC power supply, and connecting the three floor heating panels in the last row of the floor heating panel array to a second DC power supply, and connecting the floor heating panels in adjacent rows and columns of the floor heating panel array to each other, the entire floor heating panel array can be powered as long as one floor heating panel is connected to one of the DC power supplies. At the same time, the floor heating system adopts dual DC power supply, which on the one hand can avoid the problem of single power supply failure affecting the normal operation of the system, and on the other hand can complement each other's power to ensure that the working voltage of each floor heating panel is consistent, thereby improving the reliability of the floor heating panel system.

[0013] To better understand and implement this invention, the following detailed description is provided in conjunction with the accompanying drawings. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of an existing underfloor heating system in one embodiment of this utility model;

[0015] Figure 2 This is a schematic diagram of the structure of a floor heating system according to one embodiment of the present invention;

[0016] Figure 3 This is a schematic diagram of the structure of a floor heating system according to another embodiment of the present invention;

[0017] Figure 4 This is a schematic diagram of the structure of the first DC power supply 110 and the second DC power supply 120 in one embodiment of the present invention;

[0018] Figure 5 This is a schematic diagram of the structure of a floor heating system in another embodiment of the present invention. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the present invention will be described in further detail below with reference to the accompanying drawings.

[0020] It should be understood that the described embodiments are merely some embodiments of this utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0021] The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular forms “a,” “the,” and “the” used in this invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0022] In the following description, when referring to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims. In the description of this application, it should be understood that the terms "first," "second," "third," etc., are used only to distinguish similar objects and are not necessarily used to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] Furthermore, in the description of this application, unless otherwise stated, "several" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0024] like Figure 2As shown, this utility model provides a floor heating system, including a first DC power supply 110, a second DC power supply 120, and a floor heating panel array 130;

[0025] The floor heating panel array 130 includes three connection interfaces. The floor heating panels of the floor heating panel array 130 are connected in pairs through the connection interfaces, so that when the floor heating panel array 130 receives a DC power input, it can supply power to all the floor heating panels of the floor heating panel array 130.

[0026] The floor heating panel array 130 includes at least a first floor heating panel 131, a second floor heating panel 132, a third floor heating panel 133, a fourth floor heating panel 134, a fifth floor heating panel 135, and a sixth floor heating panel 136.

[0027] The first DC power supply 110 is connected to one connection interface of the first floor heating panel 131, the second floor heating panel 132, and the third floor heating panel 133, respectively; the second DC power supply 120 is connected to one connection interface of the fourth floor heating panel 134, the fifth floor heating panel 135, and the sixth floor heating panel 136, respectively; the remaining two connection interfaces of the first floor heating panel 131, the second floor heating panel 132, the third floor heating panel 133, the fourth floor heating panel 134, the fifth floor heating panel 135, and the sixth floor heating panel 136 are connected to the floor heating panels in adjacent rows and / or adjacent columns.

[0028] The first floor heating panel 131 is located in the first row and first column of the floor heating panel array 130; the second floor heating panel 132 is located in the middle column of the first row of the floor heating panel array 130; the third floor heating panel 133 is located in the last column of the first row of the floor heating panel array 130; the fourth floor heating panel 134 is located in the first column of the last row of the floor heating panel array; the fifth floor heating panel 135 is located in the middle column of the last row of the floor heating panel array 130; and the sixth floor heating panel 136 is located in the last row and last column of the floor heating panel array 130.

[0029] like Figure 2 As shown in the embodiment of this application, the underfloor heating panel array 130 may include 12 underfloor heating panels, arranged in a three-row, four-column configuration. The other two interfaces of the first underfloor heating panel 131, the second underfloor heating panel 132, the third underfloor heating panel 133, the fourth underfloor heating panel 134, and the sixth underfloor heating panel 136 are respectively connected to the underfloor heating panels in adjacent rows and columns. The other two interfaces of the fifth underfloor heating panel 135 are connected to the underfloor heating panels in adjacent rows. The three interfaces of the underfloor heating panels in the second row are respectively connected to the underfloor heating panels in adjacent rows and columns.

