A hemispherical electrode base composite sintering mold and device

Abstract

This utility model discloses a composite sintering mold and device for a hemispherical electrode base. The mold includes an upper mold, a lower mold, and a hemispherical electrode base. The hemispherical electrode base includes a base body, multiple glass electrode components located on the base body, a copper tube, and a solder ring sleeved on the copper tube. Both the upper and lower molds have positioning grooves that mate with the base body. The bottom of the positioning groove has an overflow groove, and the bottom of the overflow groove has multiple insertion holes corresponding to the electrode needles. The bottom of the upper overflow groove also has a receiving through hole that mates with the copper tube. The base body is positioned within the space enclosed by the upper and lower positioning grooves. The electrode needles are positioned in the corresponding upper and lower insertion holes, and the copper tube is positioned in the receiving through hole, with its upper end extending out of the receiving through hole. This utility model can achieve one-step sintering of the hemispherical electrode base. Compared with the traditional two-step sintering, it shortens the process flow, reduces costs, and improves the yield.

Description

Technical Field

[0001] This utility model relates to the field of hemispherical resonant gyroscope assembly technology, specifically to a composite sintering mold and device for a hemispherical electrode base. Background Technology

[0002] The hemispherical resonator gyroscope is a solid-state wave gyroscope based on the Gothic effect. It boasts advantages such as high precision, long lifespan, and high reliability, making it a crucial direction for future gyroscope development. Future applications of hemispherical resonator gyroscopes include aerospace, marine, and many other fields. The resonator, as a key component of the hemispherical resonator gyroscope, has a high Q-value, which is an important indicator of its quality and also affects the performance of the hemispherical resonator gyroscope. Operating the hemispherical resonator gyroscope in a vacuum environment is one of the core conditions for achieving its high precision and long lifespan. A vacuum environment significantly reduces the loss of resonator vibration energy due to air damping. Furthermore, a vacuum can suppress vibrational mode interference; molecular collisions in the air introduce random noise, disrupting the stability of the four antinodes of the resonator gyroscope's vibration.

[0003] Therefore, to ensure the long-term use of the hemispherical resonant gyroscope (including MEMS gyroscope) head in a high vacuum environment, the head is generally sealed in a cavity consisting of an excitation cover and a base. The head signal is led out through the base by an electrode needle. The electrode needle and the base are connected by a glass sintering seal and brazed with an oxygen-free copper tube. After the cavity is vented through the oxygen-free copper tube, the oxygen-free copper tube is clamped and the tube opening is sealed.

[0004] Therefore, the fabrication process of the electrode base is extremely important to achieve good sealing. Traditional electrode base sintering processes employ a two-step method: first, glass powder, electrodes, and the electrode base are sintered at high temperatures; subsequently, the exhaust copper tube is vacuum brazed. It is evident that the traditional electrode base fabrication process is relatively cumbersome, and the numerous sintering steps can easily lead to poor sealing of the meter head, affecting the performance and lifespan of the hemispherical resonator gyroscope. Utility Model Content

[0005] To address the problems in the background technology, this utility model proposes a composite sintering mold and device for hemispherical electrode bases that shortens the process flow, reduces costs, and improves yield.

[0006] The present invention adopts the following technical solution:

[0007] A composite sintering mold for a hemispherical electrode base includes: an upper mold, a lower mold, and a hemispherical electrode base.

[0008] The hemispherical electrode base includes a base body, multiple glass electrode assemblies, a copper tube, and a solder ring sleeved on the copper tube. Each glass electrode assembly includes an electrode needle and a glass column coaxially fixed to the electrode needle. The electrode needle and copper tube penetrate the base body, while the solder ring and glass column are located within the base body.

[0009] The top surface of the lower mold has a lower positioning groove that mates with the lower part of the base body. The bottom of the lower positioning groove has a lower overflow groove, and the bottom of the lower overflow groove has multiple lower insertion holes, each of which corresponds to an electrode pin that passes through the base body.

