A mobile automatic washing device for semiconductor component surface treatment

The mobile automatic rinsing device for semiconductor component surface treatment utilizes a robotic arm structure to achieve all-round cleaning and drying, solving the problems of high manual labor intensity, harsh environment, and uneven cleaning, thus improving cleaning quality and ease of operation.

CN224343719UActive Publication Date: 2026-06-09SHENZHEN XINCHENGNUO ENVIRONMENTAL PROTECTION IND CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN XINCHENGNUO ENVIRONMENTAL PROTECTION IND CO LTD
Filing Date
2025-04-07
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

In the existing technology, the cleaning and drying of semiconductor components mainly rely on manual operation, which has problems such as high operation intensity, harsh environment, uneven cleaning quality, safety hazards and high energy consumption.

Method used

The mobile automatic rinsing device for semiconductor component surface treatment uses a robotic arm structure to replace manual operation, combined with high-pressure water nozzles and air cutter nozzles to achieve all-round, no-dead-angle cleaning and drying.

Benefits of technology

It reduces labor costs, improves the consistency of cleaning quality and ease of operation, ensures the cleanliness and safety of products, and reduces the technical requirements for operators.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the field of semiconductor parts, and disclose a kind of semiconductor parts surface treatment mobile automatic flushing device, including T-shaped groove body and to be washed piece, T-shaped groove body inside opening one end is equipped with to be washed piece, to be washed piece is connected with the hanger bar of crown block in the side of T-shaped groove body outside, the outside of T-shaped groove body is equipped with fixed rack structure, fixed rack structure is close to T-shaped groove body opening side, multiple groups T edge flushing mechanical arm structure are equipped on fixed rack structure, T edge flushing mechanical arm structure is in T-shaped groove body side, multiple groups straight edge flushing mechanical arm structure are equipped on fixed rack structure, straight edge flushing mechanical arm structure is in T-shaped groove body side, to replace artificial hand-held high-pressure water gun and dust gun operation with automated mechanical arm, operator only needs to select cleaning program and mode on system panel, press start button, without spending a lot of physical strength to carry out high-intensity flushing and drying operation, greatly reduce manpower input, reduce labor cost.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor components, specifically a mobile automatic rinsing device for surface treatment of semiconductor components. Background Technology

[0002] In the semiconductor component manufacturing industry, surface treatment of aluminum alloy workpieces is crucial. Corrosive chemical solutions are typically used to treat the surface of aluminum alloy workpieces to remove deposits and impurities from the surface and machined holes. This involves multiple processes, including ultrasonic degreasing, alkaline washing, acid washing, dust removal, neutralization, and high-pressure rinsing. During the cleaning process, after acid washing and dust removal, a loose compound forms on the product surface. This not only affects subsequent processes but must also be removed using high-pressure water rinsing. Afterward, the workpiece surface and machined holes must be dried to ensure product surface cleanliness and avoid affecting subsequent packaging.

[0003] Currently, the cleaning and drying of semiconductor components mainly relies on manual operation, with workers using high-pressure water guns and dust guns. First, the operation is physically demanding, and prolonged work can easily lead to fatigue. Second, the harsh working environment makes operators susceptible to getting wet, and excessive noise can affect hearing. Third, the cleaning quality is affected by the operator's skill, and uneven cleaning is likely to occur. Finally, the use of high-pressure water guns poses safety hazards and may result in injury due to misoperation. Although hot air drying is used, it is energy-intensive and has limited functionality, failing to achieve simultaneous rinsing and drying. Therefore, we propose a mobile automatic rinsing device for the surface treatment of semiconductor components. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a mobile automatic rinsing device for surface treatment of semiconductor components, which solves the aforementioned problems.

