High efficiency film stripping device for circuit board etching

Abstract

The utility model relates to a high -efficient film stripping device for circuit board etching, the upper portion of film stripping equipment is equipped with the spraying equipment for carrying out the spraying to circuit board substrate surface dry film, one side of spraying equipment is provided with the fixed frame that is fixedly connected with film stripping equipment, the inside fixed frame is equipped with the impurity removal mechanism for to film slag after falling processing, one side of impurity removal mechanism is provided with the secondary spraying mechanism for processing circuit board substrate again with fixed frame is fixedly connected, compared with prior art, the utility model has the beneficial effect that: through setting up the impurity removal mechanism in the upper portion of the conveying wheel, and the suction end of impurity removal mechanism stretches to between the conveying wheel, through starting the suction equipment, the film body after separation will enter the inside air inlet pipe through the suction nozzle, then through the guide cylinder and enter the inside sliding frame, realize the concentrated collection of film body, avoid the film body that separates from the membrane body influence the membrane body's demoulding work of subsequent, realize efficient demoulding work.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing, and in particular to a high-efficiency film removal device for circuit board etching. Background Technology

[0002] In the process of stripping the circuit board, the main task is to wash away the cured dry film with a chemical solution to facilitate subsequent etching. Currently, during the stripping process, the circuit board substrate is transported by a conveyor wheel, and its surface is sprayed with a spray nozzle. The chemical solution reacts with the dry film to remove the film. However, in actual use, when the dry film separates from the circuit board substrate, a portion of the dry film adheres to the surface of the circuit board substrate. If the chemical solution is sprayed again at this time, it cannot fully contact the film underneath the dry film to be detached, thus affecting the stripping quality. Therefore, to address the above problems, a high-efficiency stripping device for circuit board etching is proposed. Utility Model Content

[0003] In view of the above-mentioned problems in the prior art, the main purpose of this utility model is to provide a high-efficiency film removal device for circuit board etching. The separated film will enter the air inlet pipe through the suction nozzle and enter the sliding frame through the guide tube to realize the centralized collection of the film, avoid the detached film from affecting the subsequent film removal work, and achieve efficient film removal.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a high-efficiency film removal device for PCB etching, wherein a spraying device for spraying dry film on the surface of PCB substrate is installed above the film removal device, and a fixing frame is provided on one side of the spraying device and is fixedly connected to the film removal device.

[0005] The fixed frame is equipped with a cleaning mechanism for treating the film residue that has fallen off. On one side of the cleaning mechanism, there is a secondary spraying mechanism that is fixedly connected to the fixed frame for further processing of the circuit board substrate. Below the cleaning mechanism, there is a conveyor wheel that is rotatably connected to the fixed frame for conveying the circuit board substrate.

[0006] Furthermore, the impurity removal mechanism includes a mounting frame that is fixedly connected to the fixed frame, and an air suction device is installed inside the mounting frame with the input end face downwards.

[0007] The mounting frame also has a sliding frame inside, and a filter screen for filtering solid impurities is installed above the sliding frame.

[0008] Two sets of air inlet pipes are installed at the bottom of the mounting frame. The other end of the air inlet pipes is fixedly connected to a vertically arranged suction nozzle for sucking up impurities from the membrane after film removal.

[0009] Furthermore, the sliding frame is equipped with two sets of hollow guide cylinders that are vertically arranged, with the tops of the guide cylinders being pointed.

[0010] Furthermore, the bottom of the guide tube is aligned with the top of the intake pipe.

[0011] In the process of stripping the circuit board, the main task is to wash away the cured dry film with a chemical solution to facilitate subsequent etching. Currently, during stripping, the circuit board substrate is transported by conveyor wheels, and its surface is sprayed with a spray nozzle. The chemical solution reacts with the dry film to facilitate stripping. However, in actual use, when the dry film separates from the circuit board substrate, some of the dry film adheres to the surface of the circuit board substrate. If the chemical solution is continued to be sprayed at this time, it may not be able to fully contact the film below the detached dry film, thus affecting the stripping quality. By setting a cleaning mechanism above the conveyor wheels, with the suction end of the cleaning mechanism extending between the conveyor wheels, the separated film is drawn into the air inlet pipe through the suction nozzle by activating the suction device. Then, it enters the sliding frame through the guide tube, achieving centralized collection of the film and preventing the detached film from affecting the subsequent stripping process, thus achieving efficient stripping.

[0012] Furthermore, the secondary spraying mechanism includes a spraying frame that is fixedly connected to the fixed frame. A pump body is installed inside the spraying frame. The input end of the pump body is connected to a liquid inlet pipe, and the other end of the liquid inlet pipe is connected to the liquid storage tank of the spraying equipment.