[0010] The bottom surface of the upper mold is provided with an upper positioning groove that mates with the upper part of the base body. The bottom of the upper positioning groove is provided with an upper overflow groove. The bottom of the upper overflow groove is provided with multiple upper insertion holes. The multiple upper insertion holes correspond one-to-one with the electrode pins that pass through the base body. The bottom of the upper overflow groove is also provided with a receiving through hole that mates with the copper tube.

[0011] The base body is positioned within the space enclosed by the upper positioning groove and the lower positioning groove. The upper part of the electrode needle is positioned in the corresponding upper insertion hole, and the lower part is positioned in the corresponding lower insertion hole. The copper tube is positioned in the receiving through hole, and its upper end extends out of the receiving through hole.

[0012] Optionally, the bottom of the overflow trough is also provided with an exhaust vent, which is connected to the receiving vent.

[0013] Optionally, the top surface of the base body is provided with a plurality of first receiving grooves, and the glass pillars of the plurality of glass electrode assemblies are respectively disposed in the plurality of first receiving grooves. One or more first connecting through holes are provided at the bottom of the first receiving groove. The lower part of the electrode needle of the glass electrode assembly passes through the corresponding first connecting through hole. There is a space between the hole wall of the first connecting through hole and the electrode needle for molten glass to flow in.

[0014] Optionally, the top surface of the base body is provided with a second receiving groove that mates with the brazing ring. The brazing ring is sleeved on the copper tube and placed in the second receiving groove. The bottom of the second receiving groove is provided with a second connecting through hole, through which the lower part of the copper tube passes.

[0015] As a general inventive concept, this utility model also provides a hemispherical electrode base composite sintering device, including a vacuum furnace, a rotating mechanism, an induction heating mechanism, and the aforementioned composite sintering mold. The rotating mechanism, the induction heating mechanism, and the composite sintering mold are located inside the vacuum furnace. The rotating mechanism is connected to the composite sintering mold for driving the composite sintering mold to rotate circumferentially. The induction coil of the induction heating mechanism is sleeved on the composite sintering mold.

[0016] Optionally, the rotating mechanism includes a drive mechanism and a connecting rod. The upper end of the connecting rod is detachably connected to the lower mold of the composite sintering mold, and its lower end is connected to the drive mechanism for transmission.

[0017] Optionally, the bottom surface of the lower mold is provided with a groove that mates with the upper end of the connecting rod. The bottom of the groove is provided with a plurality of first pin holes, and the upper end surface of the connecting rod is provided with a plurality of second pin holes that correspond one-to-one with the first pin holes. The lower mold and the connecting rod are detachably connected by positioning pins that pass through the first pin holes and the second pin holes.

[0018] Optionally, it also includes a temperature control mechanism located inside the vacuum furnace for monitoring the temperature inside the vacuum furnace.

[0019] Optionally, the vacuum furnace is provided with a condensate inlet and a condensate outlet, and the induction coil is provided with a condensate channel. The two ends of the condensate channel are connected to the condensate inlet and the condensate outlet respectively, and are connected to the cooling water source outside the vacuum furnace to form a cooling circulation loop.

[0020] Optionally, the vacuum furnace is also equipped with an observation window, a vacuum pump connection port, and a protective gas connection.

[0021] Compared with the prior art, the advantages of this utility model are:

[0022] This invention designs a composite sintering mold that can complete the glass insulation sealing sintering between the metal electrode and the metal base, as well as the brazing sintering between the oxygen-free copper tube and the metal base in one step. Compared with the traditional two-step sintering, this shortens the process flow, reduces costs, and improves the yield. Attached Figure Description

[0023] To facilitate understanding of this invention, it will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of this invention and should not be considered as limiting the scope of protection of this invention.

[0024] Figure 1 This is a three-dimensional exploded view of the composite sintering mold of Embodiment 1 of this utility model.

[0025] Figure 2 This is a cross-sectional structural diagram of the composite sintering mold of Embodiment 1 of this utility model.

[0026] Figure 3 This is a schematic diagram of the cross-sectional structure of the lower mold.

[0027] Figure 4 This is a top view of the lower mold structure.

[0028] Figure 5 This is a schematic diagram of the cross-sectional structure of the upper mold.

[0029] Figure 6 This is a schematic diagram of the upper mold structure viewed from below.

