A thermal imaging camera interlock control system for photovoltaic array monitoring

Abstract

The utility model relates to a kind of thermal imaging camera interlocking control system for photovoltaic array monitoring, including thermal imaging camera, thermal imaging camera is provided with support, thermal imaging camera is set on photovoltaic panel top by support, the detection range of thermal imaging camera covers photovoltaic array;It further includes control module, control module includes first communication module and embedded processor, embedded processor is connected with thermal imaging camera communication by first communication module, embedded processor is also connected with central controller by first communication module, the input end of embedded processor is connected with light intensity sensor;Central controller is connected with second communication module, and central controller connects multiple circuit breakers by second communication module.The utility model sets thermal imaging camera to detect photovoltaic array, data processing is carried out by control module and is transmitted to central controller, and central controller controls each circuit breaker, provides hardware basis for fire detection and processing.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic array monitoring technology, specifically to an interlocking control system for a thermal imaging camera used for photovoltaic array monitoring. Background Technology

[0002] With the large-scale application of photovoltaic modules on industrial plant roofs, the fire risk caused by hot spot effects, aging wiring, and arcing faults has increased significantly. Traditional photovoltaic systems primarily rely on the following technologies for fire protection:

[0003] (1) Temperature sensor monitoring (install point temperature sensor on the back of photovoltaic panel or junction box), (2) Smoke detector (installed inside factory to detect gas produced after combustion), (3) Infrared thermometer and (4) Manual circuit breaker protection;

[0004] Problems with existing technology:

[0005] 1. Monitoring blind spots and missed detections: Point-type temperature sensors require dense deployment, which is costly and cannot scan the entire photovoltaic panel surface in real time. Localized high temperatures caused by hot spot effects may be located in sensor blind spots, making them difficult to detect in a timely manner with current technology.

[0006] 2. Poor false alarm and anti-interference capabilities: In outdoor environments, direct sunlight and cloud reflection may cause infrared thermometers to misjudge. Smoke detectors frequently trigger false alarms in dusty industrial environments and cannot distinguish between fire and dust.

[0007] 3. Insufficient response delay and linkage: Existing systems mostly use audible and visual alarms, but they are not directly linked to circuit breakers. The average time from alarm to manual power disconnection is >5 minutes. High-voltage arcs exist on the photovoltaic DC side, and traditional AC circuit breakers have insufficient breaking speed.

[0008] 4. Low level of intelligence. Summary of the Invention

[0009] To address the problems existing in current large-scale photovoltaic array fire monitoring, this utility model proposes a thermal imaging camera interlocking control system for photovoltaic array monitoring. The system uses thermal imaging cameras to detect the photovoltaic array, processes the data through a control module, and transmits it to a central controller. The central controller then controls each circuit breaker, providing a hardware foundation for fire detection and handling.

[0010] To achieve the above objectives, this utility model proposes an interlocking control system for a thermal imaging camera for monitoring a photovoltaic array, comprising a photovoltaic array with multiple photovoltaic panels arranged at equal intervals. Each photovoltaic panel is equipped with an inverter circuit, the output terminal of which is connected to a power grid. A circuit breaker is installed between the output terminal of the inverter circuit and the power grid. At least one thermal imaging camera is installed in the area where the photovoltaic array is located. The thermal imaging camera is equipped with a bracket and is mounted above the photovoltaic panel via the bracket. The detection range of the thermal imaging camera covers the photovoltaic array.

[0011] It also includes a control module, which includes a first communication module and an embedded processor. The embedded processor is connected to the thermal imaging camera through the first communication module. The embedded processor is also connected to a central controller through the first communication module. The input terminal of the embedded processor is connected to a light intensity sensor.

[0012] The central controller is connected to a second communication module, and the central controller is connected to multiple circuit breakers through the second communication module.

[0013] Furthermore, the first communication module includes one or more combinations of RS485 module, Bluetooth module and LoRa module;

[0014] The embedded processor includes an MCU chip, and the output of the light intensity sensor is communicatively connected to the MCU chip.

[0015] The MCU chip communicates with the thermal imaging camera via an RS485 module, and wirelessly connects with the central controller via a Bluetooth module or a LoRa module.

[0016] A light intensity sensor is set up to detect the current light intensity, providing the hardware basis for environmental compensation of the detection data from the thermal imaging camera based on light intensity. (Dynamically filtering out interference from sunlight reflection)

[0017] Furthermore, the second communication module includes one or more combinations of RS485 module, Modbus module and LoRa module;

[0018] The central controller includes a PLC controller, and the output of the PLC controller is connected to the coil of the circuit breaker through a second communication module.

