A 25um semiconductor carrier board fixture

Abstract

The utility model relates to test fixture technical field, concretely relates to a 25um semiconductor carrier plate fixture, including fixed base, the fixed base inside is provided with the mounting groove, the mounting groove inside is provided with the positioning assembly, among them: The positioning assembly includes the locating plate, the locating plate sets up in the mounting groove inside four corners department, through the locating plate in the mounting groove inside carries out horizontal and vertical movement adjustment multiple locating plate between carrier plate positioning space length and width's size, the locating plate inside the support plate top fixedly connected with electric push rod, electric push rod output end pushes the top connection's flexible top plate up and down movement adjustment carrier plate and places height, can accurate regulation carrier plate positioning space's long, wide size precision reaches micron level, adapts to the positioning demand of different specifications carrier plate, ensures the positioning accuracy of carrier plate in three -dimensional space, ensures its in the processing process keeps level, avoids the warping deformation caused by gravity or external force.

Description

Technical Field

[0001] This utility model relates to the field of testing fixture technology, and more specifically, to a 25µm semiconductor substrate fixture. Background Technology

[0002] In recent years, the global semiconductor industry has been experiencing rapid growth. With the widespread application of emerging technologies such as 5G communication, artificial intelligence, and the Internet of Things, higher demands are being placed on the performance, power consumption, and integration of semiconductor chips. To meet these demands, semiconductor manufacturing processes are continuously advancing towards smaller process nodes, resulting in shrinking chip sizes and increasingly complex structures. 25µm semiconductor substrates, with their thinness, lightness, and high efficiency, have gradually become the mainstream choice for manufacturing high-end semiconductor products, widely used in advanced packaging, high-performance computing, and other fields. Market demand is experiencing explosive growth. As a key factor affecting the quality and production efficiency of semiconductor products, the performance of 25µm semiconductor substrate fixtures directly impacts a company's market competitiveness.

[0003] There are many existing technologies for carrier plate fixtures, such as:

[0004] Chinese Patent (Application No.: CN202420199946.4) discloses a high-precision IC carrier board testing fixture, comprising an upper mold base, a lower mold base, and one end of a guide rod evenly distributed at the lower end of the upper mold base. A pressure plate is slidably mounted on the guide rod, and a probe for power-on testing is provided at the lower end of the pressure plate. The lower mold base is connected to the other end of the guide rod and has an inwardly concave placement cavity in which the IC carrier board is located. Alignment grooves are arranged around the placement cavity, and alignment protrusions are also provided at the lower end of the pressure plate, with the alignment protrusions and grooves engaging. The lower mold base also includes a clamping assembly for clamping the IC carrier board. This testing fixture employs an engaging connection design between the alignment grooves and protrusions, effectively reducing limit offset caused by factors such as pressure plate friction. Combined with the clamping assembly, this clamps the IC carrier board, thereby improving testing accuracy and ensuring more accurate and reliable test results for the IC carrier board.

[0005] Traditional semiconductor substrate fixtures are primarily designed and manufactured for thicker, larger substrates, employing relatively crude positioning, clamping, and support methods. When applied to ultra-thin semiconductor substrates such as 25µm substrates, on the one hand, the positioning accuracy of traditional fixtures is insufficient to meet the submicron or even nanometer-level precision required for 25µm substrate processing. This can easily lead to substrate misalignment during high-precision processes such as chip mounting and photolithography, resulting in incorrect chip-to-substrate connections or circuit misalignment, affecting the electrical performance and reliability of the product. On the other hand, 25µm substrates are thin, lightweight, and lack rigidity. The clamping and support structures of traditional fixtures are prone to causing mechanical damage, such as surface scratches and deformation, when fixing the substrate, reducing the substrate yield. Utility Model Content

[0006] This utility model addresses the technical problems existing in the prior art by providing a 25µm semiconductor carrier fixture, which solves the problems of insufficient positioning accuracy of ultra-thin carriers and easy mechanical damage when fixing ultra-thin carriers using traditional fixtures.