[0013] The pump body has a drain pipe connected to the inlet end, and a longitudinal pipe connected to the other end. A spray nozzle is installed on the outside of the longitudinal pipe.

[0014] Furthermore, the spray nozzles are arranged in multiple groups longitudinally, and the spray nozzles are set at an angle.

[0015] A secondary spraying mechanism is also installed inside the fixed frame. After the impurity removal mechanism performs the film suction work, the chemical solution is drawn out again by the pump body and discharged through the spray nozzle on one side of the longitudinal pipe. The chemical solution comes into contact with the unseparated film on the surface of the circuit board substrate, ensuring that the circuit board substrate is fully delaminated and ensuring that subsequent work proceeds smoothly.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] 1. By setting a cleaning mechanism above the conveyor wheel, and extending the suction end of the cleaning mechanism between the conveyor wheels, the separated membrane body will enter the air inlet pipe through the suction nozzle when the suction device is started, and then enter the sliding frame through the guide tube, so as to realize the centralized collection of the membrane body and avoid the detached membrane body from affecting the subsequent membrane removal work, thus achieving efficient membrane removal work.

[0018] 2. A secondary spraying mechanism is also installed inside the fixed frame. After the impurity removal mechanism performs the film suction work, the chemical solution is drawn out again by the pump body and discharged through the spray nozzle on one side of the longitudinal pipe. The chemical solution comes into contact with the unseparated film on the surface of the circuit board substrate, ensuring that the circuit board substrate is fully delaminated and ensuring that subsequent work proceeds smoothly. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a cross-sectional view of the fixing frame of this utility model;

[0021] Figure 3 This is a schematic diagram of the impurity removal mechanism of this utility model;

[0022] Figure 4 This is a cross-sectional view of the sliding frame of this utility model;

[0023] Figure 5 This is a schematic diagram of the secondary spraying mechanism of this utility model.

[0024] Legend: 1. Film removal equipment; 2. Spraying equipment; 3. Fixed frame; 4. Impurity removal mechanism; 401. Mounting frame; 402. Air suction equipment; 403. Sliding frame; 404. Filter screen; 405. Guide cylinder; 406. Air inlet pipe; 407. Impurity suction nozzle; 5. Secondary spraying mechanism; 501. Spraying frame; 502. Pump body; 503. Drain pipe; 504. Longitudinal pipe; 505. Spray nozzle; 506. Liquid inlet pipe; 6. Conveying wheel. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments. Example

[0026] High-efficiency film stripping device for circuit board etching, such as Figure 1-5 As shown, a spraying device 2 for spraying the dry film on the surface of the circuit board substrate is installed above the film removal device 1, and a fixing frame 3 is fixedly connected to the film removal device 1 on one side of the spraying device 2.

[0027] The fixed frame 3 is equipped with a cleaning mechanism 4 for treating the film residue after it falls off. A secondary spraying mechanism 5 is fixedly connected to the fixed frame 3 on one side for further processing of the circuit board substrate. A conveying wheel 6 is rotatably connected to the fixed frame 3 below the cleaning mechanism 4 for conveying the circuit board substrate.

[0028] The impurity removal mechanism 4 includes a mounting frame 401 that is fixedly connected to the fixed frame 3. An air suction device 402 is installed inside the mounting frame 401, and the input end face of the air suction device 402 is facing downward.

[0029] The mounting frame 401 is also slidably connected to a sliding frame 403, and a filter screen 404 for filtering solid impurities is installed above the sliding frame 403.

[0030] Two sets of air inlet pipes 406 are installed at the bottom of the mounting frame 401. The other end of the air inlet pipe 406 is fixedly connected to a suction nozzle 407 arranged longitudinally for sucking up impurities in the membrane after film removal.

[0031] The sliding frame 403 also has two sets of hollow guide cylinders 405 installed vertically inside, with the top of the guide cylinders 405 being pointed.

[0032] The bottom of the guide tube 405 is aligned with the top of the air intake pipe 406.

[0033] In the process of stripping the circuit board, the main task is to wash away the cured dry film with a chemical solution to facilitate subsequent etching. Currently, during the stripping process, the circuit board substrate is transported by a conveyor wheel, and its surface is sprayed with a spray nozzle. The chemical solution reacts with the dry film to remove the film. However, in actual use, when the dry film separates from the circuit board substrate, some of the dry film will adhere to the surface of the circuit board substrate. If the chemical solution is sprayed again at this time, it may not be able to fully contact the film below the detached dry film, thus affecting the stripping quality. By setting a cleaning mechanism 4 above the conveyor wheel 6, and the suction end of the cleaning mechanism 4 extends between the conveyor wheel 6, by activating the suction device 402, the separated film will enter the air inlet pipe 406 through the suction nozzle 407, and then enter the sliding frame 403 through the guide tube 405, so as to achieve centralized collection of the film and avoid the detached film from affecting the subsequent stripping work, thus achieving efficient stripping.