[0019] The PLC controller communicates with the MCU chip via a LoRa module, and the PLC controller is electrically connected to the circuit breaker coil via an RS485 module or a Modbus module.

[0020] Furthermore, the output terminal of the PLC controller is electrically connected to an audible and visual alarm;

[0021] The PLC controller is connected to the host computer via a second communication module.

[0022] The PLC controller is electrically connected to the audible and visual alarm, providing the hardware foundation for providing audible and visual alarms.

[0023] Furthermore, the support includes a top frame, legs, and a mounting frame. The top frame has a grid-like structure, and the legs are provided at the corners of the top frame. The legs have an I-shaped structure, with the upper end of the legs fixed to the top frame by bolts and the lower end of the legs connected to the ground by bolts.

[0024] The top frame has a detachable mounting bracket on its horizontal section and vertical end, and the thermal imaging camera is fixedly mounted on the lower end of the mounting bracket.

[0025] The thermal imaging camera should be positioned at a certain distance from the photovoltaic array so that its detection range covers the array. A support bracket should be provided to give the thermal imaging camera a stable detection position, allowing the detection range to be set up reasonably.

[0026] Furthermore, the mounting bracket includes a fixing plate and a side plate. The fixing plate is a vertically arranged U-shaped plate. The groove of the fixing plate fits against the side of the transverse section and the longitudinal end of the top frame, and the end face of the fixing plate is flush with the other side of the transverse section and the longitudinal end.

[0027] The side plate is a rectangular plate, and threaded holes are opened on the end faces of the side plate and the fixed plate respectively. The side plate and the fixed plate are fixed by bolts. When the side plate and the fixed plate are fixed, the transverse section and the longitudinal end of the top frame are clamped.

[0028] The lower end face of the fixing plate is fixedly connected to the thermal imaging camera.

[0029] The mounting bracket connects to the top frame and the thermal imaging camera. The mounting bracket can be installed on the horizontal and vertical sections of the top frame as needed, facilitating installation and maintenance by staff.

[0030] The beneficial effects of this utility model through the above technical solution are as follows:

[0031] This invention enables fire monitoring of photovoltaic arrays. A support bracket positions thermal imaging cameras above the photovoltaic array, dividing the array into multiple areas. Thermal imaging technology enables full-field temperature matrix scanning, overcoming blind spots and missed detections in existing methods. Data from a single thermal imaging camera is transmitted to an embedded processor via a first communication module. The embedded processor corresponds one-to-one with each thermal imaging camera, and after processing, outputs an electrical signal to the central controller, resolving false alarms in existing methods. The central controller, via a second communication module, controls the energization of circuit breaker coils connected to the photovoltaic panels within that area. In the event of a fire, the embedded processor outputs detection parameters, and the central controller de-energizes the circuit breaker coils, causing the circuit breaker to reset and disconnecting the burning photovoltaic panel. Simultaneously, an audible and visual alarm is activated, resolving the response delay and low intelligence issues of existing detection methods. Attached Figure Description

[0032] Figure 1 This is a structural diagram of a support frame for an interlocking control system of a thermal imaging camera for photovoltaic array monitoring according to the present invention.

[0033] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0034] Figure 3 This is one of the electrical schematic diagrams of an interlocking control system for a thermal imaging camera used for photovoltaic array monitoring according to this utility model;

[0035] Figure 4 This is the second electrical schematic diagram of the interlocking control system for a thermal imaging camera used for photovoltaic array monitoring according to this utility model.

[0036] Reference numerals: 1 is the inverter circuit, 2 is the circuit breaker, 3 is the thermal imaging camera, 4 is the first communication module, 5 is the embedded processor, 6 is the central controller, 7 is the light intensity sensor, 8 is the second communication module, 9 is the audible and visual alarm, 10 is the top frame, 11 is the support leg, 12 is the fixing plate, and 13 is the side plate. Detailed Implementation

[0037] Example 1

[0038] like Figures 1-4 As shown, a photovoltaic array monitoring thermal imaging camera interlocking control system includes a photovoltaic array with multiple photovoltaic panels arranged at equal intervals. Each photovoltaic panel is equipped with an inverter circuit 1, the output terminal of which is connected to the power grid. A circuit breaker 2 is installed between the output terminal of the inverter circuit 1 and the power grid. At least one thermal imaging camera 3 is installed in the area where the photovoltaic array is located. The thermal imaging camera is equipped with a bracket and is mounted above the photovoltaic panel via the bracket. The detection range of the thermal imaging camera 3 covers the photovoltaic array.

