Electromagnetic coupling chip package and electromagnetic coupling amplification system

Abstract

This application relates to an electromagnetically coupled chip package and an electromagnetically coupled amplification system, belonging to the field of semiconductor packaging technology. The electromagnetically coupled chip package includes: an inductor coil, a chip, and a package housing. The inductor coil includes a first connection terminal and a second connection terminal; the chip includes a first signal terminal and a second signal terminal, the first signal terminal being electrically connected to the first connection terminal, and the second signal terminal being electrically connected to the second connection terminal; the inductor coil is used to supply power to the chip, and the chip is used to output communication signals through the inductor coil; the package housing encloses the inductor coil and the chip. The inductor coil of this application, as an energy transmission medium, can replace traditional chip pins to realize communication between the chip and external circuits. It eliminates the need for chip pins on the package housing, removes connection nodes of external chip pins, improves the structural reliability of the electromagnetically coupled chip package under dynamic environments such as bending and stretching of flexible circuits, reduces circuit system failures, and ensures normal operation and safety of the equipment.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to an electromagnetic coupling chip package and an electromagnetic coupling amplification system. Background Technology

[0002] With the development of technology, electronic circuits with different functions have shown strong momentum in many fields. For example, in the field of wearable devices, such as smart bracelets, watches, and even gloves, these products need to be highly flexible to comfortably conform to the human body and achieve long-term wear without affecting the user's daily activities. In implantable applications, such as implantable pacemakers and neurostimulators, there are also extremely high requirements for the flexibility of circuits, because they need to work stably in the complex and dynamic environment inside the human body, and flexible circuits can better adapt to the shape and movement changes of human tissue. In the field of tag recognition, such as clothing tags, book tags, and logistics tags, these need to be embedded in fabric or paper, and will also cause certain deformations during use. However, in these applications, there is a significant contradiction between flexibility and reliability.

[0003] In traditional electronic circuits, chip pin connection nodes formed by soldering, wire bonding, or reverse sealing are the most vulnerable parts of the entire circuit module. With the frequent bending and stretching of wearable devices, the physiological effects of implanted devices inside the body, and the bending of tags during use, chip pin connection nodes are highly susceptible to breakage and loosening, leading to malfunctions in the entire circuit system and severely impacting the normal operation and safety of the device. Utility Model Content

[0004] Therefore, it is necessary to provide an electromagnetic coupling chip package and electromagnetic coupling amplification system that can reduce circuit system failures in response to the above-mentioned technical problems.

[0005] In a first aspect, this application proposes an electromagnetically coupled chip package, comprising: an inductor coil, the inductor coil including a first connection terminal and a second connection terminal; a chip, the chip including a first signal terminal and a second signal terminal, the first signal terminal being electrically connected to the first connection terminal and the second signal terminal being electrically connected to the second connection terminal; the inductor coil being used to supply power to the chip, and the chip being used to output communication signals through the inductor coil; and a package housing, the package housing enclosing the inductor coil and the chip.

[0006] In one embodiment, the electromagnetic coupling chip package further includes a magnetic core disposed in the inductor coil, and the package housing encloses the magnetic core.

[0007] In one embodiment, the electromagnetic coupling chip package further includes: the magnetic core is configured as a rectangle, a circle, or a ring, and the material of the magnetic core is a soft magnetic ferrite, a ferrite, or a nanocrystalline alloy.

[0008] In one embodiment, the electromagnetic coupling chip package further includes: a first bonding lead and a second bonding lead, wherein the first bonding lead is connected to the first signal terminal and the first connection terminal respectively, and the second bonding lead is connected to the second signal terminal and the second connection terminal respectively.

[0009] In one embodiment, the inductor coil has an opening, and the chip is disposed at the opening.

[0010] In one embodiment, the encapsulation housing is rectangular, the length of the encapsulation housing is less than or equal to 5 mm, the width of the encapsulation housing is less than or equal to 5 mm, and the thickness of the encapsulation housing is less than or equal to 1 mm.