[0030] Or, such as Figure 3As shown, it is a schematic diagram of a floor heating system according to another embodiment. The difference between this embodiment and the above embodiment is that the three interfaces of the second floor heating board 132 are respectively connected to the first DC power supply 110 and the floor heating board in the adjacent row. One interface of the floor heating board in the second row and second column and the third row and third column is empty, and the other two interfaces are connected to the adjacent row.

[0031] It should be noted that the underfloor heating panel array can also be an array of any number of rows and columns. The connection method of the underfloor heating panels in the middle row and middle column can be referred to the connection method of the middle row and middle column in the above embodiment, and will not be repeated here.

[0032] like Figure 1 As shown, traditional underfloor heating systems connect individual heating panels to an AC power source to supply power to the panels. If a problem occurs in the power supply circuit, the heating panels will lose power and stop operating. Furthermore, the wiring of such underfloor heating systems is complex, making construction difficult and costly.

[0033] In this embodiment, both the first and second DC power supplies are DC power supplies. Compared to AC power supplies, which lack polarity and are prone to short circuits, DC power supplies have clearly defined high and low voltages, reducing the risk of incorrect connection and short circuits. Furthermore, by utilizing both power supplies to power the underfloor heating system, this application achieves power complementarity, ensuring that each underfloor heating panel operates at the same voltage, avoiding voltage loss during transmission and improving operational stability. Simultaneously, with this underfloor heating system, as long as any connection interface is connected to a power source, all underfloor heating panels can receive power and operate normally, preventing system malfunctions caused by single-point failures.

[0034] The underfloor heating system of this application embodiment connects the connection interfaces of the three underfloor heating panels in the first row of the underfloor heating panel array to a first DC power supply, connects the three underfloor heating panels in the last row of the underfloor heating panel array to a second DC power supply, and connects the underfloor heating panels in adjacent rows and adjacent columns of the underfloor heating panel array to each other. As long as one underfloor heating panel is connected to one of the DC power supplies, the entire underfloor heating panel array can be powered. At the same time, the underfloor heating system adopts dual DC power supply, which on the one hand can avoid the problem of single power supply failure affecting the normal operation of the system, and on the other hand can complement each other's power to ensure that the working voltage of each underfloor heating panel is consistent, thereby improving the reliability of the underfloor heating panel system.

[0035] In a preferred embodiment, the connection interfaces of the first, second, and third floor heating panels that are connected to the first DC power supply are foolproof design interfaces, and the connection interfaces of the fourth, fifth, and sixth floor heating panels that are connected to the second DC power supply are foolproof design interfaces.

[0036] The foolproof design interface is used to prevent reverse connection of the DC power supply polarity. The foolproof design interface can be an existing foolproof design interface.

[0037] Optionally, the foolproof design interface can be an interface with positive and negative markings, where the positive marking indicates that the pin is connected to the positive terminal and the negative marking indicates that the pin is connected to the negative terminal.

[0038] Alternatively, in another embodiment, the connection interface can be a recessed or raised interface corresponding to the docking interface of the DC power supply. The connection interface only matches the docking interface of the DC power supply when the DC power supply is correctly connected; otherwise, the connection cannot be made.

[0039] The foolproof design of the interface can effectively prevent reverse connection of the positive and negative terminals of the DC power supply, thus improving the safety of the underfloor heating system.

[0040] like Figure 4 As shown, in one embodiment, the first DC power supply 110 includes a first 220V AC power supply 111 and a first DC conversion circuit 112; the first DC conversion circuit 112 is used to convert the 220V AC voltage of the first 220V AC power supply 111 into a target DC voltage.

[0041] The second DC power supply 120 includes a second 220V AC power supply 121 and a second DC conversion circuit 122; the second DC conversion circuit 122 is used to convert the 220V AC voltage of the second 220V AC power supply 121 into a target DC voltage.

