A wrap-around conductive shielding film for an SD memory card

Abstract

The utility model discloses a kind of for SD memory card's package type conductive shielding film, including conductive cloth single-sided tape, first conductive double-sided adhesive layer, copper foil layer, second conductive double-sided adhesive layer, insulating film and third conductive double-sided adhesive layer;Copper foil layer is set on the glue surface of the conductive cloth single-sided tape by first conductive double-sided adhesive layer;Second conductive double-sided adhesive layer covers copper foil layer and the conductive cloth single-sided tape area not covered by copper foil layer;Insulating film is set on the partial area of second conductive double-sided adhesive layer;Third conductive double-sided adhesive layer is set on the edge of second conductive double-sided adhesive layer;After the conductive shielding film forms package structure, third conductive double-sided adhesive layer and the outside of conductive cloth single-sided tape are overlapped. The conductive shielding film of the utility model has excellent electromagnetic shielding efficiency, ultrathin light weight, good flexibility and wrapping, reliable low impedance grounding, good insulation protection and the like, can ensure the stable operation of SD memory card under various complex electromagnetic environment.

Description

Technical Field

[0001] This utility model relates to the field of conductive shielding film technology, and in particular to a wrap-around conductive shielding film for SD memory cards. Background Technology

[0002] With the rapid development of information technology, the demand for data storage in portable electronic devices (such as smartphones, tablets, digital cameras, and drones) has surged. SD (Secure Digital) memory cards, due to their small size, large capacity, and good compatibility, have become one of the most widely used mobile storage media. However, SD cards integrate sophisticated flash memory chips and control circuits. These electronic components generate electromagnetic radiation (EMI) during operation and are also highly susceptible to external electromagnetic interference (EMS), which can lead to data read / write errors, reduced transmission rates, and even damage to the memory chips, seriously affecting data reliability and device stability.

[0003] To ensure the proper functioning of SD cards and meet increasingly stringent electromagnetic compatibility (EMC) regulations (such as FCC and CE certifications), effective electromagnetic shielding is a crucial design element. Traditional SD card shielding solutions primarily rely on encasing the card in a metal shielding cover (usually made of stainless steel or stamped brass). While this metal cover provides some shielding effect, it also has several significant drawbacks:

[0004] Size and thickness limitations: The metal casing itself has a certain thickness and rigidity, and its molding process also limits further miniaturization. This contradicts the current trend of SD cards (especially microSD cards) becoming increasingly smaller and thinner, limiting the optimal utilization of internal space in devices.

[0005] Assembly complexity and cost: The metal cover requires precise stamping and is then fixed to the SD card's PCB board or casing during assembly via welding or snap-fit. This not only increases material costs (metal materials, processing fees) but also complicates the automated assembly process, resulting in relatively low production efficiency.

[0006] Grounding reliability issues: The metal shield needs to form a good, stable, low-impedance electrical connection with the grounding layer inside the SD card to achieve the ideal shielding effect. The reliability of solder joints or contact points is easily affected by process fluctuations and mechanical stress (such as bending and dropping), which may lead to poor grounding and reduced shielding effectiveness.

[0007] Poor flexibility and adaptability: Rigid metal covers are difficult to adapt to irregular or complex structures that require flexible wrapping, and have limited stress buffering effect on internal components.

[0008] High-frequency shielding effectiveness is limited: As data transmission rates continue to increase (such as UHS-II, UHS-III, SDExpress), operating frequencies are getting higher and higher. The shielding effectiveness of traditional metal shields at high frequencies may be significantly attenuated due to gaps, holes (such as at interfaces), and inadequate grounding.

[0009] To overcome some of the drawbacks of metal shields, solutions using flexible materials such as conductive tape, conductive cloth, or conductive foam for localized shielding or gap filling have emerged on the market. However, these solutions typically have the following shortcomings:

[0010] Poor structural integrity: Most are single-layered or simply stacked, making it difficult to form a complete and continuous enveloping shield for the internal circuitry of the SD card.

[0011] Insufficient conductivity and grounding stability: The surface impedance and vertical impedance (current carrying capacity) of the material may not be ideal, and the connection method with the grounding point (such as point contact) is not reliable enough, affecting the overall shielding effectiveness, especially in the high frequency band.

[0012] Process complexity and consistency: The bonding and positioning accuracy of multi-layer flexible materials is high, the operation is complicated, it is difficult to ensure the consistency and yield of mass production, and there is a lack of effective positioning and overlapping design, which can easily lead to gaps or misalignments after wrapping.