[0011] In one embodiment, the material of the encapsulation housing is ceramic or high-frequency plastic.

[0012] Secondly, this application also proposes an electromagnetic coupling amplification system, comprising: the electromagnetic coupling chip package and the coupling line described in the first aspect embodiment above, wherein the electromagnetic coupling chip package and the coupling line are both disposed on a substrate, the coupling line is spaced at a preset distance from the electromagnetic coupling chip package, the coupling line is used to supply power to the chip of the electromagnetic coupling chip package through the inductor coil of the electromagnetic coupling chip package, and the chip is used to output communication signals through the inductor coil and the coupling line.

[0013] In one embodiment, the preset distance is less than or equal to 1 centimeter.

[0014] In one embodiment, the length of the coupling line is 12 to 17 centimeters.

[0015] The aforementioned electromagnetic coupling chip package and electromagnetic coupling amplification system encapsulates the inductor coil and chip within a package housing, electrically connecting the chip's signal terminal to the inductor coil's connection terminal. This utilizes the electromagnetic coupling effect of the inductor coil to power the chip, enabling the chip to output communication signals. The inductor coil in this application, acting as an energy transfer medium, can replace traditional chip pins to achieve signal interaction between the chip and external circuits. It eliminates the need for chip pins on the package housing, completely removing the connection nodes of traditional external chip pins. This improves the structural reliability of the electromagnetic coupling chip package under dynamic environments such as bending and stretching, reduces circuit system failures, and ensures normal equipment operation and safety. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of an electromagnetic coupling chip package in one embodiment;

[0018] Figure 2 This is a schematic diagram of an electromagnetic coupling chip package with a rectangular magnetic core in one embodiment;

[0019] Figure 3 This is a schematic diagram of an electromagnetic coupling chip package with a circular magnetic core in one embodiment;

[0020] Figure 4 This is a schematic diagram of an electromagnetic coupling chip package having a first bonding lead in one embodiment;

[0021] Figure 5 This is a schematic diagram of an electromagnetic coupling chip package with a second bonding lead in one embodiment;

[0022] Figure 6 This is a schematic diagram of an electromagnetic coupling amplification system in one embodiment;

[0023] Figure 7 This is a schematic diagram of an electromagnetic coupling amplification system in another embodiment;

[0024] Explanation of reference numerals in the attached figures:

[0025] Inductor coil 110, chip 120, package housing 130, magnetic core 140, first connection terminal 111, second connection terminal 112, first signal terminal 121, second signal terminal 122, first bonding lead 151, second bonding lead 152, coupling line 210. Detailed Implementation

[0026] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0028] It is understood that the terms “first,” “second,” etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another.

[0029] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. Furthermore, in the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if there is an exchange of electrical signals or data between the connected objects.

[0030] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0031] As described in the background section, in traditional flexible electronic device integration, chip pins and external circuits rely on soldering, wire bonding, or flip-chip bonding to form physical connection nodes. However, such connection structures are prone to microcrack propagation under dynamic mechanical stress, leading to fracture of the intermetallic connection layer or interface delamination. When flexible electronic devices are subjected to high-frequency bending or tensile deformation environments, the stress concentration effect at the connection nodes is significantly aggravated, easily causing sudden changes in impedance or even complete interruption of the electrical signal transmission path, thereby affecting the continuous operation stability and service life of the circuit device. For example, in the flexible circuit system of an implantable neurostimulator, multiple signal processing chips are integrated on a multilayer stacked polyimide substrate. After implantation, the device needs to adapt to the periodic bending deformation caused by muscle contraction, thus subjecting the connection interface between the solder ball array of the flip-chip and the substrate pads to alternating shear stress. After approximately 10 5After repeated bending with an amplitude of 0.5 mm, tin whisker growth and interface metal layer cracking occur at the solder joint, ultimately leading to an amplitude attenuation of more than 30% in the nerve stimulation signal. This situation will cause the implanted device to fail before its intended lifespan, potentially leading to medical risks such as treatment interruption or erroneous signal output. Furthermore, implanted devices often require a second surgery for replacement after failure, significantly increasing the incidence of patient complications and medical costs. In the field of tag identification, RFID (Radio Frequency Identification) chips are soldered to external coils and jointly mounted on flexible substrates (such as fabric, paper, etc.). During use, users may fold or bend the device, causing the RFID chip to detach from the external coil and damaging the tag identification function.

