Chip backplane cooling pipeline

Abstract

The application provides a chip backboard cooling pipeline, and relates to the technical field of air conditioning equipment. The pipeline comprises a first heat exchanger, a first pipeline, a second heat exchanger and a second pipeline which are sequentially penetrated to form a first circulation pipeline. The first heat exchanger is used for condensing gaseous carbon dioxide carrier medium input by the second pipeline to obtain liquid carbon dioxide carrier medium, and outputs the liquid carbon dioxide carrier medium to the first pipeline. The second heat exchanger is used for vaporizing liquid carbon dioxide carrier medium input by the first pipeline to obtain gaseous carbon dioxide carrier medium, and outputs the gaseous carbon dioxide carrier medium to the second pipeline. The application utilizes liquid CO2 working medium flowing from the bottom of a microchannel, vaporizes after absorbing heat of a server backboard, and flows out from the top due to the density difference, thereby avoiding the problems of gas-liquid retention or flow dead zone caused by the traditional horizontal or reverse flow channel, and ensuring that the phase change process of the working medium is more uniform and efficient.

Description

Technical Field

[0001] This application relates to the field of heat exchange technology, and in particular to a chip backplane cooling pipeline. Background Technology

[0002] Data center servers generate a significant amount of heat during operation. Without proper cooling measures for components such as chips, this can easily lead to localized overheating, impacting equipment reliability. In particular, chips require simultaneous cooling of both the chip cold plate and the chip backplane to ensure stable performance.

[0003] In related technologies, Freon refrigerants are typically used to cool chip backplanes. While they offer higher cooling efficiency than traditional air or water cooling systems, the high Global Warming Potential (GWP) and Ozone Depletion Potential (ODP) limits the applicability of Freon-based cooling solutions. Furthermore, in low-temperature environments below -20°C, the viscosity of the fluorinated liquid increases significantly, leading to increased refrigerant reflux resistance and a decrease in heat transfer efficiency of over 50%, making it unsuitable for the heat dissipation needs of data centers in high-altitude and cold regions.

[0004] Therefore, a new cooling system for chip backplanes is urgently needed to solve the above problems. Utility Model Content

[0005] This application provides a chip backplane cooling pipeline to solve the problems of insufficient heat exchange capacity and insufficient environmental friendliness of the cooling structure in the prior art under certain scenarios.

[0006] This application provides a chip backplane cooling pipeline, including:

[0007] A first heat exchanger, a first pipeline, a second heat exchanger, and a second pipeline are sequentially connected to form a first circulation pipeline; carbon dioxide cooling medium flows in the first circulation pipeline.

[0008] The first heat exchanger is used to condense the gaseous carbon dioxide cooling medium input from the second pipeline into liquid carbon dioxide cooling medium, and output the liquid carbon dioxide cooling medium to the first pipeline;

[0009] The second heat exchanger is used to vaporize the liquid carbon dioxide cooling medium input from the first pipeline to obtain gaseous carbon dioxide cooling medium, and output the gaseous carbon dioxide cooling medium to the second pipeline.

[0010] The second heat exchanger is bonded to the chip backplane and is used to absorb heat from the surface of the chip backplane.

[0011] In some feasible embodiments, it also includes:

[0012] The second circulation pipeline includes the first heat exchanger; a first cooling medium flows within the second circulation pipeline; the second circulation pipeline is used for heat exchange between the first heat exchanger and the first circulation pipeline, so that the gaseous carbon dioxide cooling medium in the first circulation pipeline condenses to obtain liquid carbon dioxide cooling medium.

[0013] In some feasible embodiments, the first pipeline is provided with a first electric throttle valve; the second pipeline is provided with a first temperature sensor and a first pressure gauge.

[0014] In some feasible embodiments, in the second circulation pipeline, the input section of the first heat exchanger is provided with a second electric throttle valve; the output section of the first heat exchanger is provided with a second temperature sensor and a second pressure gauge.

[0015] In some feasible embodiments, it also includes:

[0016] The controller is electrically connected to the first electric throttle valve, the first temperature sensor, the first pressure gauge, the second electric throttle valve, the second temperature sensor, and the second pressure gauge, respectively.

