energy storage device
By using semiconductor heat sinks based on the Boltzmann effect in energy storage devices, the problem of poor temperature control in the temperature control module of energy storage devices has been solved, achieving rapid and reliable temperature regulation and uniform temperature control, thus improving the practicality and reliability of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUNGROW POWER SUPPLY CO LTD
- Filing Date
- 2025-04-29
- Publication Date
- 2026-06-09
Smart Images

Figure CN224342353U_ABST
Abstract
Description
Technical Field
[0001] The embodiments in this application relate to the field of new energy technology, and in particular to an energy storage device. Background Technology
[0002] In related technologies, energy storage devices such as lithium-ion batteries can be equipped with temperature control modules. These modules can be used to regulate the operating temperature inside the energy storage device, enabling it to achieve better electrical and safety performance under optimal temperature conditions.
[0003] However, the temperature control modules of current energy storage devices have poor temperature control performance, which can easily lead to poor overall temperature uniformity of the energy storage device, reducing its practicality and reliability. Utility Model Content
[0004] Several embodiments in this application propose an energy storage device aimed at improving the temperature control uniformity of the energy storage device and ensuring its stable operation.
[0005] An embodiment of this application proposes an energy storage device including a housing, a temperature control component, and a battery assembly. The housing has a receiving cavity; the battery assembly is disposed within the receiving cavity; the temperature control component is disposed within the receiving cavity, between the inner wall of the receiving cavity and the side wall of the battery assembly. The temperature control component has a first end and a second end opposite to each other. The first end is thermally connected to the battery assembly, and the second end is thermally connected to the housing. The temperature control component includes a semiconductor heat sink, which is connected to the first end and the second end respectively.
[0006] In one embodiment, the semiconductor heat sink includes a first current guide, a second current guide, a first conductor, and a second conductor. The first current guide is connected to the first end; the second current guide is connected to the second end; the two ends of the first conductor are respectively connected to the first current guide and the second current guide; the two ends of the second conductor are respectively connected to the first current guide and the second current guide, and the second conductor and the first conductor are arranged at intervals.
[0007] In one embodiment, the temperature control component further includes a first partition and a second partition, wherein the first partition is the first end; the second partition is spaced apart from the first partition and is the second end; the semiconductor heat sink is disposed between the first partition and the second partition, the first flow guide is connected to the side of the first partition facing the second partition, and the second flow guide is connected to the side of the second partition facing the first partition.
[0008] In one embodiment, the first partition is made of insulating ceramic; and / or, the second partition is made of insulating ceramic.
[0009] In one embodiment, the temperature control component further includes a wire connected to a semiconductor heat sink.
[0010] In one embodiment, the temperature control component includes at least two semiconductor heat sinks, which are arranged side by side between the first end and the second end.
[0011] In one embodiment, the battery assembly includes at least two battery cells arranged sequentially, and the first end of the temperature control component is heat-transfer connected to at least two battery cells respectively.
[0012] In one embodiment, the battery assembly further includes a separator disposed between two adjacent battery cells.
[0013] In one embodiment, the battery assembly further includes a temperature sensing element disposed on the separator and used to detect the temperature of the individual battery cells; and / or, the separator is made of a gel material.
[0014] In one embodiment, the housing includes a housing and a cover, the cover being snapped onto the housing and forming the receiving cavity with the housing, and a clearance opening is provided on one side of the housing; the battery assembly also includes a wiring terminal, the wiring terminal passing through the clearance opening.
[0015] In one embodiment, the battery assembly includes a first surface and a second surface connected to each other, and the temperature control component is disposed adjacent to the first surface; the energy storage device further includes a buffer component disposed within the accommodating cavity and located between the inner wall of the accommodating cavity and the second surface of the battery assembly.
