An apparatus for improving signal integrity of a high-speed optical module

Abstract

This utility model relates to the field of optical module technology and discloses a device for improving the signal integrity of high-speed optical modules. The device includes an optical module housing and an optical module housing cover. The optical module housing and the optical module housing cover are fitted together. A conductive rubber layer is disposed on the inner wall of the optical module housing, and a copper foil layer is disposed on the inner wall of the conductive rubber layer. A positioning groove is formed inside the optical module housing, and a positioning component is disposed at the bottom of the optical module housing cover. A heat dissipation component is disposed at the bottom of the optical module housing. The positioning component includes a connecting block, the top of which is fixedly connected to the bottom of the optical module housing cover. In this utility model, the conductive rubber layer elastically fills the gaps, and the good conductivity of the copper foil layer constructs an electromagnetic shielding structure. Simultaneously, the connecting block at the bottom of the housing cover slides into the positioning groove for initial positioning, and the hook engages with the slot to complete a stable connection. This achieves the effect of strictly shielding external electromagnetic interference and facilitating quick disassembly and maintenance of the housing.

Description

Technical Field

[0001] This utility model relates to the field of optical module technology, and in particular to a device for improving the signal integrity of high-speed optical modules. Background Technology

[0002] With the rapid development of 5G communication, data centers, and cloud computing technologies, high-speed optical modules, as core components for optical signal transmission, directly impact the stability and efficiency of data transmission due to their signal integrity. In high-frequency, high-speed signal transmission scenarios, optical modules are susceptible to external electromagnetic interference (EMI), leading to signal distortion and increased bit error rate. Traditional optical module protection devices often employ metal casings or simple sealing structures. However, as the integration of electronic devices continues to increase and the electromagnetic environment becomes increasingly complex, traditional protection technologies are no longer sufficient to meet the stringent requirements of high-speed optical modules for signal purity and transmission stability. Therefore, there is an urgent need to develop new protection devices with efficient electromagnetic shielding and precise positioning capabilities.

[0003] The electromagnetic protection of existing high-speed optical modules mainly adopts two methods: one is a metal shield, which wraps the optical module with a stamped metal shell and uses the conductivity of the metal material to reflect electromagnetic signals; the other is a plastic shell combined with a conductive coating, which achieves shielding by spraying conductive paint or plating a metal film on the plastic surface.

[0004] However, existing optical module protection devices generally suffer from inadequate electromagnetic shielding, leading to susceptibility to signal interference and reduced transmission quality. Even with the addition of conductive pads, traditional metal shields cannot completely eliminate electromagnetic leakage at the seams. In high-speed optical module applications, signal jitter caused by electromagnetic interference can severely affect the accuracy of data transmission. Furthermore, existing protection devices are inconvenient to disassemble and assemble, making it difficult to maintain internal electronic components in a timely manner. Therefore, a device to improve the signal integrity of high-speed optical modules is proposed to solve the above problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a device for improving the signal integrity of high-speed optical modules, aiming to improve the problems in the prior art where electromagnetic shielding is not tight, making the signal susceptible to interference, and making it difficult to maintain the internal electronic components in a timely manner.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A device for improving the signal integrity of a high-speed optical module includes an optical module housing and an optical module housing cover. The optical module housing and the optical module housing cover are attached together. A conductive rubber layer is provided on the inner wall of the optical module housing, and a copper foil layer is provided on the inner wall of the conductive rubber layer. A positioning groove is provided inside the optical module housing. A positioning component is provided at the bottom of the optical module housing cover, and a heat dissipation component is provided at the bottom of the optical module housing.

[0008] The positioning component includes a connecting block, the top of which is fixedly connected to the bottom of the optical module box cover, the connecting block is slidably connected inside the positioning groove, a spring block is fixedly connected to the bottom of the optical module box cover, a hook is fixedly connected to one side of the spring block, and a slot is opened inside the optical module box body, the hook engaging with the slot.

[0009] As a further description of the above technical solution:

[0010] The heat dissipation assembly includes a cooling box one and a cooling box two, the tops of which are fixedly connected to the bottom of the optical module box.

[0011] As a further description of the above technical solution:

[0012] A heat-absorbing pipe is fixedly connected inside the first cooling box, and an air supply pipe is fixedly connected inside the second cooling box.

[0013] As a further description of the above technical solution:

[0014] Both the heat absorption pipe and the air supply pipe are installed inside the optical module housing, and a cooling pipe is provided between the first cooling box and the second cooling box.

[0015] As a further description of the above technical solution:

[0016] Multiple heat dissipation fins are fixedly connected to the outer wall of the cooling pipe, and the two ends of the cooling pipe are respectively connected to the first cooling box and the second cooling box.

[0017] As a further description of the above technical solution:

[0018] A cooling fan is fixedly connected to the bottom of each of the aforementioned heat dissipation fins.