[0017] The controller is used to generate control commands for controlling the first electric throttle valve based on the first data fed back by the first temperature sensor and the first pressure gauge, and to generate control commands for controlling the second electric throttle valve based on the second data fed back by the second temperature sensor and the second pressure gauge.

[0018] The solution provided in this application has the following beneficial effects:

[0019] 1. This application utilizes a precisely designed microchannel structure within the evaporation section to significantly increase the contact area between the working fluid and the server backplane, thereby enhancing the rapid absorption of heat and the efficiency of phase change initiation. This allows liquid CO2 to rapidly vaporize upon heating, with latent heat absorption reaching 5-8 times that of sensible heat exchange, significantly improving the heat dissipation capacity per unit area and meeting the heat dissipation requirements of high heat density server racks (single rack power ≥ 20kW).

[0020] 2. This application is based on a gravity-driven closed-loop architecture. After liquid CO2 absorbs heat and vaporizes in the evaporation section, it rises to the condensation section by natural driving force formed by the density difference between gas and liquid. The condensed liquid working fluid automatically flows back under the action of gravity, without the need for external power devices such as mechanical pumps, which greatly reduces the power consumption of data centers and meets the energy-saving requirements under the "dual carbon" target.

[0021] 3. The pipeline constructed in this application integrates an electric regulating valve control strategy based on the return gas superheat of a microchannel heat exchanger. By monitoring the return gas superheat in real time and dynamically adjusting the valve opening, the CO2 working fluid flow rate is precisely controlled, achieving high-precision control to stabilize the return gas superheat at 1K. This mechanism effectively avoids the risk of dry evaporation or liquid slugging in the condensation section caused by uneven working fluid flow in traditional gravity heat pipe systems, ensuring that the gas-liquid two-phase circulation is always in the efficient phase change range.

[0022] 4. The CO2 gravity heat pipe backplate heat exchanger in this application is directly attached to the server rack and adopts an integrated design, which greatly reduces the pipe redundancy and space occupation of traditional heat dissipation systems, improves the flexibility of data center rack layout, and adapts to the construction needs of high-density modular data centers. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the chip backplane cooling pipeline provided in some embodiments of this application;

[0024] Figure 2 The schematic diagram of the chip backplane cooling pipeline provided in this application.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1-Output section; 2-Input section; 3-Second temperature sensor; 4-Second pressure gauge; 5-Second electric throttle valve; 6-First heat exchanger; 7-Second pipeline; 8-First pipeline; 9-First temperature sensor; 10-First pressure gauge; 11-First electric throttle valve; 12-CO2 gravity heat pipe; 13-Backplate heat exchanger. Detailed Implementation

[0027] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of this application.

[0028] It should be noted that the carbon dioxide (CO2) involved in this application, as a novel working fluid, has a critical temperature of 31.1℃ and a triple point of -56.6℃. It can achieve efficient heat transfer through a liquid-to-gas phase change within the temperature range of -55℃ to 0℃. Furthermore, CO2 has a GWP of 1, an ODP of 0, and is non-corrosive and flammable / explosive, making its safety and environmental friendliness significantly superior to traditional fluorinated liquid working fluids.

[0029] See Figure 1This is a schematic diagram of the chip backplane cooling pipeline provided in some embodiments of this application; see also Figure 2 This is a schematic diagram of the chip backplane cooling pipeline provided in this application;

[0030] See Figure 1 This application provides a chip backplane cooling pipeline, including:

[0031] A first heat exchanger 6, a first pipeline 8, a second heat exchanger, and a second pipeline 7 are sequentially connected to form a first circulation pipeline; a carbon dioxide cooling medium flows in the first circulation pipeline; wherein, the second heat exchanger includes a CO2 gravity heat pipe 12 and a back plate heat exchanger 13 connected to each other.