[0032] Based on the above reasons, this application provides an electromagnetic coupling chip packaging and electromagnetic coupling amplification system to improve the structural reliability of electromagnetic coupling chip packaging under dynamic environments such as bending and stretching of flexible circuits, reduce circuit system failures, and ensure the normal use and safety of equipment.

[0033] In one embodiment, such as Figure 1 As shown, an electromagnetic coupling chip package is provided, including: an inductor coil 110, a chip 120, and a package housing 130. The inductor coil 110 includes a first connection terminal 111 and a second connection terminal 112; the chip 120 includes a first signal terminal 121 and a second signal terminal 122, the first signal terminal 121 being electrically connected to the first connection terminal 111, and the second signal terminal 122 being electrically connected to the second connection terminal 112; the inductor coil 110 is used to supply power to the chip 120, and the chip 120 is used to output communication signals through the inductor coil 110; the package housing 130 encloses the inductor coil 110 and the chip 120.

[0034] Specifically, inductor coil 110 refers to a conductive structure used to generate electromagnetic induction, which can be implemented using metal wires to form a ring or spiral structure. The two ports of inductor coil 110 connecting to chip 120 to form a loop are the first connection terminal 111 and the second connection terminal 112. The first connection terminal 111 of inductor coil 110 is electrically connected to the first signal terminal 121 of chip 120, and the second connection terminal 112 of inductor coil 110 is electrically connected to the second signal terminal 122 of chip 120. Inductor coil 110 is used to supply power to chip 120 through the two connection terminals, and chip 120 is used to transmit electrical signals to inductor coil 110 through the two signal terminals to output communication signals and realize information transmission. Inductor coil 110 can be manufactured using electroplating or laser direct forming (LDS) technology. It is understood that the connection terminals of inductor coil 110 and the signal terminals of chip 120 can be directly or indirectly connected. In some embodiments, such as... Figure 1 As shown, when making the inductor coil 110, the chip 120 can be placed in advance so that the connection end of the formed inductor coil 110 can be directly connected to the signal end of the chip 120.

[0035] Chip 120 refers to the smallest functional unit cut from a wafer, also called a die, which is a semiconductor device integrating signal processing functions. The first signal terminal 121 and the second signal terminal 122 of chip 120 are metallized areas on the surface of chip 120, used to extract electrical signals and connect to external systems. The first signal terminal 121 and the second signal terminal 122 of chip 120 are directly electrically connected to the two connection terminals of inductor coil 110 to transmit electrical signals. In some embodiments, chip 120 has RFID (Radio Frequency Identification) functionality. For example, chip 120 has at least one of the following: low frequency (LF) tag frequency standards (such as ISO / IEC 18000-2), high frequency (HF) tag frequency standards (ISO / IEC 14443, ISO / IEC 15693), and ultra-high frequency (UHF) tag frequency standards (ISO / IEC 18000-6). In some embodiments, chip 120 only has the UHF tag frequency standard (ISO / IEC 18000-6).

[0036] The encapsulation housing 130 refers to the encapsulation structure that wraps around and protects the internal components (inductor coil 110 and chip 120). In some embodiments, the encapsulation housing 130 is made of ceramic (such as alumina, aluminum nitride, silicon carbide, etc.) or high-frequency plastic (such as polytetrafluoroethylene, liquid crystal polymer, modified polyphenylene ether, etc.), which can be formed by injection molding or sintering processes.