[0013] Inadequate insulation and protection: The lack of an effective insulation layer design may lead to the risk of accidental short circuits between the shielding layer and the internal circuitry, or cause interference to external components after being wrapped.

[0014] Therefore, there is an urgent need in this field for a new type of SD card shielding solution that simultaneously meets the following requirements: excellent electromagnetic shielding performance, ultra-thin and lightweight design, good flexibility and encapsulation, reliable low-impedance grounding, and good insulation protection. Utility Model Content

[0015] To solve the above-mentioned technical problems, the purpose of this utility model is to provide a wrap-around conductive shielding film for SD memory cards, which has excellent electromagnetic shielding performance, ultra-thin and lightweight, good flexibility and wrap-around properties, reliable low impedance grounding, and good insulation protection.

[0016] To achieve the above-mentioned technical objectives and effects, this utility model is implemented through the following technical solution:

[0017] A wrap-around conductive shielding film for SD memory cards includes a conductive single-sided adhesive tape, a first conductive double-sided adhesive layer, a copper foil layer, a second conductive double-sided adhesive layer, an insulating film, and a third conductive double-sided adhesive layer. The copper foil layer is disposed on the adhesive surface of the conductive single-sided adhesive tape through the first conductive double-sided adhesive layer. The second conductive double-sided adhesive layer covers the copper foil layer and the area of ​​the conductive single-sided adhesive tape not covered by the copper foil layer. The insulating film is disposed on a portion of the second conductive double-sided adhesive layer. The third conductive double-sided adhesive layer is disposed on the edge of the second conductive double-sided adhesive layer. After the conductive shielding film forms a wrap-around structure, the third conductive double-sided adhesive layer overlaps with the outer side of the conductive single-sided adhesive tape.

[0018] Furthermore, a silicone protective film is provided on the non-adhesive side of the conductive cloth single-sided tape, and the silicone protective film is bonded to the conductive cloth single-sided tape through an adhesive layer thereon.

[0019] Furthermore, the size of the silicone protective film is larger than the size of the conductive cloth single-sided tape.

[0020] Furthermore, the surface impedance of the conductive cloth single-sided tape is less than 0.2Ω, and the vertical impedance is less than 0.05Ω.

[0021] Furthermore, the impedance of the first conductive double-sided adhesive layer is less than 0.01Ω.

[0022] Furthermore, the second conductive double-sided adhesive layer has an adhesion of ≥300gf / in, a surface resistance of <200mΩ / in, and a vertical resistance of <50mΩ / in. 2 .

[0023] Furthermore, the third conductive double-sided adhesive layer has an adhesion greater than 3.8 N / cm, a surface resistance less than 0.3 Ω / sq, and a vertical resistance less than 0.03 Ω / in. 2 .

[0024] Furthermore, the insulating film is a PET film, and the insulating film is positioned corresponding to the position of the copper foil layer.

[0025] Furthermore, the silicone protective film is provided with positioning holes.

[0026] Furthermore, the shape of the first conductive double-sided adhesive layer is consistent with the shape of the copper foil layer.

[0027] The technical effects of this utility model are as follows:

[0028] The conductive cloth single-sided adhesive tape in this invention provides flexibility and a grounding path. Its good flexibility can adapt to the shape of the SD memory card and the bending requirements during the assembly process. At the same time, as a grounding base layer, it provides a stable grounding connection for the entire shielding structure, ensuring the effectiveness of electromagnetic shielding.

[0029] The first conductive double-sided adhesive layer not only firmly bonds the copper foil layer and electrically connects it to the conductive cloth single-sided tape, establishing a low-impedance conductive path and achieving efficient electromagnetic shielding signal transmission, but also plays a preliminary role in fixing and supporting the copper foil layer, ensuring the stability of the copper foil layer during subsequent processing and use, and preventing the copper foil layer from shifting or falling off.

[0030] As the core electromagnetic shielding layer, the copper foil layer possesses excellent conductivity and electromagnetic shielding effectiveness, effectively reflecting and absorbing high-frequency electromagnetic waves to provide comprehensive electromagnetic shielding protection for the electronic components inside the SD memory card. Simultaneously, the copper foil layer exhibits a certain degree of hardness and strength, providing mechanical protection functions such as puncture resistance, bending resistance, and stress dispersion, maximizing the protection of components (chips) from external impacts and mechanical damage, and ensuring the reliability of the memory card in complex working environments.

