A combined differential pressure transmitter

Abstract

This utility model discloses a combined differential pressure transmitter, specifically relating to the field of differential pressure transmitters. It includes a transmitter and a connecting pipe installed at the bottom of the transmitter. A pressure channel is installed at the bottom of the connecting pipe, and a low-pressure end plate and a high-pressure end plate are respectively installed at both ends of the pressure channel. Low-pressure inlets and high-pressure inlets are respectively opened on the side walls of the low-pressure end plate and the high-pressure end plate. Removable heat-conducting mechanisms are installed on both the low-pressure end plate and the high-pressure end plate, with one end extending into the interior of the pressure channel and the other end facing outwards from the low-pressure end plate and the high-pressure end plate, respectively. This utility model integrates differential pressure measurement and medium temperature regulation functions, adapting to different temperature measurement media without additional equipment. Simultaneously, an H-bridge drive circuit controls the semiconductor cooling chip to flexibly switch between cooling and heating modes, and high thermal conductivity copper studs and heat-conducting rods achieve efficient temperature regulation.

Description

Technical Field

[0001] This utility model relates to the field of differential pressure transmitters, and more specifically, to a combined differential pressure transmitter. Background Technology

[0002] In industrial differential pressure measurement, differential pressure transmitters need to handle media with different temperatures (such as high-temperature fluids and low-temperature gases). However, traditional differential pressure transmitters lack targeted temperature regulation functions. When the medium temperature is too high or too low, the performance of the measuring element is easily affected, thus reducing the accuracy of differential pressure detection. At the same time, the heat-conducting components in existing transmitters that come into contact with the medium are mostly fixed structures. After long-term use, impurities and scale easily remain on the surface, affecting heat transfer efficiency. Moreover, disassembly and cleaning are difficult, requiring complete disassembly of the equipment, which is inconvenient for maintenance and makes it difficult to ensure long-term stable measurement accuracy. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides a combined differential pressure transmitter, including a transmitter and a connecting pipe installed at the bottom of the transmitter. A pressure channel is installed at the bottom end of the connecting pipe, and a low-pressure end plate and a high-pressure end plate are respectively installed at both ends of the pressure channel. Low-pressure inlet and high-pressure inlet are respectively opened on the side walls of the low-pressure end plate and the high-pressure end plate. A detachable heat-conducting mechanism is installed on both the low-pressure end plate and the high-pressure end plate. One end of the two heat-conducting mechanisms extends into the interior of the pressure channel, and the other end faces the outside of the low-pressure end plate and the high-pressure end plate, respectively. An outward support is installed on the outer wall of the low-pressure end plate and the high-pressure end plate, which are far apart. A reciprocating pusher is installed on the outward support. A semiconductor cooling chip is installed at the end of the pusher. The reciprocating movement of the pusher causes the semiconductor cooling chip to adhere to the heat-conducting mechanism.

[0004] In a preferred embodiment, the outer walls of the high-pressure end plate and the low-pressure end plate, which are close to each other, are provided with inner grooves that communicate with the inside of the pressure channel, and the bottom of the inner grooves are provided with mounting screw holes that penetrate the high-pressure end plate and the low-pressure end plate.

[0005] In a preferred embodiment, the heat-conducting mechanism includes a removable copper stud in a mounting screw hole. A plurality of heat-conducting rods are mounted on one end of the copper stud facing the inner groove. A recessed gasket groove is formed on the other end of the copper stud away from the inner groove. A recessed hexagonal screw hole is formed in the middle of the gasket groove.

[0006] In a preferred embodiment, the outward support includes a connecting ring fixed to the outer wall of the high-pressure end plate and the low-pressure end plate, a plurality of connecting rods fixed to the connecting ring, and an adjusting plate fixed to the end of the connecting rods.

[0007] In a preferred embodiment, the pusher includes an adjusting screw tube fixed to the adjusting plate, a movable adjusting screw is inserted into the adjusting screw tube, the adjusting screw extends through the adjusting plate toward the pressure channel, and the thermoelectric cooling chip is fixed to the end of the adjusting screw toward the pressure channel.

[0008] In a preferred embodiment, the semiconductor cooling chip is powered by an H-bridge drive circuit.

[0009] In a preferred embodiment, a silicone thermal conductive sheet is attached to the gasket groove, and the semiconductor cooling chip is moved and attached to the silicone thermal conductive sheet by adjusting the screw.

