Modular assembly type closed air cooling machine cabinet

Abstract

This utility model relates to a modular, enclosed, air-cooled chassis, comprising a fan unit, a heat sink, and a functional unit. The fan unit includes a fan unit housing and a cover plate. The fan unit housing houses a power module, a cooling fan, and a circuit board. The heat sink includes a structural frame and a heat dissipation structure. The functional unit includes a functional unit housing, within which a functional circuit board is housed. The functional circuit board contains functional devices and an internal adapter connector, which also connects to an external interface connector located on the functional unit housing. The fan unit housing and the functional unit housing are detachably mounted on opposite sides of the structural frame. At least one side of the structural frame, distributed circumferentially, has an air inlet, and the cover plate has an air outlet. This utility model employs a modular assembly structure, facilitating installation and disassembly. It allows for independent maintenance of the fan unit and functional unit without requiring complete disassembly, simplifying maintenance operations and shortening maintenance time.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, specifically a modular combined sealed air-cooled chassis. Background Technology

[0002] As electronic devices become increasingly integrated, the heat dissipation power of internal chips is also increasing. Thermal design has become a crucial aspect of electronic device design, and improper thermal design is a significant cause of electronic device failure. Thermal design is also directly related to the lifespan and reliability of electronic devices. Natural heat dissipation alone is no longer sufficient for product application requirements, and forced air cooling is now widely used.

[0003] Furthermore, electronic equipment often needs to withstand harsh environmental conditions, such as dust, rain, and electromagnetic compatibility issues. Therefore, a fully sealed chassis cooling system is typically used to protect the functional circuits and cooling fans. During operation, if a functional circuit or cooling fan malfunctions, repair requires disassembling the entire chassis, making maintenance cumbersome and significantly increasing repair time. Summary of the Invention

[0004] To overcome the shortcomings of existing technologies, this utility model provides a modular combined sealed air-cooled chassis. It adopts a modular assembly structure, which is convenient for installation and disassembly. It allows for independent maintenance of fan units and functional units without the need to completely disassemble the chassis, thus simplifying maintenance operations and shortening maintenance time.

[0005] This utility model is specifically achieved through the following technical solution: A modular, sealed, air-cooled chassis according to this utility model includes a fan unit, a heat sink, and a functional unit. The fan unit includes a fan unit housing and a cover plate detachably connected to the fan unit housing. A power module, a cooling fan, and a circuit board connected to the power module are disposed within the fan unit housing. The heat sink includes a structural frame and a heat dissipation structure disposed within the structural frame. The functional unit includes a functional unit housing, a functional circuit board disposed within the functional unit housing, functional devices disposed on the functional circuit board, and an internal adapter connector connected to the functional devices. The internal adapter connector is also connected to an external interface connector disposed on the functional unit housing. The fan unit housing and the functional unit housing are detachably mounted on opposite sides of the structural frame. An air inlet is disposed on at least one side of the structural frame distributed circumferentially, and an air outlet is disposed on the cover plate.

[0006] The aforementioned modular sealed air-cooled chassis also has a power supply interface on the fan unit housing, which is connected to an external power supply and power module.

[0007] The aforementioned modular sealed air-cooled chassis has a first connector on the fan unit housing, a fourth connector in the functional unit housing, and a second connector adapted to the first connector and a third connector adapted to the fourth connector on the structural frame. The second connector and the third connector are connected by a cable.

[0008] Furthermore, a temperature sensor is provided on the functional circuit board, and the temperature sensor is also connected to the fourth connector; a chip is also provided on the circuit board of the fan unit, and the chip is also connected to the first connector and the cooling fan.

[0009] Furthermore, the third connector mating end and the fourth connector mating end are also provided with a guide structure, which includes a guide pin and a guide pin hole.

[0010] The aforementioned modular sealed air-cooled chassis also includes a fan switch on the fan unit housing, which is connected to a circuit board.

[0011] The aforementioned modular, enclosed, air-cooled chassis includes functional components such as a CPU, a DC / DC module, a temperature sensor, an LDO, and a clock chip.

[0012] The aforementioned modular sealed air-cooled chassis includes a heat dissipation structure comprising heat dissipation fins, which are integrally formed with or welded to the structural frame.