[0016] In several embodiments provided in this application, a temperature control component is provided between the side wall of the battery module and the inner wall of the housing cavity. This temperature control component may include a semiconductor heat sink utilizing the Bourdieu effect. By adjusting the direction and magnitude of the current input to the semiconductor heat sink, the first and second ends of the temperature control component can absorb or release heat respectively. The first end is connected to the battery module for heat transfer, and the second end is connected to the housing for heat transfer. This allows the temperature control component to more quickly and reliably regulate the battery module temperature to a suitable operating temperature, preventing thermal runaway or low-temperature effects on the battery module, thus ensuring stable electrical performance. This temperature control component reduces the required spacing between components in the energy storage device, minimizes the space occupied by the temperature control component, and utilizes the semiconductor heat sink to achieve high heat transfer efficiency, ensuring adequate temperature control of the battery module, effectively improving the uniformity of battery module temperature control, reducing temperature differences in the battery module, and enhancing the practicality and structural reliability of the energy storage device. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments or prior art of this application, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0018] Figure 1 A schematic diagram of the structure of an embodiment of the energy storage device provided in this application;
[0019] Figure 2 for Figure 1 A schematic diagram of the internal structure of an embodiment of an energy storage device;
[0020] Figure 3 for Figure 2 A top view of an embodiment of an energy storage device;
[0021] Figure 4 for Figure 3 A magnified view of a section at point A in the middle;
[0022] Figure 5 for Figure 2 A top view of another embodiment of the energy storage device;
[0023] Figure 6 for Figure 1 An exploded view of the structure of an embodiment of an energy storage device;
[0024] Figure 7 A schematic diagram of the structure of a temperature control component for an energy storage device provided in this application;
[0025] Figure 8 A circuit diagram of an embodiment of a semiconductor heat sink for an energy storage device provided in this application;
[0026] Figure 9 A circuit diagram of another embodiment of the semiconductor heat sink for the energy storage device provided in this application.
[0027] Explanation of icon numbers:
[0028] 100. Energy storage device; 10. Housing; 10a. Receptacle; 11. Housing; 111. Clearance opening; 13. Cover; 30. Battery assembly; 31. Battery cell; 33. Separator; 35. Temperature sensing element; 37. Terminal block; 50. Temperature control assembly; 50a. First end; 50b. Second end; 51. First partition; 53. Second partition; 55. Semiconductor heat sink; 551. First flow guide; 553. Second flow guide; 555. First conductor; 557. Second conductor; 57. Wire; 70. Buffer. Detailed Implementation
[0029] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings of several embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0030] It should be noted that if directional indications (such as up, down, left, right, front, back, etc.) are involved in multiple embodiments of this application, the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0031] Furthermore, if multiple embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text implies three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0032] In related technologies, energy storage devices such as lithium-ion batteries can be equipped with temperature control modules. These modules can regulate the operating temperature within the energy storage device, enabling it to achieve better electrical and safety performance under optimal temperature conditions. However, the temperature control modules in current energy storage devices generally have poor temperature control performance, leading to inconsistent overall temperature control and reducing the practicality and reliability of the energy storage device.
[0033] Understandably, most energy storage devices currently employ temperature control methods such as air cooling and liquid cooling. Air cooling devices can use low-temperature airflow to remove heat generated by the energy storage device, or high-temperature airflow to heat components inside. Alternatively, liquid cooling plates at the top or bottom of the device can transfer low-temperature fluids to remove heat, while high-temperature fluids can be transferred within the plates to heat the device. This allows for temperature control, enabling the energy storage device to operate in a suitable environment, fully utilizing its electrical performance while minimizing the impact of extreme temperatures and ensuring stable operation. However, air cooling has poor heat transfer efficiency and requires gaps within the battery modules for airflow, potentially leading to significant temperature differences between the inside and outside of the device. Liquid cooling, on the other hand, requires considerable space and is typically located at the top or bottom of the device, which can cause localized temperature variations, resulting in low temperature uniformity and reduced practicality and reliability. To address the aforementioned issues, this application proposes an energy storage device 100.
[0034] Please see Figure 2 , Figure 3 and Figure 5In one embodiment of this application, the energy storage device 100 includes a housing 10, a temperature control component 50, and a battery component 30. The housing 10 has a receiving cavity 10a; the battery component 30 is disposed in the receiving cavity 10a; the temperature control component 50 is disposed in the receiving cavity 10a and between the inner wall of the receiving cavity 10a and the side wall of the battery component 30. The temperature control component 50 has a first end 50a and a second end 50b opposite to each other. The first end 50a is thermally connected to the battery component 30, and the second end 50b is thermally connected to the housing 10. The temperature control component 50 includes a semiconductor heat sink 55, which is connected to the first end 50a and the second end 50b respectively.