[0034] After the circuit board substrate comes into contact with the chemical solution, the dry film on the surface of the substrate separates from it. Then, by activating the suction device 402, some of the film impurities can enter the air inlet pipe 406 through the suction nozzle 407, and then enter the sliding frame 403 through the guide tube 405. Under the action of the filter screen 404, the solid impurities are blocked and fall into the sliding frame 403 for collection. The impurities can be centrally processed by sliding the sliding frame 403.

[0035] The secondary spraying mechanism 5 includes a spraying frame 501 fixedly connected to the fixed frame 3. A pump body 502 is installed inside the spraying frame 501. The input end of the pump body 502 is connected to an inlet pipe 506, and the other end of the inlet pipe 506 is connected to the storage tank of the spraying equipment 2.

[0036] The pump body 502 has a drain pipe 503 connected to its input end, and a longitudinal pipe 504 connected to the other end of the drain pipe 503. A spray nozzle 505 is installed on the outside of the longitudinal pipe 504.

[0037] The spray nozzles 505 are arranged in multiple groups longitudinally, and the spray nozzles 505 are inclined.

[0038] Inside the fixed frame 3, a secondary spraying mechanism 5 is also installed. After the impurity removal mechanism 4 performs the film suction work, the chemical solution is extracted again by the pump body 502 and discharged through the spray nozzle 505 on one side of the longitudinal pipe 504. The chemical solution comes into contact with the unseparated film on the surface of the circuit board substrate, ensuring that the circuit board substrate is fully delaminated and ensuring that subsequent work proceeds smoothly.

[0039] An inclined spray nozzle 505 is provided on one side of the longitudinal tube 504. The chemical solution is discharged through it, which can make the dry film on the surface of the circuit board substrate in contact with the chemical solution, ensuring that it is separated from the circuit board substrate and ensuring the quality of subsequent etching.

[0040] Finally, it should be noted that the above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A high-efficiency film stripping device for circuit board etching, comprising a film stripping apparatus (1), characterized in that: Above the film removal device (1) is a spraying device (2) for spraying the dry film on the surface of the circuit board substrate. A fixing frame (3) is fixedly connected to the film removal device (1) on one side of the spraying device (2). The fixed frame (3) is equipped with a cleaning mechanism (4) for treating the film residue after it falls off. A secondary spraying mechanism (5) is fixedly connected to the fixed frame (3) on one side for further processing of the circuit board substrate. A conveying wheel (6) is rotatably connected to the fixed frame (3) and used to transport the circuit board substrate below the cleaning mechanism (4).

2. The high-efficiency film removal device for circuit board etching according to claim 1, characterized in that: The impurity removal mechanism (4) includes a mounting frame (401) fixedly connected to the fixed frame (3), and an air suction device (402) is installed inside the mounting frame (401), with the input end face of the air suction device (402) facing downward. The mounting frame (401) is also slidably connected to a sliding frame (403), and a filter screen (404) for filtering solid impurities is installed above the sliding frame (403). Two sets of air inlet pipes (406) are installed at the bottom of the mounting frame (401), and the other end of the air inlet pipe (406) is fixedly connected to a suction nozzle (407) arranged in a longitudinal direction for sucking up impurities in the membrane after the membrane is removed.

3. The high-efficiency film removal device for circuit board etching according to claim 2, characterized in that: The sliding frame (403) is also equipped with two sets of hollow guide cylinders (405) arranged vertically, with the top of the guide cylinders (405) being pointed.

4. The high-efficiency film removal device for circuit board etching according to claim 3, characterized in that: The bottom of the guide tube (405) is aligned with the top of the air intake pipe (406).

5. The high-efficiency film removal device for circuit board etching according to claim 1, characterized in that: The secondary spraying mechanism (5) includes a spraying frame (501) fixedly connected to the fixed frame (3). A pump body (502) is installed inside the spraying frame (501). The input end of the pump body (502) is connected to an inlet pipe (506). The other end of the inlet pipe (506) is connected to the storage tank of the spraying equipment (2). The pump body (502) has an input end connected to a drain pipe (503), and the other end of the drain pipe (503) is connected to a longitudinal pipe (504). A spray nozzle (505) is installed on the outside of the longitudinal pipe (504).

6. The high-efficiency film removal device for circuit board etching according to claim 5, characterized in that: The spray nozzles (505) are arranged in multiple longitudinal groups and are inclined.

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