[0013] The aforementioned modular sealed air-cooled chassis also has conductive adhesive strips on the mounting surfaces of the functional units and the heat sink.

[0014] In the aforementioned modular sealed air-cooled chassis, the top surface of the functional components is in close contact with the bottom of the heat sink structural frame, or a thermally conductive pad is provided between the top surface of the functional components and the bottom of the heat sink structural frame.

[0015] The aforementioned modular sealed air-cooled chassis also includes a guide structure between the fan unit and the heat sink, and between the heat sink and the functional unit. The guide structure includes guide pins and guide pin holes.

[0016] Compared with the prior art, this utility model has significant advantages and beneficial effects. Through the above technical solution, this utility model achieves considerable technological advancement and practicality, and has broad application value, possessing at least the following advantages:

[0017] (1) The modular combined sealed air-cooled chassis of this utility model adopts a modular assembly structure, which is convenient for installation and disassembly. The guide structure can guide the fan unit, functional unit and heat sink to be quickly aligned and installed. When disassembly and maintenance are required, if only the fan unit needs to be maintained, only the cover plate needs to be removed to maintain the inside of the fan unit. If only the functional unit needs to be maintained, only the functional unit needs to be removed from the bottom of the heat sink. Therefore, this utility model can maintain the fan unit and functional unit independently without disassembling them completely, which simplifies the maintenance operation and shortens the maintenance time.

[0018] (2) The functional components in the functional unit of this utility model are closely attached to the bottom of the heat sink, resulting in a short heat conduction path and high heat conduction efficiency, thus improving heat dissipation efficiency. Furthermore, this utility model can detect the ambient temperature information in the functional unit in real time and transmit the temperature information to the circuit board of the fan unit via a connector, automatically adjusting the cooling fan speed according to the temperature information. Moreover, operators can also manually adjust the fan speed as needed to achieve heat dissipation and cooling of the functional unit. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model.

[0020] Figure 2 This is a schematic diagram of the internal structure of the fan unit.

[0021] Figure 3 This is a schematic diagram of the bottom structure of the fan unit.

[0022] Figure 4 This is a schematic diagram of the radiator structure.

[0023] Figure 5 This is a schematic diagram of the bottom structure of the radiator.

[0024] Figure 6 This is a schematic diagram of the internal structure of a functional unit.

[0025] [Component and Symbol Explanation]

[0026] 1-Fan unit, 2-Heat sink, 3-Functional unit, 4-Screw hole I, 5-Screw hole IV, 6-Guide pin hole I;

[0027] 11-Power supply interface, 12-Fan switch, 3-Power module, 14-Cooling fan, 15-Circuit board, 16-Cover plate, 17-First connector, 18-Ventilation window, 19-Mounting flange;

[0028] 21-Structural frame, 22-Second connector, 23-Wire groove, 24-Third connector, 25-Heat dissipation fins, 26-Screw hole II, 27-First guide pin, 28-Third guide pin, 29-Screw hole III;

[0029] 31-Functional unit housing, 32-Functional circuit board, 321-Functional device, 322-Internal adapter connector, 33-Fourth connector, 34-External interface connector, 35-Guide pin hole II, 36-Guide pin hole III. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below in conjunction with specific embodiments and accompanying drawings. Obviously, the described features are only a part of the embodiments of this utility model, not all of them. Therefore, the following detailed description of this utility model provided in the accompanying drawings is not intended to limit the scope of protection claimed, but merely to illustrate selected embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments described below without creative effort are within the scope of protection of this utility model.

[0031] It should be noted that the directional terms such as "upper", "lower", "top", "bottom", and "side" used in this utility model are based on the directions shown in the accompanying drawings only and do not represent a limitation on this utility model.

[0032] like Figure 1 As shown, the modular sealed air-cooled chassis provided by this utility model includes a fan unit 1, a heat sink 2 and a functional unit 3. The fan unit 1 and the functional unit 3 are respectively detachably installed on the top and bottom of the heat sink.

[0033] In one embodiment, the fan unit 1 and the heat sink, as well as the functional unit 3 and the heat sink, are detachably connected by screws, but this description is not intended to limit the present invention.