[0035] In this application, the temperature control component 50 may include a semiconductor heat sink 55 designed using the Peltier effect (a thermoelectric effect). This semiconductor heat sink 55 can regulate temperature by utilizing the movement of current through conductors of different materials, creating a temperature difference between the two ends of the conductor. Since charge carriers (such as electrons) exist at different energy levels in different materials, when a charge carrier moves from a high-energy-level material to a low-energy-level material, it can release excess energy; when a charge carrier moves from a low-energy-level material to a high-energy-level material, it can absorb energy from the outside. This energy can be absorbed or released as heat at the interface between the two ends of different materials. Figure 8 and Figure 9 As shown, Figure 8 and Figure 9 The circuit diagrams of the semiconductor heat sink 55 under different current directions are illustrated. The dashed lines with arrows indicate the direction of charge carrier movement, and the solid lines with arrows indicate the direction of energy transfer. The semiconductor heat sink 55 includes a first current guide 551, a second current guide 553, a first conductor 555, and a second conductor 557, wherein the material energy level of the first conductor 555 is set higher than that of the second conductor 557. Figure 8 In this process, when current is input into the semiconductor heat sink 55, the first current-carrying member 551, which allows charge carriers to flow from the first conductor 555 to the second conductor 557, is in a heat-releasing state, while the second current-carrying member 553, which allows charge carriers to flow from the second conductor 557 to the first conductor 555, is in a heat-absorbing state. And... Figure 9 In this process, by changing the direction of the current, the first current guide 551, which allows the charge carrier to flow from the second conductor 557 to the first conductor 555, is in a state of releasing heat, while the second current guide 553, which allows the charge carrier to flow from the first conductor 555 to the second conductor 557, is in a state of absorbing heat.
[0036] That is, when the semiconductor heat sink 55 of the temperature control component 50 is energized, the Bourdieu effect of the semiconductor heat sink 55 can be used to cause the first end 50a and the second end 50b connected to the semiconductor heat sink 55 to absorb or release heat respectively, thereby realizing the temperature control function of the temperature control component 50 in the energy storage device 100. At this time, as the direction of the current flowing into the temperature control component 50 changes, the movement direction of the charge carrier between materials of different energy levels can be changed, thereby realizing the heat absorption and heat release conversion of the first end 50a and the second end 50b. This allows the temperature control component 50 to adjust the heat absorption and cooling or heat release and heating of the battery component 30 by the first end 50a through the change of the direction of the input current, realizing a more convenient temperature control operation of the energy storage device 100.
[0037] By placing the temperature control component 50 between the inner wall of the accommodating cavity 10a of the housing 10 and the side wall of the battery module 30, and making the first end 50a of the temperature control component 50 heat-transfer connected to the battery module 30 and the second end 50b heat-transfer connected to the housing 10, after the semiconductor heat sink 55 of the temperature control component 50 is energized, the first end 50a absorbs heat to form a cold end and the second end 50b releases heat to form a hot end, so that the temperature control component 50 dissipates heat from the battery module 30; or the current direction within the temperature control component 50 can be reversed, making the first end 50a release heat to form a hot end and the second end 50b absorb heat to form a cold end, so that the temperature control component 50 heats the battery module 30. Thus, during the operation of the energy storage device 100, the current direction within the temperature control component 50 can be determined according to the operating conditions of the battery module 30, so that the temperature control component 50 can regulate the temperature of the battery module 30 to a more suitable operating temperature, ensuring the stable charging and discharging of the battery module 30.
[0038] It is understood that the energy storage device 100 can adjust the direction and magnitude of the current input to the semiconductor heat sink 55 according to the temperature control effect required by the battery module 30. The direction and magnitude of the current input to the semiconductor heat sink 55 can be controlled by software program; or the direction and magnitude of the current input to the semiconductor heat sink 55 can be controlled by components such as electronic control switches. This application does not limit the control method of the semiconductor heat sink 55.