[0037] In the electromagnetic coupling chip package of this application, an inductor coil 110 is used as the energy transmission medium, which can replace traditional wires to realize signal interaction between the chip 120 and the external circuit. The package housing 130 protects internal components and maintains structural stability. This electromagnetic coupling chip package structure eliminates the physical connection nodes between the chip 120 pins and the external circuit in traditional solutions, avoiding the problem of connection node failure under dynamic stress. When applied to flexible scenarios, it improves the reliability and stability of the electromagnetic coupling chip package under frequent bending and stretching, significantly extends the service life of the electromagnetic coupling chip package, reduces the risk of functional abnormalities due to connection failure, and ensures normal use and safety of the device. For example, when the electromagnetic coupling chip package is used for RFID tag identification, the chip 120 has RFID functionality. Since the package housing 130 encapsulates the inductor coil 110 and the chip 120 into a single structure, the user's bending and stretching actions will not affect the electromagnetic coupling chip package. Existing structures that weld RFID chips to coils and embed them in fabric or paper are prone to breakage at the welding points of the RFID chip under the action of user folding, stretching, or other actions, resulting in functional failure.

[0038] In one embodiment, such as Figure 2 As shown, the electromagnetic coupling chip package also includes a magnetic core 140, which is disposed in the inductor coil 110, and the package housing 130 encloses the magnetic core 140.

[0039] Specifically, the magnetic core 140 refers to a magnetically conductive structure disposed within the inductor coil 110 to enhance the magnetic field coupling efficiency. It improves the energy transfer efficiency of the inductor coil 110 by concentrating magnetic field lines. In some embodiments, the material of the magnetic core 140 is one of soft magnetic ferrite (such as nickel-zinc ferrite, manganese-zinc ferrite, etc.), ferrite, or nanocrystalline alloy (iron-based nanocrystalline alloy, etc.). Soft magnetic ferrite is suitable for high-frequency applications due to its high resistivity, which reduces eddy current losses. Ferrite has high permeability and temperature stability, making it suitable for medium- and high-frequency environments. Nanocrystalline alloys achieve high permeability and low coercivity through a nanoscale grain structure, making them suitable for miniaturized packaging. The material of the magnetic core 140 can be determined by the operating frequency range of the chip 120. When the operating frequency is above 1MHz, using soft magnetic ferrite can reduce the loss of the magnetic core 140; in the 500kHz to 1MHz range, ferrite can control material costs while maintaining magnetic flux density; when the package thickness is compressed to below 0.8mm, the thin strip stacked structure of nanocrystalline alloy can reduce the volume of the magnetic core 140 by 40%. By matching the material's permeability with the inductance parameters, the magnetic core 140 forms a uniform magnetic field distribution inside the package housing 130, so that the current change at the signal terminal of the chip 120 generates stable electromagnetic coupling through the inductor coil 110, avoiding magnetic saturation under high-frequency operating conditions.

[0040] In some embodiments, the magnetic core 140 is configured as a rectangle, a circle, or a ring. The shape of the magnetic core 140 affects the magnetic field distribution efficiency and structural reliability. By configuring the magnetic core 140 as a regular structure, the magnetic field on the magnetic core 140 is uniformly distributed, and the fabrication of the magnetic core 140 is facilitated. Specific examples include... Figure 2 As shown, the magnetic core 140 is rectangular, and correspondingly, the inductor coil 110 surrounding the magnetic core 140 is also a ring-shaped rectangle, and the package housing 130 is also rectangular. Figure 3 As shown, the magnetic core 140 is circular, and correspondingly, the inductor coil 110 surrounding the magnetic core 140 is also circular in an annular shape, and the package housing 130 is also circular.

[0041] In one embodiment, such as Figure 4 As shown, the electromagnetic coupling chip package also includes: a first bonding lead 151, which is connected to a first signal terminal 121 and a first connection terminal 111 respectively, and a second signal terminal 122 is directly connected to a second connection terminal 112.