[0031] The second conductive double-sided adhesive layer, while further securing the copper foil layer, provides flat tension support for the copper foil, preventing wrinkles during wrapping and ensuring a tight bond between the copper foil layer and the conductive cloth single-sided tape, thus enhancing the overall structural strength. Furthermore, the second conductive double-sided adhesive layer also achieves good electrical connection between the edge area of ​​the copper foil layer and the conductive cloth single-sided tape, forming a composite shielding base layer with superior electrical performance and a more stable structure, preventing a decrease in electromagnetic shielding effectiveness due to poor connection. Simultaneously, the second conductive double-sided adhesive layer provides stable bonding points for the insulating film, allowing it to firmly adhere to the shielding structure. As the innermost layer, the second conductive double-sided adhesive layer fully adheres to the SD card's plastic casing during wrapping, providing all-area adhesion and preventing the shielding film from loosening or detaching during use.

[0032] The third conductive double-sided adhesive layer, in conjunction with the outer side of the conductive cloth single-sided adhesive tape, achieves self-adhesive overlap, forming a wrapping structure. This is easy to operate and provides a strong bond. A low-impedance bridging path is established at the overlap seam, ensuring that the outermost conductive cloth is an electrically continuous whole after wrapping. This eliminates the risk of electromagnetic wave leakage at the edges and gaps, forming a complete and effectively grounded shielding shell. This comprehensively and efficiently suppresses electromagnetic interference generated by the SD card and prevents external electromagnetic interference from entering, ensuring the stability of data transmission and the normal operation of the memory card.

[0033] The insulating film provides electrical insulation, preventing accidental short circuits in different conductive areas inside the shielding structure when bent or compressed, thus avoiding the risk of failure caused by short circuits and improving the safety and reliability of the entire shielding structure.

[0034] In this invention, the first, second, and third conductive double-sided adhesive layers work together to construct a three-dimensional conductive network, resulting in superior electromagnetic shielding performance that meets the high-frequency electromagnetic shielding requirements of high-speed data transmission scenarios. Simultaneously, the design and optimized impedance characteristics of the multi-layer conductive double-sided adhesive layers achieve a complete and continuous shielding effect and low-impedance grounding, ensuring stable operation of the SD memory card in various complex electromagnetic environments and improving the security and reliability of data storage and transmission. Furthermore, the overall encapsulated conductive shielding film structure is rationally designed, with complementary material properties in each layer. It features ultra-thin and lightweight construction, excellent flexibility and encapsulation, meeting the miniaturization and high-performance requirements of modern electronic devices. It is easy to assemble and mass-produce, reducing production costs and improving production efficiency. Attached Figure Description

[0035] Figure 1 This is an exploded structural diagram of the encapsulated conductive shielding film of this utility model.

[0036] Figure 2 This is a schematic diagram of the overall structure of the encapsulated conductive shielding film of this utility model.

[0037] In the diagram, 1: silicone protective film; 2: conductive cloth single-sided tape; 3: first conductive double-sided adhesive layer; 4: copper foil layer; 5: second conductive double-sided adhesive layer; 6: insulating film; 7: third conductive double-sided adhesive layer. Detailed Implementation

[0038] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0039] This invention provides a wrap-around conductive shielding film for SD memory cards. Its functional structure includes a conductive single-sided adhesive tape 2, a first conductive double-sided adhesive layer 3, a copper foil layer 4, a second conductive double-sided adhesive layer 5, an insulating film 6, and a third conductive double-sided adhesive layer 7. The copper foil layer 4 is disposed on the adhesive surface of the conductive single-sided adhesive tape 2 through the first conductive double-sided adhesive layer 3. The second conductive double-sided adhesive layer 5 covers the copper foil layer 4 and the area of ​​the conductive single-sided adhesive tape 2 not covered by the copper foil layer 4. The insulating film 6 is disposed on a portion of the second conductive double-sided adhesive layer 5. The third conductive double-sided adhesive layer 7 is disposed on the edge of the second conductive double-sided adhesive layer 5. After the conductive shielding film forms a wrap-around structure, the third conductive double-sided adhesive layer 7 overlaps with the outer side of the conductive single-sided adhesive tape 2.