[0032] In this embodiment, carbon dioxide is used as the cooling medium, and its natural phase change cycle is the core. The heat absorption and release effects of vaporization / condensation are utilized to remove heat from the chip backplane using the first circulation pipeline. Specifically, the first heat exchanger 6 and the second heat exchanger perform different heat exchange processes in this embodiment:

[0033] The first heat exchanger 6 is used to condense the gaseous carbon dioxide cooling medium input from the second pipeline 7 into liquid carbon dioxide cooling medium, and output the liquid carbon dioxide cooling medium to the first pipeline 8;

[0034] The second heat exchanger is used to vaporize the liquid carbon dioxide cooling medium input into the first pipeline 8 to obtain gaseous carbon dioxide cooling medium, and output the gaseous carbon dioxide cooling medium to the second pipeline 7;

[0035] The second heat exchanger is bonded to the chip backplane to absorb heat from its surface. In practical applications, the CO2 gravity heat pipe 12 and the backplane heat exchanger 13 can be integrated into a high-efficiency heat transfer unit and directly bonded to the server rack to transfer heat from the chip backplane.

[0036] In this embodiment, the horizontal height of the first heat exchanger 6 is higher than that of the second heat exchanger, which allows the gaseous carbon dioxide cooling medium generated in the second heat exchanger to automatically flow along the second pipeline 7 towards the first heat exchanger 6 based on the density difference. It also allows the liquid carbon dioxide cooling medium generated in the first heat exchanger 6 to automatically flow along the first pipeline 8 towards the second heat exchanger based on the height difference, thereby achieving the flow of the medium without the need for a driving device.

[0037] See Figure 2In this embodiment, the second heat exchanger, consisting of the CO2 gravity heat pipe 12 and the backplate heat exchanger 13, serves as the evaporation section. It is tightly bonded to the server rack (chip) backplate using a high thermal conductivity interface material. Liquid CO2, the cooling medium, flows uniformly into the evaporation section from a microchannel array with a "bottom-in, top-out" flow channel design at the bottom. The precise layout of the microchannels (channel width 0.5-1.2 mm, depth 2-3 mm) significantly increases the contact area between the working fluid and the heat source, enabling the liquid CO2 to rapidly exceed the phase change threshold and complete the transition from liquid to gas when absorbing heat generated by the server operation. Due to its significantly reduced density, the gaseous CO2 rises along the second pipe 7 to the first heat exchanger 6 under the natural driving force created by the density difference between the gas and liquid phases. The entire process follows the spontaneous heat transfer law of the second law of thermodynamics.

[0038] See also Figure 2 In the first heat exchanger 6, high-temperature gaseous CO2 and the external cooling medium undergo forced convection heat exchange through corrugated heat transfer tube bundles. Under supercritical pressure (approximately 7.4 MPa), the gaseous CO2 releases latent heat and cools to 30-35°C, completing the gas-liquid phase change and condensing into a liquid state. The condensed high-density liquid CO2 returns to the bottom of the microchannels in the backplate heat exchanger 13 along the return pipe (first pipe 8) under the action of gravity, thus forming a closed loop of "evaporation-rise-condensation-return".

[0039] As can be seen from the above technical solution, in the embodiment of this application, the evaporator of the backplate heat exchanger adopts a bottom-in, top-out microchannel flow channel layout. The liquid CO2 working fluid flows in from the bottom of the microchannel, vaporizes after absorbing heat from the server backplate, and the gaseous working fluid naturally floats up and flows out from the top due to the density difference, which perfectly matches the driving principle of the "thermosiphon effect" of gravity heat pipes. This design reduces the flow resistance of CO2 in the microchannel by more than 30%, avoids the gas-liquid stagnation or flow dead zone problems that may be caused by traditional horizontal or reverse flow channels, and ensures that the phase change process of the working fluid is more uniform and more efficient.

[0040] Meanwhile, this application uses CO2 as the working fluid, which has a global warming potential (GWP) of only 1 and an ozone depletion potential (ODP) of 0. This fundamentally solves the high environmental impact problem caused by traditional fluorinated liquid working fluids (GWP > 1000), aligns with the global trend of low-carbon data center construction, and meets stringent environmental regulations. Utilizing the unique phase change characteristics of CO2 (triple point -56.6℃, critical temperature 31.1℃), efficient heat transfer can still be achieved through liquid-gas phase change in the low-temperature range of -55℃ to 0℃. This completely solves the problem of heat transfer efficiency decreasing by more than 50% due to the viscosity surge of fluorinated liquids below -20℃. It can not only meet the heat dissipation needs of high-altitude, cold regions, as well as green data centers and high-density data centers, but also significantly expand the application scenarios of gravity heat pipe backplanes.