[0039] It also includes a control module, which includes a first communication module 4 and an embedded processor 5. The embedded processor 5 is connected to the thermal imaging camera 3 through the first communication module 4. The embedded processor 5 is also connected to a central controller 6 through the first communication module 4. The input terminal of the embedded processor 5 is connected to a light intensity sensor 7.

[0040] The central controller 6 is connected to a second communication module 8, and the central controller 6 is connected to multiple circuit breakers 2 through the second communication module 8.

[0041] The first communication module 4 includes one or more combinations of RS485 module, Bluetooth module and LoRa module;

[0042] The embedded processor 5 includes an MCU chip, and the output of the light intensity sensor 7 is communicatively connected to the MCU chip.

[0043] The second communication module 8 includes one or more combinations of RS485 module, Modbus module and LoRa module;

[0044] The central controller 6 includes a PLC controller, and the output of the PLC controller is connected to the coil of the circuit breaker 2 through the second communication module 8.

[0045] The output terminal of the PLC controller is electrically connected to an audible and visual alarm 9;

[0046] The PLC controller is connected to the host computer via the second communication module 8.

[0047] The support includes a top frame 10, legs 11 and a mounting frame. The top frame 10 has a grid-shaped structure. The legs 11 are provided at the corners of the top frame 10. The legs 11 have an I-shaped structure. The upper end of the legs 11 is fixed to the top frame 10 by bolts, and the lower end of the legs 11 is connected to the ground by bolts.

[0048] The top frame 10 has a detachable mounting bracket on its horizontal section and vertical end, and the thermal imaging camera 3 is fixedly mounted on the lower end of the mounting bracket.

[0049] The mounting bracket includes a fixing plate 12 and a side plate 13. The fixing plate 12 is a vertically arranged U-shaped plate. The groove of the fixing plate 12 fits against the side of the transverse section and the longitudinal end of the top frame 10, and the end face of the fixing plate 12 is flush with the other side of the transverse section and the longitudinal end.

[0050] The side plate 13 is a rectangular plate. The end faces of the side plate 13 and the fixing plate 12 are respectively provided with threaded holes. The side plate 13 and the fixing plate 12 are fixed by bolts. When the side plate 13 and the fixing plate 12 are fixed, the transverse section and the longitudinal end of the top frame 10 are clamped.

[0051] The lower end face of the fixing plate 12 is fixedly connected to the thermal imaging camera 3.

[0052] In this embodiment, the thermal imaging camera 3 is a Hikvision DS-2TD2628-7 / QA thermal imaging camera, the MCU chip is an STM32 microcontroller, the LoRa module is an ST67W611M1 chip, the PLC controller is a Siemens S7-1200, the light intensity sensor 7 is a BH1750 module, the circuit breaker 2 is a CW2-16001600A intelligent circuit breaker, and the audible and visual alarm 9 is a Hikvision DS-PS1-R audible and visual alarm.

[0053] The thermal imaging camera 3 communicates with the MCU chip via an RS485 module. The MCU chip communicates with the light intensity sensor 7 via an I2C serial port. The MCU chip communicates with the ST67W611M1 chip via a UART serial port.

[0054] The PLC controller is also equipped with a ZKD-8I8SO-WIFI chip. The PLC controller is connected to the coil of circuit breaker 2 via a Modbus module, and to the host computer via an RS485 module. The contacts of circuit breaker 2 are connected to inverter circuit 1.

[0055] Example 2

[0056] Based on Embodiment 1, a thermal imaging camera interlocking control system for photovoltaic array monitoring is described in this embodiment, which illustrates the fire detection process.

[0057] In a photovoltaic array, photovoltaic panels are arranged in a row and column matrix. One thermal imaging camera 3 can monitor 20-30 photovoltaic panels. The number of thermal imaging cameras 3 is determined according to the number of photovoltaic panels.

[0058] Taking a thermal imaging camera 3 monitoring 20 photovoltaic panels as an example, the photovoltaic panels are arranged in a 4x5 matrix. The temperature matrix data acquired by the thermal imaging camera 3 is correlated and calibrated according to the pixel position and the actual position of the photovoltaic panel. After the thermal imaging camera 3 acquires the temperature matrix, the embedded processor 5 accurately matches the temperature data in the matrix to each photovoltaic panel according to the pre-set mapping rules, thereby achieving accurate monitoring of the temperature of a single photovoltaic panel.