[0039] The semiconductor heat sink 55, utilizing the Bourdieu effect, can better reduce the space required for the temperature control component 50. Furthermore, by utilizing the movement of charge carriers between conductors of different materials, the first end 50a and the second end 50b of the temperature control component 50 absorb or release heat, achieving a faster heat transfer effect. The temperature can be regulated by adjusting the input current, allowing the temperature control component 50 to better regulate the temperature of the battery pack 30 to a suitable operating temperature. By connecting the second end 50b of the temperature control component 50 to the housing 10 for heat transfer, the temperature control component 50 can quickly release or absorb heat from the external environment through the housing 10, ensuring more stable and reliable operation and effectively improving the practicality and structural reliability of the energy storage device 100.
[0040] The temperature control component 50 can have its first end 50a in direct contact with the side wall of the battery component 30 for heat transfer, or a thermally conductive material with good thermal conductivity can be placed between the temperature control component 50 and the battery component 30 to ensure the heat transfer efficiency between the temperature control component 50 and the battery component 30; the temperature control component 50 can have its second end 50b in direct contact with the inner wall of the housing cavity 10a for heat transfer, or a thermally conductive material with good thermal conductivity can be placed between the temperature control component 50 and the inner wall of the housing cavity 10a to ensure the heat transfer efficiency between the temperature control component 50 and the housing 10; of course, there are many ways to connect the temperature control component 50 with the battery component 30 and the housing 10, and this application does not limit this.
[0041] In one embodiment of this application, a temperature control component 50 is provided between the side wall of the battery assembly 30 and the inner wall of the accommodating cavity 10a. The temperature control component 50 can adopt the Bourdieu effect principle. By adjusting the direction and magnitude of the current input to the temperature control component 50, the first end 50a and the second end 50b of the temperature control component 50 can absorb or release heat respectively. The first end 50a is connected to the battery assembly 30 for heat transfer, and the second end 50b is connected to the housing 10 for heat transfer. This allows the temperature control component 50 to adjust the temperature of the battery assembly 30 to a suitable operating temperature more quickly and reliably, preventing the battery assembly 30 from thermal runaway or being affected by low temperature, so that the battery assembly 30 can maintain a relatively stable electrical performance operation. Under the function of the temperature control component 50, the requirements for the arrangement gaps of various components in the energy storage device 100 can be reduced. At the same time, the space occupied by the temperature control component 50 can be reduced. Furthermore, the high heat transfer efficiency of the temperature control component 50 can be used to ensure sufficient temperature control of the battery module 30, effectively improve the uniformity of temperature control of the battery module 30, reduce the temperature difference of the battery module 30, and improve the practicality and structural reliability of the energy storage device 100.
[0042] See Figure 4 and Figure 7In one embodiment of this application, the temperature control component 50 includes a first partition 51, a second partition 53, and a semiconductor heat sink 55. The first partition 51 is a first end 50a; the second partition 53 is spaced apart from the first partition 51 and is a second end 50b; the semiconductor heat sink 55 is disposed between the first partition 51 and the second partition 53; the first flow guide 551 is connected to the side of the first partition 51 facing the second partition 53, and the second flow guide 553 is connected to the side of the second partition 53 facing the first partition 51.
[0043] In this embodiment, the first partition 51 and the second partition 53 can be made of materials with certain insulation and thermal conductivity properties, including but not limited to ceramics, heat-resistant thermally conductive plastics, graphene, etc. The semiconductor heat sink 55 is connected by conductors of different materials in sequence. After the semiconductor heat sink 55 is energized, the movement of current in the semiconductor heat sink 55 allows the connection ends of the conductors in the semiconductor heat sink 55 to absorb or release heat. At this time, by placing the semiconductor heat sink 55 between the first partition 51 and the second partition 53, the first current guide and the second current guide at both ends of the different conductors connected in the semiconductor heat sink 55 can be connected to the first partition 51 and the second partition 53 respectively, which is beneficial for utilizing the first partition 51 and the second partition 53. The insulating function of the separator 53 prevents electrical conduction between the semiconductor heat sink 55 and the battery module 30 and the housing 10. Utilizing the thermal conductivity of the first separator 51 and the second separator 53, the first separator 51 can stably achieve heat conduction between the semiconductor heat sink 55 and the battery module 30, and the second separator 53 can stably achieve heat conduction between the semiconductor heat sink 55 and the housing 10. This allows the temperature control component 50 to stably absorb or release heat from the battery module 30, and simultaneously stably release or absorb heat to the external environment through the housing 10. This ensures stable temperature control of the battery module 30 by the temperature control component 50, reduces the impact of the temperature control component 50's connection to power on the operation of the battery module 30, and further improves the practicality and structural reliability of the energy storage device 100.