[0030] Figure 7 This is a three-dimensional structural diagram of the hemispherical electrode base.

[0031] Figure 8 This is a three-dimensional exploded view of the hemispherical electrode base.

[0032] Figure 9This is a schematic diagram of the three-dimensional structure of the base body.

[0033] Figure 10 This is a three-dimensional structural diagram of the composite sintering device according to Embodiment 2 of this utility model.

[0034] Figure 11 This is a three-dimensional structural diagram of the vacuum tank exterior in Embodiment 2 of this utility model.

[0035] Figure 12 This is a three-dimensional structural diagram of the interior of the vacuum tank in Embodiment 2 of this utility model.

[0036] Figure 13 This is a schematic diagram of the three-dimensional structure after the composite sintering mold and the connecting rod are assembled.

[0037] Figure 14 A three-dimensional exploded view of the assembly of the composite sintering mold and the connecting rod.

[0038] Figure 15 A three-dimensional exploded view of the assembly of the composite sintering mold and the connecting rod.

[0039] Figure label:

[0040] 1. Vacuum furnace; 11. Observation window; 13. Condensate inlet; 16. Condensate outlet; 14. Vacuum pump connection port; 15. Protective gas connection; 2. Control system; 3. Temperature control mechanism; 4. Composite sintering mold; 41. Upper mold; 411. Upper positioning groove; 412. Upper overflow groove; 413. Upper insertion hole; 414. Receiving through hole; 415. Exhaust through hole; 42. Lower mold; 421. Lower positioning groove; 422. Lower overflow groove; 423. Lower insertion hole; 424. Slot; 425. First pin hole; 43. Hemispherical electrode base; 431. Base body; 4311. First receiving groove; 4312. Second receiving groove; 4313. First connecting through hole; 4314. Second connecting through hole; 432. Glass electrode assembly; 4321. Electrode needle; 4322. Glass column; 433. Copper tube; 434. Brazing ring; 5. Induction heating mechanism; 6. Rotation mechanism; 61. Drive mechanism; 62. Linkage rod; 621. Second pin hole. Detailed Implementation

[0041] The embodiments of the present invention are described below with reference to the accompanying drawings, so that those skilled in the art can better understand and implement the present invention. However, the listed embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments can be combined with each other, wherein the same components are indicated by the same reference numerals.

[0042] like Figures 1-9As shown, this embodiment provides a composite sintering mold for a hemispherical electrode base, including: an upper mold 41, a lower mold 42, and a hemispherical electrode base 43.

[0043] The hemispherical electrode base 43 includes a base body 431, multiple glass electrode assemblies 432, a copper tube 433, and a solder ring 434 sleeved on the copper tube 433. The glass electrode assembly 432 includes an electrode needle 4321 and a glass column 4322 coaxially fixed on the electrode needle 4321. The electrode needle 4321 and the copper tube 433 penetrate the base body 431, and the solder ring 434 and the glass column 4322 are located inside the base body 431.

[0044] like Figure 3 and Figure 4 As shown, the top surface of the lower mold 42 has a lower positioning groove 421 that mates with the lower part of the base body 431. The bottom of the lower positioning groove 421 has a lower overflow groove 422. The bottom of the lower overflow groove 422 has multiple lower insertion holes 423, and each of the multiple lower insertion holes 423 corresponds to an electrode pin 4321 that passes through the base body 431.

[0045] like Figure 5 and Figure 6 As shown, the bottom surface of the upper mold 41 is provided with an upper positioning groove 411 that mates with the upper part of the base body 431. The bottom of the upper positioning groove 411 is provided with an upper overflow groove 412. The bottom of the upper overflow groove 412 is provided with multiple upper insertion holes 413. The multiple upper insertion holes 413 correspond one-to-one with the electrode needles 4321 that pass through the base body 431. The bottom of the upper overflow groove 412 is also provided with a receiving through hole 414 that mates with the copper tube 433.

[0046] The base body 431 is positioned within the space enclosed by the upper positioning groove 411 and the lower positioning groove 421. The upper part of the electrode needle 4321 is positioned in the corresponding upper insertion hole 413, and the lower part is positioned in the corresponding lower insertion hole 423. The copper tube 433 is positioned in the receiving through hole 414, and its upper end extends out of the receiving through hole 414.