[0010] The technical effects and advantages of this utility model are as follows:

[0011] 1. This utility model integrates differential pressure measurement and medium temperature regulation functions into one unit, which can adapt to measurement media of different temperatures without additional equipment. At the same time, the H-bridge drive circuit controls the semiconductor cooling chip to flexibly switch between cooling and heating modes, and with the high thermal conductivity copper stud and heat-conducting rod, efficient temperature regulation is achieved.

[0012] 2. The pusher component can precisely control the fit between the semiconductor cooling chip and the heat conduction mechanism to improve heat transfer efficiency. In addition, the heat conduction mechanism is detachable for easy cleaning of impurities on the heat conduction rod, and the silicone heat conduction sheet is replaceable to enhance maintenance convenience. The overall structure is compact and can stably ensure measurement accuracy. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the internal structure of this utility model.

[0015] Explanation of reference numerals in the attached drawings: 1 Transmitter, 2 Connecting pipe, 3 Pressure channel, 4 Low-pressure end plate, 5 High-pressure end plate, 6 High-pressure inlet, 7 Low-pressure inlet, 8 Heat conduction mechanism, 9 Outward support, 10 Pushing component, 11 Semiconductor cooling chip, 12 Inner groove, 13 Mounting screw hole, 14 Copper stud, 15 Heat conduction rod, 16 Gasket groove, 17 Hexagonal screw hole, 18 Connecting ring, 19 Connecting rod, 20 Adjusting plate, 21 Adjusting screw tube, 22 Adjusting screw, 23 Silicone heat conduction sheet, 24 Knob. Detailed Implementation

[0016] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical applications of the present invention, and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for a particular purpose.

[0017] like Figure 1-2 A combined differential pressure transmitter is shown, including a transmitter 1 and a connecting pipe 2 installed at the bottom of the transmitter 1. A pressure channel 3 is installed at the bottom end of the connecting pipe 2. A low-pressure end plate 4 and a high-pressure end plate 5 are respectively installed at the two ends of the pressure channel 3. A low-pressure inlet 7 and a high-pressure inlet 6 are respectively opened on the side walls of the low-pressure end plate 4 and the high-pressure end plate 5. A detachable heat conduction mechanism 8 is installed on both the low-pressure end plate 4 and the high-pressure end plate 5. One end of the two heat conduction mechanisms 8 extends into the interior of the pressure channel 3, and the other end faces the outside of the low-pressure end plate 4 and the high-pressure end plate 5 respectively. An outward support 9 is installed on the outer wall of the low-pressure end plate 4 and the high-pressure end plate 5, which are far apart. A back-and-forth moving pusher 10 is installed on the outward support 9. A semiconductor cooling chip 11 is installed at the end of the pusher 10. The back-and-forth movement of the pusher 10 drives the semiconductor cooling chip 11 to adhere to the heat conduction mechanism 8.

[0018] Based on the above, the low-pressure inlet 7 and the high-pressure inlet 6 are respectively connected to the two media to be measured. After the media enter the pressure channel 3, a pressure difference is formed. This differential pressure is transmitted to the transmitter 1 through the connecting pipe 2. The transmitter 1 completes the measurement and output of the differential pressure signal. One end of the heat conduction mechanism 8 is inserted into the pressure channel 3 and contacts the media. The other end is located on the outside of the end plate, providing a transmission path for temperature regulation. The outward support 9 fixes the pusher 10. The pusher 10 moves back and forth to drive the semiconductor cooling chip 11 to move closer to or away from the heat conduction mechanism 8. When they are in contact, the temperature of the media can be regulated through the heat conduction mechanism 8. When they are separated, the regulation stops.

[0019] The combined structure integrates differential pressure measurement and temperature regulation functions, requiring no additional equipment and featuring a compact design. The bonding / separation of the heat conduction mechanism 8 and the semiconductor cooling chip 11 can be flexibly controlled by the pusher 10 to adapt to different operating conditions.

[0020] The outer walls of the high-pressure end plate 5 and the low-pressure end plate 4 are respectively provided with inner grooves 12 that communicate with the inside of the pressure channel 3. The bottom of the inner groove 12 is provided with mounting screw holes 13 that penetrate the high-pressure end plate 5 and the low-pressure end plate 4.