[0044] See Figure 4 and Figure 7 In one embodiment of this application, the semiconductor heat sink 55 includes a first current guide 551, a second current guide 553, a first conductor 555, and a second conductor 557. The first current guide 551 is connected to a first end; the second current guide 553 is connected to a second end; the two ends of the first conductor 555 are respectively connected to the first current guide 551 and the second current guide 553; the two ends of the second conductor 557 are respectively connected to the first current guide 551 and the second current guide 553, and the second conductor 557 and the first conductor 555 are arranged at intervals.
[0045] In this embodiment, the first current guide 551 and the second current guide 553 can be made of conductive materials with certain temperature resistance, including but not limited to nickel-based alloys, platinum-rhodium alloys, etc., while the first conductor 555 and the second conductor 557 can be metals or semiconductors of different materials to ensure the overall power supply of the semiconductor heat sink 55. By connecting the first current guide 551 or the second current guide 553 to a power source through a wire, which can be the battery assembly 30 or other power supply equipment, the charge carrier can move from the first conductor 555 through the first current guide 551 to the second conductor 557. Due to the different materials of the first conductor 555 and the second conductor 557, the charge carrier can absorb or release energy at the first current guide 551. Similarly, when the charge carrier moves from the second conductor 557 through the second current guide 553 to the first conductor 555, the charge carrier can be connected to the second current guide 557 through the second current guide 551 to the first conductor 557. The first and second current-carrying components 551 and 553 absorb or release heat respectively under the action of the charge carrier. The first current-carrying component 551 connects with the first separator 51 forming the first end 50a to transfer heat and achieve heat dissipation or heating of the battery assembly 30. The second current-carrying component 553 connects with the second separator 53 forming the second end 50b to transfer heat and achieve rapid heat absorption or dissipation of the temperature control component 50 from the environment through the housing 10. This effectively ensures the stable and reliable operation of the temperature control component 50 and further improves the practicality and structural reliability of the energy storage device 100.
[0046] See Figure 2 , Figure 4 and Figure 7 In one embodiment of this application, the temperature control component 50 further includes a wire 57 connected to a semiconductor heat sink 55.
[0047] In this embodiment, the temperature control component 50 can be electrically connected to the semiconductor heat sink 55 via a wire 57 to transmit current to the semiconductor heat sink 55. This current forms a circuit within the semiconductor heat sink 55, allowing charge carriers to move between conductors of different energy levels to achieve cooling or heating, ensuring the stable operation of the temperature control component 50. Alternatively, the wire 57 can be electrically connected to the battery assembly 30, allowing current to be transmitted to the temperature control component 50 via the battery assembly 30; or, the wire 57 can extend out of the housing 10 and be electrically connected to an external power supply system of the energy storage device 100, allowing current to be transmitted to the temperature control component 50 via the external power supply system, ensuring a stable power supply to the temperature control component 50. The semiconductor heat sink 55 can be connected to the positive and negative terminals of the power supply via two wires 57 respectively, forming a stable current circuit within the semiconductor heat sink 55, ensuring the movement of charge carriers between conductors of different energy levels, and further improving the structural stability and reliability of the energy storage device 100.
[0048] See Figure 2In one embodiment of this application, the temperature control component 50 includes at least two semiconductor heat sinks 55, which are arranged side by side between the first end 50a and the second end 50b.