[0042] The target DC voltage can be determined based on the operating voltage of the underfloor heating panel.

[0043] The first DC-DC conversion circuit 112 and the second DC-DC conversion circuit 122 can use existing rectifier circuits, AC-DC converters, or other existing AC-to-DC circuits or devices to achieve AC-DC conversion.

[0044] In this embodiment, the 220V AC voltage is converted into the target DC voltage when the floor heating board is working by using a first DC-DC conversion circuit and a second DC-DC conversion circuit, thus ensuring the power demand of the floor heating system.

[0045] In the above embodiments, the floor heating board can be a graphene floor heating board. Traditional graphene floor heating boards use a method of pasting graphene heating film. When the external temperature sensing power supply control switch malfunctions, the temperature of the graphene floor heating board can easily soar to over 60 degrees Celsius, which can easily burn people and damage the floor heating board.

[0046] Therefore, in one embodiment, the floor heating panel includes a temperature sensor, a controller, and a power supply control switch; the controller is connected to the temperature sensor and the power supply control switch respectively, and the power supply control switch is disposed on the power supply circuit of the floor heating panel.

[0047] Temperature sensors are used to detect the temperature of the underfloor heating panels;

[0048] The controller is used to control the opening and closing of the power supply control switch.

[0049] The power supply control switch is used to control the power supply to the underfloor heating panel. The controller determines the temperature of the underfloor heating panel based on the detection signal from the temperature sensor. When the temperature of the underfloor heating panel is abnormal (such as when the temperature of the underfloor heating panel exceeds the target temperature threshold), the power supply control switch disconnects the power supply circuit of the underfloor heating panel, thereby cutting off the power to the underfloor heating panel to reduce its temperature and prevent burns to users and damage to other components of the underfloor heating panel.

[0050] The power supply control switch can be any existing mechanical switch, electronic switch, or other switching element.

[0051] Mechanical switches control the switching of circuits through physical contact, while electronic switches control the switching of circuits through electronic components (such as transistors and thyristors). In this embodiment, the power supply control switch is preferably an electronic switch. Electronic switches can switch the circuit on and off in a very short time, and they do not suffer from the wear and tear of mechanical contacts that is common in mechanical switches, resulting in a longer service life.

[0052] like Figure 5 As shown in the embodiment of this application, another underfloor heating system is also provided, including a first DC power supply 210, a second DC power supply 220, and an underfloor heating panel array 230; the underfloor heating panels of the underfloor heating panel array 230 include four connection interfaces, and the underfloor heating panel array 230 includes at least a first underfloor heating panel 231, a second underfloor heating panel 232, a third underfloor heating panel 233, a fourth underfloor heating panel 234, a fifth underfloor heating panel 235, a sixth underfloor heating panel 236, a seventh underfloor heating panel 237, and an eighth underfloor heating panel 238;

[0053] The first DC power supply 210 is connected to one connection interface of the first floor heating panel 231, the second floor heating panel 232, the third floor heating panel 233, and the fourth floor heating panel 234, respectively. The second DC power supply 220 is connected to one connection interface of the fifth floor heating panel 235, the sixth floor heating panel 236, the seventh floor heating panel 237, and the eighth floor heating panel 238, respectively. The remaining three connection interfaces of the first floor heating panel 231, the second floor heating panel 232, the third floor heating panel 233, the fourth floor heating panel 234, the fifth floor heating panel 235, the sixth floor heating panel 236, the seventh floor heating panel 237, and the eighth floor heating panel 238 are connected to the floor heating panels in adjacent rows and / or adjacent columns.

[0054] The first floor heating panel 231 is located in the first row and first column of the floor heating panel array; the second floor heating panel 232 and the third floor heating panel 233 are located in the middle column of the first row of the floor heating panel array 230; the fourth floor heating panel 234 is located in the last column of the first row of the floor heating panel array 230; the fifth floor heating panel 235 is located in the first column of the last row of the floor heating panel array; the sixth floor heating panel 236 and the seventh floor heating panel 237 are located in the middle column of the last row of the floor heating panel array 230; and the eighth floor heating panel 238 is located in the last row and last column of the floor heating panel array 230.