[0005] To achieve the above-mentioned objectives, this utility model provides the following technical solution: a mobile automatic rinsing device for surface treatment of semiconductor components, comprising a T-shaped trough and a component to be cleaned. The component to be cleaned is provided at one open end of the T-shaped trough. The component to be cleaned is connected to the hanging rod of a crane on one side of the T-shaped trough. A fixed frame structure is provided on the outer side of the T-shaped trough, with the fixed frame structure close to the open side of the T-shaped trough. Multiple sets of T-side rinsing robotic arm structures are provided on the fixed frame structure, with the T-side rinsing robotic arm structures located on one side of the T-shaped trough. Multiple sets of straight-side rinsing robotic arm structures are also provided on the fixed frame structure, with the straight-side rinsing robotic arm structures located on one side of the T-shaped trough.

[0006] Preferably, the fixed frame structure includes a fixed frame, a slider mounting plate, and linear sliders. The fixed frame is installed on the side of the T-shaped groove, and the fixed frame is around the side of the T-shaped groove. The fixed frame is close to the opening of the T-shaped groove. Four linear sliders distributed in a rectangular pattern are fixedly connected to one side of the slider mounting plate. The linear sliders are slidably connected to the sliders on the fixed frame. Multiple slider mounting plates are slidably connected to the fixed frame.

[0007] Preferably, the fixed frame structure further includes a servo motor, a drive gear, and a tank chain. The servo motor is mounted on the side of the slider mounting plate opposite to the linear slider. The drive gear is rotatably connected to the side of the slider mounting plate connected to the linear slider via a rotating shaft. The rotating shaft of the drive gear passes through the slider mounting plate. The output shaft of the servo motor is connected to the rotating shaft of the drive gear via a transmission reversing mechanism. The drive gear is frictionally connected to the synchronous belt of the fixed frame. A tank chain is mounted on the fixed frame, and the wiring of the drive gear is installed inside the tank chain.

[0008] Preferably, the straight-edge rinsing robotic arm structure includes a straight-edge robotic arm, a high-pressure water nozzle, and an air-cutting nozzle. The straight-edge robotic arm is a C-shaped square tube structure. The inner side of one of the folded edges of the straight-edge robotic arm is fixedly connected to the side of the slider mounting plate opposite to the drive gear. The middle folded edge of the straight-edge robotic arm is above the opening of the T-shaped groove. A symmetrical folded edge of the straight-edge robotic arm and the slider mounting plate is inside the T-shaped groove. A high-pressure water nozzle and an air-cutting nozzle are installed on one folded edge of the straight-edge robotic arm inside the T-shaped groove, and the high-pressure water nozzle and the air-cutting nozzle face the part to be cleaned.

[0009] Preferably, the T-side rinsing robotic arm structure includes a T-side robotic arm, a folding drive cylinder, a folding robotic arm, a high-pressure water nozzle, and an air-cutting nozzle. The T-side robotic arm is a C-shaped square tube structure. The inner side of one of the folded edges of the T-side robotic arm is fixedly connected to the side of the slider mounting plate opposite to the drive gear. The middle folded edge of the T-side robotic arm is above the opening of the T-shaped groove. A symmetrical folded edge of the T-side robotic arm and the slider mounting plate is inside the T-shaped groove. A folding drive cylinder is mounted on one folded edge of the T-side robotic arm inside the T-shaped groove via a hinge seat. The lug of the folding drive cylinder body is hinged to the hinge seat on the T-side robotic arm. One end of the folded edge of the T-side robotic arm inside the T-shaped groove is rotatably connected to the folding robotic arm. The lug of the piston rod of the folding drive cylinder is rotatably connected to the folding robotic arm. A high-pressure water nozzle and an air-cutting nozzle are mounted on the folding robotic arm, facing the workpiece to be cleaned.

[0010] Preferably, the straight-edged robotic arm has a reaction force support rod installed on one folded edge of the T-shaped groove away from the high-pressure water nozzle, and the reaction force support rod is in contact with the inner wall of the T-shaped groove. The folded robotic arm has another reaction force support rod installed away from the high-pressure water nozzle, and the reaction force support rod is in contact with the inner wall of the T-shaped groove.