[0049] In this embodiment, the temperature control component 50 may include at least two semiconductor heat sinks 55. By arranging at least two semiconductor heat sinks 55 side-by-side between the first end 50a and the second end 50b, the temperature regulation efficiency of the temperature control component 50 can be improved, achieving a more reliable temperature control effect for the energy storage device 100. With the action of at least two semiconductor heat sinks 55, the temperature control range of the temperature control component 50 can be increased, allowing it to be better applied in energy storage devices 100 with larger battery modules 30. This ensures sufficient heat transfer between the temperature control component 50 and the sidewalls of the battery module 30, while also enabling the temperature control component 50 to more quickly absorb or release heat to the external environment through the housing 10. Furthermore, the at least two semiconductor heat sinks 55 can be independently powered, ensuring the operation of the temperature control component 50 even if some semiconductor heat sinks 55 fail. This achieves more reliable system control of the energy storage device 100, further improving the practicality and structural reliability of the energy storage device 100.
[0050] Furthermore, when the battery module 30 includes at least two battery cells 31, the temperature control component 50 can set a semiconductor heat sink 55 corresponding to a battery cell 31. This is beneficial for quickly controlling the temperature of a battery module 30 using a semiconductor heat sink 55, thereby improving the overall temperature control stability and uniformity of the battery module 30 by the temperature control component 50 and ensuring the stable operation of the energy storage device 100.
[0051] In one embodiment of this application, the first partition 51 is made of insulating ceramic; and / or, the second partition 53 is made of insulating ceramic.
[0052] In this embodiment, by using insulating ceramic material for the first separator 51, the excellent insulation and thermal conductivity of the insulating ceramic material can be utilized to achieve a more stable and reliable insulation effect between the first separator 51 and the semiconductor heat sink 55 and the battery assembly 30. In addition, the first separator 51 can achieve better thermal conductivity, so that the battery assembly 30 can transfer heat to the temperature control component 50 more quickly and fully, thereby further improving the structural stability and reliability of the energy storage device 100.
[0053] Furthermore, in other embodiments, by using insulating ceramic material for the second separator 53, the excellent insulation and thermal conductivity of the insulating ceramic material can be utilized to achieve a more stable and reliable insulation effect between the second separator 53 and the semiconductor heat sink 55 and the housing 10. It can also achieve better thermal conductivity of the second separator 53, so that the battery assembly 30 can transfer heat to the housing 10 more quickly and fully, ensuring that the energy storage device 100 can quickly absorb or release heat through the housing 10 and the external environment, further improving the structural stability and reliability of the energy storage device 100.
[0054] It should be noted that the first partition 51 and the second partition 53 can be made of different thermally conductive and insulating materials. For example, one of the first partition 51 and the second partition 53 can be made of insulating ceramic, and the other can be made of heat-resistant and thermally conductive plastic. Of course, the first partition 51 and the second partition 53 can also be made of the same thermally conductive and insulating material. For example, both the first partition 51 and the second partition 53 can be made of insulating ceramic.
[0055] See Figure 2 In one embodiment of this application, the battery assembly 30 includes at least two battery cells 31, which are arranged in sequence, and the first end 50a of the temperature control assembly 50 is heat-transfer connected to the at least two battery cells 31 respectively.
[0056] In this embodiment, the battery assembly 30 may include at least two battery cells 31. By arranging multiple battery cells 31 sequentially and electrically connecting at least two battery cells 31, the energy storage device 100 can have a larger charge and discharge capacity to meet various power demands. The temperature control component 50 can make its first end 50a heat-transferringly connected to each of the at least two battery cells 31. This can be achieved by using a large thermally conductive structure to simultaneously contact at least two battery cells for heat transfer, or by providing a semiconductor heat sink 55 corresponding to the number of battery cells 31, with one heat sink 55 transferring heat to one battery cell 31. This allows the temperature control component 50 to achieve better independent temperature control for multiple battery cells 31. Furthermore, the temperature control component 50 can effectively control the temperature of the battery assembly 30, ensuring that each battery cell 31 operates in a suitable temperature environment, further improving the practicality and structural reliability of the energy storage device 100.
[0057] See Figure 2 and Figure 6 In one embodiment of this application, the battery assembly 30 further includes a separator 33 disposed between two adjacent battery cells 31.