[0041] Further, see Figure 1 In some feasible embodiments, the chip cooling pipeline provided in this application further includes:

[0042] The second circulation pipeline includes the first heat exchanger 6; a first cooling medium flows within the second circulation pipeline; the second circulation pipeline is used to exchange heat between the first heat exchanger 6 and the first circulation pipeline, so that the gaseous carbon dioxide cooling medium in the first circulation pipeline condenses to obtain liquid carbon dioxide cooling medium.

[0043] In this embodiment of the application, the second circulation pipeline can be connected to any external refrigeration pipeline, and the first cooling medium can be cooling water or other cooling media.

[0044] In some feasible embodiments, see Figure 1 The first pipeline 8 is equipped with a first electric throttle valve 11; the second pipeline 7 is equipped with a first temperature sensor 9 and a first pressure gauge 10. The first temperature sensor 9 is used to monitor the temperature of the gaseous carbon dioxide cooling medium in the second pipeline 7 in real time, and the monitored temperature data is used as real-time data. The first pressure gauge 10 is used to monitor the pressure of the gaseous carbon dioxide cooling medium in the second pipeline 7 in real time, and the monitored pressure data is used as real-time data. In practical applications, the opening degree of the first electric throttle valve 11 can be dynamically adjusted according to the real-time data from the first temperature sensor 9 and the first pressure gauge 10 to precisely control the flow rate and pressure of the gaseous carbon dioxide cooling medium in the second pipeline 7, thereby achieving precise regulation of the cooling effect.

[0045] In some feasible embodiments, see Figure 1 In the second circulation pipeline, the input section 2 of the first heat exchanger 6 is equipped with a second electric throttle valve 5; the output section 1 of the first heat exchanger 6 is equipped with a second temperature sensor 3 and a second pressure gauge 4. The second temperature sensor 3 is used to monitor the temperature of the first cooling medium in the output section 1 of the first heat exchanger 6 in real time, and uses the monitored temperature data as real-time data. The second pressure gauge 4 is used to monitor the pressure of the first cooling medium in the output section 1 of the first heat exchanger 6 in real time, and uses the monitored pressure data as real-time data. In practical applications, the opening degree of the second electric throttle valve 5 can be dynamically adjusted according to the real-time data from the second temperature sensor 3 and the second pressure gauge 4 to precisely control the flow rate and pressure of the first cooling medium in the first heat exchanger 6, thereby further ensuring the stability and efficiency of the cooling effect.

[0046] In some feasible embodiments, it also includes:

[0047] The controller (not shown in the figure) is electrically connected to the first electric throttle valve 11, the first temperature sensor 9, the first pressure gauge 10, the second electric throttle valve 5, the second temperature sensor 3, and the second pressure gauge 4, respectively.

[0048] The controller is used to generate control commands for controlling the first electric throttle valve 11 based on the first data fed back by the first temperature sensor 9 and the first pressure gauge 10, and to generate control commands for controlling the second electric throttle valve 5 based on the second data fed back by the second temperature sensor 3 and the second pressure gauge 4.

[0049] In this embodiment, the controller can process and analyze the data fed back from the first temperature sensor 9, the first pressure gauge 10, the second temperature sensor 3, and the second pressure gauge 4 using a preset algorithm or model, thereby determining the optimal opening degree of the first electric throttle valve 11 and the second electric throttle valve 5. By adjusting the opening degree of these two throttle valves in real time, precise control of the cooling system can be achieved, ensuring that it maintains the best cooling effect under different operating conditions. In addition, the controller can also have fault diagnosis and early warning functions. When an abnormality occurs in the system, it can promptly detect it and take corresponding measures to prevent the fault from escalating further and ensure the stable operation of the system.

[0050] As can be seen from the above technical solution, the pipeline provided in this application can integrate an electric regulating valve control strategy based on the return gas superheat of the microchannel heat exchanger through a controller. By monitoring the return gas superheat in real time and dynamically adjusting the valve opening, the CO2 working fluid flow rate can be precisely controlled, achieving high-precision control to stabilize the return gas superheat at 1K. This mechanism effectively avoids the risk of dry evaporation section or liquid slugging in condensation section caused by uneven working fluid flow in traditional gravity heat pipe systems, ensuring that the gas-liquid two-phase circulation is always in the efficient phase change range.