[0011] Compared with the prior art, this utility model provides a mobile automatic rinsing device for surface treatment of semiconductor components, which has the following advantages:

[0012] 1. This mobile automatic rinsing device for semiconductor component surface treatment replaces manual operation with a robotic arm that uses a handheld high-pressure water gun and blower. Operators only need to select the cleaning program and mode on the system panel and press the start button. There is no need to spend a lot of physical effort on high-intensity rinsing and drying operations, which greatly reduces labor input and lowers labor costs. At the same time, the simple operation process means that workers do not need to have superb operating skills, which reduces the technical requirements for operators and improves the convenience of operation.

[0013] 2. This mobile automatic rinsing device for semiconductor component surface treatment features a robotic arm that slides stably on a fixed frame. The T-side rinsing robotic arm has an adjustable angle and, in conjunction with high-pressure water nozzles and air-cutting nozzles, can perform all-round, thorough rinsing and drying of semiconductor components. Compared to manual operation, which is prone to uneven cleaning due to skill level, this device ensures that each product receives a consistent cleaning effect, effectively improving cleaning quality, guaranteeing product consistency, and providing more reliable components for subsequent production processes. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the installation of the fixed frame structure of this utility model;

[0016] Figure 3 This is a schematic diagram of the T-side flushing robotic arm structure installation of this utility model;

[0017] Figure 4 This is a schematic diagram of the installation of the straight-edge rinsing robotic arm structure of this utility model.

[0018] In the diagram: 1. T-shaped groove; 2. Fixed frame; 3. T-sided robotic arm; 4. Tank chain; 5. Part to be cleaned; 6. Straight-sided robotic arm; 7. Folding drive cylinder; 8. Folding robotic arm; 9. High-pressure water nozzle; 10. Air cutter nozzle; 11. Servo motor; 12. Drive gear; 13. Slider mounting plate; 14. Linear slider; 15. Reaction force support rod. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4 A mobile automatic rinsing device for surface treatment of semiconductor components includes a T-shaped trough 1 and a component 5 to be cleaned. The component 5 is provided at one end of the opening inside the T-shaped trough 1. The component 5 is connected to the hanging rod of a crane on one side outside the T-shaped trough 1. A fixed frame structure is provided on the outside of the T-shaped trough 1. The fixed frame structure is close to the opening of the T-shaped trough 1. Multiple sets of T-side rinsing robotic arms are provided on the fixed frame structure, which is located on one side of the T-shaped trough 1. Multiple sets of straight-side rinsing robotic arms are also provided on the fixed frame structure, which is located on one side of the T-shaped trough 1.

[0021] Furthermore, the fixed frame structure includes a fixed frame 2, a slider mounting plate 13, and linear sliders 14. The fixed frame 2 is installed on the side of the T-shaped groove 1, and the fixed frame 2 is around the side of the T-shaped groove 1. The fixed frame 2 is close to the opening of the T-shaped groove 1. Four linear sliders 14 distributed in a rectangular shape are fixedly connected to one side of the slider mounting plate 13. The linear sliders 14 are slidably connected to the slide bars on the fixed frame 2. Multiple slider mounting plates 13 are slidably connected to the fixed frame 2. The fixed frame 2 is the slide rail of the fixed frame structure. The slider mounting plate 13 is used to connect the fixed frame 2 and the T-shaped side-washing robotic arm structure. The linear sliders 14 are used for the slider mounting plates 13 to slide on the fixed frame 2.

[0022] Furthermore, the fixed frame structure also includes a servo motor 11, a drive gear 12, and a tank chain 4. The servo motor 11 is mounted on the side of the slider mounting plate 13 facing away from the linear slider 14. The drive gear 12 is rotatably connected to the side of the slider mounting plate 13 connected to the linear slider 14 via a rotating shaft. The rotating shaft of the drive gear 12 passes through the slider mounting plate 13. The output shaft of the servo motor 11 is connected to the rotating shaft of the drive gear 12 via a transmission reversing mechanism. The drive gear 12 is frictionally connected to the synchronous belt of the fixed frame 2. The tank chain 4 is mounted on the fixed frame 2, and the wiring of the drive gear 12 is installed inside the tank chain 4. The servo motor 11 is used to provide the force for the T-side rinsing robotic arm structure and the sliding of the side rinsing robotic arm structure on the fixed frame 2. The drive gear 12 is used to drive the servo motor 11 and the fixed frame 2. The tank chain 4 is used for wiring.

