A rod-shaped laser crystal packaging device

Abstract

This invention discloses a rod-shaped laser crystal packaging device, relating to the field of laser technology. The rod-shaped laser crystal packaging device includes a protective sleeve, a heat sink, a semiconductor cooler, and a base. The protective sleeve has placement holes, into which the rod-shaped laser crystal is placed and welded to the inner wall of the protective sleeve. Both ends of the rod-shaped laser crystal protrude a certain distance from the placement holes. After orienting the rod-shaped laser crystal, the protective sleeve is marked with the crystal orientation. The heat sink has mounting holes, into which the protective sleeve is embedded and welded to the heat sink. The semiconductor cooler is supported below the heat sink. The base is located below the semiconductor cooler. By protruding a certain distance from the placement holes at both ends of the rod-shaped laser crystal, contact between the end faces of the rod-shaped laser crystal and the welding point is physically isolated during welding, avoiding damage to the laser crystal end faces caused by high temperatures during welding. The protective sleeve encapsulates the rod-shaped laser crystal before being placed in the heat sink, facilitating the orientation of the rod-shaped laser crystal.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a rod-shaped laser crystal packaging device. Background Technology

[0002] As the power of solid-state lasers continues to increase, the heat generated by the laser crystal has an increasingly significant impact on laser efficiency. Therefore, encapsulating the laser crystal into a temperature control system is an indispensable step in laser assembly. In the traditional rod-shaped laser crystal packaging process, the rod-shaped laser crystal 100 is first processed, polished, and coated, then soldered to the heat sink 2, and subsequently connected to the TEC (thermal condenser cooler) 3 and the base 4, as shown below. Figure 1 As shown.

[0003] However, the traditional laser crystal packaging process involves coating the rod-shaped laser crystal 100 and then soldering it to the heat sink 2. In actual operation, the rod-shaped laser crystal 100 is wrapped with indium foil, and then the front end of the rod-shaped laser crystal 100 is aligned with the end face of the heat sink for soldering. Since the front end of the rod-shaped laser crystal 100 is extremely close to the soldering point, the end face of the rod-shaped laser crystal 100 and its coating layer may be damaged during soldering. At the same time, for rod-shaped laser crystals 100 with small size (such as about 1 mm), it is also very difficult to orient them when placed in the overall device. Utility Model Content

[0004] In view of this, the present invention proposes a rod-shaped laser crystal packaging device to solve the technical problems mentioned in the background art, which are that when aligning the front end of the rod-shaped laser crystal with the heat sink end face for welding, the end face of the rod-shaped laser crystal and its film layer are likely to be damaged; and that the orientation of small rod-shaped laser crystals is very difficult.

[0005] The technical solution of this utility model is implemented as follows:

[0006] This utility model provides a rod-shaped laser crystal packaging device, including a protective sleeve, a heat sink, a semiconductor cooler, and a base, wherein:

[0007] The protective sleeve has a placement hole, in which the rod-shaped laser crystal is placed and welded to the inner wall of the protective sleeve. Both ends of the rod-shaped laser crystal protrude a certain distance from the placement hole. After the protective sleeve orients the rod-shaped laser crystal, the crystal orientation is marked on the protective sleeve.

[0008] The heat sink has an installation hole, the protective sleeve is embedded in the installation hole and welded to the heat sink;

[0009] The semiconductor cooler is supported below the heat sink;

[0010] The base is positioned below the semiconductor cooler.

[0011] Based on the above technical solutions, preferably, the rod-shaped laser crystal is wrapped with indium foil and then inserted into the protective sleeve. The indium foil is heated and melted to weld the rod-shaped laser crystal and the inner wall of the protective sleeve.

[0012] Based on the above technical solutions, preferably, one end of the rod-shaped laser crystal is aligned with the end face of the protective sleeve.

[0013] Based on the above technical solutions, preferably, the length of the protective sleeve is less than the length of the heat sink, and the entire protective sleeve is located inside the heat sink.

[0014] Based on the above technical solutions, preferably, the protective sleeve is circular or square in shape.

[0015] Based on the above technical solutions, preferably, the material of the protective sleeve and the material of the heat sink are the same.

[0016] Based on the above technical solutions, preferably, the base is equipped with a water cooling device.

[0017] Based on the above technical solutions, preferably, all welding is performed with indium foil wrapped around the foil at 157°C.

[0018] The rod-shaped laser crystal packaging device of this invention has the following advantages over the prior art:

[0019] (1) The rod-shaped laser crystal protrudes a distance from the placement hole at both ends, which physically isolates the end face of the rod-shaped laser crystal from the welding point during the welding process, thus avoiding damage to the end face of the laser crystal caused by high temperature during welding; the whole consisting of the protective sleeve and the rod-shaped laser crystal is larger than the size of the rod-shaped laser crystal, which makes it easier to orient the rod-shaped laser crystal, and the direction can be marked on the protective sleeve for subsequent processes.

[0020] (2) After the indium foil is wrapped around the rod-shaped laser crystal, it is inserted into the protective sleeve. The indium foil is heated and melted to weld the rod-shaped laser crystal and the inner wall of the protective sleeve, ensuring that the welded part does not contact the end face of the rod-shaped laser crystal and will not cause damage to the end face of the cut rod-shaped laser crystal, thereby improving the reliability of the device.