[0047] Therefore, by designing a composite sintering mold that can complete the glass insulation sealing sintering between the metal electrode and the metal base and the brazing sintering between the oxygen-free copper tube and the metal base in one step, the process flow is shortened, the cost is reduced, and the yield rate is improved compared with the traditional two-step sintering.

[0048] The mold of this utility model adopts a split-type combined structure, which satisfies the positioning and fixing of the guide pins during the sintering process, prevents the guide pin position from changing during sintering and causing short circuits, and is suitable for use in various models of products.

[0049] Furthermore, both the upper mold 41 and the lower mold 42 adopt a double-step design process, which simultaneously satisfies the requirements of base fixation and prevents the glass powder from sticking to the mold after melting, ensuring that the mold and the glass powder do not come into contact.

[0050] Both the upper mold 41 and the lower mold 42 are made of graphite as the base material, which is conductive and can withstand high temperatures.

[0051] In this embodiment, the bottom of the upper overflow trough 412 is also provided with an exhaust vent 415, which is connected to the receiving vent 414.

[0052] like Figures 7-9 As shown, the top surface of the base body 431 is provided with a plurality of first receiving grooves 4311, and the glass pillars 4322 of the plurality of glass electrode assemblies 432 are respectively disposed in the plurality of first receiving grooves 4311. The bottom of the first receiving groove 4311 is provided with one or more first connecting through holes 4313, and the lower part of the electrode needle 4321 of the glass electrode assembly 432 passes through the corresponding first connecting through hole 4313. There is a space between the hole wall of the first connecting through hole 4313 and the electrode needle 4321 for molten glass to flow in.

[0053] In this embodiment, the top surface of the base body 431 is provided with a second receiving groove 4312 that cooperates with the brazing ring 434. The brazing ring 434 is sleeved on the copper tube 433 and placed in the second receiving groove 4312. The bottom of the second receiving groove 4312 is provided with a second connecting through hole 4314, and the lower part of the copper tube passes through the second connecting through hole 4314.

[0054] Example 2:

[0055] like Figures 10-15 As shown, this embodiment provides a hemispherical electrode base composite sintering device, including a vacuum furnace 1, a control system 2, a temperature control mechanism 3, a rotating mechanism 6, an induction heating mechanism 5, and a composite sintering mold 4 as described in Embodiment 1. The temperature control mechanism 3, the rotating mechanism 6, the induction heating mechanism 5, and the composite sintering mold 4 are located inside the vacuum furnace 1. The rotating mechanism 6 is connected to the composite sintering mold 4 for driving the composite sintering mold 4 to rotate circumferentially, avoiding the defect of uneven induction heating temperature. The induction coil of the induction heating mechanism 5 is sleeved on the composite sintering mold 4 and is used to heat the hemispherical electrode base 43 inside the composite sintering mold 4. The sintering atmosphere is switched through a vacuum atmosphere dual-way valve, and high-frequency induction heating is achieved by utilizing the electromagnetic characteristics of the electrode base. A condensate channel is provided inside the induction coil, and the condensate channel is connected to a cooling water source outside the vacuum furnace 1. The temperature control mechanism 3 is used to monitor the temperature inside the vacuum furnace 1. A dual-atmosphere design mode is adopted, and a high-frequency induction heating source + infrared non-contact temperature control mode is selected for the magnetic electrode base, resulting in higher heating efficiency.

[0056] Therefore, this device can achieve dual-purpose use in a single furnace, simultaneously satisfying the synchronous or asynchronous sintering processes of sintering electrode glass powder and brazing copper tubes. Furthermore, compared to traditional sintering processes, vacuum sintering using this device reduces the use of organic crosslinking agents, making it environmentally friendly and highly efficient.

[0057] In this embodiment, the rotating mechanism 6 includes a driving mechanism 61 and a connecting rod 62. The upper end of the connecting rod 62 is detachably connected to the lower mold 42 of the composite sintering mold, and its lower end is connected to the driving mechanism 61 for transmission.