[0058] In this embodiment, by setting a separator 33 between adjacent battery cells 31, the separator 33 can better reduce the mutual influence between adjacent battery cells 31, ensure the independent operation of each battery cell 31, and facilitate the temperature control component 50 to make corresponding temperature control adjustments according to each battery cell 31, thereby achieving a better overall temperature control effect of the energy storage device 100 and further improving the practicality and structural reliability of the energy storage device 100.
[0059] See Figure 6 In one embodiment of this application, the battery assembly 30 further includes a temperature sensing element 35, which is disposed on the separator 33 and used to detect the temperature of the battery cell 31; and / or, the separator 33 is made of a gel material.
[0060] In this embodiment, by setting a temperature sensing element 35 in the separator 33, the operating temperature of adjacent battery cells can be detected by the temperature sensing element 35. This facilitates the adjustment of the current direction and magnitude in the temperature control component 50 based on the detected temperature data, enabling the temperature control component 50 to better absorb or dissipate heat from the battery assembly 30, ensuring that the battery assembly 30 operates in a suitable temperature environment. When the temperature control component 50 is equipped with semiconductor heat sinks 55 corresponding to the number of battery cells 31, the battery cells 31, temperature sensing element 35, and semiconductor heat sinks 55 can cooperate with each other. This allows the temperature control component 50 to use the corresponding semiconductor heat sinks 55 to control the temperature of the battery cells 31, ensuring temperature regulation of each battery cell 31 in the energy storage device 100. This helps to improve the uniformity of overall temperature control of the battery assembly 30, reduce the temperature difference between multiple battery cells 31, and further improve the practicality and structural reliability of the energy storage device 100.
[0061] In addition, in some embodiments, the separator 33 can be made of a gel material such as rubber or silicone. The gel material separator 33 can effectively buffer the interaction between the separator 33 and the battery cell 31, reduce the mutual compression of multiple battery cells 31 during transportation or use, and further improve the overall structural stability and reliability of the energy storage device 100.
[0062] In other embodiments, the use of a gel-like separator 33 can provide better protection for the temperature sensing element 35 contained within the separator 33. This helps to better buffer the squeezing force exerted on the temperature sensing element 35 by the battery cells 31, enabling the temperature sensing element 35 to more accurately detect the temperature of each battery cell 31. This ensures stable temperature control of the battery assembly 30 by the temperature control component 50, further improving the practicality and structural reliability of the energy storage device 100.
[0063] See Figure 1 and Figure 6In one embodiment of this application, the housing 10 includes a housing 11 and a cover 13. The cover 13 can be fastened to the housing 11 and surrounds the housing 11 to form an accommodating cavity 10a. A clearance opening 111 is provided on one side of the housing 11. The battery assembly 30 also includes a wiring terminal 37, which passes through the clearance opening 111.
[0064] In this embodiment, the housing 10 can be configured as a separate structure with a housing 11 and a cover 13. The cover 13 can be fastened to the housing 11 to form a closed accommodating cavity 10a, providing better protection for components such as the battery pack 30 and temperature control component 50, thus ensuring the stable operation of the energy storage device 100. Furthermore, by providing a clearance opening 111 on the housing 11, the wiring terminals 37 connecting the battery pack 30 to the external power supply can pass through the clearance opening 111, ensuring that the battery pack 30 can be stably powered through the external wiring terminals 37 when the housing 10 is closed, thus guaranteeing the stable operation of the energy storage device 100. The modular housing 10 design facilitates easier disassembly and maintenance of components such as the battery pack 30 and temperature control component 50. It should be noted that the housing 10 can be fitted with sealing rings, gaskets, or other sealing structures at the connection point between the housing 11 and the cover 13. This allows the cover 13 to better fill the gap between the cover 13 and the housing 11 when it is fastened to the housing 11, resulting in a more reliable sealing and protection function for the housing 10. Furthermore, this design helps to reduce the impact on components such as the battery pack 30 and temperature control component when using air-cooling or liquid-cooling devices on the outside of the housing 10 for temperature control, further improving the structural stability and reliability of the energy storage device 100.
[0065] See Figure 5 In one embodiment of this application, the battery assembly 30 includes a first surface and a second surface connected to each other, and the temperature control component 50 is disposed adjacent to the first surface; the energy storage device 100 also includes a buffer 70, which is disposed in the accommodating cavity 10a and located between the inner wall of the accommodating cavity 10a and the second surface of the battery assembly 30.