[0021] (3) Aligning one end of the rod-shaped laser crystal with the end face of the protective sleeve facilitates subsequent encapsulation processes;

[0022] (4) Since the length of the protective sleeve is less than the length of the heat sink, the entire protective sleeve is located inside the heat sink, which facilitates the heat sink to regulate the temperature of the protective sleeve and the rod-shaped laser crystal. The temperature regulation uniformity is better, which can improve reliability. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a cross-sectional view of the rod-shaped laser crystal packaging device in the background art of this utility model;

[0025] Figure 2 This is a cross-sectional view of the rod-shaped laser crystal packaging device in an embodiment of the present invention;

[0026] Figure 3 This is a perspective view of the rod-shaped laser crystal packaging device in an embodiment of the present invention;

[0027] Figure 4 This is a front view of the protective sleeve fitted with the rod-shaped laser crystal in an embodiment of the present invention;

[0028] Figure 5 This is a side view of the protective sleeve (circular) containing the rod-shaped laser crystal in an embodiment of the present invention;

[0029] Figure 6 This is a side view of the protective sleeve (square) in an embodiment of the present invention, in which a rod-shaped laser crystal is inserted.

[0030] Explanation of reference numerals in the attached diagram: 1-protective cover, 2-heat sink, 3-thermal cooler, 4-base;

[0031] 100-Ring laser crystal;

[0032] 11-Placement hole;

[0033] 21-Mounting hole. Detailed Implementation

[0034] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0035] Reference Figures 2-6 As shown in the embodiment of this utility model, a rod-shaped laser crystal packaging device is proposed, including a protective sleeve 1, a heat sink 2, a semiconductor cooler 3, and a base 4, wherein:

[0036] The protective sleeve 1 has a placement hole 11 inside, and the rod-shaped laser crystal 100 is placed in the placement hole 11 and welded to the inner wall of the protective sleeve 1. The length of the protective sleeve 1 is slightly shorter than that of the laser crystal, and both ends of the rod-shaped laser crystal 100 protrude a certain distance from the placement hole 11. After the protective sleeve 1 orients the rod-shaped laser crystal 100, the crystal direction is marked on the protective sleeve 1. The protective sleeve 1 is made of metal, which can conduct heat well.

[0037] The heat sink 2 is provided with a mounting hole 21, and the protective sleeve 1 is embedded in the mounting hole 21 and welded to the heat sink 2;

[0038] The semiconductor cooler 3 is supported below the heat sink 2 and is used to monitor and control the temperature of the heat sink 2. When the temperature of the heat sink 2 is higher than the target temperature, it transfers the heat of the heat sink 2 downward to the next level base 4; when the temperature of the heat sink 2 is lower than the target temperature, it heats itself and conducts the heat into the heat sink 2.

[0039] The base 4 is located below the semiconductor cooler 3.

[0040] The heat sink 2 encloses the protective sleeve 1, which in turn encloses the rod-shaped laser crystal 100. Below the heat sink 2 are the semiconductor cooler 3 and the base 4. Together, these five parts constitute the packaging system.

[0041] The rod-shaped laser crystal packaging device proposed in this embodiment has the rod-shaped laser crystal 100 protruding from the placement hole 11 by a certain distance at both ends. During the welding process, the end face of the rod-shaped laser crystal 100 is physically isolated from the welding point, avoiding damage to the end face of the laser crystal caused by high temperature or other reasons during welding. The whole formed by the protective sleeve 1 and the rod-shaped laser crystal 100 is larger than the rod-shaped laser crystal 100, which makes it easier to orient the rod-shaped laser crystal 100. At the same time, the orientation can be marked on the protective sleeve 1 to facilitate subsequent processes.

[0042] In some embodiments, the rod-shaped laser crystal 100 is wrapped with indium foil and inserted into the protective sleeve 1. The indium foil is heated to melt it, thereby welding the rod-shaped laser crystal 100 and the inner wall of the protective sleeve 1. This welding method ensures that the weld joint does not contact the end face of the rod-shaped laser crystal 100 and does not damage the cut end face of the rod-shaped laser crystal 100, thus improving the reliability of the device.

[0043] In some embodiments, before the protective sleeve 1 is inserted into the mounting hole 21, one end of the rod-shaped laser crystal 100 is cut off to align with the end face of the protective sleeve 1. The rod-shaped laser crystal 100 is shaved off during laser crystal processing, polishing, coating, and other processes to align its front end with the end face of the protective sleeve 1, facilitating subsequent packaging processes.

[0044] In some embodiments, the length of the protective sleeve 1 is less than the length of the heat sink 2, and the protective sleeve 1 is entirely located inside the heat sink 2. This arrangement facilitates temperature control of the protective sleeve 1 and the rod-shaped laser crystal 100 by the heat sink 2, resulting in better temperature uniformity and improved reliability.

[0045] In some embodiments, the protective sleeve 1 is circular in shape, and the shape of the internal placement hole 11 is just right to insert the rod-shaped laser crystal 100.