[0034] like Figure 2 As shown, the fan unit 1 includes a fan unit housing and a cover plate 16 detachably connected to the fan unit housing. The cover plate 16 is installed on the top of the fan unit housing and detachably connected to the fan unit housing by screws. A power supply interface 11 and a fan switch 12 are provided on the side of the fan unit housing. A power module 13, a cooling fan 14, and a circuit board 15 are housed inside the fan unit housing. One end of the power supply interface 11 is connected to an external power source, and the other end is connected to the power module 13 to supply power to the power module 13. The power module 13 is also connected to the cooling fan 14 and the circuit board 15. The fan switch 12 and the cooling fan 14 are also connected to the circuit board 15. The fan switch allows manual control of the cooling fan to turn on or off and adjust the cooling fan speed.

[0035] In one embodiment, the fan switch is further provided with an automatic speed adjustment mode, and the circuit board is further provided with a chip (not shown in the figure) for automatically adjusting the speed of the cooling fan. When the fan switch is adjusted to the automatic speed adjustment mode, the chip can automatically adjust the speed of the cooling fan.

[0036] A first connector 17 is located at the bottom of the fan unit housing, with its mating end facing downwards for interlocking with a second connector 22 in the heat sink to achieve signal transmission. In one embodiment, the first connector 17 is connected to a chip on a circuit board via printed circuit board traces.

[0037] Ventilation windows 18 are also provided at the bottom of the fan unit housing and on the cover plate, with the positions of the ventilation windows corresponding to the positions of the cooling fans. The ventilation window at the bottom of the fan unit housing is the air inlet, and the ventilation window on the cover plate is the air outlet.

[0038] exist Figures 1-3 In the embodiment shown, two cooling fans are provided in the fan unit housing, but the present invention is not limited to this, and one or more cooling fans may be provided as needed.

[0039] like Figure 3 As shown, the bottom of the fan unit housing is provided with screw hole I 4 for detachable assembly to the top of the heatsink by screws.

[0040] In one embodiment, a mounting flange 19 is provided at the bottom of the fan unit housing, through which quick-release screws can be installed to fix the fan unit to the heat sink.

[0041] like Figure 4 As shown, the heat sink includes a structural frame 21 and heat dissipation fins 25 disposed within the structural frame. The heat dissipation fins and the structural frame can be integrally machined or connected by welding. The structural frame includes a base plate and two opposing side plates perpendicularly connected to the base plate. Screw holes II 26 are provided at the top of the side plates of the structural frame, corresponding to screw holes I at the bottom of the fan unit. The fan unit is detachably fixed to the heat sink by installing screws in screw holes I and screw holes II.

[0042] Preferably, the axial direction of the side plate of the radiator structure frame is parallel to the axial direction of the heat dissipation fins, and the two ends of the radiator axial direction are ventilation openings, which can maximize the heat dissipation effect.

[0043] The base plate of the radiator structural frame is also equipped with a second connector 22 and a third connector 24. The second connector has its mating end facing upwards and is used to mate with the first connector to achieve signal transmission. The third connector has its mating end facing downwards and is used to mate with the fourth connector 33 in the functional unit to achieve signal transmission. The second and third connectors are connected by a cable, which is installed in a cable groove 23 opened on the base plate of the structural frame.

[0044] like Figure 5 As shown, the bottom of the radiator structure frame is provided with screw holes Ⅲ29 for connection with functional units.

[0045] like Figure 6 As shown, the functional unit includes a functional unit housing 31, a functional circuit board 32 disposed within the housing, a functional device 321 and an internal adapter connector 322 disposed on the circuit board, the internal adapter connector 322 being connected to the functional device 321 for input or output signals. An external interface connector 34 is also disposed on the side of the functional unit housing, and the internal adapter connector 322 is connected to the external interface connector 34 via a cable for outputting signals or transmitting external signals to the internal adapter connector 322 via the external interface connector, and then from the internal adapter connector to the functional device 321.

[0046] In one embodiment, the functional device 321 includes a CPU, a DC / DC module, a temperature sensor, an LDO (low dropout linear regulator), a clock chip, etc. The above description is not intended to limit the present invention.