[0040] Among them, a silicone protective film 1 is provided on the non-adhesive surface of the conductive cloth single-sided tape 2 for protecting the functional structure of the shielding film. The silicone protective film 1 includes a PET substrate and a silicone adhesive layer provided on the surface of the PET substrate. The silicone protective film 1 is adhered to the conductive cloth single-sided tape 2 through the adhesive layer provided thereon. The viscosity of the silicone protective film 1 is 6-12 gf / in. The size of the silicone protective film 1 is larger than that of the conductive cloth single-sided tape 2. The silicone protective film 1 is also provided with positioning holes for assembly positioning. The silicone protective film 1 is removed after wrapping the SD memory card.

[0041] The conductive cloth single-sided tape 2 includes a matte black conductive woven cloth and a conductive acrylic adhesive provided on one side of the conductive woven cloth. The viscosity of the conductive cloth single-sided tape 2 > 1016 g / in, its surface impedance is less than 0.2 Ω, and the vertical impedance is less than 0.05 Ω. The black appearance and surface gloss of the surface of the conductive cloth single-sided tape 2 can avoid too large appearance differences from surrounding components, and at the same time, the unified base color is more beautiful.

[0042] The viscosity of the first conductive double-sided adhesive layer 3 > 1800 g / 2.5 cm, and its impedance (to the copper foil layer 4) is less than 0.01 Ω. The shape of the first conductive double-sided adhesive layer 3 is consistent with the shape of the copper foil layer 4.

[0043] The copper foil layer 4 is made of recycled alloy copper foil, which is conducive to the use and consumption of renewable resources.

[0044] The viscosity of the second conductive double-sided adhesive layer 5 ≥ 300 gf / in, the surface impedance < 200 mΩ / in, and the vertical impedance < 50 mΩ / in 2 ; The shape of the second conductive double-sided adhesive layer 5 is consistent with the shape of the conductive cloth single-sided tape 2.

[0045] The viscosity of the third conductive double-sided adhesive layer 7 > 3.8 N / cm, the surface impedance < 0.3 Ω / sq, and the vertical impedance < 0.03 Ω / in 2 .

[0046] The insulating film 6 is a PET film, preferably black, and the insulating film 6 is provided at the position corresponding to the copper foil layer 4. The insulating film 6 is a "C" - shaped structure.

[0047] Embodiment

[0048] The conductive shielding film for SD memory cards in this embodiment has a functional structure comprising, from bottom to top, a conductive single-sided adhesive tape 2, a first conductive double-sided adhesive layer 3, a copper foil layer 4, a second conductive double-sided adhesive layer 5, an insulating film 6, and a third conductive double-sided adhesive layer 7. The copper foil layer 4 is disposed on the adhesive surface of the conductive single-sided adhesive tape 2 through the first conductive double-sided adhesive layer 3. The second conductive double-sided adhesive layer 5 covers the copper foil layer 4 and the area of ​​the conductive single-sided adhesive tape 2 not covered by the copper foil layer 4. The insulating film 6 is disposed on a portion of the second conductive double-sided adhesive layer 5. The third conductive double-sided adhesive layer 7 is disposed on the edge of the second conductive double-sided adhesive layer 5. After the conductive shielding film forms a wrapping structure, the third conductive double-sided adhesive layer 7 overlaps with the outer side of the conductive single-sided adhesive tape 2.

[0049] The conductive single-sided tape 2 has a silicone protective film 1 on its non-adhesive side to protect the functional structure of the shielding film. In this embodiment, the silicone protective film 1 is model TR-7501-LG, blue in color, and includes a PET substrate and a silicone adhesive layer disposed on the surface of the PET substrate. The silicone protective film 1 is bonded to the conductive single-sided tape 2 via its adhesive layer. The silicone protective film 1 has an adhesive strength of 6-12 gf / in and a thickness of 0.085 mm. The size of the silicone protective film 1 is larger than that of the conductive single-sided tape 2. The silicone protective film 1 also has positioning holes for assembly positioning. The silicone protective film 1 is removed after wrapping the SD memory card.

[0050] The conductive single-sided tape 2, model SH-93704WB-C2, comprises a matte black conductive braided fabric and a conductive acrylic adhesive applied to one side of the braided fabric. This conductive single-sided tape 2 has an tack greater than 1016 g / in, a surface impedance of less than 0.2 Ω, a vertical impedance of less than 0.05 Ω, and a thickness of 0.04 mm. The black appearance and glossy finish of the conductive single-sided tape 2 prevent significant visual differences from surrounding components, while also providing a more aesthetically pleasing, unified base color.