[0021] Based on the above, the inner groove 12 provides installation space for the heat conduction mechanism 8, allowing the heat conduction mechanism 8 to extend into the pressure channel 3 through the inner groove 12, ensuring effective contact with the medium; the mounting screw hole 13 provides a fixing interface for the heat conduction mechanism 8, allowing the heat conduction mechanism 8 to be stably installed on the end plate through threaded engagement, while also providing a structural basis for the disassembly of the heat conduction mechanism 8;

[0022] Furthermore, the inner groove 12 design ensures the effectiveness of the contact between the heat conduction mechanism 8 and the medium, and the mounting screw hole 13 enables the heat conduction mechanism 8 to be firmly fixed and easily disassembled, facilitating later maintenance.

[0023] The heat conduction mechanism 8 includes a detachable copper stud 14 in the mounting screw hole 13. A plurality of heat conduction rods 15 are installed on one end of the copper stud 14 facing the inner groove 12. A recessed gasket groove 16 is opened on the end of the copper stud 14 away from the inner groove 12. A recessed hexagonal screw hole 17 is opened in the middle of the gasket groove 16.

[0024] Based on the above, the copper stud 14 is fixed by the mounting screw hole 13, and its high thermal conductivity enables rapid heat transfer; the heat-conducting rod 15 extends into the pressure channel 3, increasing the contact area with the medium and improving the heat exchange efficiency; the gasket groove 16 is used to place the heat-conducting components, providing a transition for heat transfer between the semiconductor cooling chip 11 and the copper stud 14; the hexagonal screw hole 17 is adapted to a tool, making it easy to rotate the copper stud 14 and disassemble the entire heat-conducting mechanism 8 from the mounting screw hole 13;

[0025] Furthermore, the copper material and multiple heat-conducting rods 15 design improve heat transfer efficiency and ensure temperature regulation effect; the cooperation between the hexagonal screw hole 17 and the mounting screw hole 13 makes the heat conduction mechanism 8 easy to disassemble, facilitates cleaning of impurities on the heat-conducting rods 15, and maintains long-term stability.

[0026] The outward support includes a connecting ring 18 fixed on the outer wall of the high-pressure end plate 5 and the low-pressure end plate 4, a plurality of connecting rods 19 fixed on the connecting ring 18, and an adjusting plate 20 fixed on the end of the connecting rods 19.

[0027] Based on the above, the connecting ring 18 fixes the outward support 9 to the outer wall of the end plate to ensure the stability of the overall structure; the connecting rod 19 connects the connecting ring 18 and the adjusting plate 20, supports the adjusting plate 20 and keeps it at a certain distance from the end plate, providing installation and movement space for the pusher 10 and the thermoelectric cooler 11; the adjusting plate 20 serves as the installation base for the pusher 10, ensuring that the pusher 10 drives the thermoelectric cooler 11 to move stably.

[0028] Furthermore, the multi-link 19 structure enhances the stability of the support and prevents vibration from affecting the fitting accuracy between the semiconductor cooling chip 11 and the heat conduction mechanism 8; the adjustment plate 20 provides stable support for the pusher 10 and ensures the reliability of the movement process.

[0029] The pusher 10 includes an adjusting screw tube 21 fixed on the adjusting plate 20. A movable adjusting screw 22 is inserted into the adjusting screw tube 21. The adjusting screw 22 extends through the adjusting plate 20 toward the pressure channel 3. The semiconductor cooling chip 11 is fixed at one end of the adjusting screw 22 toward the pressure channel 3. A knob 24 is installed at the other end of the adjusting screw 22.

[0030] Based on the above, the adjusting screw tube 21 is fixed on the adjusting plate 20 and forms a transmission structure with the adjusting screw 22 through a threaded engagement; when the adjusting screw 22 is rotated by the knob 24, it moves axially, causing the end semiconductor cooling chip 11 to move closer to or away from the heat conduction mechanism 8, so as to achieve the contact or separation of the two.

[0031] The threaded drive structure can precisely control the movement distance of the semiconductor cooling chip 11, ensuring a tight fit with the heat conduction mechanism 8 and improving heat transfer efficiency. It is simple to operate, easy to quickly switch states according to needs, and after separation, it can leave operating space to facilitate the disassembly and replacement of the heat conduction mechanism 8.

[0032] The thermoelectric cooler 11 is powered by an H-bridge drive circuit. The H-bridge drive circuit can change the direction of the current input to the thermoelectric cooler 11. When the current is input in the positive direction, the thermoelectric cooler 11 produces a cooling effect, and the cooling energy is transferred to the medium through the heat conduction mechanism 8, thereby reducing the temperature of the medium. When the current is input in the reverse direction, the thermoelectric cooler 11 produces a heating effect, and the heat is transferred to the medium through the heat conduction mechanism 8, thereby increasing the temperature of the medium and adjusting the temperature of the medium to a suitable measurement range.