[0051] To explain the working principle of the controller in detail, this application also provides a control method for a chip backplane cooling pipeline, applied to the controller in the chip backplane cooling pipeline of any of the foregoing embodiments, the method comprising:

[0052] S100: Obtain the return superheat data of the gaseous carbon dioxide cooling medium in the second pipeline; specifically, it is necessary to monitor and record the temperature and pressure of the gaseous carbon dioxide in the second pipeline during the circulation process, thereby calculating its superheat value. Superheat refers to the value by which the gas temperature exceeds its saturation temperature, and it is one of the important parameters for measuring the efficiency and stable operation of the refrigeration system. By accurately obtaining this data, it is possible to ensure that the refrigeration system operates efficiently according to design requirements, while avoiding system failures caused by abnormal superheat.

[0053] S200: Based on the comparison result between the return gas superheat data and the preset threshold, a first control command is generated; the first control command is used to adjust the opening degree of the first electric throttle valve on the first pipeline. Specifically, the adjustment method is divided into increasing the opening degree or decreasing the opening degree. By setting a preset threshold and comparing it with real-time data, the corresponding control rules can be derived.

[0054] Furthermore, in some feasible embodiments, the step of generating a first control command based on the comparison result of the return gas superheat data and a preset threshold includes:

[0055] S210: If the return gas superheat data is lower than a preset threshold, the first control command is used to reduce the opening of the first electric throttle valve; for example, when the superheat is lower than 0.8K, the valve opening is reduced to limit the working fluid flow rate and avoid liquid accumulation in the evaporation section due to incomplete vaporization of liquid CO2.

[0056] S220: If the return gas superheat data is higher than a preset threshold, the first control command is used to increase the opening of the first electric throttle valve; for example, when the superheat is higher than 1.2K, the valve opening is increased to accelerate the circulation of the working fluid and prevent the evaporation section from drying out.

[0057] When the return gas superheat data is abnormal, in addition to adjusting the medium flow rate in the first circulation pipeline, the medium flow rate in the second circulation pipeline can also be adjusted accordingly. Therefore, in some feasible embodiments, the method further includes:

[0058] S230: When the return gas superheat data is lower than the preset threshold, a second control command is generated; the second control command is used to reduce the opening of the second electric throttle valve in the second circulation pipeline;

[0059] S240: When the return gas superheat data is higher than the preset threshold, a third control command is generated; the third control command is used to increase the opening of the second electric throttle valve in the second circulation pipeline.

[0060] For example, when the superheat is below 0.8K, the opening of the second electric throttle valve in the second circulation line will decrease accordingly to reduce the flow rate of the working fluid in that line. Conversely, when the superheat is above 1.2K, the opening of the second electric throttle valve will increase to promote the flow of the working fluid in the second circulation line. Through this dual regulation mechanism, the flow rate of the working fluid in the cooling lines can be controlled more precisely, improving cooling efficiency while ensuring the stability and reliability of the system.

[0061] In some feasible embodiments, the method further includes:

[0062] S300: Obtain real-time data of the cabinet where the chip backplane is located; the real-time data includes at least one of the following: cabinet power, ambient temperature, and working fluid overheating.

[0063] S400: If the real-time data meets the first preset rule, a fourth control command is generated; the fourth control command is used to adjust the opening of the first electric throttle valve on the first pipeline, and / or adjust the opening of the second electric throttle valve in the second circulation pipeline.

[0064] In this embodiment, the controller can also integrate an intelligent control module to establish communication with the service center. By collecting multi-dimensional data such as cabinet power, ambient temperature, and working fluid superheat in real time, it can dynamically adjust the cooling medium flow rate and valve opening. For example, when the cabinet load suddenly increases (e.g., from 15kW to 25kW), the controller can generate a control command to increase the cooling water flow rate by 20% and accelerate CO2 circulation by adjusting the opening of the electric throttle valve to ensure that the heat dissipation capacity matches the heat load.