[0047] The functional unit housing also includes a fourth connector 33, with its mating end facing upwards for mating with the third connector on the base plate of the radiator structural frame. The fourth connector is also connected to a temperature sensor mounted on the functional circuit board 32. The temperature sensor detects the ambient temperature within the functional unit and transmits the temperature data to the fourth connector. The fourth connector connects to the third connector, the third connector connects to the second connector, the second connector connects to the first connector, and the first connector connects to the circuit board in the fan unit. Therefore, the real-time temperature data detected by the temperature sensor is transmitted via these four connectors to a chip on the fan unit circuit board. Upon receiving the temperature information, the chip adjusts the speed of the cooling fan, achieving automatic speed control.

[0048] The functional unit housing is also provided with screw holes IV5. The position of screw hole IV corresponds to the position of screw hole III provided at the bottom of the heat sink. The functional unit can be detachably fixed to the bottom of the heat sink by installing screws in screw holes III and screw holes IV.

[0049] Furthermore, conductive adhesive strips are provided on the mounting surfaces of the functional units and heat sinks to meet electromagnetic shielding requirements.

[0050] After the functional unit and heat sink are installed, ensure that the top surface of the functional device 321 is in close contact with the bottom of the heat sink to ensure heat transfer. Furthermore, a thermally conductive pad can be added between the top surface of the functional device 321 and the bottom of the heat sink. This pad can fill the gap between the top surface of the functional device 321 and the bottom of the heat sink, improving heat conduction.

[0051] In one embodiment, the fan unit and functional unit are further assembled to the heat sink via a primary guide structure. The primary guide structure may be a guide pin and a guide pin hole guide structure.

[0052] exist Figures 1-6 In the illustrated embodiment, a guide pin hole I is provided at the bottom of the fan unit housing, and a guide pin hole II 35 is provided at the top of the side wall of the functional unit housing. Correspondingly, a first guide pin 27 and a second guide pin 30 are mounted on the side plate of the heat sink structural frame. The first guide pin is used to cooperate with guide pin hole I to guide the fan unit to be aligned and installed with the heat sink, and the second guide pin is used to cooperate with guide pin hole II 35 to guide the functional unit to be aligned and installed with the heat sink. The primary guiding structure allows the fan unit and the functional unit to be quickly aligned and installed with the heat sink.

[0053] The first guide pin 27 and the second guide pin 30 can be a single integrated guide pin, installed in the structural frame of the radiator and with both ends exposed, or they can be two independent guide pins.

[0054] The third connector on the heat sink and the fourth connector in the functional unit can be aligned and mated via a secondary guide structure. The secondary guide structure can also employ a guide pin and guide pin hole structure.

[0055] exist Figure 5 and Figure 6 In the embodiment shown, the third connector on the heat sink is provided with a third guide pin 28, and the fourth connector in the functional unit is provided with a guide pin hole Ⅲ 36. When the functional unit and the heat sink are installed in alignment, the third connector and the fourth connector are quickly aligned and inserted by the guiding effect of the third guide pin and the guide pin hole Ⅲ.

[0056] In other embodiments, the guide pins and corresponding guide pin holes may be interchanged.

[0057] The aforementioned modular sealed air-cooled chassis of this utility model allows for the rapid alignment and installation of the heat sink and functional units under the guidance of the second guide pin and guide pin hole II, and the third guide pin and guide pin hole III. After installation, the functional components in the functional unit are in close contact with the heat sink, or a thermally conductive pad is added between the functional components and the heat sink to improve heat conduction. Then, screws are inserted from screw hole IV to screw hole III and tightened to secure the heat sink to the functional unit. Next, the fan unit is aligned and installed with the heat sink under the guidance of the first guide pin and guide pin hole I, and screws are inserted from screw hole I to screw hole II and tightened to secure the fan unit to the heat sink. Finally, the cover plate is installed on the fan unit housing to complete the assembly.