[0019] As a further description of the above technical solution:

[0020] The optical module box is fixedly connected to a support, and the support has an installation hole inside.

[0021] This utility model has the following beneficial effects:

[0022] 1. In this utility model, the conductive rubber layer on the inner wall of the box uses elasticity to fill the gaps, and together with the good conductivity of the copper foil layer, the two construct an electromagnetic shielding structure. At the same time, the connecting block at the bottom of the box cover slides into the positioning groove of the box to achieve initial positioning, and the spring block drives the hook to engage into the slot to complete a stable connection. These structures work together to achieve the effect of strictly shielding external electromagnetic interference and facilitating quick disassembly and maintenance of the box. This solves the problems of inadequate electromagnetic shielding, which leads to easy interference of signals and difficulty in timely maintenance of internal electronic components, thereby improving signal integrity and maintenance convenience.

[0023] 2. In this utility model, the heat generated by the optical module is absorbed by the heat-absorbing pipe in the first cooling box, and the air supply pipe in the second cooling box introduces airflow. The two work together with the cooling pipe to form a heat dissipation circulation channel. At the same time, the heat dissipation fins increase the heat dissipation area, and the bottom heat dissipation fan actively delivers air to enhance heat exchange. These structures work together to achieve the effect of quickly and efficiently removing the heat from the optical module and maintaining it at a suitable temperature. This solves the problems of low heat dissipation efficiency of traditional optical modules and unstable signal transmission and performance degradation caused by high temperature. Attached Figure Description

[0024] Figure 1 This is a three-dimensional schematic diagram of a device for improving the signal integrity of a high-speed optical module according to the present invention.

[0025] Figure 2 This is a cross-sectional schematic diagram of a device for improving the signal integrity of a high-speed optical module according to the present invention.

[0026] Figure 3 This is a schematic diagram of the hook structure of a device for improving the signal integrity of a high-speed optical module proposed in this utility model;

[0027] Figure 4 This is a schematic diagram of the bottom structure of the optical module housing of the device for improving the signal integrity of a high-speed optical module proposed in this utility model;

[0028] Figure 5 This is a schematic diagram of the cooling pipe structure of a device for improving the signal integrity of a high-speed optical module proposed in this utility model.

[0029] Legend:

[0030] 1. Optical module housing; 2. Optical module cover; 3. Conductive rubber layer; 4. Copper foil layer; 5. Positioning groove; 6. Connecting block; 7. Spring block; 8. Hook; 9. Slot; 10. Cooling box one; 11. Cooling box two; 12. Heat absorption pipe; 13. Air supply pipe; 14. Cooling pipe; 15. Heat dissipation fins; 16. Cooling fan; 17. Support; 18. Mounting hole. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figures 1-3 The present invention provides an embodiment of a device for improving the signal integrity of a high-speed optical module, comprising an optical module housing 1 and an optical module housing cover 2, wherein the optical module housing 1 and the optical module housing cover 2 are fitted together, and a conductive rubber layer 3 is provided on the inner wall of the optical module housing 1. The conductive rubber layer 3 effectively reduces electrostatic interference and prevents electromagnetic interference from affecting the optical signal. A copper foil layer 4 is provided on the inner wall of the conductive rubber layer 3 to enhance the stability of the signal during signal transmission. The copper foil layer 4 can effectively reflect external electromagnetic waves, reduce signal loss, and further improve the electromagnetic compatibility of the module. A positioning groove 5 is provided inside the optical module housing 1, a positioning component is provided at the bottom of the optical module housing cover 2, and a heat dissipation component is provided at the bottom of the optical module housing 1.

[0033] The positioning component includes a connecting block 6, the top of which is fixedly connected to the bottom of the optical module box cover 2. The connecting block 6 is slidably connected inside the positioning groove 5. The connecting block 6 is connected to the inside of the positioning groove 5 through a sliding structure to ensure that the optical module box cover 2 can be accurately positioned during installation and has a certain amount of room for movement. A spring block 7 is fixedly connected to the bottom of the optical module box cover 2. A hook 8 is fixedly connected to one side of the spring block 7. A slot 9 is opened inside the optical module box body 1. The hook 8 engages with the slot 9 to achieve stable closure of the optical module box body 1 and the optical module box cover 2.