[0051] The first conductive double-sided adhesive layer 3 is model TT-219-5, with an adhesion greater than 1800g / 2.5cm, an impedance (to copper foil layer 4) less than 0.01Ω, and a thickness of 0.05mm. The shape of the first conductive double-sided adhesive layer 3 is consistent with the shape of the copper foil layer 4.

[0052] Copper foil layer 4 is made of recycled alloy copper foil, model C77000R, with a thickness of 0.1mm.

[0053] The second conductive double-sided adhesive layer 5 is model N7402A, gray in color, with an adhesion ≥300gf / in, surface resistance <200mΩ / in, and vertical resistance <50mΩ / in. 2, with a thickness of 0.02 mm; the shape of the second conductive double-sided adhesive layer 5 is the same as that of the conductive cloth single-sided tape 2.

[0054] The model of the third conductive double-sided adhesive layer 7 is TESA60262, the color is gray, its adhesion > 3.8 N / cm, the surface impedance < 0.3 Ω / sq, and the vertical impedance < 0.03 Ω / in 2 , with a thickness of 0.05 mm.

[0055] The insulating film 6 is a PET film, the model is D250, the color is black, and the thickness is 0.05 mm. The insulating film 6 is arranged corresponding to the position of the copper foil layer 4. The insulating film 6 is in a "匚" shape structure.

[0056] The functions of each layer in the wrapped conductive shielding film of the present utility model are as follows:

[0057] The conductive cloth single-sided tape 2 in the present utility model provides flexibility and a grounding path. Its good flexibility can adapt to the shape of the SD memory card and the bending requirements during the assembly process. At the same time, as a grounding base layer, it provides a stable grounding connection for the entire shielding structure, ensuring the exertion of the electromagnetic shielding effect.

[0058] The first conductive double-sided adhesive layer 3 not only firmly bonds and electrically connects the copper foil layer 4 to the conductive cloth single-sided tape 2, establishes a low-impedance conductive path, and realizes efficient electromagnetic shielding signal conduction, but also plays a preliminary fixing and supporting role for the copper foil layer 4, ensuring the stability of the copper foil layer 4 during subsequent processing and use, and preventing the copper foil layer 4 from shifting or falling off.

[0059] The copper foil layer 4, as the core electromagnetic shielding layer, has excellent conductive performance and electromagnetic shielding effect. It can effectively reflect and absorb high-frequency electromagnetic waves, forming an all-round electromagnetic shielding protection for the electronic components inside the SD memory card. At the same time, the copper foil layer 4 has a certain hardness and strength, and can provide mechanical protection functions such as anti-puncture, anti-bending, and stress dispersion, maximizing the protection of components (chips) from external force impact and mechanical damage, and ensuring the reliability of the memory card in a complex working environment.

[0060] The second conductive double-sided adhesive layer 5, while further securing the copper foil layer 4, provides flat tension support for the copper foil, preventing wrinkles during wrapping. This ensures a tight bond between the copper foil layer 4 and the conductive cloth single-sided adhesive tape 2, enhancing the overall structural strength. Furthermore, the second conductive double-sided adhesive layer 5 achieves a good electrical connection between the edge area of ​​the copper foil layer 4 and the conductive cloth single-sided adhesive tape 2, forming a composite shielding base layer with superior electrical performance and a more stable structure, preventing a decrease in electromagnetic shielding effectiveness due to poor connection. Simultaneously, the second conductive double-sided adhesive layer 5 provides stable bonding points for the insulating film 6, allowing it to firmly adhere to the shielding structure. As the innermost layer, it fully adheres to the SD card's plastic casing during wrapping, providing all-area adhesion and preventing loosening or detachment of the shielding film during use.

[0061] The third conductive double-sided adhesive layer 7, in conjunction with the outer side of the conductive cloth single-sided adhesive tape 2, achieves self-adhesive overlap, forming a wrapping structure. This is easy to operate and provides a strong bond. A low-impedance bridging path is established at the overlap seam, ensuring that the outermost conductive cloth is an electrically continuous whole after wrapping. This eliminates the risk of electromagnetic wave leakage at the edges and gaps, forming a complete and effectively grounded shielding shell. This comprehensively and efficiently suppresses electromagnetic interference generated by the SD card and prevents external electromagnetic interference from entering, ensuring the stability of data transmission and the normal operation of the memory card.