[0046] In some embodiments, the protective sleeve 1 is square or other polygonal in shape (e.g., triangle, pentagon, hexagon, etc.).

[0047] In some embodiments, the protective sleeve 1 is made of the same material as the heat sink 2, namely brass or copper.

[0048] In some embodiments, the base 4 is equipped with a water-cooling device. The water-cooling device inside the base 4 uses water flow to remove the heat transferred by the semiconductor cooler 3, enabling it to operate normally and stably.

[0049] In some embodiments, all welding is performed with indium foil wrapped around the foil at 157°C.

[0050] The following two specific experimental examples illustrate the working process of the rod-shaped laser crystal packaging device:

[0051] Experimental Example 1

[0052] In this experimental example, the protective sleeve 1 is circular, and the specific encapsulation method is as follows:

[0053] S11: Wrap an unprocessed rod-shaped laser crystal 100 with a radius of 1 mm with an indium foil of 0.02 mm thickness, insert it into a protective sleeve 1 with an inner diameter of 1.021 mm and an outer diameter of 10 mm, leaving the front and rear ends of the rod-shaped laser crystal 100 exposed, heat the indium foil to 157°C to melt it, and weld the rod-shaped laser crystal 100 and the inner wall of the protective sleeve 1 together;

[0054] S12: Process the rod-shaped laser crystal 100 through processes such as processing, polishing, and coating to align the front end of the rod-shaped laser crystal 100 with the end face of the protective sleeve 1. Then, orient the rod-shaped laser crystal 100 and mark the measured crystal direction on the protective sleeve 1.

[0055] S13: Wrap the protective sleeve 1 with 0.02mm indium foil, place it in the brass heat sink 2, heat the indium foil to 157℃ to melt it, and weld the protective sleeve 1 to the heat sink 2.

[0056] S14: After the protective sleeve 1 is welded to the heat sink 2, it is connected to the semiconductor cooler 3 and the whole assembly is connected to the base 4.

[0057] Experimental Example 2

[0058] In this experimental example, protective sleeve 1 is square, and the specific encapsulation method is as follows:

[0059] S21: Orient the unprocessed rod-shaped laser crystal 100 with a radius of 3mm, record the crystal orientation, wrap the rod-shaped laser crystal 100 with an indium foil with a thickness of 0.05mm, select a square protective sleeve 1 with an inner diameter of 3.051mm and an outer side length of 20mm, align the orientation of the rod-shaped laser crystal 100 with one end face of the square protective sleeve 1 and insert it into the protective sleeve 1 so that both the front and rear ends of the rod-shaped laser crystal 100 are exposed, and mark the crystal orientation on the end face of the square protective sleeve 1.

[0060] S22: Process the rod-shaped laser crystal 100 through processes such as processing, polishing, and coating to align the front end of the rod-shaped laser crystal 100 with the end face of the protective sleeve 1.

[0061] S23: Wrap the protective sleeve 1 with an indium foil with a thickness of 0.05mm, place it in a heat sink 2 made of copper, heat the indium foil to 157℃ to melt it, and weld the protective sleeve 1 to the heat sink 2;

[0062] S24: After the protective sleeve 1 is welded to the heat sink 2, it is connected to the semiconductor cooler 3 and the whole assembly is connected to the base 4.

[0063] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A rod-shaped laser crystal packaging device, characterized in that, Includes a protective case, heat sink, thermoelectric cooler, and base, wherein: The protective sleeve has a placement hole, in which the rod-shaped laser crystal is placed and welded to the inner wall of the protective sleeve. Both ends of the rod-shaped laser crystal protrude from the placement hole by a certain distance. After the protective sleeve orients the rod-shaped laser crystal, the crystal orientation is marked on the protective sleeve. The heat sink has an installation hole, the protective sleeve is embedded in the installation hole and welded to the heat sink; The semiconductor cooler is supported below the heat sink; The base is positioned below the semiconductor cooler.

2. The rod-shaped laser crystal packaging device as described in claim 1, characterized in that, The rod-shaped laser crystal is wrapped with indium foil and inserted into the protective sleeve. The indium foil is heated and melted to weld the rod-shaped laser crystal and the inner wall of the protective sleeve.

3. The rod-shaped laser crystal packaging device as described in claim 1, characterized in that, One end of the rod-shaped laser crystal is aligned with the end face of the protective sleeve.

4. The rod-shaped laser crystal packaging device as described in claim 1, characterized in that, The length of the protective sleeve is less than the length of the heat sink, and the entire protective sleeve is located inside the heat sink.

5. The rod-shaped laser crystal packaging device as described in claim 1, characterized in that, The protective sleeve is circular or square in shape.

6. The rod-shaped laser crystal packaging device as described in claim 1, characterized in that, The protective sleeve is made of the same material as the heat sink.

7. The rod-shaped laser crystal packaging device as described in claim 1, characterized in that, The base is equipped with a water cooling device.

8. The rod-shaped laser crystal packaging device according to any one of claims 1-7, characterized in that, All welding was performed with indium foil wrapped around the foil at 157°C.

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