Wafer cutting machine material frame clamping device

Abstract

The utility model relates to wafer processing technology field discloses wafer cutting machine material frame clamping device, including base, the base outer surface fixedly connected with the limiting ring, the base top fixedly connected with the heat conduction plate, the heat conduction plate top is provided with crystal, the base outer surface is provided with the fixed ring, the fixed ring outer surface fixedly connected with the evenly distributed air cylinder, a plurality of the air cylinder outer surface all fixedly connected with the connecting block, a plurality of the connecting block outer surface all fixedly connected silica gel gasket. In the utility model, through fixing a plurality of air cylinders on the fixed ring, and setting the fixed ring through the sliding block and the sliding slot on the outer surface of base, make the fixed ring can slide freely on the base, and when installing, only need to make the connecting ring push out the stop block through rotating by poking the poking piece, the fixed ring is clamped between the stop block and the limiting ring, solved the problem of time -consuming of being troublesome when replacing the assembly of clamping part.