[0059] Meanwhile, the light intensity sensor 7 monitors the ambient light intensity in real time. The embedded processor 5 performs temperature compensation based on the ambient light intensity. When the temperature data corresponding to a certain photovoltaic panel exceeds 85℃, the embedded processor 5 determines that there is a fire risk and sends the photovoltaic panel number to the PLC controller. After receiving the fault signal, the PLC controller drives the audible and visual alarm 9 to sound an alarm, reminding maintenance personnel.

[0060] On the other hand, the PLC controller uses the Modbus module to control the circuit breaker 2 corresponding to that number to trip, cutting off the connection between the faulty photovoltaic panel and the power grid.

[0061] In addition, the PLC controller will also upload fault information to the host computer via the RS485 module, which will facilitate monitoring and management by the staff and ensure the safe and stable operation of the entire photovoltaic array system.

[0062] The embodiments described above are merely preferred embodiments of this utility model and are not intended to limit the scope of implementation of this utility model. Therefore, all equivalent changes or modifications made to the structure, features and principles described in the patent claims of this utility model should be included within the scope of the patent application of this utility model.

Claims

1. A thermal imaging camera interlocking control system for photovoltaic array monitoring, comprising a photovoltaic array with multiple photovoltaic panels arranged at equal intervals, wherein each photovoltaic panel is equipped with an inverter circuit (1), and the output terminal of the inverter circuit (1) is connected to a power grid, characterized in that, A circuit breaker (2) is provided between the output terminal of the inverter circuit (1) and the power grid. At least one thermal imaging camera (3) is provided in the site where the photovoltaic array is located. The thermal imaging camera (3) is provided with a bracket. The thermal imaging camera (3) is set above the photovoltaic panel through the bracket. The detection range of the thermal imaging camera (3) covers the photovoltaic array. It also includes a control module, which includes a first communication module (4) and an embedded processor (5). The embedded processor (5) is connected to the thermal imaging camera (3) through the first communication module (4). The embedded processor (5) is also connected to a central controller (6) through the first communication module (4). The input terminal of the embedded processor (5) is connected to a light intensity sensor (7). The central controller (6) is connected to a second communication module (8), and the central controller (6) is connected to multiple circuit breakers (2) through the second communication module (8).

2. The interlocking control system for a thermal imaging camera for photovoltaic array monitoring according to claim 1, characterized in that, The first communication module (4) includes one or more combinations of RS485 module, Bluetooth module and LoRa module; The embedded processor (5) includes an MCU chip, and the output of the light intensity sensor (7) is communicatively connected to the MCU chip.

3. The interlocking control system for a thermal imaging camera used for photovoltaic array monitoring according to claim 1, characterized in that, The second communication module (8) includes one or more combinations of RS485 module, Modbus module and LoRa module; The central controller (6) includes a PLC controller, and the output of the PLC controller is connected to the coil of the circuit breaker (2) through a second communication module (8).

4. The interlocking control system for a thermal imaging camera for photovoltaic array monitoring according to claim 3, characterized in that, The output terminal of the PLC controller is electrically connected to an audible and visual alarm (9). The PLC controller is connected to the host computer via the second communication module (8).

5. The interlocking control system for a thermal imaging camera for photovoltaic array monitoring according to claim 1, characterized in that, The support includes a top frame (10), legs (11) and a mounting frame. The top frame (10) has a grid-shaped structure. The legs (11) are provided at the corners of the top frame (10). The legs (11) have an I-shaped structure. The upper end of the legs (11) is fixed to the top frame (10) by bolts, and the lower end of the legs (11) is connected to the ground by bolts. The top frame (10) has a detachable mounting bracket on its transverse section and longitudinal end, and the thermal imaging camera (3) is fixedly mounted on the lower end of the mounting bracket.

6. The interlocking control system for a thermal imaging camera for photovoltaic array monitoring according to claim 5, characterized in that, The mounting bracket includes a fixing plate (12) and a side plate (13). The fixing plate (12) is a vertically arranged U-shaped plate. The groove of the fixing plate (12) fits against the side of the transverse section and the longitudinal end of the top frame (10), and the end face of the fixing plate (12) is flush with the other side of the transverse section and the longitudinal end. The side plate (13) is a rectangular plate. The end faces of the side plate (13) and the fixing plate (12) are respectively provided with threaded holes. The side plate (13) and the fixing plate (12) are fixed by bolts. When the side plate (13) and the fixing plate (12) are fixed, the transverse section and the longitudinal end of the top frame (10) are clamped. The lower end face of the fixing plate (12) is fixedly connected to the thermal imaging camera (3).

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