[0042] Specifically, in this embodiment, a first bonding lead 151 is additionally provided to indirectly connect the first signal terminal 121 and the first connection terminal 111. The first bonding lead 151 is made of a metallic material, such as gold wire, aluminum wire, or copper wire. One end of the first bonding lead 151 is connected to the first signal terminal 121 of the chip 120, and the other end is connected to the first connection terminal 111 of the inductor coil 110 via hot pressing, ultrasonic bonding, or thermosonic bonding processes. Protective adhesive can be applied to the solder joints of the first bonding lead 151 to enhance connection strength and durability. The wire diameter of the first bonding lead 151 is between 20 and 50 micrometers, and the arc height of the first bonding lead 151 is maintained between 100 and 300 micrometers, forming a suspended structure to alleviate external stress. The length of the first bonding lead 151 can be adjusted according to the relative position of the chip 120 and the inductor coil 110, typically between 0.5 and 2 millimeters. This embodiment uses a first bonding lead 151 to electrically connect the first signal terminal 121 and the first connection terminal 111. This process is more mature and simpler. Furthermore, when the package housing 130 is bent or stretched, the arc-shaped structure of the bonding lead can absorb some stress through deformation, preventing stress concentration at the solder joint. Simultaneously, the high ductility of the metal material allows the first bonding lead 151 to maintain electrical continuity after repeated deformation, resulting in higher fatigue resistance in the connection between the chip 120 and the inductor coil 110 under dynamic conditions, thereby improving the overall reliability of the package.

[0043] In one embodiment, such as Figure 5As shown, the electromagnetic coupling chip package also includes: a first bonding lead 151 and a second bonding lead 152. The first bonding lead 151 is connected to the first signal terminal 121 and the first connection terminal 111, respectively, and the second bonding lead 152 is connected to the second signal terminal 122 and the second connection terminal 112, respectively.

[0044] Specifically, in this embodiment, the electromagnetic coupling chip package is provided with a first bonding lead 151 and a second bonding lead 152. The second bonding lead 152 adopts a topology symmetrical to the first bonding lead 151, and is indirectly connected to the second signal terminal 122 and the second connection terminal 112 respectively. The second bonding lead 152 is made of a metal material, such as gold wire, aluminum wire, or copper wire. One end of the second bonding lead 152 is connected to the second signal terminal 122 of the chip 120, and the other end is connected to the second connection terminal 112 of the inductor coil 110 through hot pressing, ultrasonic, or thermosonic bonding processes. Protective adhesive can be applied to the solder joints of the second bonding lead 152 to enhance connection strength and durability. The wire diameter of the second bonding lead 152 is between 20 micrometers and 50 micrometers, and the arc height of the second bonding lead 152 is maintained between 100 micrometers and 300 micrometers, forming a suspended structure to alleviate external stress. The length of the second bonding lead 152 can be adjusted according to the relative position of the chip 120 and the inductor coil 110, and is typically set between 0.5 mm and 2 mm. This embodiment uses the first bonding lead 151 and the second bonding lead 152 to electrically connect the inductor coil 110 to the chip 120. This process is more mature and simpler. Furthermore, when the package housing 130 is bent or stretched, the arc-shaped structure of the bonding lead can absorb some stress through deformation, preventing stress concentration at the solder joint. Simultaneously, the high ductility of the metal material allows the first bonding lead 151 and the second bonding lead 152 to maintain electrical continuity after repeated deformation, giving the connection between the chip 120 and the inductor coil 110 higher fatigue resistance in dynamic environments, thereby further improving the overall reliability of the package.

[0045] In one embodiment, such as Figure 5 As shown, an opening is provided on the inductor coil 110, and the chip 120 is disposed at the opening.