[0007] To achieve the above objectives, this utility model provides a 25µm semiconductor substrate fixture, including a fixed base. The fixed base has an internal mounting groove, and the mounting groove has a positioning component. The positioning component includes a positioning plate, which is located at the four corners of the mounting groove. The positioning plate can be moved laterally and vertically within the mounting groove to adjust the length and width of the substrate positioning space between multiple positioning plates. An electric push rod is fixedly connected to the top of the internal support plate of the positioning plate. The output end of the electric push rod pushes the top-connected flexible top plate to move up and down to adjust the placement height of the substrate.

[0008] The beneficial effects of this utility model are:

[0009] 1. When positioning and installing the carrier plate, the micron-level displacement adjustment of the positioning plate is achieved through the bidirectional lead screw drive in the positioning component and the motor, which meets the stringent precision requirements of advanced packaging processes. The closed-loop control system of electric push rod + displacement sensor calibrates the height of the carrier plate in real time to ensure that it remains horizontal during processing and avoids warping deformation caused by gravity or external forces.

[0010] 2. During the testing of the carrier plate, the flexible top plate and flexible pressure plate achieve "soft contact" clamping with the carrier plate. The clamping force can be precisely controlled by the screw speed, which ensures the stability of the carrier plate and avoids damage caused by rigid compression.

[0011] Based on the above technical solution, the present invention can be further improved as follows.

[0012] Preferably, the mounting slot is provided with several insertion holes, and a 25µm probe is engaged and connected inside the insertion holes.

[0013] The advantages of adopting the above-mentioned further solution are that it ensures the stability of the connection between the 25um probe contact and the test point on the carrier board, avoids poor connection or misalignment, and the connection is simple, easy to replace, compatible with different testing or packaging process requirements, and reduces the cost of fixture use.

[0014] Preferably, the lower ends of the two positioning plates on the right are threaded with a first bidirectional lead screw, one end of which is fixedly connected to the output end of the first motor. The lower ends of the two positioning plates on the left are slidably connected with a first guide rod. Both ends of the first bidirectional lead screw and the first guide rod are connected with a first moving block. The two first moving blocks at the front end of the mounting groove are threaded with a second bidirectional lead screw, one end of which is fixedly connected to the output end of the second motor. The two first moving blocks at the rear end of the mounting groove are slidably connected with a second guide rod. A displacement sensor is installed inside the flexible top plate.

[0015] The beneficial effect of adopting the above-mentioned further solution is that it enables high-precision positioning and adaptive adjustment of the jig on the carrier plate, real-time calibration of the carrier plate height, ensuring that it remains horizontal during processing, and avoiding warping deformation caused by gravity or external forces.

[0016] Preferably, the upper ends of both sides of the mounting groove are symmetrically provided with sliding grooves, and the positioning plate is slidably connected with a limiting rod, the two ends of which slide inside the sliding groove.

[0017] The beneficial effect of adopting the above-mentioned further solution is that the sliding cooperation between the limiting rod and the slide groove provides guidance and support for the positioning plate, reduces shaking during movement, and further improves the fixation stability.

[0018] Preferably, a support frame is fixedly connected to the top of the fixed base, and a clamping assembly is provided inside the support frame. The clamping assembly includes a flexible pressure plate, and a second moving block is fixedly connected to the top of the flexible pressure plate. The second moving block slides up and down inside the support frame, and a one-way lead screw is threaded inside the second moving block.