[0065] Furthermore, considering that some data anomalies may lead to ineffective control—for example, if the cabinet load suddenly increases and then immediately returns to normal, further adjustment of the medium flow rate in the cooling pipes may not be necessary—a preset time limit can be added to step S400. This allows for a certain delay or time limit to complete the adjustment. Accordingly, in some feasible embodiments, the method further includes:

[0066] S410: If the real-time data meets the first preset rule, a fifth control command is generated; the fifth control command is used to adjust the opening of the first electric throttle valve on the first pipeline within a preset time period, and / or adjust the opening of the second electric throttle valve in the second circulation pipeline.

[0067] S420: Obtain real-time data within the preset time period. If the real-time data meets the second preset rule, generate a sixth control instruction. The sixth control instruction is used to cancel the fifth control instruction.

[0068] For example, the fifth control command is generated based on the requirement to increase the cooling water flow rate by 20% within 5 seconds when the cabinet load suddenly increases (e.g., from 15kW to 25kW). If the cabinet load is again measured at 15kW within 5 seconds, it means that the sudden increase was not sustained. In this case, the operation of the fifth control command can be canceled by generating the sixth control command without changing the flow rate of the medium in the first or second circulation pipeline, thus avoiding unnecessary waste of resources.

[0069] As described above, the solution proposed in this application utilizes a CO2 gravity heat pipe backplate to construct the cooling pipeline, with natural phase change circulation using CO2 as the working fluid as the core. Combined with key technologies such as microchannel enhanced heat transfer, supercritical pressure optimization, and intelligent dynamic control, it provides stable heat dissipation for high heat density server racks (single rack power ≥ 20kW) without requiring additional energy consumption. Its compact, integrated design can be directly embedded into the back of the rack, saving 30%-40% of data center space. Furthermore, with its environmentally friendly characteristics of GWP=1 and ODP=0, it helps achieve carbon neutrality goals, making it an ideal cooling solution for cold regions and modular data centers.

[0070] It is readily understood that, based on the several embodiments provided in this application, those skilled in the art can combine, split, or reorganize the embodiments of this application to obtain other embodiments, none of which exceed the protection scope of this application.

[0071] The above detailed embodiments further illustrate the purpose, technical solution, and beneficial effects of the embodiments of this application. It should be understood that the above are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solutions of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A chip backplane cooling pipeline, characterized in that, include: A first heat exchanger, a first pipeline, a second heat exchanger, and a second pipeline are sequentially connected to form a first circulation pipeline; carbon dioxide cooling medium flows in the first circulation pipeline. The first heat exchanger is used to condense the gaseous carbon dioxide cooling medium input from the second pipeline into liquid carbon dioxide cooling medium, and output the liquid carbon dioxide cooling medium to the first pipeline; The second heat exchanger is used to vaporize the liquid carbon dioxide cooling medium input from the first pipeline to obtain gaseous carbon dioxide cooling medium, and output the gaseous carbon dioxide cooling medium to the second pipeline. The second heat exchanger is bonded to the chip backplane and is used to absorb heat from the surface of the chip backplane.

2. The chip backplane cooling pipeline according to claim 1, characterized in that, Also includes: The second circulation pipeline includes the first heat exchanger; a first cooling medium flows within the second circulation pipeline. The second circulation pipeline is used to exchange heat between the first heat exchanger and the first circulation pipeline, so that the gaseous carbon dioxide cooling medium in the first circulation pipeline is condensed to obtain liquid carbon dioxide cooling medium.

3. The chip backplane cooling pipeline according to claim 2, characterized in that, The first pipeline is equipped with a first electric throttle valve; the second pipeline is equipped with a first temperature sensor and a first pressure gauge.

4. The chip backplane cooling pipeline according to claim 3, characterized in that, In the second circulation pipeline, the input section of the first heat exchanger is equipped with a second electric throttle valve; the output section of the first heat exchanger is equipped with a second temperature sensor and a second pressure gauge.

5. The chip backplane cooling pipeline according to claim 4, characterized in that, Also includes: The controller is electrically connected to the first electric throttle valve, the first temperature sensor, the first pressure gauge, the second electric throttle valve, the second temperature sensor, and the second pressure gauge, respectively. The controller is used to generate control commands for controlling the first electric throttle valve based on the first data fed back by the first temperature sensor and the first pressure gauge, and to generate control commands for controlling the second electric throttle valve based on the second data fed back by the second temperature sensor and the second pressure gauge.

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