[0046] Specifically, the outline of the inductor coil 110 forms a closed loop, and an opening is provided on one side of the loop, which is a gap not occupied by the inductor coil 110. The chip 120 is fixed at the opening, maintaining a certain distance or overlap with the edge of the opening of the inductor coil 110. By embedding the chip 120 into the opening area of ​​the inductor coil 110, the space occupied by the chip 120 and the coil on the plane is reduced, optimizing the package structure layout. In some embodiments, when the inductor coil 110 is set as a ring-shaped rectangle, the long side of the coil rectangle is parallel to the length direction of the chip 120, and the size of the opening area matches the planar size of the chip 120. In some other embodiments, the inductor coil 110 can also be set as a square, circle, spiral, etc. with an opening. In this embodiment, the opening design of the inductor coil 110 allows the chip 120 to be directly embedded in the inductor coil 110, avoiding the side-by-side arrangement of the chip 120 and the inductor coil 110 in the horizontal or vertical direction. Space reuse is achieved through structural nesting, making the package volume more compact and meeting the requirements for package miniaturization.

[0047] In some embodiments, such as Figure 5 As shown, when the magnetic core 140 is rectangular, the inductor coil 110 is also rectangular with an opening. The close fit between the magnetic core 140 and the inductor coil 110 improves electromagnetic coupling efficiency, and the rectangular magnetic core 140 fully utilizes the internal space of the inductor coil 110, maximizing the magnetic field strength. In this case, the long side of the rectangular magnetic core 140 is parallel to the long side of the inductor coil 110, effectively reducing leakage loss of magnetic field lines at corners. The rectangular magnetic core 140 forms a symmetrical magnetic circuit through its four straight sides, with each side maintaining a right-angle structure. When the encapsulation housing 130 is bent by external force, the stress at the right-angle locations is evenly distributed and transmitted through the four sides. In some other embodiments, the connection points of adjacent sides can also be rounded. The distance between the edge of the magnetic core 140 and the inner wall of the inductor coil 110 is set to 0.05 mm to 0.1 mm. In some other embodiments, the distance between the edge of the magnetic core 140 and the inner wall of the inductor coil 110 can also be greater than 0.1 mm or less than 0.05 mm. In one embodiment, the distance between the edge of the magnetic core 140 and the inner wall of the inductor coil 110 can be set to 0.06 mm, 0.07 mm, 0.075 mm, 0.08 mm, 0.09 mm, etc. It is understood that the magnetic core 140 in this embodiment is a thin-film structure, which can be manufactured using different processes depending on the material of the magnetic core 140. For example, when the magnetic core 140 is ferrite, a casting process can be used to form the magnetic core 140; when the magnetic core 140 is soft magnetic ferrite, a powder pressing process can be used to form the magnetic core 140; and when the magnetic core 140 is a nanocrystalline alloy, a thin-film deposition process can be used to form the magnetic core 140.

[0048] In one embodiment, the package housing 130 is rectangular, with a length of 5 mm or less, a width of 5 mm or less, and a thickness of 1 mm or less. It should be noted that the size of the package housing is not limited to the above dimensions and can be adaptively adjusted according to the location and size of the specific application scenario. Specifically, the rectangular package housing 130 facilitates planar layout with other electronic components on the substrate. Limiting its length and width to within 5 mm and its thickness to within 1 mm ensures that the overall volume of the electromagnetic coupling chip package is suitable for miniaturized wearable or implantable devices. The rectangular package housing 130 can conform to the substrate surface through planar geometry, avoiding localized stress concentration caused by irregular shapes. Limiting the length and width to within 5 mm reduces the package area, minimizing deformation caused by external compression or bending during wear or implantation. Limiting the thickness to within 1 mm further reduces the overall height of the package housing 130, making it easier to bend with the substrate in dynamic environments without applying excessive shear force to the internal chip 120 connection nodes. For example, when using high-frequency plastics, a thickness of 1 mm ensures that the material maintains its elastic deformation range during bending, preventing plastic deformation from causing the casing to crack. This embodiment, through the geometric design of the encapsulation casing 130, reduces the mechanical load on internal connection nodes while maintaining structural integrity, thereby improving circuit reliability.

[0049] In some other embodiments, the length of the encapsulation housing 130 is greater than 5 mm and less than or equal to 10 mm, the width of the encapsulation housing 130 is greater than 5 mm and less than or equal to 10 mm, and the thickness of the encapsulation housing 130 is greater than 1 mm and less than or equal to 2 mm. In some other embodiments, the length of the encapsulation housing 130 is greater than 10 mm, the width of the encapsulation housing 130 is greater than 10 mm, and the thickness of the encapsulation housing 130 is greater than 2 mm. The size of the encapsulation housing 130 can be selected according to specific application requirements.