[0019] The advantage of adopting the above-mentioned further solution is that it effectively ensures the alignment accuracy between the carrier board and the 25µm probe contact, and avoids loose connection or misalignment during the test.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0021] By cooperating with the first and second bidirectional lead screws in the positioning assembly and the first and second motors, the four corner positioning plates can move laterally and vertically. The length and width dimensions of the positioning space of the carrier plate can be precisely adjusted with an accuracy of up to the micrometer level, which can adapt to the positioning requirements of carrier plates of different specifications. The displacement sensor monitors the height of the flexible top plate in real time, and combined with the electric push rod, the placement height of the four corners of the carrier plate is adjusted individually to ensure the positioning accuracy of the carrier plate in three-dimensional space and to ensure that it remains horizontal during processing, avoiding warping deformation caused by gravity or external forces. Attached Figure Description

[0022] Figure 1This is an isometric view of one side of the overall structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the positioning component structure of this utility model;

[0024] Figure 3 This is a top view sectional structural diagram of the present invention;

[0025] Figure 4 This is a schematic diagram of a cross-sectional view of one side of the present invention.

[0026] The meanings of the labels in the diagram are as follows:

[0027] 1. Fixed base; 11. Mounting slot; 12. Insertion hole; 13. 25um probe; 14. Slide groove; 15. Support frame;

[0028] 2. Positioning assembly; 21. Positioning plate; 22. Limiting rod; 23. First bidirectional lead screw; 24. First motor; 25. First guide rod; 26. First moving block; 27. Second bidirectional lead screw; 28. Second motor; 29. ​​Second guide rod; 210. Electric push rod; 211. Flexible top plate; 212. Displacement sensor;

[0029] 3. Clamping assembly; 31. Flexible pressure plate; 32. Second moving block; 33. One-way lead screw. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Please see Figures 1-4 As shown, this embodiment provides a 25µm semiconductor substrate fixture, including a fixed base 1. The fixed base 1 has an installation groove 11 inside. Considering that the positioning accuracy of traditional fixtures for ultra-thin substrates is insufficient and it is difficult to be compatible with substrates of different sizes or thicknesses, a positioning component 2 is provided inside the installation groove 11. The positioning component 2 includes a positioning plate 21, which is located at the four corners inside the installation groove 11. The positioning plate 21 can be moved horizontally and vertically inside the installation groove 11 to adjust the length and width of the substrate positioning space between multiple positioning plates 21. An electric push rod 210 is fixedly connected to the top of the support plate inside the positioning plate 21. The output end of the electric push rod 210 pushes the flexible top plate 211 connected to the top to move up and down to adjust the placement height of the substrate.

[0032] In summary, the improvement of this embodiment lies in:

[0033] Through the cooperation of the first bidirectional lead screw 23 and the second bidirectional lead screw 27 in the positioning assembly 2 with the first motor 24 and the second motor 28, the horizontal and vertical movement of the four corner positioning plates 21 can be realized. The length and width dimensions of the positioning space of the carrier plate can be precisely adjusted with an accuracy of up to the micrometer level, which can adapt to the positioning requirements of carrier plates of different specifications. The displacement sensor 212 monitors the height of the flexible top plate 211 in real time, and combined with the electric push rod 210, adjusts the placement height of the four corners of the carrier plate individually to ensure the positioning accuracy of the carrier plate in three-dimensional space and ensure that it remains horizontal during processing, avoiding warping deformation caused by gravity or external force.

[0034] Based on the above, other structures also need to be disclosed in detail, such as:

[0035] The mounting slot 11 has several insertion holes 12 inside, and 25µm probes 13 are engaged inside the insertion holes 12. The engagement structure between the insertion holes 12 and the 25µm probes 13 provides precise positioning. Combined with the high-precision adjustment of the positioning plate 21, it ensures the alignment accuracy between the contacts of the 25µm probes 13 and the test points on the carrier board, avoiding loose connections or misalignment. The connection is simple, easy to replace, compatible with different testing or packaging process requirements, and reduces the cost of fixture use.