[0055] like Figure 5 As shown in the embodiment of this application, the underfloor heating panel array 130 may include 12 underfloor heating panels, which are arranged in a three-row, four-column configuration. The remaining three connection interfaces of the first underfloor heating panel 231, the second underfloor heating panel 232, the third underfloor heating panel 233, the fourth underfloor heating panel 234, the fifth underfloor heating panel 235, the sixth underfloor heating panel 236, the seventh underfloor heating panel 237, and the eighth underfloor heating panel 238 are respectively connected to the underfloor heating panels in the adjacent row and the adjacent column.

[0056] In one embodiment, the first DC power supply 210 includes a first 220V AC power supply and a first DC conversion circuit; the first DC conversion circuit is used to convert the 220V AC voltage into a target DC voltage.

[0057] The second DC power supply 220 includes a second 220V AC power supply and a second DC conversion circuit; the second DC conversion circuit is used to convert the 220V AC voltage into a target DC voltage.

[0058] In one embodiment, the connection interfaces of the first floor heating board 231, the second floor heating board 232, the third floor heating board 233, and the fourth floor heating board 234 that are connected to the first DC power supply 210 are foolproof design interfaces, and the connection interfaces of the fifth floor heating board 235, the sixth floor heating board 236, the seventh floor heating board 237, and the eighth floor heating board 238 that are connected to the second DC power supply 220 are foolproof design interfaces.

[0059] In one embodiment, the floor heating panel includes a temperature sensor, a controller, and a power supply control switch; the controller is connected to both the temperature sensor and the power supply control switch, and the power supply control switch is located on the power supply circuit of the floor heating panel.

[0060] In one embodiment, the power supply control switch is an electronic switch.

[0061] In one embodiment, the floor heating panel is a graphene floor heating panel.

[0062] The underfloor heating system of this application embodiment has a similar structure to the underfloor heating system of the above embodiments. The difference is that in this application embodiment, each power source is connected to four underfloor heating panels, which can realize the four-head networking and power supply of the underfloor heating system. The same structure of the first DC power source 210, the second DC power source 220 and the underfloor heating panels in the underfloor heating system can be referred to the description of the above embodiments, and will not be repeated here.

[0063] It should be noted that the underfloor heating system of this application may also include two or more DC power supplies, such as a third DC power supply and a fourth DC power supply. The third DC power supply may be located on the left side of the underfloor heating panel array 230 and may be connected to any number of underfloor heating panels in the leftmost column of the underfloor heating panel array 230. The fourth DC power supply may be located on the right side of the underfloor heating panel array 230 and may be connected to any number of underfloor heating panels in the rightmost column of the underfloor heating panel array 230, thereby realizing multi-head power supply for the underfloor heating system and improving the stability and reliability of the power supply of the underfloor heating system.

[0064] This application also provides a graphene underfloor heating system, including any of the above-mentioned underfloor heating systems. The underfloor heating panel of this graphene underfloor heating system is a graphene underfloor heating panel.

[0065] This utility model is not limited to the above-described embodiments. If any modifications or variations to this utility model do not depart from the spirit and scope of this utility model, and if such modifications and variations fall within the scope of the claims and equivalent technologies of this utility model, then this utility model also intends to include such modifications and variations.