[0050] In one specific embodiment, the thickness of the encapsulation housing 130 may also be less than 0.75 mm, or between 0.25 and 0.75 mm, or 0.5 mm.

[0051] In one embodiment, the packaging shell 130 is made of ceramic or high-frequency plastic. Specifically, the ceramic packaging shell 130 forms a rigid support structure with the internal components (inductor coil 110, chip 120, and magnetic core 140) through a sintering process. When the wearable device is bent, its own rigidity maintains the shape of the packaging structure, preventing the connection nodes from breaking due to displacement of the internal components. The high-frequency plastic shell encapsulates the internal components through an injection molding process. When the implanted device is subjected to pressure during physiological activities, its elastic deformation disperses external stress, preventing stress concentration from damaging the bonding wires. The packaging shell 130 of this application matches the requirements of different application scenarios through the physical properties of different materials, and its low dielectric loss characteristics ensure the signal transmission efficiency between the inductor coil 110 and the chip 120.

[0052] In one embodiment, such as Figure 6 As shown, this application also proposes an electromagnetic coupling amplification system, including: the electromagnetic coupling chip package and coupling line 210 in the above embodiment. Both the electromagnetic coupling chip package and the coupling line 210 are disposed on the substrate. The coupling line 210 is spaced apart from the electromagnetic coupling chip package by a preset distance. The coupling line 210 is used to supply power to the chip 120 of the electromagnetic coupling chip package through the inductor coil 110 of the electromagnetic coupling chip package. The chip 120 is used to output communication signals through the inductor coil 110 and the coupling line 210.

[0053] Specifically, in this embodiment, the base layer can be a rigid or flexible base layer, and the base layer can be a single-layer or multi-layer structure. When the base layer is a multi-layer structure, the electromagnetic coupling chip package and coupling line 210 are disposed between the multi-layer structures. The material of the flexible base layer can be one of polyester (PET), polyimide (PI), polydimethylsiloxane (PDMS), polyvinyl alcohol (PVA), polyethylene naphthalate (PEN), paper, or textile materials. The material of the rigid base layer can be one of ceramic, metal, or rigid plastic.

[0054] By setting a coupling line 210 on the base layer and keeping the coupling line 210 at a preset distance from the electromagnetic coupling chip package, the energy of the radiated signal in the electromagnetic coupling chip package can be further received and amplified through the coupling line 210. This allows the coupling line 210 to supply energy to the chip 120 of the electromagnetic coupling chip package through the inductor coil 110 of the electromagnetic coupling chip package, and the chip 120 to output communication signals through the inductor coil 110 and the coupling line 210. This not only improves the signal transmission quality and strength but also enhances the energy utilization efficiency of the entire system, providing strong support for realizing a more efficient and reliable flexible circuit system.

[0055] It is understood that the electromagnetic coupling strength between the coupling line 210 and the electromagnetic coupling chip package is negatively correlated with the distance. When the preset distance decreases, the non-uniformity of the magnetic / electric field distribution increases, leading to an increase in induced current / voltage and a significant enhancement of the coupling effect; conversely, increasing the preset distance can weaken the coupling strength, but radiation loss and conductor loss must be balanced. In some embodiments, the preset distance is less than or equal to 1 cm. In some other embodiments, the preset distance is greater than 1 cm but less than 2 cm. In some other embodiments, the preset distance is greater than 2 cm. The preset distance can be determined by an electromagnetic simulation model. In a specific embodiment, the preset distance can be 0.5 cm, 0.6 cm, 0.7 cm, 0.8 cm, 0.9 cm, or other determined preset distance values.