[0023] Furthermore, the straight-edge rinsing robotic arm structure includes a straight-edge robotic arm 6, a high-pressure water nozzle 9, and an air-cutting nozzle 10. The straight-edge robotic arm 6 is a C-shaped square tube structure. The inner side of one of the folded edges of the straight-edge robotic arm 6 is fixedly connected to the side of the slider mounting plate 13 facing away from the drive gear 12. The middle folded edge of the straight-edge robotic arm 6 is above the opening of the T-shaped groove 1. The symmetrical folded edge of the straight-edge robotic arm 6 and the slider mounting plate 13 is inside the T-shaped groove 1. The high-pressure water nozzle 9 and the air-cutting nozzle 10 are installed on one folded edge of the straight-edge robotic arm 6 inside the T-shaped groove 1. The high-pressure water nozzle 9 and the air-cutting nozzle 10 face the part to be cleaned 5. The straight-edge robotic arm 6 is used to install the high-pressure water nozzle 9 and the air-cutting nozzle 10. After cleaning the part to be cleaned 5, the high-pressure water nozzle 9 and the air-cutting nozzle 10 blow dry the part to be cleaned 5. The straight-edge robotic arm 6 slides on the fixed frame 2 to thoroughly clean the part to be cleaned 5.

[0024] Furthermore, the T-side rinsing robotic arm structure includes a T-side robotic arm 3, a folding drive cylinder 7, a folding robotic arm 8, a high-pressure water nozzle 9, and an air cutter nozzle 10. The T-side robotic arm 3 is a C-shaped square tube structure. The inner side of one of the folded edges of the T-side robotic arm 3 is fixedly connected to the side of the slider mounting plate 13 opposite to the drive gear 12. The middle folded edge of the T-side robotic arm 3 is above the opening of the T-shaped groove 1. A folded edge of the T-side robotic arm 3 symmetrical to the slider mounting plate 13 is inside the T-shaped groove 1. A folding drive cylinder 7 is mounted on one of the folded edges of the T-side robotic arm 3 inside the T-shaped groove 1 via a hinge seat. The lug of the cylinder 7 body is hinged to the hinge seat on the T-side robotic arm 3. The T-side robotic arm 3 is rotatably connected to one end of a folded edge in the T-shaped groove 1 with a folding robotic arm 8. The lug of the piston rod of the folding drive cylinder 7 is rotatably connected to the folding robotic arm 8. The folding robotic arm 8 is equipped with a high-pressure water nozzle 9 and an air cutter nozzle 10. The high-pressure water nozzle 9 and the air cutter nozzle 10 face the part to be cleaned 5. The T-side robotic arm 3 is used to install the folding robotic arm 8. The folding drive cylinder 7 makes the angle between the folding robotic arm 8 and the T-side robotic arm 3 adjustable. The high-pressure water nozzle 9 and the air cutter nozzle 10 swing to thoroughly clean the part to be cleaned 5.

[0025] Furthermore, the straight-edged robotic arm 6 has a reaction force support rod 15 installed on one folded edge of the T-shaped groove 1, facing away from the high-pressure water nozzle 9. The reaction force support rod 15 is in contact with the inner wall of the T-shaped groove 1. The folded robotic arm 8 has another reaction force support rod 15 installed facing away from the high-pressure water nozzle 9. The reaction force support rod 15 is in contact with the inner wall of the T-shaped groove 1. The reaction force support rod 15 is used to support the high-pressure water nozzle 9 and the air cutter nozzle 10 on the T-shaped groove 1, so that the high-pressure water nozzle 9 and the air cutter nozzle 10 are stable when working.