[0036] The lower ends of the two positioning plates 21 on the right are threaded with a first bidirectional lead screw 23, one end of which is fixedly connected to the output end of the first motor 24. The lower ends of the two positioning plates 21 on the left are slidably connected with a first guide rod 25. Both ends of the first bidirectional lead screw 23 and the first guide rod 25 are connected with a first moving block 26. The two first moving blocks 26 at the front end of the mounting groove 11 are threaded with a second bidirectional lead screw 27, one end of which is fixedly connected to the output end of the second motor 28. The two first moving blocks 26 at the rear end of the mounting groove 11 are slidably connected with a second guide rod 29. A displacement sensor 212 is installed inside the flexible top plate 211. Sliding grooves 14 are symmetrically arranged on the upper ends of both sides of the mounting groove 11. Limit rods 22 are slidably connected inside the positioning plates 21. By placing the carrier plate on top of multiple flexible top plates 211, which provide soft support, stress concentration is reduced when the carrier plate contacts the fixture, preventing surface damage. Then, the first motor 24 drives the first bidirectional lead screw 23 to rotate. The external thread of the first bidirectional lead screw 23 engages with the internal thread of the positioning plate 21, thereby driving the two right-end positioning plates 21 to move synchronously back and forth laterally. Meanwhile, the two left-end positioning plates 21 are connected to the two right-end positioning plates 21 via limiting rods 22. The movement of the two right-end positioning plates 21 further drives the two left-end positioning plates 21 to move back and forth laterally until one side of the four positioning plates 21 contacts the front and rear sides of the carrier plate, clamping and fixing the carrier plate. During this process, the two ends of the limiting rods 22 slide within the sliding grooves 14. The sliding engagement between the limiting rod 22 and the slide groove 14 provides guidance and support for the positioning plate 21, reducing swaying during movement and further improving the stability of the fixation. The second motor 28 drives the second bidirectional lead screw 27 to rotate, and the external thread of the second bidirectional lead screw 27 meshes with the internal thread of the first moving block 26, thereby causing the four positioning plates 21 to move laterally relative to each other. This causes the other side of the positioning plate 21 to contact the left and right sides of the carrier plate, clamping and fixing the carrier plate left and right. After fixing, the displacement sensor 212 monitors the position of the carrier plate, and the electric push rod 210 pushes the flexible top plate 211 to move up and down, calibrating the height of the carrier plate in real time to ensure that it remains horizontal during processing and avoids warping deformation caused by gravity or external force. This achieves high-precision positioning and adaptive adjustment of the carrier plate by the fixture.

[0037] A support frame 15 is fixedly connected to the top of the fixed base 1. A clamping assembly 3 is provided inside the support frame 15. The clamping assembly 3 includes a flexible pressure plate 31. A second moving block 32 is fixedly connected to the top of the flexible pressure plate 31. The second moving block 32 slides up and down inside the support frame 15. A one-way screw 33 is threaded inside the second moving block 32. After the position of the carrier plate is determined, the second moving block 32 is pushed by rotating the one-way screw 33, which drives the flexible pressure plate 31 to move down and achieve "soft contact" clamping with the top of the carrier plate. This effectively ensures the alignment accuracy of the carrier plate and the 25um probe 13 contact point and avoids loose connection or offset during the test.

[0038] In summary, the working principle of this solution is as follows:

[0039] First, the carrier plate is placed on top of multiple flexible top plates 211. The flexible top plates 211 provide soft support for the carrier plate, reducing stress concentration when the carrier plate contacts the fixture and preventing surface damage. Then, the first motor 24 drives the first bidirectional lead screw 23 to rotate. The external thread of the first bidirectional lead screw 23 meshes with the internal thread of the positioning plate 21, thereby driving the two positioning plates 21 on the right end to move synchronously back and forth laterally relative to each other. At this time, the two positioning plates 21 on the left end are connected to the two positioning plates 21 on the right end through the limiting rod 22. The movement of the two positioning plates 21 on the right end drives the two positioning plates 21 on the left end to move back and forth laterally relative to each other until one side of the interior of the four positioning plates 21 contacts the front and rear sides of the carrier plate, clamping and fixing the carrier plate. During the process, the two ends of the limiting rod 22 slide inside the slide groove 14. The sliding cooperation between the limiting rod 22 and the slide groove 14 provides guidance and support for the positioning plates 21, reducing swaying during movement and further improving the fixing stability. The second motor 28 drives the second bidirectional lead screw 27 to rotate. The external thread of the second bidirectional lead screw 27 engages with the internal thread of the first moving block 26, thereby causing the four positioning plates 21 to move laterally relative to each other. This allows the other side of the positioning plate 21 to contact the left and right sides of the carrier plate, clamping and fixing the carrier plate left and right. After fixing, the position of the carrier plate is monitored by the displacement sensor 212. The electric push rod 210 pushes the flexible top plate 211 to move up and down, calibrating the height of the carrier plate in real time to ensure that it remains horizontal during processing and avoids warping deformation caused by gravity or external force. This achieves high-precision positioning and adaptive adjustment of the carrier plate by the fixture. After the position of the carrier plate is determined, the second moving block 32 is pushed by rotating the unidirectional lead screw 33 to move the flexible pressure plate 31 down, achieving "soft contact" clamping with the top of the carrier plate. This effectively ensures the alignment accuracy of the carrier plate and the 25um probe 13 contact point, avoiding loose connection or offset during testing. At this time, the 25um probe 13 contact point is in contact with the test point of the carrier plate, forming a closed circuit. The 25um probe 13 is energized to detect the continuity, short circuit or open circuit between the circuits.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A 25µm semiconductor substrate fixture, comprising a fixed base (1), characterized in that: The fixed base (1) is provided with an installation groove (11), and the installation groove (11) is provided with a positioning component (2). The positioning component (2) includes a positioning plate (21), which is located at the four corners inside the installation groove (11). The positioning plate (21) can be moved horizontally and vertically inside the installation groove (11) to adjust the length and width of the space between the multiple positioning plates (21). An electric push rod (210) is fixedly connected to the top of the support plate inside the positioning plate (21). The output end of the electric push rod (210) pushes the flexible top plate (211) connected to the top to move up and down to adjust the placement height of the carrier plate.

2. The 25µm semiconductor substrate fixture according to claim 1, characterized in that: The mounting slot (11) is provided with several insertion holes (12), and a 25um probe (13) is engaged and connected inside the insertion hole (12).

3. The 25µm semiconductor substrate fixture according to claim 1, characterized in that: The upper ends of both sides of the mounting groove (11) are symmetrically provided with sliding grooves (14), and the positioning plate (21) is slidably connected with a limiting rod (22), and the two ends of the limiting rod (22) slide inside the sliding groove (14).

4. A 25µm semiconductor substrate fixture according to claim 1, characterized in that: The lower ends of the two positioning plates (21) on the right are threaded with a first bidirectional lead screw (23), one end of which is fixedly connected to the output end of the first motor (24), and the lower ends of the two positioning plates (21) on the left are slidably connected with a first guide rod (25).

5. A 25µm semiconductor substrate fixture according to claim 4, characterized in that: Both ends of the first bidirectional lead screw (23) and the first guide rod (25) are connected to the first moving block (26). The two first moving blocks (26) at the front end of the mounting groove (11) are threadedly connected to the second bidirectional lead screw (27). One end of the second bidirectional lead screw (27) is fixedly connected to the output end of the second motor (28). The two first moving blocks (26) at the rear end of the mounting groove (11) are slidably connected to the second guide rod (29).

6. A 25µm semiconductor substrate fixture according to claim 1, characterized in that: The flexible top plate (211) is equipped with a displacement sensor (212).

7. A 25µm semiconductor substrate fixture according to claim 1, characterized in that: The fixed base (1) is fixedly connected to the top of the support frame (15), and the support frame (15) is provided with a clamping assembly (3). The clamping assembly (3) includes a flexible pressure plate (31), and the top of the flexible pressure plate (31) is fixedly connected to a second moving block (32). The second moving block (32) slides up and down inside the support frame (15), and the second moving block (32) is threadedly connected to a one-way screw (33).

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