[0033] Furthermore, the system enables rapid switching between cooling and heating modes by switching the current direction, adapting to media at different temperatures such as high and low temperatures, and avoiding the impact of abnormal temperatures on differential pressure measurement accuracy; the H-bridge circuit provides stable control, ensuring the reliability of temperature regulation.

[0034] A silicone thermally conductive sheet 23 is attached to the gasket groove 16. The thermoelectric cooler 11 moves and attaches to the silicone thermally conductive sheet 23 via the adjusting screw 22. The silicone thermally conductive sheet 23, attached to the gasket groove 16, has good thermal conductivity and flexibility, which can fill the gap between the thermoelectric cooler 11 and the copper stud 14, enhancing heat transfer efficiency. When the thermoelectric cooler 11 moves to attach to the silicone thermally conductive sheet 23 via the adjusting screw 22, cold or heat is transferred to the medium through the silicone thermally conductive sheet 23, the copper stud 14, and the heat-conducting rod 15. After the thermoelectric cooler 11 separates from the silicone thermally conductive sheet 23, the silicone thermally conductive sheet 23 can be removed from the gasket groove 16 for easy cleaning or replacement.

[0035] Furthermore, the silicone heat-conducting sheet 23 enhances heat transfer performance and ensures temperature regulation; the detachable design facilitates individual cleaning or replacement, preventing heat transfer from being affected by aging, and, in conjunction with the disassembly of the heat-conducting mechanism 8, further improves the overall ease of maintenance.

[0036] Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of this utility model without creative effort should fall within the protection scope of this utility model. Structures, devices, and operating methods not specifically described and explained in this utility model, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A combined differential pressure transmitter, comprising a transmitter and a connecting pipe installed at the bottom of the transmitter, wherein a pressure channel is installed at the bottom end of the connecting pipe, and a low-pressure end plate and a high-pressure end plate are respectively installed at both ends of the pressure channel, and a low-pressure inlet and a high-pressure inlet are respectively provided on the sidewalls of the low-pressure end plate and the high-pressure end plate, characterized in that, A detachable heat-conducting mechanism is installed on both the low-pressure end plate and the high-pressure end plate. One end of each heat-conducting mechanism extends into the interior of the pressure channel, and the other end faces the outside of the low-pressure end plate and the high-pressure end plate, respectively. An outward support is installed on the outer wall of the low-pressure end plate and the high-pressure end plate, which are far apart. A pusher that moves back and forth is installed on the outward support. A thermoelectric cooler is installed at the end of the pusher. The back and forth movement of the pusher causes the thermoelectric cooler to adhere to the heat-conducting mechanism.

2. The combined differential pressure transmitter according to claim 1, characterized in that: Both the high-pressure end plate and the low-pressure end plate have inner grooves on their outer walls that are close to each other and communicate with the inside of the pressure channel. The bottom of the inner groove has mounting screw holes that penetrate the high-pressure end plate and the low-pressure end plate.

3. A combined differential pressure transmitter according to claim 2, characterized in that: The heat-conducting mechanism includes a removable copper stud in the mounting screw hole. Several heat-conducting rods are installed on the end of the copper stud facing the inner groove. A recessed gasket groove is opened on the end of the copper stud away from the inner groove. A recessed hexagonal screw hole is opened in the middle of the gasket groove.

4. A combined differential pressure transmitter according to claim 3, characterized in that: The outward support includes a connecting ring fixed to the outer wall of the high-pressure end plate and the low-pressure end plate, several connecting rods fixed to the connecting ring, and an adjusting plate fixed to the end of the connecting rods.

5. A combined differential pressure transmitter according to claim 4, characterized in that: The pusher includes an adjusting screw tube fixed to the adjusting plate, a movable adjusting screw is inserted into the adjusting screw tube, the adjusting screw extends through the adjusting plate toward the pressure channel, and the semiconductor cooling chip is fixed at the end of the adjusting screw toward the pressure channel.

6. A combined differential pressure transmitter according to claim 1, characterized in that: The semiconductor cooling chip is powered by an H-bridge drive circuit.

7. A combined differential pressure transmitter according to claim 5, characterized in that: A silicone thermal conductive sheet is attached to the gasket groove, and the semiconductor cooling chip is moved and attached to the silicone thermal conductive sheet by adjusting the screw.

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