[0058] like Figure 14 and Figure 15 As shown, the bottom surface of the lower mold 42 is provided with a groove 424 that mates with the upper end of the connecting rod 62. The bottom of the groove 424 is provided with a plurality of first pin holes 425. The upper end surface of the connecting rod 62 is provided with a plurality of second pin holes 621 that correspond one-to-one with the first pin holes 425. The lower mold 42 and the connecting rod 62 are detachably connected by positioning pins that pass through the first pin holes 425 and the second pin holes 621.

[0059] In this embodiment, the vacuum furnace 1 is provided with an observation window 11, a control connection cable channel 12, a condensate inlet 13, a condensate outlet 16, a vacuum pump connection port 14, and a protective gas connection port 15. The condensate inlet 13, the condensate outlet 16, the condensate channel, and the cooling water source are connected to form a cooling circulation loop. The temperature control mechanism 3, the rotation mechanism 6, and the induction heating mechanism 5 are electrically connected to the control system 2 outside the vacuum furnace, and the control cable enters the vacuum furnace through the control connection cable channel 12.

[0060] The process of composite sintering of the hemispherical electrode base using the composite sintering apparatus of this embodiment is as follows:

[0061] 1) Install the mold: First, fix the lower mold 42 on the atmosphere furnace through the connecting rod 62. Specifically, the connecting rod 62 connects the drive mechanism 61 to the composite sintering mold. One end is connected to the drive mechanism 61, and the other end is connected to the lower mold 42 by passing a pin through three first pin holes 425 and second pin holes 621.

[0062] 2) Install the electrode base: Place the base body 431 on the lower mold 42, and place the pre-pressed glass electrode assembly 432 on the corresponding hole according to the electrode hole positions. Insert the pin to the bottom to achieve the positioning of the pin.

[0063] 3) Install the upper mold: Install the copper tube 433 and the brazing ring 434 on the base body 431, pass the upper mold 41 through the copper tube 433, and after aligning it with the position of the pin, cover the upper mold 41 to complete the mold installation.

[0064] 4) Open the vacuum pump connection port 14, then close the connection port, and then open the protective gas connection port 15 to replace the gas in the vacuum tank with a nitrogen (argon) atmosphere.

[0065] 5) The induction heating mechanism 5 and the rotating mechanism 6 are activated by the control system 2, the condensate channel is opened, the high-frequency coil is cooled, the sintering temperature is controlled by the infrared temperature control mechanism 3, and synchronous sintering is achieved.

[0066] 6) After sintering is complete, open the upper mold and remove the electrode base.

[0067] 7) Testing: Mainly performs leak rate testing and continuity testing.

[0068] The embodiments described above are merely preferred embodiments of this utility model. The terms "in one embodiment," "in another embodiment," "in yet another embodiment," or "in still another embodiment" used in this specification all refer to one or more of the same or different embodiments according to this disclosure. Ordinary variations and substitutions made by those skilled in the art within the scope of this utility model's technical solution should be included within the protection scope of this utility model.

Claims

1. A composite sintering mold for a hemispherical electrode base, characterized in that, include: Upper mold (41), lower mold (42) and hemispherical electrode base (43). The hemispherical electrode base (43) includes a base body (431), multiple glass electrode assemblies (432), a copper tube (433), and a solder ring (434) sleeved on the copper tube (433). The glass electrode assembly (432) includes an electrode needle (4321) and a glass column (4322) coaxially fixed on the electrode needle (4321). The electrode needle (4321) and the copper tube (433) penetrate the base body (431), and the solder ring (434) and the glass column (4322) are located inside the base body (431). The top surface of the lower mold (42) is provided with a lower positioning groove (421) that mates with the lower part of the base body (431). The bottom of the lower positioning groove (421) is provided with a lower overflow groove (422). The bottom of the lower overflow groove (422) is provided with multiple lower insertion holes (423). The multiple lower insertion holes (423) correspond one-to-one with the electrode needles (4321) that pass through the base body (431). The bottom surface of the upper mold (41) is provided with an upper positioning groove (411) that cooperates with the upper part of the base body (431). The bottom of the upper positioning groove (411) is provided with an upper overflow groove (412). The bottom of the upper overflow groove (412) is provided with multiple upper insertion holes (413). The multiple upper insertion holes (413) correspond one-to-one with the electrode needles (4321) that pass through the base body (431). The bottom of the upper overflow groove (412) is also provided with a receiving through hole (414) that cooperates with the copper tube (433). The base body (431) is positioned within the space enclosed by the upper positioning groove (411) and the lower positioning groove (421). The upper part of the electrode needle (4321) is positioned in the corresponding upper insertion hole (413), and its lower part is positioned in the corresponding lower insertion hole (423). The copper tube (433) is positioned in the receiving through hole (414), and its upper end extends out of the receiving through hole (414).