[0026] Structural Description:

[0027] T-shaped trough 1: T-shaped, used to accommodate the parts to be cleaned 5 and provide operating space for cleaning and drying;

[0028] Fixed frame 2: Installed on the side of T-shaped groove 1, serving as a slide rail to support the sliding of slider mounting plate 13 and robotic arm structure;

[0029] T-edge robotic arm 3: C-shaped square tube structure, used to install folding robotic arm 8, the angle is adjusted by folding drive cylinder 7 to realize the rinsing and drying of the T-edge part of the workpiece in T-shaped groove 1;

[0030] Tank chain 4: Installed on the fixed frame 2, it is used to organize and protect the wiring of the drive gear 12 to prevent the wires from getting tangled;

[0031] Item 5 to be cleaned: Placed in T-shaped trough 1 and connected by overhead crane rod for cleaning and drying;

[0032] Straight-edge robotic arm 6: C-shaped square tube structure, used to install high-pressure water nozzle 9 and air cutter nozzle 10, moves along the straight edge of T-shaped groove 1 to perform rinsing and drying;

[0033] Folding drive cylinder 7: Installed on the T-side robotic arm 3, it drives the folding robotic arm 8 through the piston rod and adjusts its angle with the T-side robotic arm 3;

[0034] Folding robotic arm 8: Installed on the T-side robotic arm 3, the angle is adjusted by the folding drive cylinder 7, and high-pressure water nozzle 9 and air cutting nozzle 10 are installed for rinsing and drying.

[0035] High-pressure water nozzle 9: Installed on the straight-edged robotic arm 6 and the folding robotic arm 8, it is used to spray high-pressure water to clean the workpiece surface and the deposits in the machined holes;

[0036] Air nozzle 10: Installed on the straight-edge robotic arm 6 and the folding robotic arm 8, it is used to spray dry and clean compressed air to quickly dry the water stains on the surface of the workpiece.

[0037] Servo motor 11: mounted on slider mounting plate 13, drives drive gear 12 through transmission reversing mechanism, providing power for the sliding of the robotic arm structure;

[0038] Drive gear 12: It is connected to servo motor 11 via a rotating shaft and frictionally connected to the synchronous belt of fixed frame 2 to transmit power;

[0039] Slider mounting plate 13: connects the fixed frame 2 and the robotic arm structure, and slides on the fixed frame 2 via linear slider 14;

[0040] Linear slider 14: It is installed on the slider mounting plate 13 and is slidably connected to the slide bar on the fixed frame 2 to realize the sliding of the slider mounting plate 13;

[0041] Reaction force support rod 15: Installed on the straight-edged robotic arm 6 and the folding robotic arm 8, it fits against the inner wall of the T-shaped groove 1, supports the high-pressure water nozzle 9 and the air cutter nozzle 10, and ensures working stability.