[0034] Reference Figure 1 , Figure 4 and Figure 5The heat dissipation assembly includes a cooling box 10 and a cooling box 2 11. The tops of both cooling box 10 and cooling box 2 11 are fixedly connected to the bottom of the optical module housing 1. A heat-absorbing pipe 12 is fixedly connected inside cooling box 10. The heat-absorbing pipe 12 is responsible for absorbing heat generated inside the optical module and transferring the heat to the interior of cooling box 2 11 through fluid conduction, thus achieving heat dissipation. An air supply pipe 13 is fixedly connected inside cooling box 2 11. Both the heat-absorbing pipe 12 and the air supply pipe 13 pass through the interior of the optical module housing 1. A cooling pipe 14 is provided between cooling box 10 and cooling box 2 11. The outer wall of the cooling pipe 14... Multiple heat dissipation fins 15 are fixedly connected. The function of the heat dissipation fins 15 is to increase the contact area between the cooling pipe 14 and the outside air, help the cooling pipe 14 dissipate heat more effectively, reduce the operating temperature of the optical module, and prevent overheating. The two ends of the cooling pipe 14 are connected to the first cooling box 10 and the second cooling box 11 respectively. The bottom of the multiple heat dissipation fins 15 is fixedly connected to the cooling fan 16. The cooling fan 16 accelerates the diffusion of heat through air flow, which further improves the heat dissipation effect. The side wall of the optical module box 1 is fixedly connected to the support 17, and the support 17 has mounting holes 18 inside.

[0035] Working principle: When using this device to improve the signal integrity of high-speed optical modules, the box and the cover fit together to form a closed space. The conductive rubber layer 3 on the inner wall of the box can fill the gaps with its own elasticity. The copper foil layer 4, with its good conductivity, together form an electromagnetic shielding structure to block external electromagnetic interference from entering the box and reduce the impact on the optical module signal. In terms of positioning, the bottom connecting block 6 of the optical module cover 2 slides into the positioning groove 5 of the box to achieve initial positioning guidance. At the same time, the spring block 7 drives the hook 8 to engage with the slot 9 of the box. Through mechanical engagement, the cover and the box are firmly connected, ensuring that the optical module is installed in a precise position and avoiding abnormal signal transmission path due to loosening. It also facilitates the disassembly and maintenance of the box.

[0036] When heat dissipation of the optical module is required, cooling box 10 and cooling box 21 serve as the heat dissipation base. The heat absorption pipe 12 inside cooling box 10 absorbs the heat generated by the optical module during operation, and the air supply pipe 13 inside cooling box 21 introduces airflow. Together with cooling pipe 14, the two form a heat dissipation circulation channel. The heat dissipation fins 15 on the outer wall of cooling pipe 14 increase the heat dissipation area and accelerate heat dissipation. The bottom cooling fan 16 actively blows air to enhance heat exchange efficiency, removes heat in time, maintains the optical module in a suitable temperature environment, avoids signal transmission problems caused by high temperature, and comprehensively improves the stability and reliability of high-speed optical module signal transmission.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A device for improving the signal integrity of a high-speed optical module, comprising an optical module housing (1) and an optical module cover (2), characterized in that: The optical module box (1) is attached to the optical module box cover (2). The inner wall of the optical module box (1) is provided with a conductive rubber layer (3). The inner wall of the conductive rubber layer (3) is provided with a copper foil layer (4). The optical module box (1) is provided with a positioning groove (5). The bottom of the optical module box cover (2) is provided with a positioning component. The bottom of the optical module box (1) is provided with a heat dissipation component. The positioning component includes a connecting block (6), the top of which is fixedly connected to the bottom of the optical module box cover (2), the connecting block (6) is slidably connected inside the positioning groove (5), a spring block (7) is fixedly connected to the bottom of the optical module box cover (2), a hook (8) is fixedly connected to one side of the spring block (7), and a slot (9) is opened inside the optical module box body (1), the hook (8) engages with the slot (9).

2. The device for improving signal integrity of a high-speed optical module according to claim 1, characterized in that: The heat dissipation assembly includes a first cooling box (10) and a second cooling box (11), the tops of which are fixedly connected to the bottom of the optical module box (1).

3. The device for improving the signal integrity of a high-speed optical module according to claim 2, characterized in that: The first cooling box (10) is fixedly connected to a heat absorption pipe (12), and the second cooling box (11) is fixedly connected to an air supply pipe (13).

4. The device for improving the signal integrity of a high-speed optical module according to claim 3, characterized in that: The heat absorption pipe (12) and the air supply pipe (13) are both installed inside the optical module box (1), and a cooling pipe (14) is provided between the first cooling box (10) and the second cooling box (11).

5. The device for improving the signal integrity of a high-speed optical module according to claim 4, characterized in that: The outer wall of the cooling pipe (14) is fixedly connected with multiple heat dissipation fins (15), and the two ends of the cooling pipe (14) are respectively connected to the first cooling box (10) and the second cooling box (11).

6. The device for improving signal integrity of a high-speed optical module according to claim 5, characterized in that: A cooling fan (16) is fixedly connected to the bottom of each of the heat dissipation fins (15).

7. The device for improving signal integrity of a high-speed optical module according to claim 1, characterized in that: The optical module box (1) has a support (17) fixedly connected to its side wall, and the support (17) has an installation hole (18) inside.

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