2. The composite sintering mold for the hemispherical electrode base according to claim 1, characterized in that, The bottom of the overflow trough (412) is also provided with an exhaust vent (415), which is connected to the receiving vent (414).

3. The composite sintering mold for the hemispherical electrode base according to claim 1, characterized in that, The top surface of the base body (431) is provided with a plurality of first receiving grooves (4311), and the glass pillars (4322) of the plurality of glass electrode assemblies (432) are respectively disposed in the plurality of first receiving grooves (4311). One or more first connecting through holes (4313) are provided at the bottom of the first receiving groove (4311). The lower part of the electrode needle (4321) of the glass electrode assembly (432) passes through the corresponding first connecting through hole (4313). There is a space between the hole wall of the first connecting through hole (4313) and the electrode needle (4321) for the molten glass liquid to flow in.

4. The composite sintering mold for the hemispherical electrode base according to claim 1, characterized in that, The top surface of the base body (431) is provided with a second receiving groove (4312) that mates with the brazing ring (434). The brazing ring (434) is sleeved on the copper tube (433) and placed in the second receiving groove (4312). The bottom of the second receiving groove (4312) is provided with a second connecting through hole (4314). The lower part of the copper tube is located in the second connecting through hole (4314).

5. A composite sintering device for a hemispherical electrode base, comprising a vacuum furnace (1), a rotating mechanism (6), an induction heating mechanism (5), and a composite sintering mold (4) as described in any one of claims 1-4, wherein the rotating mechanism (6), the induction heating mechanism (5), and the composite sintering mold (4) are located inside the vacuum furnace (1), the rotating mechanism (6) is connected to the composite sintering mold (4) for driving the composite sintering mold (4) to rotate circumferentially, and the induction coil of the induction heating mechanism (5) is sleeved on the composite sintering mold (4).

6. The hemispherical electrode base composite sintering apparatus according to claim 5, characterized in that, The rotating mechanism (6) includes a driving mechanism (61) and a connecting rod (62). The upper end of the connecting rod (62) is detachably connected to the lower mold (42) of the composite sintering mold, and its lower end is connected to the driving mechanism (61) for transmission.

7. The hemispherical electrode base composite sintering apparatus according to claim 5, characterized in that, The bottom surface of the lower mold (42) is provided with a groove (424) that mates with the upper end of the connecting rod (62). The bottom of the groove (424) is provided with a plurality of first pin holes (425). The upper end surface of the connecting rod (62) is provided with a plurality of second pin holes (621) that correspond one-to-one with the first pin holes (425). The lower mold (42) and the connecting rod (62) are detachably connected by a positioning pin that passes through the first pin hole (425) and the second pin hole (621).

8. The composite sintering apparatus for hemispherical electrode bases according to claim 5, characterized in that, It also includes a temperature control mechanism (3), which is located inside the vacuum furnace (1) and is used to monitor the temperature inside the vacuum furnace (1).

9. The hemispherical electrode base composite sintering apparatus according to claim 5, characterized in that, The vacuum furnace (1) is provided with a condensate inlet (13) and a condensate outlet (16). The induction coil is provided with a condensate channel. The two ends of the condensate channel are connected to the condensate inlet (13) and the condensate outlet (16) respectively, and are connected to the cooling water source outside the vacuum furnace (1) to form a cooling circulation loop.

10. The hemispherical electrode base composite sintering apparatus according to claim 5, characterized in that, The vacuum furnace (1) is also equipped with an observation window (11), a vacuum pump connection port (14), and a protective gas connection (15).

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