[0058] During operation, the heat generated by the functional components on the functional circuit board is transferred to the bottom of the heat sink. The heat sink's structural frame and heat dissipation fins are made of highly thermally conductive materials. After the heat is transferred to the heat dissipation fins, cool air enters from both ends of the heat dissipation fins under the action of the cooling fan, carrying away the heat from the fins, and then is exhausted from the ventilation window at the top of the fan unit (as shown by the arrow in Figure 1). The temperature information inside the functional unit is detected by a temperature sensor and transmitted to the first connector via the fourth, third, and second connectors. The first connector then transmits the information to the chip on the fan unit circuit board, which adjusts the fan speed based on the temperature information. Furthermore, the operator can also manually adjust the fan speed as needed to achieve heat dissipation and cooling of the functional unit.

[0059] When disassembly and repair are required, if only the fan unit needs maintenance, only the cover plate on the fan unit needs to be removed. If only the functional unit needs maintenance, only the functional unit needs to be removed from the bottom of the heat sink. Therefore, this invention allows for independent maintenance of the fan unit and the functional unit without complete disassembly, simplifying maintenance operations, shortening maintenance time, and improving maintenance efficiency. At the same time, the functional components in the functional unit are directly attached to the bottom of the heat sink, resulting in a short heat conduction path, high heat conduction efficiency, and improved heat dissipation efficiency.

[0060] The above description is merely an embodiment of this utility model and is not intended to limit the utility model in any way. This utility model can also have other embodiments based on the above structure and function, which will not be listed hereafter. Therefore, any simple modifications, equivalent changes, and alterations made by those skilled in the art to the above embodiments based on the technical essence of this utility model without departing from the scope of the utility model's technical solution shall still fall within the scope of the utility model's technical solution.

Claims

1. A modular, hermetic, air-cooled chassis, characterized in that, The system includes a fan unit (1), a heat sink (2), and a functional unit (3). The fan unit includes a fan unit housing and a cover plate (16) detachably connected to the fan unit housing. The fan unit housing contains a power module (13), a cooling fan (14), and a circuit board (15) connected to the power module. The heat sink includes a structural frame (21) and a heat dissipation structure disposed within the structural frame. The functional unit includes a functional unit housing (31), a functional circuit board (32) disposed within the functional unit housing, a functional device (321) disposed on the functional circuit board, and an internal adapter connector (322) connected to the functional device. The internal adapter connector is also connected to an external interface connector (34) disposed on the functional unit housing. The fan unit housing and the functional unit housing are detachably installed on opposite sides of the structural frame. At least one side of the structural frame distributed circumferentially has an air inlet, and the cover plate has an air outlet.

2. The modular, sealed, air-cooled chassis as described in claim 1, characterized in that, The fan unit housing is also equipped with a power supply interface (11), which is connected to an external power supply and power module.

3. The modular, sealed, air-cooled chassis as described in claim 1, characterized in that, A first connector (17) is provided on the fan unit housing, a fourth connector (33) is provided in the functional unit housing, and a second connector (22) adapted to the first connector and a third connector (24) adapted to the fourth connector are provided on the structural frame (21). The second connector and the third connector are connected by a cable.

4. The modular combined hermetic air-cooled chassis as described in claim 3, characterized in that, A temperature sensor is provided on the functional circuit board, and the temperature sensor is connected to the fourth connector; a chip is also provided on the circuit board (15), and the chip is connected to the first connector and the cooling fan.

5. The modular, sealed, air-cooled chassis as described in claim 1, characterized in that, A fan switch (12) is provided on the fan unit housing, and the fan switch (12) is connected to the circuit board (15).

6. The modular, sealed, air-cooled chassis as described in claim 1, characterized in that, The functional components include a CPU, a DC / DC module, a temperature sensor, an LDO, and a clock chip.

7. The modular combined hermetic air-cooled chassis as described in any one of claims 1-6, characterized in that, The heat dissipation structure includes heat dissipation fins.

8. The modular, sealed, air-cooled chassis as described in any one of claims 1-6, characterized in that, Conductive adhesive strips are provided on the mounting surfaces of the functional units and heat sinks.

9. The modular, hermetic air-cooled chassis as described in any one of claims 1-6, characterized in that, The functional components are in close contact with the structural frame, or a thermally conductive pad is placed between the functional components and the structural frame.

10. The modular, hermetic air-cooled chassis as described in any one of claims 1-6, characterized in that, A guide structure is provided between the fan unit housing and the structural frame, and between the structural frame and the functional unit housing. The guide structure includes a guide pin and a guide pin hole.

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