[0042] Working Principle: The operator manually lowers the overhead crane to hoist the part to be cleaned (5) into the T-shaped tank (1), ensuring the upper edge of the part is slightly below the high-pressure rinsing nozzle. Then, the operator selects the appropriate cleaning program based on the product width on the system panel, choosing either the high-pressure rinsing mode or the liquid cutting mode. Pressing the program start button on the control panel initiates operation. Upon pressing the start button, the servo motor (11) in the fixed frame structure begins operation. The output shaft of the servo motor (11) drives the drive gear (12) to rotate via a transmission reversing mechanism. The drive gear (12) rubs against the synchronous belt on the fixed frame (2), providing power to the slider mounting plate (13), allowing it to slide along the slide bar on the fixed frame (2) using the sliding action of the linear slider (14). As the sliding block mounting plate 13 connects to both the T-side and straight-side flushing robotic arm structures, it drives these two robotic arms to slide on the fixed frame 2. The tank chain 4 is responsible for organizing and protecting the wiring of the drive gear 12, ensuring orderly wiring and preventing tangling that could affect equipment operation. The straight-side flushing robotic arm 6 slides along the straight edge of the T-shaped groove 1 as the sliding block mounting plate 13 slides on the fixed frame 2. The high-pressure water nozzle 9 mounted on the straight-side robotic arm 6 sprays high-pressure water onto the workpiece 5 during movement, rinsing the surface of the workpiece and the deposits inside the machined holes. After rinsing, the air cutter nozzle 10 starts working, using dry, clean compressed air to quickly dry the water stains on the workpiece surface. The straight-side robotic arm 6 moves along the T-shaped groove... The reaction force support rod 15 installed on one folded edge of the body 1, away from the high-pressure water nozzle 9, fits tightly against the inner wall of the T-shaped groove 1, effectively supporting the high-pressure water nozzle 9 and the air cutter nozzle 10, ensuring their stability during operation, preventing shaking caused by the reaction force of the high-pressure water jet, and thus ensuring the uniformity and stability of the rinsing and drying effect. The T-side rinsing robotic arm 3 also slides along the fixed frame 2 under the drive of the slider mounting plate 13. When the cleaning program starts, the folding drive cylinder 7 on the T-side robotic arm 3 is released, driving the folding robotic arm 8 to rotate around the rotation connection point with the T-side robotic arm 3, causing a change in the angle between the folding robotic arm 8 and the T-side robotic arm 3. The high-pressure water nozzle 9 and the air cutter nozzle 10 installed on the folding robotic arm 8 then swing accordingly, affecting the... The T-side of the workpiece inside the T-shaped trough 1 is thoroughly rinsed and dried. A reaction force support rod 15, installed on the folding robotic arm 8 away from the high-pressure water nozzle 9, fits against the inner wall of the T-shaped trough 1, providing stable support and ensuring the stability of the high-pressure water nozzle 9 and the air cutter nozzle 10 during operation. After the cleaning or drying process is completed, the folding drive cylinder 7 drives the folding robotic arm 8 to automatically retract, and the servo system of the T-side robotic arm 3 automatically returns to its origin. This allows for manual remote control of the overhead crane to move the product to the side for inspection to ensure it is clean. During the operation of the straight-edge rinsing robotic arm 6 and the T-side rinsing robotic arm 3, the overhead crane is raised a short distance after each round trip of the robotic arm, repeating this cycle until the entire workpiece is rinsed and dried.The process involves cleaning and drying the surfaces of semiconductor components to achieve the goals of cleaning the workpiece surface, removing deposits and impurities, ensuring product surface cleanliness, and preventing impact on subsequent packaging.

[0043] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A mobile automatic rinsing device for surface treatment of semiconductor components, comprising a T-shaped trough (1) and a component to be cleaned (5), wherein the component to be cleaned (5) is provided at one end of the opening inside the T-shaped trough (1), and the component to be cleaned (5) is connected to a hanging rod of an overhead crane on one side outside the T-shaped trough (1), characterized in that: The T-shaped trough (1) is provided with a fixed frame structure on the outside. The fixed frame structure is close to the opening of the T-shaped trough (1). The fixed frame structure is provided with multiple sets of T-side rinsing robotic arm structures. The T-side rinsing robotic arm structures are on one side of the T-shaped trough (1). The fixed frame structure is provided with multiple sets of straight-side rinsing robotic arm structures. The straight-side rinsing robotic arm structures are on one side of the T-shaped trough (1).

2. The mobile automatic rinsing device for surface treatment of semiconductor components according to claim 1, characterized in that: The fixed frame structure includes a fixed frame (2), a slider mounting plate (13), and linear sliders (14). The fixed frame (2) is installed on the side of the T-shaped groove (1). The fixed frame (2) is around the side of the T-shaped groove (1). The fixed frame (2) is close to the opening of the T-shaped groove (1). Four linear sliders (14) in a rectangular distribution are fixedly connected to one side of the slider mounting plate (13). The linear sliders (14) are slidably connected to the sliders on the fixed frame (2). Multiple slider mounting plates (13) are slidably connected to the fixed frame (2).