[0056] The coupling line 210 is made of a metallic material, which may be copper, aluminum, silver, or an alloy (copper alloy, aluminum alloy). In some embodiments, the coupling line 210 is formed using a copper foil etching process. The shape of the coupling line 210 may be straight, curved, or bent. Specific examples include... Figure 6 As shown, coupling line 210 is configured as a straight line. Figure 7 As shown, the coupling line 210 is configured as a bent type.

[0057] In some embodiments, the diameter or width of the coupling wire is less than or equal to 1 mm, or less than or equal to 0.5 mm, or between 0.5 and 1 mm, or between 0.5 and 2 mm, or between 0.5 and 3 mm.

[0058] In some embodiments, the base surface is also covered with an epoxy resin protective layer that completely covers the non-contact area of ​​the electromagnetic coupling chip package and the coupling line 210, leaving only the pad area where the coupling line 210 connects to the external circuit.

[0059] In one embodiment, the length of the coupling line 210 is 12-26 cm. In a specific embodiment, the length of the coupling line 210 is 12-17 cm, or 17-21 cm, or 13-16 cm, or 14-15 cm.

[0060] Specifically, the frequency range of coupling line 210 is from 800MHz to 1GHz, and it is In the case of coupling line 210, the length of coupling line 210 is 12 cm to 17 cm, which is suitable for communication with chip 120 that has an ultra-high frequency (UHF) tag frequency standard (ISO / IEC 18000-6). In some other embodiments, the frequency band range of coupling line 210 is 500 MHz to 800 MHz, and it is... In the case of coupling line 210, the length of coupling line 210 is 17 cm to 26 cm.

[0061] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," and "specific embodiment" refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example that is included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0062] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0063] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An electromagnetic coupling chip package, characterized in that, include: An inductor coil, the inductor coil including a first connection terminal and a second connection terminal; The chip includes a first signal terminal and a second signal terminal, the first signal terminal being electrically connected to a first connection terminal, and the second signal terminal being electrically connected to the second connection terminal; the inductor is used to supply power to the chip, and the chip is used to output communication signals through the inductor. A housing that encapsulates the inductor coil and the chip.

2. The electromagnetic coupling chip package according to claim 1, characterized in that, Also includes: A magnetic core is disposed in the inductor coil, and the encapsulation housing encloses the magnetic core.

3. The electromagnetic coupling chip package according to claim 2, characterized in that, The magnetic core is configured as one of a rectangle, a circle, or a ring, and the material of the magnetic core is one of a soft magnetic ferrite, a ferrite, or a nanocrystalline alloy.

4. The electromagnetic coupling chip package according to claim 1, characterized in that, Also includes: A first bonding lead and a second bonding lead, wherein the first bonding lead is connected to the first signal terminal and the first connection terminal respectively, and the second bonding lead is connected to the second signal terminal and the second connection terminal respectively.

5. The electromagnetic coupling chip package according to claim 1, characterized in that, An opening is provided on the inductor coil, and the chip is disposed at the opening.

6. The electromagnetic coupling chip package according to claim 1, characterized in that, The encapsulation housing is rectangular, with a length of less than or equal to 5 mm, a width of less than or equal to 5 mm, and a thickness of less than or equal to 1 mm.

7. The electromagnetic coupling chip package according to claim 1, characterized in that, The material of the encapsulation shell is ceramic or high-frequency plastic.

8. An electromagnetic coupling amplification system, characterized in that, include: The electromagnetic coupling chip package and coupling line as described in any one of claims 1 to 7, wherein the electromagnetic coupling chip package and the coupling line are both disposed on a substrate, the coupling line is spaced at a predetermined distance from the electromagnetic coupling chip package, the coupling line is used to supply power to the chip of the electromagnetic coupling chip package through the inductor coil of the electromagnetic coupling chip package, and the chip is used to output communication signals through the inductor coil and the coupling line.

9. The electromagnetic coupling amplification system according to claim 8, characterized in that, The preset distance is less than or equal to 1 centimeter.

10. The electromagnetic coupling amplification system according to claim 8, characterized in that, The length of the coupling line is 12 cm to 17 cm.

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