[0066] In this embodiment, the battery cells within the battery assembly 30 can be arranged in a direction toward the second surface. When thermal runaway occurs in the battery assembly 30, it typically expands toward the second surface. By making the first end 50a of the temperature control component 50 thermally connected to the first surface of the battery assembly 30, the impact of the battery assembly 30's expansion on the temperature control component 50 can be effectively reduced, ensuring the stable operation of the temperature control component 50 and further improving the overall structural stability and reliability of the energy storage device 100.
[0067] By providing a buffer 70 between the second surface of the battery assembly 30 and the inner wall of the accommodating cavity 10a, the interaction between the housing 10 and the battery assembly 30 can be buffered, reducing the instantaneous force on the battery assembly 30 during transportation or use. At the same time, the buffer 70 can be made of heat-insulating material, which helps to prevent the heat released from the second end 50b of the temperature control component 50 to the housing 10 from being transferred to the battery assembly 30 through the second surface, so that the temperature control component 50 can achieve a more reliable temperature control effect on the battery assembly 30, further improving the structural stability and reliability of the energy storage device 100.
[0068] The above description is merely an exemplary embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the technical concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.
Claims
1. An energy storage device, characterized in that, include: The housing has a receiving cavity; A battery assembly disposed within the accommodating cavity; A temperature control component is disposed within the accommodating cavity and between the inner wall of the accommodating cavity and the side wall of the battery assembly. The temperature control component has a first end and a second end opposite to each other. The first end is thermally connected to the battery assembly, and the second end is thermally connected to the housing. The temperature control component includes a semiconductor heat sink, which is connected to the first end and the second end respectively.
2. The energy storage device as described in claim 1, characterized in that, The semiconductor heat sink includes: A first guide member is connected to the first end; The second guide is connected to the second end; A first conductor, the two ends of which are respectively connected to the first flow guide and the second flow guide; The second conductor has its two ends connected to the first guide element and the second guide element, respectively, and the second conductor and the first conductor are arranged at intervals.
3. The energy storage device as described in claim 2, characterized in that, The temperature control component also includes: The first partition, the first partition being the first end; and The second partition is spaced apart from the first partition, and the second partition is the second end; The semiconductor heat sink is disposed between the first partition and the second partition. The first flow guide is connected to the side of the first partition facing the second partition, and the second flow guide is connected to the side of the second partition facing the first partition.
4. The energy storage device as described in claim 3, characterized in that, The first partition is made of insulating ceramic. And / or, the material of the second partition is insulating ceramic.
5. The energy storage device as described in claim 1, characterized in that, The temperature control component also includes wires that connect to the semiconductor heat sink.
6. The energy storage device as described in any one of claims 1 to 5, characterized in that, The temperature control component includes at least two semiconductor heat sinks, which are arranged side by side between the first end and the second end.
7. The energy storage device as described in any one of claims 1 to 5, characterized in that, The battery assembly includes at least two battery cells, which are arranged sequentially, and the first end of the temperature control component is heat-transfer connected to at least two battery cells respectively.
8. The energy storage device as described in claim 7, characterized in that, The battery assembly also includes a separator disposed between two adjacent battery cells.
9. The energy storage device as described in claim 8, characterized in that, The battery assembly also includes a temperature sensing element disposed on the separator and used to detect the temperature of the individual battery cells; And / or, the material of the separator is a colloidal material.
10. The energy storage device as described in any one of claims 1 to 5, characterized in that, The box includes a box body and a cover. The cover can be fastened to the box body and together with the box body to form the receiving cavity. An avoidance opening is provided on one side of the box body. The battery assembly also includes wiring terminals that pass through the clearance opening.
11. The energy storage device as described in any one of claims 1 to 5, characterized in that, The battery assembly includes a first surface and a second surface connected to each other, and the temperature control component is disposed adjacent to the first surface; The energy storage device further includes a buffer element disposed within the accommodating cavity and located between the inner wall of the accommodating cavity and the second surface of the battery assembly.