[0062] The insulating film 6 provides electrical insulation, preventing accidental short circuits in different conductive layers inside the wrapping structure when bent or compressed, avoiding the risk of failure caused by short circuits, and improving the safety and reliability of the entire shielding structure.

[0063] In this invention, the first conductive double-sided adhesive layer 3, the second conductive double-sided adhesive layer 5, and the third conductive double-sided adhesive layer 7 work together to construct a three-dimensional conductive network, resulting in superior electromagnetic shielding performance and meeting the high-frequency electromagnetic shielding requirements of high-speed data transmission scenarios. Simultaneously, the design and optimized impedance characteristics of the multi-layer conductive double-sided adhesive layers achieve a complete and continuous shielding effect and low-impedance grounding effect, ensuring the stable operation of the SD memory card in various complex electromagnetic environments and improving the security and reliability of data storage and transmission. Furthermore, the overall encapsulated conductive shielding film structure is rationally designed, with complementary material properties in each layer. It features ultra-thin and lightweight construction, good flexibility and encapsulation, meeting the miniaturization and high-performance requirements of modern electronic devices. It is easy to assemble and mass-produce, reducing production costs and improving production efficiency.

[0064] Before use, the wrap-around conductive shielding film of this utility model is placed on the release film. When in use, the conductive shielding film is removed from the release film and assembled into the corresponding position using the positioning holes on the silicone protective film 1 to adapt it to the SD memory card. Then, the silicone protective film 1 is removed and the conductive shielding film is used to wrap and stick the SD memory card.

[0065] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.

[0066] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wrap-around conductive shielding film for SD memory cards, characterized in that, The device includes a conductive single-sided adhesive tape, a first conductive double-sided adhesive layer, a copper foil layer, a second conductive double-sided adhesive layer, an insulating film, and a third conductive double-sided adhesive layer. The copper foil layer is disposed on the adhesive surface of the conductive single-sided adhesive tape through the first conductive double-sided adhesive layer. The second conductive double-sided adhesive layer covers the copper foil layer and the area of ​​the conductive single-sided adhesive tape not covered by the copper foil layer. The insulating film is disposed on a portion of the second conductive double-sided adhesive layer. The third conductive double-sided adhesive layer is disposed on the edge of the second conductive double-sided adhesive layer. After the conductive shielding film forms a wrapping structure, the third conductive double-sided adhesive layer overlaps with the outer side of the conductive single-sided adhesive tape.

2. The encapsulated conductive shielding film for SD memory cards according to claim 1, characterized in that, The non-adhesive side of the conductive cloth single-sided tape is provided with a silicone protective film, and the silicone protective film is bonded to the conductive cloth single-sided tape through an adhesive layer thereon.

3. The encapsulated conductive shielding film for SD memory cards according to claim 2, characterized in that, The size of the silicone protective film is larger than the size of the conductive cloth single-sided tape.

4. The encapsulated conductive shielding film for SD memory cards according to claim 1, characterized in that, The surface impedance of the conductive cloth single-sided tape is less than 0.2Ω, and the vertical impedance is less than 0.05Ω.

5. The encapsulated conductive shielding film for SD memory cards according to claim 1, characterized in that, The impedance of the first conductive double-sided adhesive layer is less than 0.01Ω.

6. The encapsulated conductive shielding film for SD memory cards according to claim 1, characterized in that, The second conductive double-sided adhesive layer has an adhesion of ≥300gf / in, a surface impedance of <200mΩ / in, and a vertical impedance of <50mΩ / in. 2 .

7. The encapsulated conductive shielding film for SD memory cards according to claim 1, characterized in that, The third conductive double-sided adhesive layer has an adhesion greater than 3.8 N / cm, a surface resistance less than 0.3 Ω / sq, and a vertical resistance less than 0.03 Ω / in. 2 .

8. The encapsulated conductive shielding film for SD memory cards according to claim 1, characterized in that, The insulating film is a PET film, and the insulating film is positioned corresponding to the position of the copper foil layer.

9. The encapsulated conductive shielding film for SD memory cards according to claim 2, characterized in that, The silicone protective film has positioning holes.

10. The encapsulated conductive shielding film for an SD memory card according to claim 1, characterized in that, The shape of the first conductive double-sided adhesive layer is consistent with the shape of the copper foil layer.

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