Claims

1. A floor heating system, characterized in that: It includes a first DC power supply, a second DC power supply, and an array of floor heating panels; the floor heating panels of the array of floor heating panels include three connection interfaces, and the array of floor heating panels includes at least a first floor heating panel, a second floor heating panel, a third floor heating panel, a fourth floor heating panel, a fifth floor heating panel, and a sixth floor heating panel; The first DC power supply is connected to one connection interface of the first, second, and third floor heating panels respectively; the second DC power supply is connected to one connection interface of the fourth, fifth, and sixth floor heating panels respectively; the remaining two connection interfaces of the first, second, third, fourth, fifth, and sixth floor heating panels are connected to the floor heating panels in adjacent rows and / or adjacent columns. The first floor heating panel is located in the first row and first column of the floor heating panel array; the second floor heating panel is located in the middle column of the first row of the floor heating panel array; the third floor heating panel is located in the last column of the first row of the floor heating panel array; the fourth floor heating panel is located in the first column of the last row of the floor heating panel array; the fifth floor heating panel is located in the middle column of the last row of the floor heating panel array; and the sixth floor heating panel is located in the last row and last column of the floor heating panel array.

2. The underfloor heating system according to claim 1, characterized in that: The first DC power supply includes a first 220V AC power supply and a first DC conversion circuit; the first DC conversion circuit is used to convert the 220V AC voltage into a target DC voltage; The second DC power supply includes a second 220V AC power supply and a second DC conversion circuit; the second DC conversion circuit is used to convert the 220V AC voltage into a target DC voltage.

3. The underfloor heating system according to claim 1, characterized in that, The underfloor heating panel includes a temperature sensor, a controller, and a power supply control switch; the controller is connected to both the temperature sensor and the power supply control switch, and the power supply control switch is located on the power supply circuit of the underfloor heating panel.

4. The underfloor heating system according to claim 3, characterized in that: The power supply control switch is an electronic switch.

5. The underfloor heating system according to claim 1, characterized in that: The connection interfaces of the first floor heating board, the second floor heating board and the third floor heating board that are connected to the first DC power supply are foolproof design interfaces to prevent the positive and negative poles of the DC power supply from being reversed. The connection interfaces of the fourth, fifth, and sixth floor heating panels that are connected to the second DC power supply are designed to prevent reverse connection of the positive and negative terminals of the DC power supply.

6. The underfloor heating system according to any one of claims 1-5, characterized in that: The floor heating board is a graphene floor heating board.

7. A floor heating system, characterized in that, It includes a first DC power supply, a second DC power supply, and an array of floor heating panels; the floor heating panels of the array of floor heating panels include four connection interfaces, and the array of floor heating panels includes at least a first floor heating panel, a second floor heating panel, a third floor heating panel, a fourth floor heating panel, a fifth floor heating panel, a sixth floor heating panel, a seventh floor heating panel, and an eighth floor heating panel; The first DC power supply is connected to one connection interface of the first, second, third, and fourth floor heating panels, respectively; the second DC power supply is connected to one connection interface of the fifth, sixth, seventh, and eighth floor heating panels, respectively; the remaining three connection interfaces of the first, second, third, fourth, fifth, sixth, seventh, and eighth floor heating panels are connected to the floor heating panels in adjacent rows and / or adjacent columns. The first floor heating panel is located in the first row and first column of the floor heating panel array; the second and third floor heating panels are located in the middle column of the first row of the floor heating panel array; the fourth floor heating panel is located in the last column of the first row of the floor heating panel array; the fifth floor heating panel is located in the first column of the last row of the floor heating panel array; the sixth and seventh floor heating panels are located in the middle column of the last row of the floor heating panel array; and the eighth floor heating panel is located in the last row and last column of the floor heating panel array.

8. The underfloor heating system according to claim 7, characterized in that, The underfloor heating panel includes a temperature sensor, a controller, and a power supply control switch; the controller is connected to both the temperature sensor and the power supply control switch, and the power supply control switch is located on the power supply circuit of the underfloor heating panel.

9. The underfloor heating system according to any one of claims 7-8, characterized in that, The floor heating board is a graphene floor heating board.

10. A graphene underfloor heating system, characterized in that, The system includes the underfloor heating system as described in claim 1 or claim 7, wherein the underfloor heating panel of the graphene underfloor heating system is a graphene underfloor heating panel.