3. The mobile automatic rinsing device for surface treatment of semiconductor components according to claim 2, characterized in that: The fixed frame structure also includes a servo motor (11), a drive gear (12), and a tank chain (4). The servo motor (11) is installed on the side of the slider mounting plate (13) away from the linear slider (14). The drive gear (12) is rotatably connected to the side of the slider mounting plate (13) connected to the linear slider (14) via a rotating shaft. The rotating shaft of the drive gear (12) passes through the slider mounting plate (13). The output shaft of the servo motor (11) is connected to the rotating shaft of the drive gear (12) via a transmission reversing mechanism. The drive gear (12) is frictionally connected to the synchronous belt of the fixed frame (2). The tank chain (4) is installed on the fixed frame (2). The wiring of the drive gear (12) is installed inside the tank chain (4).

4. The mobile automatic rinsing device for surface treatment of semiconductor components according to claim 3, characterized in that: The straight-edge rinsing robotic arm structure includes a straight-edge robotic arm (6), a high-pressure water nozzle (9), and an air-cutting nozzle (10). The straight-edge robotic arm (6) is a C-shaped square tube structure. The inner side of one of the folded edges of the straight-edge robotic arm (6) is fixedly connected to the side of the slider mounting plate (13) away from the drive gear (12). The middle folded edge of the straight-edge robotic arm (6) is above the opening of the T-shaped groove (1). The symmetrical folded edge of the straight-edge robotic arm (6) and the slider mounting plate (13) is inside the T-shaped groove (1). The high-pressure water nozzle (9) and the air-cutting nozzle (10) are installed on one folded edge of the straight-edge robotic arm (6) inside the T-shaped groove (1). The high-pressure water nozzle (9) and the air-cutting nozzle (10) face the part to be cleaned (5).

5. A mobile automatic rinsing device for surface treatment of semiconductor components according to claim 3, characterized in that: The T-side flushing robotic arm structure includes a T-side robotic arm (3), a folding drive cylinder (7), a folding robotic arm (8), a high-pressure water nozzle (9), and an air cutter nozzle (10). The T-side robotic arm (3) is a C-shaped square tube structure. The inner side of one of the folded edges of the T-side robotic arm (3) is fixedly connected to the side of the slider mounting plate (13) facing away from the drive gear (12). The middle folded edge of the T-side robotic arm (3) is above the opening of the T-shaped groove (1). The symmetrical folded edge of the T-side robotic arm (3) and the slider mounting plate (13) is inside the T-shaped groove (1). (3) A folding drive cylinder (7) is installed on one of the folded edges in the T-shaped groove (1) via a hinge seat. The lug of the main body of the folding drive cylinder (7) is hinged to the hinge seat on the T-side robotic arm (3). The T-side robotic arm (3) is rotatably connected to one end of one of the folded edges in the T-shaped groove (1) by a folding robotic arm (8). The lug of the piston rod of the folding drive cylinder (7) is rotatably connected to the folding robotic arm (8). A high-pressure water nozzle (9) and a wind-cutting nozzle (10) are installed on the folding robotic arm (8). The high-pressure water nozzle (9) and the wind-cutting nozzle (10) face the part to be cleaned (5).

6. A mobile automatic rinsing device for surface treatment of semiconductor components according to claim 4, characterized in that: The straight-edged robotic arm (6) has a reaction force support rod (15) installed on one folded edge inside the T-shaped groove (1) away from the high-pressure water nozzle (9), and the reaction force support rod (15) is in contact with the inner wall of the T-shaped groove (1).

7. The mobile automatic rinsing device for surface treatment of semiconductor components according to claim 5, characterized in that: The folding robotic arm (8) is mounted with another reaction force support rod (15) away from the high-pressure water nozzle (9), and the reaction force support rod (15) is in contact with the inner wall of the T-shaped groove (1).